JP5278675B2 - スズ−ビスマス合金層沈着（析出）のための電解液及び方法 - Google Patents

スズ−ビスマス合金層沈着（析出）のための電解液及び方法 Download PDF

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Publication number
JP5278675B2
JP5278675B2 JP2008505749A JP2008505749A JP5278675B2 JP 5278675 B2 JP5278675 B2 JP 5278675B2 JP 2008505749 A JP2008505749 A JP 2008505749A JP 2008505749 A JP2008505749 A JP 2008505749A JP 5278675 B2 JP5278675 B2 JP 5278675B2
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Japan
Prior art keywords
bismuth
tin
electrolyte
deposition
acid
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JP2008505749A
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Japanese (ja)
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JP2008536011A5 (https=
JP2008536011A (ja
Inventor
ジョルダン，マンフレッド
Original Assignee
デーエル．−イーエヌゲー．マックス シュレッター ゲーエムベーハー ウント ツェーオー．カーゲー
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2008505749A 2005-04-12 2006-03-09 スズ−ビスマス合金層沈着（析出）のための電解液及び方法 Expired - Lifetime JP5278675B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200510016819 DE102005016819B4 (de) 2005-04-12 2005-04-12 Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
DE102005016819.1 2005-04-12
PCT/EP2006/002183 WO2006108476A2 (de) 2005-04-12 2006-03-09 Elektrolyt und verfahren zur abscheidung von zinn-wismut-legierungsschichten

Publications (3)

Publication Number Publication Date
JP2008536011A JP2008536011A (ja) 2008-09-04
JP2008536011A5 JP2008536011A5 (https=) 2012-03-15
JP5278675B2 true JP5278675B2 (ja) 2013-09-04

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ID=36527525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008505749A Expired - Lifetime JP5278675B2 (ja) 2005-04-12 2006-03-09 スズ−ビスマス合金層沈着（析出）のための電解液及び方法

Country Status (5)

Country Link
JP (1) JP5278675B2 (https=)
KR (1) KR20070120592A (https=)
DE (1) DE102005016819B4 (https=)
TW (1) TWI328052B (https=)
WO (1) WO2006108476A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120006688A1 (en) * 2009-03-18 2012-01-12 Basf Se Electrolyte and surface-active additives for the electrochemical deposition of smooth, dense aluminum layers from ionic liquids
CN102656735A (zh) * 2009-12-15 2012-09-05 巴斯夫欧洲公司 作为电化学电池和电池组的电解质溶液中的添加剂的噻唑类化合物
KR102846661B1 (ko) 2020-03-26 2025-08-18 주식회사 엘지에너지솔루션 이차전지용 전해액 첨가제, 이를 포함하는 리튬 이차전지용 비수 전해액 및 리튬 이차전지
CN112701351B (zh) * 2020-12-29 2022-08-19 中国科学院宁波材料技术与工程研究所 一种非水性电解液及其制备方法以及一种锂离子电池
CN113293409B (zh) * 2021-05-28 2022-06-24 中南大学 一种电解制备致密平整铋金属的方法
CN115029745A (zh) * 2022-07-08 2022-09-09 云南锡业集团（控股）有限责任公司研发中心 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法
CN119601802B (zh) * 2025-02-08 2025-05-30 浙江师范大学 一种锰正极电解液及其应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
ATE105877T1 (de) * 1988-10-14 1994-06-15 Atochem North America Elektroniederschlag von zinn-wismut-legierungen.
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
JPH1025595A (ja) * 1996-07-12 1998-01-27 Ishihara Chem Co Ltd スズ及びスズ合金めっき浴
JP3292055B2 (ja) * 1996-09-03 2002-06-17 上村工業株式会社 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法
JP2000100850A (ja) * 1998-09-24 2000-04-07 Ebara Udylite Kk 低融点金属バンプの形成方法
JP4077119B2 (ja) * 1999-06-30 2008-04-16 エヌ・イーケムキャット株式会社 錫−ビスマス合金電気めっき浴およびめっき方法
JP2001040497A (ja) * 1999-07-27 2001-02-13 Ne Chemcat Corp 錫−ビスマス合金めっき皮膜で被覆された電子部品
US6706418B2 (en) * 2000-07-01 2004-03-16 Shipley Company L.L.C. Metal alloy compositions and plating methods related thereto
US6726827B2 (en) * 2002-01-17 2004-04-27 Lucent Technologies Inc. Electroplating solution for high speed plating of tin-bismuth solder
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
JP4524483B2 (ja) * 2004-04-28 2010-08-18 石原薬品株式会社 スズ又はスズ合金メッキ方法
JP4389083B2 (ja) * 2004-08-10 2009-12-24 石原薬品株式会社 鉛フリーのスズ−ビスマス系合金電気メッキ浴
JP4605359B2 (ja) * 2004-10-20 2011-01-05 石原薬品株式会社 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴
JP4273266B2 (ja) * 2005-03-23 2009-06-03 石原薬品株式会社 溶解電流抑制式のスズ合金電気メッキ方法

Also Published As

Publication number Publication date
TWI328052B (en) 2010-08-01
WO2006108476A3 (de) 2007-05-31
DE102005016819A1 (de) 2006-10-19
KR20070120592A (ko) 2007-12-24
WO2006108476A2 (de) 2006-10-19
TW200643231A (en) 2006-12-16
DE102005016819B4 (de) 2009-10-01
JP2008536011A (ja) 2008-09-04

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