GB2209521A - Green tape - Google Patents
Green tape Download PDFInfo
- Publication number
- GB2209521A GB2209521A GB8721189A GB8721189A GB2209521A GB 2209521 A GB2209521 A GB 2209521A GB 8721189 A GB8721189 A GB 8721189A GB 8721189 A GB8721189 A GB 8721189A GB 2209521 A GB2209521 A GB 2209521A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- composition
- layer according
- inorganic binder
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011230 binding agent Substances 0.000 claims abstract description 22
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003989 dielectric material Substances 0.000 claims abstract description 8
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 6
- 229920000388 Polyphosphate Polymers 0.000 claims abstract description 5
- 239000001205 polyphosphate Substances 0.000 claims abstract description 5
- 235000011176 polyphosphates Nutrition 0.000 claims abstract description 5
- 229910052723 transition metal Inorganic materials 0.000 claims abstract description 3
- 150000003624 transition metals Chemical class 0.000 claims abstract description 3
- 235000021317 phosphate Nutrition 0.000 claims abstract 3
- 150000001642 boronic acid derivatives Chemical class 0.000 claims abstract 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 claims abstract 2
- 150000004760 silicates Chemical class 0.000 claims abstract 2
- 239000000203 mixture Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 239000010452 phosphate Substances 0.000 claims description 8
- 239000003085 diluting agent Substances 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- OQZCJRJRGMMSGK-UHFFFAOYSA-M potassium metaphosphate Chemical group [K+].[O-]P(=O)=O OQZCJRJRGMMSGK-UHFFFAOYSA-M 0.000 claims description 3
- 235000019828 potassium polyphosphate Nutrition 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 239000002002 slurry Substances 0.000 description 8
- 238000010304 firing Methods 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/6303—Inorganic additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/129—Ceramic dielectrics containing a glassy phase, e.g. glass ceramic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
A green tape, in the form of a layer of substantially uniform thickness, is composed of a dielectric material and an inorganic binder. The dielectric material may be e.g. alumina, silica, lead borosilicate glass or alumina borosilicate glass. The inorganic binder may be e.g. selected from phosphates, silicates, borates, polyphosphates, polysilicates polyborates or polyacids of a transition metal.
Description
GREEN TAPE
FIELD OF THE INVENTION
The present inventIon relates to green tapes, their production and use.
BACKGROUND OF THE INVENTION
Green tapes are used in the production of multichip capacitors and hybrid circuit chips. Such products can be produced by screen-printing each of the alternating layers of dielectric and conducting layers. However, screen-printing of the dielectric often leaves pinholes which can only be covered by superimposition of screen-printed materials.
It may therefore be preferred, and it is often convenient, to screen-print a metal on to a pre-formed green tape which consists essentially of a particulate dielectric material and a binder. The green tapes are produced by doctoring a suitable composition including a diluent on to an inert material, followed by slow drying.
The dried tapes are flexible and can be removed from the inert material.
In the past, organic binders have been used to provide green strength by forming a self-supporting and flexible matrix holding the 'permanent' solids content.
By permanent is meant the particulate matter of dielectric which give the fired tape the characteristic dielectric properties.
After construction of the multi-layer product, it is compressed, usually at an elevated temperature, and then subjected to burnout. Burnout is caused by firing at 600-1000 C, during which process the organic binder constituent is allowed to burn off prior to the sintering and densification stages. However, substantial difficulty in processing occurs because of the reluctance of organic binders to leave the product completely and cleanly during the 'burnout' stage.
Processing difficulties arise as a result of retained carbonaceous material leading to the reduction of certain metal oxides. Metal oxide reduction by carbon to give carbon monoxide or carbon dioxide can lead to blistering and poor adhesion in multi-layer circuits.
Also volatilisation and redeposition of low melting point metals formed by reduction can occur in unwanted areas.
Moreover the large volume of binder content used in the manufacture of green tapes will generally lower the overall densification during firing, resulting in substantial porosity. If high density products are necessary then a significant reduction in volume will occur during the firing process. Large dimensional changes lead to difficulty in alignment if subsequent screen printing operations are to be carried out on the fired product.
SUMMARY OF THE INVENTION
A layer according to the invention (which for convenience may be termed a "green tape") is of substantially uniform thickness and of a composition which comprises a dielectric material and an inorganic binder. The invention thus avoids the use of organic binders.
DESCRIPTION OF THE INVENTION
A green tape of the invention may be produced by applying the composition in admixture with a diluent on to an inert substrate, levelling the composition to the substantially uniform thickness, drying the composition, and (if desired) removing the layer of the dried composition from the insert substrate. The inert substrate is a layer of, for example, Mylar.
The dielectric or 'permanent' component is e.g. a dielectric compound such as a fine powder frit of lead borosilicate glass. The amounts of the various constituents as applied may be, for example, 10-70% by weight binder solids, 5-45% by weight diluent and 5-85% by weight of the dielectric component. The dried green tape may comprise 9-94% binder solids and 6-91% dielectric.
The binder is preferably a phosphate, silicate, borate, polyphosphate, polysilicate or polyborate or a polyacid of a transition metal. Most of these materials are polymeric in nature to some extent. The term "polyacid" includes heteropolyacids such as tungstosilicic acid.
Especially preferred inorganic binders are a) potassium polyphosphate and b) aluminium acid phosphate which in an aqueous or organic system provide the necessary rheological characteristics and when dried the required 'green strength' for the green tape. Potassium polyphosphate (KPO3)n is an example of#a generic group of mono and mixed metal polyphosphates and may be made by a variety of methods of which a simple route applicable to laboratory production is the thermal dehydration of potassium dihydrogen orthophosphate (KH2PG4). After an appropriate time at temperature the melt is quenched to give soluble long-chain polyphosphate. Aluminium acid phosphate is also made by a variety of methods of which the mixing of fine alumina powder with phosphoric acid is the preferred example.A molar ratio of P205 : Al O of between 1 : 1.5 and 3 : 1 may be used. However, preference is given to lower ratios.
Water and/or a volatile organic compound may be used as a diluent. Organic diluents, b their nature, are completely removed during the drying process.
The binder component (a) or (b) above when in a suitable diluent provides the necessary viscosity and rheological properties for application and doctoring, and on drying off excess water forms a matrix binding the particulate permanent constituent together, to form a flexible, solid green tape. Drying at 25-2000C may be accomplished using batch or belt ovens in air or an inert atmosphere. The green tape at this stage is able to receive a screen printed layer of a conductor pattern.
The green tape is also sufficiently surface active to enable lamination of successive layers of dielectric, which may be accomplished using a uniaxial press, the procedure being carried out at room temperature. On firing, the inorganic binder constituent and various dielectric components form a robust and dense structure.
Firing of green tapes or of multilayer dielectrics containing an inorganic binder may be accomplished using conventional firing profiles, generally bell-shaped, with a peak temperature between 6000C and 1100cm depending on the sintering characteristics of the permanent phases.
In accordance with the invention, the co-firing of multi-layer laminated green tape in air or neutral atmospheres may be accomplished using inorganic binders without the problems of burnout attendant on the use of organic binders.
The following Examples illustrate the invention.
Percentages are by weight.
Example 1
A dielectric slurry was made using an aqueous solution of aluminium acid phosphate having a molar ratio P205:Al203 of 2:1. A quantity of this solution mixed
25 23 with silica powder was used to formulate a slurry suitable for casting green tape by a conventional doctor blading process. The slurry consisted of 22% silica, 39% hydrated aluminium acid phosphate and 39% water. A removable backing strip of acetate sheet was used to support the cast slurry. The cast tape was dried in air at 700C and the acetate sheet removed. It was then fired in a belt furnace with a conventional bell-shaped profile of 90 minutes with 10 minutes at peak of 900 cm. The resultant fired structure was dense and robust.
Example 2
A dielectric slurry was made using an aqueous solution of aluminium acid phosphate having a molar ratio P205:Al203 of 2:1. A quantity of this solution mixed with powdered alumina borosilicate glass was used to formulate a slurry suitable for casting green tape by a conventional doctor blading process. The slurry consisted of 40% glass, 39% hydrated acid phosphate and 21% water. A removable blacking strip of acetate sheet was used to support the cast slurry. The cast tape was dried in air at 700C and the acetate sheet removed. It was then fired in a belt furnace with a conventional bell-shaped profile of 90 minutes with 10 minutes at peak of 9000C. The resultant fired structure was dense and robust.
Claims (9)
1. A layer of substantially uniform thickness, of a composition which comprises a dielectric material and an inorganic binder.
2. A layer according to claim 1, in which the inorganic binder is selected from phosphates, silicates, borates, polyphosphates, polysilicates and polyborates.
3. A layer according to claim 1, in which the inorganic binder is a polyacid of a transition metal.
4. A layer according to claim 1, in which the inorganic binder is selected from potassium polyphosphate and aluminium acid phosphate.
5. A layer according to any preceding claim, in which the dielectric material is selected from alumina, lead borosilicate glass and alumina borosilicate glass.
6. A layer according to any preceding claim, which is 250 to 1000 ssm thick.
7. A layer according to claim 1, substantially as herein described.
8. A process for producing a layer according to any preceding claim, which comprises applying the composition in admixture with a diluent on to an inert substrate, levelling the composition to the substantially uniform thickness, drying the composition, and (if desired) removing the layer of the dried composition from the inert substrate.
9. A multi-layer dielectric which comprises, in alternation, (a) layers according to any of claims 1 to 7 or of layers produced by a process according to claim 8, and (b) conductor material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8721189A GB2209521A (en) | 1987-09-09 | 1987-09-09 | Green tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8721189A GB2209521A (en) | 1987-09-09 | 1987-09-09 | Green tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8721189D0 GB8721189D0 (en) | 1987-10-14 |
| GB2209521A true GB2209521A (en) | 1989-05-17 |
Family
ID=10623505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8721189A Pending GB2209521A (en) | 1987-09-09 | 1987-09-09 | Green tape |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2209521A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992000929A2 (en) * | 1990-07-11 | 1992-01-23 | E.I. Du Pont De Nemours And Company | Boron aluminum phosphates and boron aluminum phosphosilicates for electronic packaging |
| EP0535338A1 (en) * | 1991-09-30 | 1993-04-07 | Gisulfo Baccini | A method to process green-tape type circuits, and device that employs the method |
| US6749769B2 (en) | 2001-03-09 | 2004-06-15 | E. I. Du Pont De Nemours And Company | Crystalline compositions of doped aluminum phosphate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1150465A (en) * | 1966-05-13 | 1969-04-30 | Ibm | Improvements in and relating to Ceramic Compositions |
| GB1218008A (en) * | 1968-05-31 | 1971-01-06 | Du Pont | Dielectric compositions |
| US3609483A (en) * | 1969-07-01 | 1971-09-28 | American Lava Corp | Thick film titanate capacitor composition |
| GB1408256A (en) * | 1974-02-08 | 1975-10-01 | Du Pont | Dielectric compositions and glass frits for use as components thereof |
| US4071881A (en) * | 1976-03-30 | 1978-01-31 | E. I. Du Pont De Nemours And Company | Dielectric compositions of magnesium titanate and devices thereof |
| GB1513237A (en) * | 1975-07-24 | 1978-06-07 | Kkf Corp | Coating compositions processes for depositing the same and articles resulting therefrom |
| GB1548117A (en) * | 1976-12-27 | 1979-07-04 | Philips Nv | Dielectric compositions |
-
1987
- 1987-09-09 GB GB8721189A patent/GB2209521A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1150465A (en) * | 1966-05-13 | 1969-04-30 | Ibm | Improvements in and relating to Ceramic Compositions |
| GB1218008A (en) * | 1968-05-31 | 1971-01-06 | Du Pont | Dielectric compositions |
| US3609483A (en) * | 1969-07-01 | 1971-09-28 | American Lava Corp | Thick film titanate capacitor composition |
| GB1408256A (en) * | 1974-02-08 | 1975-10-01 | Du Pont | Dielectric compositions and glass frits for use as components thereof |
| GB1513237A (en) * | 1975-07-24 | 1978-06-07 | Kkf Corp | Coating compositions processes for depositing the same and articles resulting therefrom |
| US4071881A (en) * | 1976-03-30 | 1978-01-31 | E. I. Du Pont De Nemours And Company | Dielectric compositions of magnesium titanate and devices thereof |
| GB1548117A (en) * | 1976-12-27 | 1979-07-04 | Philips Nv | Dielectric compositions |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992000929A2 (en) * | 1990-07-11 | 1992-01-23 | E.I. Du Pont De Nemours And Company | Boron aluminum phosphates and boron aluminum phosphosilicates for electronic packaging |
| WO1992000929A3 (en) * | 1990-07-11 | 1992-08-06 | Du Pont | Boron aluminum phosphates and boron aluminum phosphosilicates for electronic packaging |
| EP0535338A1 (en) * | 1991-09-30 | 1993-04-07 | Gisulfo Baccini | A method to process green-tape type circuits, and device that employs the method |
| US5314711A (en) * | 1991-09-30 | 1994-05-24 | Gisulfo Baccini | Method and apparatus for printing green-tape foil circuits |
| US6749769B2 (en) | 2001-03-09 | 2004-06-15 | E. I. Du Pont De Nemours And Company | Crystalline compositions of doped aluminum phosphate |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8721189D0 (en) | 1987-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH08507038A (en) | Low temperature firing route for aluminum nitride ceramics | |
| JPH03257041A (en) | Dielectric composition | |
| US4997795A (en) | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | |
| GB2209521A (en) | Green tape | |
| JPS6248097A (en) | Manufacture of multilayer circuit board | |
| WO1989001461A1 (en) | Co-sinterable metal-ceramic packages and materials therefor | |
| JP3678260B2 (en) | Glass ceramic composition | |
| GB2207440A (en) | Thick film ink | |
| US4525387A (en) | Process for metallizing the surface of a ceramic | |
| JP3287303B2 (en) | Dielectric ceramic composition and ceramic electronic component using the same | |
| JP4580923B2 (en) | Low-frequency fired porcelain composition for high frequency, its manufacturing method and electronic component | |
| JPS6049149B2 (en) | Manufacturing method of white alumina/ceramic for electronic parts | |
| JPH10297960A (en) | Ceramic composition baked at low temperature and production of porcelain baked at low temperature | |
| JPS62209895A (en) | Insulating paste for ceramic multilayer interconnection board | |
| US3801337A (en) | Sintering aids for producing alumina dielectric compositions cofireable with palladium | |
| JP3426820B2 (en) | Copper metallized composition and method for producing glass ceramic wiring board using the same | |
| JPH01179777A (en) | Production of low-dielectric ceramics | |
| JP2891518B2 (en) | Manufacturing method of aluminum nitride multilayer wiring board | |
| SU1754682A1 (en) | Glass for insulating metal coating | |
| JPH1125754A (en) | Manufacture of copper-metallized composition and glass-ceramic substrate | |
| JPS622406A (en) | Insulating paste for multilayer substrate | |
| EP0242226A2 (en) | Glass-ceramic materials with low firing temperature | |
| JP3778949B2 (en) | Insulating paste and method for forming insulating layer using insulating paste | |
| JPS63109050A (en) | Ceramic substrate | |
| JPS63260199A (en) | Dielectric ink for multilayer copper circuit |