IT1310557B1 - Apparecchiatura per la produzione di circuiti elettronicimultistrato - Google Patents

Apparecchiatura per la produzione di circuiti elettronicimultistrato

Info

Publication number
IT1310557B1
IT1310557B1 IT1999UD000075A ITUD990075A IT1310557B1 IT 1310557 B1 IT1310557 B1 IT 1310557B1 IT 1999UD000075 A IT1999UD000075 A IT 1999UD000075A IT UD990075 A ITUD990075 A IT UD990075A IT 1310557 B1 IT1310557 B1 IT 1310557B1
Authority
IT
Italy
Prior art keywords
production
equipment
multilayer circuits
electronic multilayer
electronic
Prior art date
Application number
IT1999UD000075A
Other languages
English (en)
Inventor
Gisulfo Baccini
Original Assignee
Gisulfo Baccini
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gisulfo Baccini filed Critical Gisulfo Baccini
Priority to IT1999UD000075A priority Critical patent/IT1310557B1/it
Publication of ITUD990075A0 publication Critical patent/ITUD990075A0/it
Priority to DE60020187T priority patent/DE60020187T2/de
Priority to EP00106658A priority patent/EP1041865B1/en
Priority to US09/538,447 priority patent/US6370748B1/en
Publication of ITUD990075A1 publication Critical patent/ITUD990075A1/it
Application granted granted Critical
Publication of IT1310557B1 publication Critical patent/IT1310557B1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193—Electrical connector or terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Screen Printers (AREA)
  • Networks Using Active Elements (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
IT1999UD000075A 1999-04-02 1999-04-02 Apparecchiatura per la produzione di circuiti elettronicimultistrato IT1310557B1 (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT1999UD000075A IT1310557B1 (it) 1999-04-02 1999-04-02 Apparecchiatura per la produzione di circuiti elettronicimultistrato
DE60020187T DE60020187T2 (de) 1999-04-02 2000-03-29 Vorrichtung zur Herstellung von mehrschichtigen elektronischen Schaltungen
EP00106658A EP1041865B1 (en) 1999-04-02 2000-03-29 Device to produce multi-layer electronic circuits
US09/538,447 US6370748B1 (en) 1999-04-02 2000-03-30 Device to produce multi-layer electronic circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT1999UD000075A IT1310557B1 (it) 1999-04-02 1999-04-02 Apparecchiatura per la produzione di circuiti elettronicimultistrato

Publications (3)

Publication Number Publication Date
ITUD990075A0 ITUD990075A0 (it) 1999-04-02
ITUD990075A1 ITUD990075A1 (it) 2000-10-02
IT1310557B1 true IT1310557B1 (it) 2002-02-18

Family

ID=11422945

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1999UD000075A IT1310557B1 (it) 1999-04-02 1999-04-02 Apparecchiatura per la produzione di circuiti elettronicimultistrato

Country Status (4)

Country Link
US (1) US6370748B1 (it)
EP (1) EP1041865B1 (it)
DE (1) DE60020187T2 (it)
IT (1) IT1310557B1 (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017365A (ja) * 2001-04-26 2003-01-17 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法及び積層セラミック電子部品の製造装置
JP2002329965A (ja) * 2001-05-07 2002-11-15 New Create Kk 薄膜積層体の製造方法および製造装置
ITUD20050158A1 (it) * 2005-09-26 2007-03-27 Gisulfo Baccini Dispositivo robotizzato per la movimentazione di un oggetto
ITUD20050159A1 (it) * 2005-09-26 2007-03-27 Gisulfo Baccini Dispositivo per orientare una piastra di supporto rispetto ad una pluralita' di assi
DE102007003224A1 (de) * 2007-01-15 2008-07-17 Thieme Gmbh & Co. Kg Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen
US20100307022A1 (en) * 2007-06-26 2010-12-09 Gisulfo Baccini Drying apparatus and method for silicon-based electronic circuits
US8215473B2 (en) * 2008-05-21 2012-07-10 Applied Materials, Inc. Next generation screen printing system
ITUD20080141A1 (it) * 2008-06-19 2009-12-20 Baccini S P A Sistema di trasporto di precisione per stampa serigrafica
FR2932717B1 (fr) * 2008-06-24 2011-03-25 Dubuit Mach Machine a imprimer.
DE102012019573A1 (de) * 2012-09-25 2014-03-27 Ekra Automatisierungssysteme Gmbh Druckvorrichtung, Drucksystem, Verfahren
US9999546B2 (en) 2014-06-16 2018-06-19 Illinois Tool Works Inc. Protective headwear with airflow
US10070567B2 (en) * 2016-06-13 2018-09-04 Arris Enterprises Llc System for printed circuit board unlocking and automated reflow carrier recycling
US11812816B2 (en) 2017-05-11 2023-11-14 Illinois Tool Works Inc. Protective headwear with airflow
CN108657757A (zh) * 2018-05-23 2018-10-16 郑州云海信息技术有限公司 一种多层pcb生产设备
DE202020101145U1 (de) * 2020-03-02 2020-07-29 Inpeko Gmbh Vorrichtung zum Stapeln, Ausrichten und Verbinden von Leiterplattenlagen
DE202020101144U1 (de) * 2020-03-02 2020-07-30 Inpeko Gmbh Vorrichtung zum Stapeln und Verbinden von Leiterplattenlagen

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4228582A (en) * 1978-09-22 1980-10-21 Tokyo Print Industry Co., Ltd. Automatic production system for printed-wiring boards
DE2932845C2 (de) * 1979-08-14 1981-04-09 G. Siempelkamp Gmbh & Co, 4150 Krefeld Vorrichtung zum Zusammenlegen von Pressgutpaketen bei der Herstellung von Laminatplatten
DE3032931C2 (de) * 1980-09-02 1982-07-29 Robert Bürkle GmbH & Co, 7290 Freudenstadt Verfahren und Anordnung zur Herstellung von Mehrschicht-Leiterplatten
US4443278A (en) * 1981-05-26 1984-04-17 International Business Machines Corporation Inspection of multilayer ceramic circuit modules by electrical inspection of green specimens
JPH01282886A (ja) * 1988-05-09 1989-11-14 Ibiden Co Ltd 電子回路基板の乾燥方法及び乾燥装置
JPH02158306A (ja) * 1988-12-10 1990-06-18 Taiyo Yuden Co Ltd グリーンシート裁断積層方法とその装置
JPH02226790A (ja) * 1989-02-28 1990-09-10 Matsushita Electric Ind Co Ltd 基板の乾燥装置
US5292548A (en) * 1990-04-03 1994-03-08 Vistatech Corporation Substrates used in multilayered integrated circuits and multichips
JP2704562B2 (ja) * 1990-07-19 1998-01-26 株式会社村田製作所 積層セラミックコンデンサの製造方法
WO1992017047A1 (fr) * 1991-03-18 1992-10-01 Fujitsu Limited Systeme et procede pour la production de cartes a circuits imprimes
JP2601044B2 (ja) * 1991-04-10 1997-04-16 日本電気株式会社 積層装置
IT1250461B (it) * 1991-08-09 1995-04-07 Morton Int Inc Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati.
DE69207136T2 (de) * 1991-09-30 1996-05-15 Gisulfo Baccini Vorrichtung zur Bearbeitung von elektrischen Schaltungen
IT1252949B (it) * 1991-09-30 1995-07-06 Gisulfo Baccini Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento
IT1259732B (it) * 1992-07-07 1996-03-26 Gisulfo Baccini Dispositivo di prelievo, sovrapposizione e bloccaggio di fogli per circuiti green-tape
US5359760A (en) * 1993-04-16 1994-11-01 The Curators Of The University Of Missouri On Behalf Of The University Of Missouri-Rolla Method of manufacture of multiple-element piezoelectric transducer
JP3227482B2 (ja) * 1993-09-13 2001-11-12 ティーディーケイ株式会社 セラミック多層基板の製造方法及び装置
US5922168A (en) * 1995-09-28 1999-07-13 Pacific Trinetics Corporation Apparatus for making laminated electrical and electronic devices
JPH1070365A (ja) * 1996-08-28 1998-03-10 Shinko Electric Ind Co Ltd 多層回路基板の製造方法
JP3712151B2 (ja) * 1996-12-17 2005-11-02 日本電気硝子株式会社 多段積載型熱処理用治具
US6255039B1 (en) * 1997-04-16 2001-07-03 Isola Laminate Systems Corp. Fabrication of high density multilayer interconnect printed circuit boards
TW504104U (en) * 1997-04-24 2002-09-21 Ciba Sc Holding Ag Apparatus for the coating of flat-form substrates, especially of printed circuit boards

Also Published As

Publication number Publication date
EP1041865B1 (en) 2005-05-18
DE60020187D1 (de) 2005-06-23
ITUD990075A1 (it) 2000-10-02
EP1041865A2 (en) 2000-10-04
ITUD990075A0 (it) 1999-04-02
DE60020187T2 (de) 2006-01-26
EP1041865A3 (en) 2001-05-23
US6370748B1 (en) 2002-04-16

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