KR20110031183A - 개선된 구리-주석 전해질 및 청동층의 침착 방법 - Google Patents

개선된 구리-주석 전해질 및 청동층의 침착 방법 Download PDF

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Publication number
KR20110031183A
KR20110031183A KR1020117000324A KR20117000324A KR20110031183A KR 20110031183 A KR20110031183 A KR 20110031183A KR 1020117000324 A KR1020117000324 A KR 1020117000324A KR 20117000324 A KR20117000324 A KR 20117000324A KR 20110031183 A KR20110031183 A KR 20110031183A
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KR
South Korea
Prior art keywords
electrolyte
acid
copper
tin
salt
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KR1020117000324A
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English (en)
Korean (ko)
Inventor
클라우스 브론더
베른트 바이뮐러
프랑크 오베르스트
자샤 베르거
우베 만츠
Original Assignee
유미코아 갈바노테히닉 게엠베하
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Publication of KR20110031183A publication Critical patent/KR20110031183A/ko
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
KR1020117000324A 2008-07-10 2009-07-06 개선된 구리-주석 전해질 및 청동층의 침착 방법 Withdrawn KR20110031183A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008032398.5 2008-07-10
DE102008032398A DE102008032398A1 (de) 2008-07-10 2008-07-10 Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Publications (1)

Publication Number Publication Date
KR20110031183A true KR20110031183A (ko) 2011-03-24

Family

ID=41258161

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117000324A Withdrawn KR20110031183A (ko) 2008-07-10 2009-07-06 개선된 구리-주석 전해질 및 청동층의 침착 방법

Country Status (10)

Country Link
US (1) US20110174631A1 (https=)
EP (1) EP2310558B1 (https=)
JP (1) JP2011527381A (https=)
KR (1) KR20110031183A (https=)
CN (1) CN102089466B (https=)
AT (1) ATE549434T1 (https=)
DE (1) DE102008032398A1 (https=)
PL (1) PL2310558T3 (https=)
TW (1) TW201014935A (https=)
WO (1) WO2010003621A1 (https=)

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DE102012008544A1 (de) 2012-05-02 2013-11-07 Umicore Galvanotechnik Gmbh Verchromte Verbundwerkstoffe ohne Nickelschicht
AT514818B1 (de) * 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
CN103789803B (zh) * 2014-01-13 2016-04-27 孙松华 一种无氰铜锡合金电镀液及其制备方法
JP5938426B2 (ja) * 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
AR100422A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN106521574B (zh) * 2016-12-05 2018-10-26 浙江工业大学 一种适用于宽pH和宽电流密度范围的无氰镀铜电镀液及其制备方法
MY199306A (en) * 2016-12-28 2023-10-24 Atotech Deutschland Gmbh Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate
CN110344079B (zh) * 2019-08-16 2021-06-08 广东超华科技股份有限公司 一种降低电解铜箔电解液中铁离子浓度的装置及方法
RU2762501C1 (ru) * 2021-05-17 2021-12-21 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Щелочной электролит для электролитического осаждения желтой оловянной бронзы
DE102021117095A1 (de) 2021-07-02 2023-01-05 Umicore Galvanotechnik Gmbh Bronzeschichten als Edelmetallersatz
DE202021004169U1 (de) 2021-07-02 2022-12-07 Umicore Galvanotechnik Gmbh Bronzeschicht als Edelmetallersatz in Smart Cards

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US4356067A (en) * 1979-06-13 1982-10-26 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
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US4347108A (en) * 1981-05-29 1982-08-31 Rohco, Inc. Electrodeposition of copper, acidic copper electroplating baths and additives therefor
CN1004010B (zh) * 1986-07-11 1989-04-26 南京大学 无氰仿金电镀液
DE4324995C2 (de) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
TW577938B (en) 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
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DE10046600C2 (de) 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
JP2004510053A (ja) * 2000-09-20 2004-04-02 デーエル.−イーエヌゲー.マックス シュレッター ゲーエムベーハー ウント ツェーオー.カーゲー 錫−銅合金層を析出させるための電解質及び方法
US6645364B2 (en) * 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
DE10243139A1 (de) * 2002-09-17 2004-03-25 Omg Galvanotechnik Gmbh Dunkle Schichten
ES2531163T3 (es) 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
US20060231409A1 (en) * 2005-03-31 2006-10-19 Tdk Corporation Plating solution, conductive material, and surface treatment method of conductive material
EP1870495A1 (de) * 2006-06-21 2007-12-26 Atotech Deutschland Gmbh Wässriges alkalisches cyanidfreies Bad zur galvanischen Abscheidung von Zink- und Zinklegierungsüberzügen
DE502007002479D1 (de) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten

Also Published As

Publication number Publication date
ATE549434T1 (de) 2012-03-15
EP2310558B1 (en) 2012-03-14
DE102008032398A1 (de) 2010-01-14
CN102089466B (zh) 2012-11-07
TW201014935A (en) 2010-04-16
EP2310558A1 (en) 2011-04-20
WO2010003621A1 (en) 2010-01-14
CN102089466A (zh) 2011-06-08
PL2310558T3 (pl) 2012-09-28
JP2011527381A (ja) 2011-10-27
US20110174631A1 (en) 2011-07-21

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PA0105 International application

Patent event date: 20110106

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid