DE102005016819B4 - Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten - Google Patents
Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten Download PDFInfo
- Publication number
- DE102005016819B4 DE102005016819B4 DE200510016819 DE102005016819A DE102005016819B4 DE 102005016819 B4 DE102005016819 B4 DE 102005016819B4 DE 200510016819 DE200510016819 DE 200510016819 DE 102005016819 A DE102005016819 A DE 102005016819A DE 102005016819 B4 DE102005016819 B4 DE 102005016819B4
- Authority
- DE
- Germany
- Prior art keywords
- electrolyte
- tin
- thiadiazole
- electrolyte according
- bismuth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003792 electrolyte Substances 0.000 title claims abstract description 63
- 230000008021 deposition Effects 0.000 title claims abstract description 16
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical group [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910001152 Bi alloy Inorganic materials 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 11
- -1 alkyl sulfonic acids Chemical class 0.000 claims abstract description 12
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 9
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 claims abstract description 7
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000002378 acidificating effect Effects 0.000 claims abstract description 6
- 150000004867 thiadiazoles Chemical class 0.000 claims abstract description 6
- JDIBGQFKXXXXPN-UHFFFAOYSA-N bismuth(3+) Chemical class [Bi+3] JDIBGQFKXXXXPN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 13
- 150000007513 acids Chemical class 0.000 claims description 12
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 12
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- YEDUAINPPJYDJZ-UHFFFAOYSA-N 2-hydroxybenzothiazole Chemical compound C1=CC=C2SC(O)=NC2=C1 YEDUAINPPJYDJZ-UHFFFAOYSA-N 0.000 claims description 4
- DXYYSGDWQCSKKO-UHFFFAOYSA-N 2-methylbenzothiazole Chemical compound C1=CC=C2SC(C)=NC2=C1 DXYYSGDWQCSKKO-UHFFFAOYSA-N 0.000 claims description 4
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- QUKGLNCXGVWCJX-UHFFFAOYSA-N 1,3,4-thiadiazol-2-amine Chemical compound NC1=NN=CS1 QUKGLNCXGVWCJX-UHFFFAOYSA-N 0.000 claims description 2
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 claims description 2
- FAYAYUOZWYJNBD-UHFFFAOYSA-N 1,3-benzothiazol-6-amine Chemical compound NC1=CC=C2N=CSC2=C1 FAYAYUOZWYJNBD-UHFFFAOYSA-N 0.000 claims description 2
- ORIIXCOYEOIFSN-UHFFFAOYSA-N 1,3-benzothiazol-6-ol Chemical compound OC1=CC=C2N=CSC2=C1 ORIIXCOYEOIFSN-UHFFFAOYSA-N 0.000 claims description 2
- UHGULLIUJBCTEF-UHFFFAOYSA-N 2-aminobenzothiazole Chemical compound C1=CC=C2SC(N)=NC2=C1 UHGULLIUJBCTEF-UHFFFAOYSA-N 0.000 claims description 2
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 claims description 2
- HMPUHXCGUHDVBI-UHFFFAOYSA-N 5-methyl-1,3,4-thiadiazol-2-amine Chemical compound CC1=NN=C(N)S1 HMPUHXCGUHDVBI-UHFFFAOYSA-N 0.000 claims description 2
- FPVUWZFFEGYCGB-UHFFFAOYSA-N 5-methyl-3h-1,3,4-thiadiazole-2-thione Chemical compound CC1=NN=C(S)S1 FPVUWZFFEGYCGB-UHFFFAOYSA-N 0.000 claims description 2
- KZHGPDSVHSDCMX-UHFFFAOYSA-N 6-methoxy-1,3-benzothiazol-2-amine Chemical compound COC1=CC=C2N=C(N)SC2=C1 KZHGPDSVHSDCMX-UHFFFAOYSA-N 0.000 claims description 2
- 150000008442 polyphenolic compounds Polymers 0.000 claims 2
- 150000003460 sulfonic acids Chemical class 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 description 32
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 25
- 238000000151 deposition Methods 0.000 description 19
- 229910052718 tin Inorganic materials 0.000 description 14
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 10
- 150000003839 salts Chemical class 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229940098779 methanesulfonic acid Drugs 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical class OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 4
- WQPMYSHJKXVTME-UHFFFAOYSA-N 3-hydroxypropane-1-sulfonic acid Chemical class OCCCS(O)(=O)=O WQPMYSHJKXVTME-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- LJYOXSMOJRTHIL-UHFFFAOYSA-N propane-1,2-disulfonic acid Chemical class OS(=O)(=O)C(C)CS(O)(=O)=O LJYOXSMOJRTHIL-UHFFFAOYSA-N 0.000 description 3
- HSXUNHYXJWDLDK-UHFFFAOYSA-N 2-hydroxypropane-1-sulfonic acid Chemical class CC(O)CS(O)(=O)=O HSXUNHYXJWDLDK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 229910009256 Sn(CH3SO3)2 Inorganic materials 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- AFAXGSQYZLGZPG-UHFFFAOYSA-L ethanedisulfonate group Chemical class C(CS(=O)(=O)[O-])S(=O)(=O)[O-] AFAXGSQYZLGZPG-UHFFFAOYSA-L 0.000 description 2
- CCIVGXIOQKPBKL-UHFFFAOYSA-N ethanesulfonic acid Chemical class CCS(O)(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- OPUAWDUYWRUIIL-UHFFFAOYSA-N methanedisulfonic acid Chemical class OS(=O)(=O)CS(O)(=O)=O OPUAWDUYWRUIIL-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-M methanesulfonate group Chemical class CS(=O)(=O)[O-] AFVFQIVMOAPDHO-UHFFFAOYSA-M 0.000 description 2
- 229920001983 poloxamer Polymers 0.000 description 2
- MGNVWUDMMXZUDI-UHFFFAOYSA-N propane-1,3-disulfonic acid Chemical class OS(=O)(=O)CCCS(O)(=O)=O MGNVWUDMMXZUDI-UHFFFAOYSA-N 0.000 description 2
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical class CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- MSBGPEACXKBQSX-UHFFFAOYSA-N (4-fluorophenyl) carbonochloridate Chemical compound FC1=CC=C(OC(Cl)=O)C=C1 MSBGPEACXKBQSX-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000003339 best practice Methods 0.000 description 1
- JALQQBGHJJURDQ-UHFFFAOYSA-L bis(methylsulfonyloxy)tin Chemical compound [Sn+2].CS([O-])(=O)=O.CS([O-])(=O)=O JALQQBGHJJURDQ-UHFFFAOYSA-L 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- MGLUJXPJRXTKJM-UHFFFAOYSA-L bismuth subcarbonate Chemical compound O=[Bi]OC(=O)O[Bi]=O MGLUJXPJRXTKJM-UHFFFAOYSA-L 0.000 description 1
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 1
- MNMKEULGSNUTIA-UHFFFAOYSA-K bismuth;methanesulfonate Chemical compound [Bi+3].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O MNMKEULGSNUTIA-UHFFFAOYSA-K 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 238000009681 x-ray fluorescence measurement Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200510016819 DE102005016819B4 (de) | 2005-04-12 | 2005-04-12 | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
| PCT/EP2006/002183 WO2006108476A2 (de) | 2005-04-12 | 2006-03-09 | Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten |
| JP2008505749A JP5278675B2 (ja) | 2005-04-12 | 2006-03-09 | スズ−ビスマス合金層沈着（析出）のための電解液及び方法 |
| KR1020077026116A KR20070120592A (ko) | 2005-04-12 | 2006-03-09 | 전해질 및 주석-비스무트 합금층의 도금 방법 |
| TW095113052A TWI328052B (en) | 2005-04-12 | 2006-04-12 | Electrolyte and method for depositing tin-bismuth alloy layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200510016819 DE102005016819B4 (de) | 2005-04-12 | 2005-04-12 | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE102005016819A1 DE102005016819A1 (de) | 2006-10-19 |
| DE102005016819B4 true DE102005016819B4 (de) | 2009-10-01 |
Family
ID=36527525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200510016819 Expired - Lifetime DE102005016819B4 (de) | 2005-04-12 | 2005-04-12 | Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5278675B2 (https=) |
| KR (1) | KR20070120592A (https=) |
| DE (1) | DE102005016819B4 (https=) |
| TW (1) | TWI328052B (https=) |
| WO (1) | WO2006108476A2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120006688A1 (en) * | 2009-03-18 | 2012-01-12 | Basf Se | Electrolyte and surface-active additives for the electrochemical deposition of smooth, dense aluminum layers from ionic liquids |
| CN102656735A (zh) * | 2009-12-15 | 2012-09-05 | 巴斯夫欧洲公司 | 作为电化学电池和电池组的电解质溶液中的添加剂的噻唑类化合物 |
| KR102846661B1 (ko) | 2020-03-26 | 2025-08-18 | 주식회사 엘지에너지솔루션 | 이차전지용 전해액 첨가제, 이를 포함하는 리튬 이차전지용 비수 전해액 및 리튬 이차전지 |
| CN112701351B (zh) * | 2020-12-29 | 2022-08-19 | 中国科学院宁波材料技术与工程研究所 | 一种非水性电解液及其制备方法以及一种锂离子电池 |
| CN113293409B (zh) * | 2021-05-28 | 2022-06-24 | 中南大学 | 一种电解制备致密平整铋金属的方法 |
| CN115029745A (zh) * | 2022-07-08 | 2022-09-09 | 云南锡业集团（控股）有限责任公司研发中心 | 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法 |
| CN119601802B (zh) * | 2025-02-08 | 2025-05-30 | 浙江师范大学 | 一种锰正极电解液及其应用 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0255558A1 (en) * | 1986-07-04 | 1988-02-10 | Daiwa Fine Chemicals Co., Ltd. | Baths or organic sulfonate solution for bismuth and bismuth alloy plating |
| US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| EP0715003A1 (en) * | 1993-06-01 | 1996-06-05 | Dipsol Chemical Co., Ltd | Sn-Bi alloy-plating bath and plating method using the same |
| JP2983548B2 (ja) * | 1988-10-14 | 1999-11-29 | アトケム ノース アメリカ，インコーポレイティド | スズービスマス合金の電気めっき法 |
| US20020153260A1 (en) * | 2000-07-01 | 2002-10-24 | Shipley Company, L.L.C. | Metal alloy compositions and plating methods related thereto |
| US20030132122A1 (en) * | 2002-01-17 | 2003-07-17 | Lucent Technologies Inc | Electroplating solution for high speed plating of tin-bismuth solder |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1025595A (ja) * | 1996-07-12 | 1998-01-27 | Ishihara Chem Co Ltd | スズ及びスズ合金めっき浴 |
| JP3292055B2 (ja) * | 1996-09-03 | 2002-06-17 | 上村工業株式会社 | 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法 |
| JP2000100850A (ja) * | 1998-09-24 | 2000-04-07 | Ebara Udylite Kk | 低融点金属バンプの形成方法 |
| JP4077119B2 (ja) * | 1999-06-30 | 2008-04-16 | エヌ・イーケムキャット株式会社 | 錫−ビスマス合金電気めっき浴およびめっき方法 |
| JP2001040497A (ja) * | 1999-07-27 | 2001-02-13 | Ne Chemcat Corp | 錫−ビスマス合金めっき皮膜で被覆された電子部品 |
| JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
| JP4441725B2 (ja) * | 2003-11-04 | 2010-03-31 | 石原薬品株式会社 | 電気スズ合金メッキ方法 |
| JP4524483B2 (ja) * | 2004-04-28 | 2010-08-18 | 石原薬品株式会社 | スズ又はスズ合金メッキ方法 |
| JP4389083B2 (ja) * | 2004-08-10 | 2009-12-24 | 石原薬品株式会社 | 鉛フリーのスズ−ビスマス系合金電気メッキ浴 |
| JP4605359B2 (ja) * | 2004-10-20 | 2011-01-05 | 石原薬品株式会社 | 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 |
| JP4273266B2 (ja) * | 2005-03-23 | 2009-06-03 | 石原薬品株式会社 | 溶解電流抑制式のスズ合金電気メッキ方法 |
-
2005
- 2005-04-12 DE DE200510016819 patent/DE102005016819B4/de not_active Expired - Lifetime
-
2006
- 2006-03-09 JP JP2008505749A patent/JP5278675B2/ja not_active Expired - Lifetime
- 2006-03-09 KR KR1020077026116A patent/KR20070120592A/ko not_active Withdrawn
- 2006-03-09 WO PCT/EP2006/002183 patent/WO2006108476A2/de not_active Ceased
- 2006-04-12 TW TW095113052A patent/TWI328052B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0255558A1 (en) * | 1986-07-04 | 1988-02-10 | Daiwa Fine Chemicals Co., Ltd. | Baths or organic sulfonate solution for bismuth and bismuth alloy plating |
| US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| JP2983548B2 (ja) * | 1988-10-14 | 1999-11-29 | アトケム ノース アメリカ，インコーポレイティド | スズービスマス合金の電気めっき法 |
| EP0715003A1 (en) * | 1993-06-01 | 1996-06-05 | Dipsol Chemical Co., Ltd | Sn-Bi alloy-plating bath and plating method using the same |
| US20020153260A1 (en) * | 2000-07-01 | 2002-10-24 | Shipley Company, L.L.C. | Metal alloy compositions and plating methods related thereto |
| US20030132122A1 (en) * | 2002-01-17 | 2003-07-17 | Lucent Technologies Inc | Electroplating solution for high speed plating of tin-bismuth solder |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI328052B (en) | 2010-08-01 |
| WO2006108476A3 (de) | 2007-05-31 |
| DE102005016819A1 (de) | 2006-10-19 |
| KR20070120592A (ko) | 2007-12-24 |
| WO2006108476A2 (de) | 2006-10-19 |
| TW200643231A (en) | 2006-12-16 |
| JP5278675B2 (ja) | 2013-09-04 |
| JP2008536011A (ja) | 2008-09-04 |
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