JP2011523910A - 次世代型スクリーン印刷システム - Google Patents

次世代型スクリーン印刷システム Download PDF

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Publication number
JP2011523910A
JP2011523910A JP2011509948A JP2011509948A JP2011523910A JP 2011523910 A JP2011523910 A JP 2011523910A JP 2011509948 A JP2011509948 A JP 2011509948A JP 2011509948 A JP2011509948 A JP 2011509948A JP 2011523910 A JP2011523910 A JP 2011523910A
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JP
Japan
Prior art keywords
substrate
conveyor
rotary actuator
substrate support
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011509948A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011523910A5 (enExample
Inventor
アンドレア バシーニ
マルコ ガリアゾ
ダニエレ アンドレオラ
サンティ ルイギ デ
クリスチアン ゾルジ
トーマソ ベルセシ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from ITUD20080112 external-priority patent/ITUD20080112A1/it
Priority claimed from ITUD2008A000262A external-priority patent/IT1392752B1/it
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2011523910A publication Critical patent/JP2011523910A/ja
Publication of JP2011523910A5 publication Critical patent/JP2011523910A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Screen Printers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2011509948A 2008-05-21 2009-05-18 次世代型スクリーン印刷システム Pending JP2011523910A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
ITUD20080112 ITUD20080112A1 (it) 2008-05-21 2008-05-21 Sistema di stampa serigrafica di nuova generazione
ITUD2008A000112 2008-05-21
ITUD2008A000262 2008-12-18
ITUD2008A000262A IT1392752B1 (it) 2008-12-18 2008-12-18 Sistema di stampa serigrafica di nuova generazione
PCT/EP2009/056024 WO2009141319A1 (en) 2008-05-21 2009-05-18 Next generation screen printing system

Publications (2)

Publication Number Publication Date
JP2011523910A true JP2011523910A (ja) 2011-08-25
JP2011523910A5 JP2011523910A5 (enExample) 2012-07-05

Family

ID=40886196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011509948A Pending JP2011523910A (ja) 2008-05-21 2009-05-18 次世代型スクリーン印刷システム

Country Status (7)

Country Link
US (1) US8215473B2 (enExample)
EP (1) EP2297777A1 (enExample)
JP (1) JP2011523910A (enExample)
KR (1) KR20110020272A (enExample)
CN (1) CN102037555B (enExample)
TW (1) TWI397146B (enExample)
WO (1) WO2009141319A1 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1394647B1 (it) * 2009-06-22 2012-07-05 Applied Materials Inc Sistema di visione migliorato per l'allineamento di uno schema di stampa serigrafica
EP2359410A4 (en) * 2008-12-10 2014-09-24 Applied Materials Inc IMPROVED VISIBILITY SYSTEM FOR ALIGNMENT OF SCREEN PRINT PATTERNS
JP5553803B2 (ja) * 2011-08-01 2014-07-16 株式会社日立製作所 パネルの印刷装置
JP5803015B2 (ja) * 2011-08-31 2015-11-04 Ｊｕｋｉオートメーションシステムズ株式会社 搬送装置、処理装置及び搬送方法
KR101137995B1 (ko) 2011-10-12 2012-04-23 주식회사 에스제이이노테크 웨이퍼 위치 교체 장치
DE102012205252A1 (de) 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
DE102012205249A1 (de) * 2012-03-30 2013-10-02 JRT Photovoltaics GmbH & Co. KG Bearbeitungsstation für flächige Substrate und Verfahren zum Bearbeiten von flächigen Substraten
CN102642385B (zh) * 2012-04-30 2014-06-11 华南理工大学 全自动多相机丝网印刷设备的定位基准标定方法及装置
CN102700237B (zh) * 2012-05-09 2015-08-26 华南理工大学 一种具有双平台的全自动视觉硅片印刷装置
KR20170135982A (ko) 2012-09-10 2017-12-08 어플라이드 머티어리얼스, 인코포레이티드 기판 이송 디바이스 및 기판들을 이동시키는 방법
CN103085447B (zh) * 2013-01-18 2015-01-21 景德镇陶瓷学院 高速旋转式印花机及其旋转式印花方法
PL2801790T3 (pl) * 2013-01-30 2017-04-28 Nittan Valve Co., Ltd. Aparatura do badania elementów roboczych
CN103552366B (zh) * 2013-11-08 2016-01-20 中国兵器工业集团第二一四研究所苏州研发中心 一种小尺寸ltcc片式电路四片同步侧印装置及方法
JP5875573B2 (ja) 2013-11-22 2016-03-02 キヤノン株式会社 記録装置及びその気泡排出方法
DE102014215022B3 (de) * 2014-07-30 2015-09-03 Ekra Automatisierungssysteme Gmbh Drucksystem und Verfahren zum Bedrucken von Substraten
CN104275916A (zh) * 2014-10-17 2015-01-14 杰锐光能(苏州)有限公司 带有两套印刷台面的直线传输式晶硅太阳能电池印刷机
CN104354453B (zh) * 2014-10-21 2017-02-08 苏州迈为科技股份有限公司 一种太阳能电池片的高效印刷方法及其装置
CN104401767B (zh) * 2014-11-14 2017-03-15 广州兴森快捷电路科技有限公司 Pcb转角传输装置及方法
CN112018011A (zh) * 2014-12-02 2020-12-01 应用材料意大利有限公司 在生产太阳能电池基板上印刷的装置及传输该基板的方法
EP3227929A1 (en) * 2014-12-02 2017-10-11 Applied Materials Italia Srl Solar cell production apparatus for processing a substrate, and method for processing a substrate for the production of a solar cell
JP6517324B2 (ja) 2015-08-03 2019-05-22 日鍛バルブ株式会社 エンジンバルブの軸接部の探傷検査方法および装置
DE102017204630A1 (de) * 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
CA3057323C (en) 2017-03-23 2022-10-04 Berkshire Grey, Inc. Systems and methods for processing objects, including automated linear processing stations
GB2562503A (en) * 2017-05-16 2018-11-21 Asm Assembly Systems Singapore Pte Ltd Workpiece transfer and printing
CN107187191B (zh) * 2017-07-03 2019-11-12 东莞市科隆威自动化设备有限公司 一种硅片印刷机
JP7029914B2 (ja) * 2017-09-25 2022-03-04 東京エレクトロン株式会社 基板処理装置
WO2019081041A1 (en) * 2017-10-27 2019-05-02 Applied Materials Italia S.R.L. CONFIGURED APPARATUS FOR DETERMINING A STATE OF A DEPOSITION ARRANGEMENT, A SYSTEM FOR MANUFACTURING A SOLAR CELL, AND A METHOD FOR DETERMINING A STATUS OF A DEPOSIT ARRANGEMENT
US10790466B2 (en) * 2018-12-11 2020-09-29 Feng-wen Yen In-line system for mass production of organic optoelectronic device and manufacturing method using the same system
CN111331156B (zh) * 2018-12-19 2021-06-22 宝成工业股份有限公司 自动上下料装置
CN110060946B (zh) * 2019-04-26 2024-08-02 无锡奥特维科技股份有限公司 双工位导电胶涂覆装置及叠片组件生产装置
US12131930B2 (en) 2020-04-02 2024-10-29 Applied Materials, Inc. Inspection system
CN111688338A (zh) * 2020-04-03 2020-09-22 绍兴永通印花有限公司 异花同步双幅印花机
US12128446B1 (en) 2023-06-30 2024-10-29 Applied Materials, Inc. High speed substrate sorter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0858062A (ja) * 1994-08-19 1996-03-05 Nippon Bunka Seiko Kk Ｃｄ多色印刷装置
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4588343A (en) * 1984-05-18 1986-05-13 Varian Associates, Inc. Workpiece lifting and holding apparatus
JPS61105853A (ja) * 1984-10-30 1986-05-23 Anelva Corp オ−トロ−ダ−
JPS61113766A (ja) 1984-11-09 1986-05-31 Nissin Electric Co Ltd エンドステ−シヨン
DE3735284A1 (de) * 1987-10-17 1989-04-27 Leybold Ag Vorrichtung nach dem karussell-prinzip zum beschichten von substraten
US4981074A (en) * 1988-06-01 1991-01-01 Hitachi Techno Engineering Co., Ltd. Method and apparatus for screen printing
IT1252949B (it) 1991-09-30 1995-07-06 Gisulfo Baccini Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento
ATE129359T1 (de) 1992-08-04 1995-11-15 Ibm Verteilungseinrichtung mit gaszufuhr- abgabevorrichtung zum handhaben und speichern von abdichtbaren tragbaren unter druck stehenden behältern.
GB9323978D0 (en) 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
US5379984A (en) * 1994-01-11 1995-01-10 Intevac, Inc. Gate valve for vacuum processing system
JP3255783B2 (ja) 1994-01-26 2002-02-12 松下電器産業株式会社 スクリーン印刷機およびスクリーン印刷方法
US6086728A (en) * 1994-12-14 2000-07-11 Schwartz; Vladimir Cross flow metalizing of compact discs
US5518599A (en) 1994-12-14 1996-05-21 Reflekt Technology, Inc. Cross flow metalizing of compact discs
US6702540B2 (en) * 1995-11-27 2004-03-09 M2 Engineering Ab Machine and method for manufacturing compact discs
US6054029A (en) * 1996-02-23 2000-04-25 Singulus Technologies Gmbh Device for gripping, holdings and/or transporting substrates
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
JP3310540B2 (ja) 1996-05-22 2002-08-05 松下電器産業株式会社 スクリーン印刷方法とその装置
WO1997048258A1 (en) 1996-06-14 1997-12-18 Matsushita Electric Industrial Co., Ltd. Screen printing method and screen printing apparatus
DE19642852A1 (de) * 1996-10-17 1998-04-23 Leybold Systems Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate
GB2323664A (en) 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
US6032577A (en) 1998-03-02 2000-03-07 Mpm Corporation Method and apparatus for transporting substrates
JPH11245370A (ja) 1998-03-02 1999-09-14 Matsushita Electric Ind Co Ltd 電気ペーストのスクリーン印刷における基板とスクリーンマスクの位置合わせ方法
DE19835154A1 (de) * 1998-08-04 2000-02-10 Leybold Systems Gmbh Vorrichtung zur Beschichtung von Substraten in einer Vakuumkammer
IT1310555B1 (it) 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronici
IT1310557B1 (it) 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
DE19945648C2 (de) 1999-09-23 2001-08-02 Steag Hamatech Ag Vorrichtung zum Be- und Entladen von Substraten
GB2377409A (en) 2001-07-13 2003-01-15 Dek Int Gmbh Screen printing alignment and inspection apparatus having at least two workpiece imaging units
US7021450B2 (en) 2002-04-17 2006-04-04 Kraft Foods Holdings, Inc. Device and method to correct uneven spacing of successive articles
DE10222119B4 (de) 2002-05-17 2004-11-11 Asys Automatisierungssysteme Gmbh Vorrichtung und Verfahren zum Einstellen der relativen Lage zwischen einem zu bedruckenden Substrat und einem Druckmuster
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
DE10237038C1 (de) 2002-08-08 2003-11-13 Thieme Gmbh & Co Kg Zentriereinrichtung für eine Siebdruckvorrichtung
JP4096359B2 (ja) 2003-03-10 2008-06-04 セイコーエプソン株式会社 製造対象物の製造装置
GB2403003B (en) 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
DE202005008581U1 (de) 2005-05-25 2006-10-05 Thieme Gmbh & Co. Kg Aufnahme für zu bedruckendes Medium in einer Druckmaschine
US20060268290A1 (en) 2005-05-25 2006-11-30 Thieme Gmbh & Co. Kg Printing table for flatbed printers
US7811016B2 (en) 2005-05-25 2010-10-12 Agfa Graphics Nv Flatbed printing machine
JP4696861B2 (ja) * 2005-11-11 2011-06-08 パナソニック株式会社 スクリーン印刷装置
ITUD20050196A1 (it) 2005-11-17 2007-05-18 Gisulfo Baccini Apparecchiatura per la produzione di celle fotovoltaiche sottili in silicio e di circuiti elettronici in materiale rigido e flessibile
TWI271367B (en) 2005-11-24 2007-01-21 Chunghwa Picture Tubes Ltd Cassette and mechanical arm and process apparatus
JP4593461B2 (ja) 2005-12-27 2010-12-08 東京エレクトロン株式会社 基板搬送システム
KR20070095148A (ko) * 2006-03-20 2007-09-28 주식회사 탑 엔지니어링 칩 공급 유닛 로딩 장치
DE102006015686C5 (de) 2006-03-27 2013-05-29 Thieme Gmbh & Co. Kg Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine
ITUD20070198A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0858062A (ja) * 1994-08-19 1996-03-05 Nippon Bunka Seiko Kk Ｃｄ多色印刷装置
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法

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