TWI328052B - Electrolyte and method for depositing tin-bismuth alloy layers - Google Patents

Electrolyte and method for depositing tin-bismuth alloy layers Download PDF

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Publication number
TWI328052B
TWI328052B TW095113052A TW95113052A TWI328052B TW I328052 B TWI328052 B TW I328052B TW 095113052 A TW095113052 A TW 095113052A TW 95113052 A TW95113052 A TW 95113052A TW I328052 B TWI328052 B TW I328052B
Authority
TW
Taiwan
Prior art keywords
electrolyte
tin
concentration
thiadiazole
coating
Prior art date
Application number
TW095113052A
Other languages
English (en)
Chinese (zh)
Other versions
TW200643231A (en
Inventor
Manfred Jordan
Original Assignee
Schlotter Gmbh & Co Kg Max Dr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlotter Gmbh & Co Kg Max Dr filed Critical Schlotter Gmbh & Co Kg Max Dr
Publication of TW200643231A publication Critical patent/TW200643231A/zh
Application granted granted Critical
Publication of TWI328052B publication Critical patent/TWI328052B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
TW095113052A 2005-04-12 2006-04-12 Electrolyte and method for depositing tin-bismuth alloy layers TWI328052B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510016819 DE102005016819B4 (de) 2005-04-12 2005-04-12 Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
PCT/EP2006/002183 WO2006108476A2 (de) 2005-04-12 2006-03-09 Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten

Publications (2)

Publication Number Publication Date
TW200643231A TW200643231A (en) 2006-12-16
TWI328052B true TWI328052B (en) 2010-08-01

Family

ID=36527525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113052A TWI328052B (en) 2005-04-12 2006-04-12 Electrolyte and method for depositing tin-bismuth alloy layers

Country Status (5)

Country Link
JP (1) JP5278675B2 (https=)
KR (1) KR20070120592A (https=)
DE (1) DE102005016819B4 (https=)
TW (1) TWI328052B (https=)
WO (1) WO2006108476A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120006688A1 (en) * 2009-03-18 2012-01-12 Basf Se Electrolyte and surface-active additives for the electrochemical deposition of smooth, dense aluminum layers from ionic liquids
CN102656735A (zh) * 2009-12-15 2012-09-05 巴斯夫欧洲公司 作为电化学电池和电池组的电解质溶液中的添加剂的噻唑类化合物
KR102846661B1 (ko) 2020-03-26 2025-08-18 주식회사 엘지에너지솔루션 이차전지용 전해액 첨가제, 이를 포함하는 리튬 이차전지용 비수 전해액 및 리튬 이차전지
CN112701351B (zh) * 2020-12-29 2022-08-19 中国科学院宁波材料技术与工程研究所 一种非水性电解液及其制备方法以及一种锂离子电池
CN113293409B (zh) * 2021-05-28 2022-06-24 中南大学 一种电解制备致密平整铋金属的方法
CN115029745A (zh) * 2022-07-08 2022-09-09 云南锡业集团(控股)有限责任公司研发中心 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法
CN119601802B (zh) * 2025-02-08 2025-05-30 浙江师范大学 一种锰正极电解液及其应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
ATE105877T1 (de) * 1988-10-14 1994-06-15 Atochem North America Elektroniederschlag von zinn-wismut-legierungen.
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
JPH1025595A (ja) * 1996-07-12 1998-01-27 Ishihara Chem Co Ltd スズ及びスズ合金めっき浴
JP3292055B2 (ja) * 1996-09-03 2002-06-17 上村工業株式会社 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法
JP2000100850A (ja) * 1998-09-24 2000-04-07 Ebara Udylite Kk 低融点金属バンプの形成方法
JP4077119B2 (ja) * 1999-06-30 2008-04-16 エヌ・イーケムキャット株式会社 錫−ビスマス合金電気めっき浴およびめっき方法
JP2001040497A (ja) * 1999-07-27 2001-02-13 Ne Chemcat Corp 錫−ビスマス合金めっき皮膜で被覆された電子部品
US6706418B2 (en) * 2000-07-01 2004-03-16 Shipley Company L.L.C. Metal alloy compositions and plating methods related thereto
US6726827B2 (en) * 2002-01-17 2004-04-27 Lucent Technologies Inc. Electroplating solution for high speed plating of tin-bismuth solder
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
JP4524483B2 (ja) * 2004-04-28 2010-08-18 石原薬品株式会社 スズ又はスズ合金メッキ方法
JP4389083B2 (ja) * 2004-08-10 2009-12-24 石原薬品株式会社 鉛フリーのスズ−ビスマス系合金電気メッキ浴
JP4605359B2 (ja) * 2004-10-20 2011-01-05 石原薬品株式会社 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴
JP4273266B2 (ja) * 2005-03-23 2009-06-03 石原薬品株式会社 溶解電流抑制式のスズ合金電気メッキ方法

Also Published As

Publication number Publication date
WO2006108476A3 (de) 2007-05-31
DE102005016819A1 (de) 2006-10-19
KR20070120592A (ko) 2007-12-24
WO2006108476A2 (de) 2006-10-19
TW200643231A (en) 2006-12-16
DE102005016819B4 (de) 2009-10-01
JP5278675B2 (ja) 2013-09-04
JP2008536011A (ja) 2008-09-04

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