JP2006117980A5 - - Google Patents

Download PDF

Info

Publication number
JP2006117980A5
JP2006117980A5 JP2004305204A JP2004305204A JP2006117980A5 JP 2006117980 A5 JP2006117980 A5 JP 2006117980A5 JP 2004305204 A JP2004305204 A JP 2004305204A JP 2004305204 A JP2004305204 A JP 2004305204A JP 2006117980 A5 JP2006117980 A5 JP 2006117980A5
Authority
JP
Japan
Prior art keywords
acid
bismuth
tin
anode
acids
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004305204A
Other languages
English (en)
Japanese (ja)
Other versions
JP4605359B2 (ja
JP2006117980A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004305204A priority Critical patent/JP4605359B2/ja
Priority claimed from JP2004305204A external-priority patent/JP4605359B2/ja
Publication of JP2006117980A publication Critical patent/JP2006117980A/ja
Publication of JP2006117980A5 publication Critical patent/JP2006117980A5/ja
Application granted granted Critical
Publication of JP4605359B2 publication Critical patent/JP4605359B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

JP2004305204A 2004-10-20 2004-10-20 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴 Expired - Fee Related JP4605359B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004305204A JP4605359B2 (ja) 2004-10-20 2004-10-20 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004305204A JP4605359B2 (ja) 2004-10-20 2004-10-20 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴

Publications (3)

Publication Number Publication Date
JP2006117980A JP2006117980A (ja) 2006-05-11
JP2006117980A5 true JP2006117980A5 (https=) 2008-07-10
JP4605359B2 JP4605359B2 (ja) 2011-01-05

Family

ID=36536133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004305204A Expired - Fee Related JP4605359B2 (ja) 2004-10-20 2004-10-20 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴

Country Status (1)

Country Link
JP (1) JP4605359B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003272790A1 (en) 2002-10-08 2004-05-04 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
RU2476475C2 (ru) * 2008-01-09 2013-02-27 Акцо Нобель Н.В. Кислотный водный раствор, содержащий хелатирующий агент, и его применение
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
CN101899691B (zh) * 2010-07-16 2012-05-23 施吉连 一种在微波高频电路板上电镀锡铈铋合金的方法
US9850588B2 (en) * 2015-09-09 2017-12-26 Rohm And Haas Electronic Materials Llc Bismuth electroplating baths and methods of electroplating bismuth on a substrate
KR102617125B1 (ko) * 2021-12-24 2023-12-27 주식회사 호진플라텍 저온 솔더를 위한 인듐-비스무스 합금용 전기 도금액
KR102617129B1 (ko) * 2022-11-23 2023-12-27 주식회사 호진플라텍 비스무스 치환 방지 성능이 향상된 저온 솔더를 위한 인듐-비스무스 합금용 전기 도금액
US12529159B2 (en) 2023-07-12 2026-01-20 Hong Kong Applied Science and Technology Research Institute Company Limited Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding
CN117980544A (zh) * 2023-07-12 2024-05-03 香港应用科技研究院有限公司 用于3D-IC低温键合的共电镀Sn-Bi合金焊料

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0663110B2 (ja) * 1988-09-22 1994-08-17 上村工業株式会社 ビスマス―錫合金電気のめっき浴
JP2819180B2 (ja) * 1990-02-22 1998-10-30 信康 土肥 すず―鉛―ビスマス合金めっき浴
JPH08225985A (ja) * 1995-02-15 1996-09-03 Okuno Chem Ind Co Ltd ビスマス−スズ合金めっき浴
JPH1025595A (ja) * 1996-07-12 1998-01-27 Ishihara Chem Co Ltd スズ及びスズ合金めっき浴
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
JP3368860B2 (ja) * 1999-02-01 2003-01-20 上村工業株式会社 電気錫合金めっき方法及び電気錫合金めっき装置
JP2000265294A (ja) * 1999-03-15 2000-09-26 Matsushita Electric Ind Co Ltd 錫及び錫合金めっき浴、めっき皮膜及び半導体装置用のリードフレーム
JP2001172791A (ja) * 1999-12-16 2001-06-26 Ishihara Chem Co Ltd スズ−銅系合金メッキ浴、並びに当該メッキ浴によりスズ−銅系合金皮膜を形成した電子部品
JP3871018B2 (ja) * 2000-06-23 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
JP2002339095A (ja) * 2001-05-16 2002-11-27 Dr Ing Max Schloetter Gmbh & Co Kg スズ−ビスマス−銅合金の析出方法
JP2004183091A (ja) * 2002-07-25 2004-07-02 Shinriyou Denshi Kk 錫−銀−銅含有めっき液、電解めっき方法、錫−銀−銅含有めっき被膜、並びにこのめっき被膜を使用したはんだ付け方法
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法

Similar Documents

Publication Publication Date Title
KR101502804B1 (ko) Ｐｄ 및 Ｐｄ-Ｎｉ 전해질 욕조
US6800121B2 (en) Electroless nickel plating solutions
US6165342A (en) Cyanide-free electroplating bath for the deposition of gold and gold alloys
KR102861234B1 (ko) 백금 전해 도금욕 및 백금 도금 제품
US20030155247A1 (en) Process for electroplating silicon wafers
KR20080066570A (ko) 무전해 금 도금욕의 도금 능력 유지관리 방법
JP2006117980A5 (https=)
US20050031895A1 (en) Electroless displacement gold plating solution and additive for use in preparing plating solution
KR20110039460A (ko) 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물
US20040149587A1 (en) Electroplating solution containing organic acid complexing agent
US8801844B2 (en) Autocatalytic plating bath composition for deposition of tin and tin alloys
KR100947488B1 (ko) 니켈 전기도금액
US3879270A (en) Compositions and process for the electrodeposition of metals
US6458264B1 (en) Sn-Cu alloy plating bath
JP2009191335A (ja) めっき液及び電子部品
US3928147A (en) Method for electroplating
EP2730682B1 (en) Alkaline, cyanide-free solution for electroplating of gold alloys, a method for electroplating and a substrate comprising a bright, corrosion-free deposit of a gold alloy
US4053372A (en) Tin-lead acidic plating bath
US6054037A (en) Halogen additives for alkaline copper use for plating zinc die castings
JP3566498B2 (ja) 置換金めっき浴
EP1930478B1 (en) Electrolyte composition and method for the deposition of quaternary copper alloys
US6852211B2 (en) Nickel electroplating solution
JP2006117980A (ja) 鉛フリーの酸性スズ−ビスマス系合金電気メッキ浴
US5853556A (en) Use of hydroxy carboxylic acids as ductilizers for electroplating nickel-tungsten alloys
JP3655388B2 (ja) 錫めっき及び錫−鉛合金めっき用非酸性浴、及び該めっき浴を用いためっき方法