IT1252949B - Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento - Google Patents
Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimentoInfo
- Publication number
- IT1252949B IT1252949B ITUD910155A ITUD910155A IT1252949B IT 1252949 B IT1252949 B IT 1252949B IT UD910155 A ITUD910155 A IT UD910155A IT UD910155 A ITUD910155 A IT UD910155A IT 1252949 B IT1252949 B IT 1252949B
- Authority
- IT
- Italy
- Prior art keywords
- green
- tape
- sheet
- procedure
- station
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Screen Printers (AREA)
Abstract
Procedimento per la lavorazione di circuiti tipo green-tape in cui su un foglio sottile di allumina allo stato crudo o di altro materia analogo o assimilabile, vengono ottenuti i contatti passanti ed i circuiti elettrici mediante processo di stampa con una pasta in materiale conduttore, detti fogli green-tape potendo provenire da nastro o da magazzino di fogli pretagliati, in cui il foglio green-tape (10), comprendente i fori di collegamento passanti ed i segni di riferimento, viene posto su un trasportatore a nastro (12, 112) costituito da almeno un foglio traspirante, detto trasportatore a nastro (12, 112) venendo caricato con detto foglio green-tape (10), che viene rilevato come posizione rispetto a detto nastro, indi stampato previo reciproco posizionamento con organo di stampa, essiccato ed eventualmente evacuato, comprendendo almeno una stazione di caricamento (13), una stazione di rilevamento posizione (15) foglio green-tape (10), una stazione di stampa (18) ed una stazione di essiccazione (19) potendo dette stazioni essere singole o tra loro conglobate in numero di due o più.Pacchetto di fogli green-tape, il foglio green-tape superiore venendo saldato al foglio green-tape immediatamente inferiore per reciproco posizionamento fisso con almeno un elemento di saldatura.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD910155A IT1252949B (it) | 1991-09-30 | 1991-09-30 | Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento |
EP92113643A EP0535338B1 (en) | 1991-09-30 | 1992-08-11 | A method to process green-tape type circuits, and device that employs the method |
DE69201428T DE69201428T2 (de) | 1991-09-30 | 1992-08-11 | Verfahren zur Verarbeitung von Schaltungen des Greentape-Typs und Vorrichtung zur Durchführung des Verfahrens. |
US07/931,314 US5314711A (en) | 1991-09-30 | 1992-08-18 | Method and apparatus for printing green-tape foil circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD910155A IT1252949B (it) | 1991-09-30 | 1991-09-30 | Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento |
Publications (3)
Publication Number | Publication Date |
---|---|
ITUD910155A0 ITUD910155A0 (it) | 1991-09-30 |
ITUD910155A1 ITUD910155A1 (it) | 1993-03-30 |
IT1252949B true IT1252949B (it) | 1995-07-06 |
Family
ID=11420913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUD910155A IT1252949B (it) | 1991-09-30 | 1991-09-30 | Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento |
Country Status (4)
Country | Link |
---|---|
US (1) | US5314711A (it) |
EP (1) | EP0535338B1 (it) |
DE (1) | DE69201428T2 (it) |
IT (1) | IT1252949B (it) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2504277B2 (ja) * | 1990-04-19 | 1996-06-05 | 株式会社村田製作所 | 積層型セラミック電子部品用セラミックグリ―ンシ―トの製造方法および装置 |
IT1259732B (it) * | 1992-07-07 | 1996-03-26 | Gisulfo Baccini | Dispositivo di prelievo, sovrapposizione e bloccaggio di fogli per circuiti green-tape |
MY119247A (en) * | 1994-10-31 | 2005-04-30 | Tdk Corp | Manufacturing method and manufacturing apparatus for ceramic electronic components |
US5948200A (en) * | 1996-07-26 | 1999-09-07 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
IT1310555B1 (it) * | 1999-04-02 | 2002-02-18 | Gisulfo Baccini | Apparecchiatura per la produzione di circuiti elettronici |
IT1310557B1 (it) * | 1999-04-02 | 2002-02-18 | Gisulfo Baccini | Apparecchiatura per la produzione di circuiti elettronicimultistrato |
US6641860B1 (en) | 2000-01-03 | 2003-11-04 | T-Ink, L.L.C. | Method of manufacturing printed circuit boards |
US6762380B2 (en) * | 2001-06-29 | 2004-07-13 | Icorp | Membrane switch circuit layout and method for manufacturing |
JP2004087561A (ja) * | 2002-08-23 | 2004-03-18 | Fuji Mach Mfg Co Ltd | 多層基板製造工程集約機 |
DE10335230A1 (de) * | 2003-08-01 | 2005-02-17 | Man Roland Druckmaschinen Ag | Verfahren zur Herstellung von RFID Etiketten |
ITUD20050196A1 (it) * | 2005-11-17 | 2007-05-18 | Gisulfo Baccini | Apparecchiatura per la produzione di celle fotovoltaiche sottili in silicio e di circuiti elettronici in materiale rigido e flessibile |
DE102006015686C5 (de) * | 2006-03-27 | 2013-05-29 | Thieme Gmbh & Co. Kg | Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine |
DE102006051558A1 (de) * | 2006-11-02 | 2008-05-08 | Manz Automation Ag | Siebdruckanlage |
DE102007003224A1 (de) * | 2007-01-15 | 2008-07-17 | Thieme Gmbh & Co. Kg | Bearbeitungslinie für plattenartige Elemente, insbesondere Solarzellen, und Verfahren zum Bearbeiten von plattenartigen Elementen |
WO2009001379A1 (en) * | 2007-06-26 | 2008-12-31 | Afco C.V. | Drying apparatus and method for silicon-based electronic circuits |
GB2452320B (en) * | 2007-09-03 | 2012-04-11 | Dek Int Gmbh | Workpiece processing system and method |
ITUD20070156A1 (it) † | 2007-09-04 | 2009-03-05 | Baccini S P A | Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo |
ITUD20070195A1 (it) * | 2007-10-24 | 2009-04-25 | Baccini S P A | Procedimento di produzione e controllo di piastre per elettronica e relativo apparato |
US8215473B2 (en) * | 2008-05-21 | 2012-07-10 | Applied Materials, Inc. | Next generation screen printing system |
US20090308860A1 (en) * | 2008-06-11 | 2009-12-17 | Applied Materials, Inc. | Short thermal profile oven useful for screen printing |
ITUD20080141A1 (it) * | 2008-06-19 | 2009-12-20 | Baccini S P A | Sistema di trasporto di precisione per stampa serigrafica |
IT1392993B1 (it) * | 2009-02-23 | 2012-04-02 | Applied Materials Inc | Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica |
EP2256796A1 (de) * | 2009-05-29 | 2010-12-01 | Hennecke Systems GmbH | Vorrichtung zum Transport von Wafern und/oder Solarzellen |
JP5833122B2 (ja) * | 2010-08-17 | 2015-12-16 | ブルーム エナジー コーポレーション | 固体酸化物形燃料電池の作製方法 |
TW201448326A (zh) | 2013-03-15 | 2014-12-16 | Bloom Energy Corp | 抗磨損固體氧化物燃料電池電極墨水 |
US11498283B2 (en) | 2019-02-20 | 2022-11-15 | General Electric Company | Method and apparatus for build thickness control in additive manufacturing |
US11794412B2 (en) | 2019-02-20 | 2023-10-24 | General Electric Company | Method and apparatus for layer thickness control in additive manufacturing |
US11179891B2 (en) | 2019-03-15 | 2021-11-23 | General Electric Company | Method and apparatus for additive manufacturing with shared components |
US11865780B2 (en) | 2021-02-26 | 2024-01-09 | General Electric Company | Accumalator assembly for additive manufacturing |
US11951679B2 (en) | 2021-06-16 | 2024-04-09 | General Electric Company | Additive manufacturing system |
US11731367B2 (en) | 2021-06-23 | 2023-08-22 | General Electric Company | Drive system for additive manufacturing |
US11958249B2 (en) | 2021-06-24 | 2024-04-16 | General Electric Company | Reclamation system for additive manufacturing |
US11958250B2 (en) | 2021-06-24 | 2024-04-16 | General Electric Company | Reclamation system for additive manufacturing |
US11826950B2 (en) | 2021-07-09 | 2023-11-28 | General Electric Company | Resin management system for additive manufacturing |
US11813799B2 (en) | 2021-09-01 | 2023-11-14 | General Electric Company | Control systems and methods for additive manufacturing |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA931024A (en) * | 1970-12-19 | 1973-07-31 | H. Prange Bernard | Method and apparatus for silk screening a pattern on an underlying substrate |
US4307661A (en) * | 1979-04-20 | 1981-12-29 | Mccorquodale Machine Systems Limited | Printer with sheet feeder having registering station and suction conveyor |
US4362486A (en) * | 1980-10-07 | 1982-12-07 | International Business Machines Corporation | Automatic multilayer ceramic (MLC) screening machine |
US4695482A (en) * | 1986-01-21 | 1987-09-22 | Weiswurm Klaus D | Method and apparatus for coating of circuit boards |
DE3602350C2 (de) * | 1986-01-27 | 1994-08-18 | Weber Marianne | Verfahren und Anlage zum beidseitigen Beschichten von Platten mit flüssigem Beschichtungsmaterial |
GB2209521A (en) * | 1987-09-09 | 1989-05-17 | Era Patents Ltd | Green tape |
US4900580A (en) * | 1987-10-22 | 1990-02-13 | Klaus Grah | Process for the electrostatic lacquering of printed circuit boards |
US5079193A (en) * | 1988-08-01 | 1992-01-07 | E. I. Du Pont De Nemours And Company | Encapsulant composition |
US4845839A (en) * | 1988-10-31 | 1989-07-11 | Hamilton Standard Controls, Inc. | Method of making a resistive element |
JPH02310996A (ja) * | 1989-05-26 | 1990-12-26 | Hitachi Ltd | セラミック多層配線基板の製造方法 |
JP2852342B2 (ja) * | 1989-08-22 | 1999-02-03 | 松下電器産業株式会社 | スクリーン印刷方法 |
US5080929A (en) * | 1990-04-02 | 1992-01-14 | Delco Electronics Corporation | Method and apparatus for through hole substrate printing |
DE4030055A1 (de) * | 1990-09-22 | 1992-03-26 | Bosch Gmbh Robert | Verfahren zum herstellen einer schaltung |
-
1991
- 1991-09-30 IT ITUD910155A patent/IT1252949B/it active IP Right Grant
-
1992
- 1992-08-11 EP EP92113643A patent/EP0535338B1/en not_active Expired - Lifetime
- 1992-08-11 DE DE69201428T patent/DE69201428T2/de not_active Expired - Fee Related
- 1992-08-18 US US07/931,314 patent/US5314711A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ITUD910155A1 (it) | 1993-03-30 |
US5314711A (en) | 1994-05-24 |
ITUD910155A0 (it) | 1991-09-30 |
DE69201428T2 (de) | 1995-09-14 |
EP0535338B1 (en) | 1995-02-15 |
EP0535338A1 (en) | 1993-04-07 |
DE69201428D1 (de) | 1995-03-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19950927 |