KR20070120592A - 전해질 및 주석-비스무트 합금층의 도금 방법 - Google Patents

전해질 및 주석-비스무트 합금층의 도금 방법 Download PDF

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Publication number
KR20070120592A
KR20070120592A KR1020077026116A KR20077026116A KR20070120592A KR 20070120592 A KR20070120592 A KR 20070120592A KR 1020077026116 A KR1020077026116 A KR 1020077026116A KR 20077026116 A KR20077026116 A KR 20077026116A KR 20070120592 A KR20070120592 A KR 20070120592A
Authority
KR
South Korea
Prior art keywords
electrolyte
tin
thiadiazole
bismuth
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077026116A
Other languages
English (en)
Korean (ko)
Inventor
만프레드 요르단
Original Assignee
독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게 filed Critical 독토르.-인제니오르 막스 슐뢰터 게엠베하 운트 코.카게
Publication of KR20070120592A publication Critical patent/KR20070120592A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020077026116A 2005-04-12 2006-03-09 전해질 및 주석-비스무트 합금층의 도금 방법 Withdrawn KR20070120592A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510016819 DE102005016819B4 (de) 2005-04-12 2005-04-12 Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
DE102005016819.1 2005-04-12

Publications (1)

Publication Number Publication Date
KR20070120592A true KR20070120592A (ko) 2007-12-24

Family

ID=36527525

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077026116A Withdrawn KR20070120592A (ko) 2005-04-12 2006-03-09 전해질 및 주석-비스무트 합금층의 도금 방법

Country Status (5)

Country Link
JP (1) JP5278675B2 (https=)
KR (1) KR20070120592A (https=)
DE (1) DE102005016819B4 (https=)
TW (1) TWI328052B (https=)
WO (1) WO2006108476A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12308388B2 (en) 2020-03-26 2025-05-20 Lg Energy Solution, Ltd. Electrolyte solution additive for secondary battery, and non-aqueous electrolyte solution for lithium secondary battery and lithium secondary battery which include the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120006688A1 (en) * 2009-03-18 2012-01-12 Basf Se Electrolyte and surface-active additives for the electrochemical deposition of smooth, dense aluminum layers from ionic liquids
CN102656735A (zh) * 2009-12-15 2012-09-05 巴斯夫欧洲公司 作为电化学电池和电池组的电解质溶液中的添加剂的噻唑类化合物
CN112701351B (zh) * 2020-12-29 2022-08-19 中国科学院宁波材料技术与工程研究所 一种非水性电解液及其制备方法以及一种锂离子电池
CN113293409B (zh) * 2021-05-28 2022-06-24 中南大学 一种电解制备致密平整铋金属的方法
CN115029745A (zh) * 2022-07-08 2022-09-09 云南锡业集团(控股)有限责任公司研发中心 一种可减少元件镀层工艺步骤并提升焊点可靠性的方法
CN119601802B (zh) * 2025-02-08 2025-05-30 浙江师范大学 一种锰正极电解液及其应用

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
ATE105877T1 (de) * 1988-10-14 1994-06-15 Atochem North America Elektroniederschlag von zinn-wismut-legierungen.
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
JPH1025595A (ja) * 1996-07-12 1998-01-27 Ishihara Chem Co Ltd スズ及びスズ合金めっき浴
JP3292055B2 (ja) * 1996-09-03 2002-06-17 上村工業株式会社 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法
JP2000100850A (ja) * 1998-09-24 2000-04-07 Ebara Udylite Kk 低融点金属バンプの形成方法
JP4077119B2 (ja) * 1999-06-30 2008-04-16 エヌ・イーケムキャット株式会社 錫−ビスマス合金電気めっき浴およびめっき方法
JP2001040497A (ja) * 1999-07-27 2001-02-13 Ne Chemcat Corp 錫−ビスマス合金めっき皮膜で被覆された電子部品
US6706418B2 (en) * 2000-07-01 2004-03-16 Shipley Company L.L.C. Metal alloy compositions and plating methods related thereto
US6726827B2 (en) * 2002-01-17 2004-04-27 Lucent Technologies Inc. Electroplating solution for high speed plating of tin-bismuth solder
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP4441725B2 (ja) * 2003-11-04 2010-03-31 石原薬品株式会社 電気スズ合金メッキ方法
JP4524483B2 (ja) * 2004-04-28 2010-08-18 石原薬品株式会社 スズ又はスズ合金メッキ方法
JP4389083B2 (ja) * 2004-08-10 2009-12-24 石原薬品株式会社 鉛フリーのスズ−ビスマス系合金電気メッキ浴
JP4605359B2 (ja) * 2004-10-20 2011-01-05 石原薬品株式会社 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴
JP4273266B2 (ja) * 2005-03-23 2009-06-03 石原薬品株式会社 溶解電流抑制式のスズ合金電気メッキ方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12308388B2 (en) 2020-03-26 2025-05-20 Lg Energy Solution, Ltd. Electrolyte solution additive for secondary battery, and non-aqueous electrolyte solution for lithium secondary battery and lithium secondary battery which include the same

Also Published As

Publication number Publication date
TWI328052B (en) 2010-08-01
WO2006108476A3 (de) 2007-05-31
DE102005016819A1 (de) 2006-10-19
WO2006108476A2 (de) 2006-10-19
TW200643231A (en) 2006-12-16
DE102005016819B4 (de) 2009-10-01
JP5278675B2 (ja) 2013-09-04
JP2008536011A (ja) 2008-09-04

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000