IT1392993B1 - Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica - Google Patents

Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica

Info

Publication number
IT1392993B1
IT1392993B1 ITUD2009A000045A ITUD20090045A IT1392993B1 IT 1392993 B1 IT1392993 B1 IT 1392993B1 IT UD2009A000045 A ITUD2009A000045 A IT UD2009A000045A IT UD20090045 A ITUD20090045 A IT UD20090045A IT 1392993 B1 IT1392993 B1 IT 1392993B1
Authority
IT
Italy
Prior art keywords
printing
support material
material substrate
procedures
improved useful
Prior art date
Application number
ITUD2009A000045A
Other languages
English (en)
Inventor
Andrea Baccini
Marco Galiazzo
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2009A000045A priority Critical patent/IT1392993B1/it
Priority to US13/202,961 priority patent/US20120034382A1/en
Priority to EP09779538A priority patent/EP2399434A1/en
Priority to CN2009801575978A priority patent/CN102326459A/zh
Priority to PCT/EP2009/056331 priority patent/WO2010094347A1/en
Priority to TW099105056A priority patent/TW201034852A/zh
Publication of ITUD20090045A1 publication Critical patent/ITUD20090045A1/it
Application granted granted Critical
Publication of IT1392993B1 publication Critical patent/IT1392993B1/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/20Supports for workpieces with suction-operated elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715Changing the direction of the conveying path
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41PINDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00Screen printing machines
    • B41P2215/10Screen printing machines characterised by their constructional features
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0293Non-woven fibrous reinforcement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0156Temporary polymeric carrier or foil, e.g. for processing or transferring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/082Suction, e.g. for holding solder balls or components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/085Using vacuum or low pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Screen Printers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
ITUD2009A000045A 2009-02-23 2009-02-23 Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica IT1392993B1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ITUD2009A000045A IT1392993B1 (it) 2009-02-23 2009-02-23 Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica
US13/202,961 US20120034382A1 (en) 2009-02-23 2009-05-25 Substrate support material useful for screen printing processes
EP09779538A EP2399434A1 (en) 2009-02-23 2009-05-25 Improved substrate support material useful for screen printing processes
CN2009801575978A CN102326459A (zh) 2009-02-23 2009-05-25 有助于丝网印刷处理的改善的基板支撑材料
PCT/EP2009/056331 WO2010094347A1 (en) 2009-02-23 2009-05-25 Improved substrate support material useful for screen printing processes
TW099105056A TW201034852A (en) 2009-02-23 2010-02-22 Improved substrate support material useful for screen printing processes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2009A000045A IT1392993B1 (it) 2009-02-23 2009-02-23 Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica

Publications (2)

Publication Number Publication Date
ITUD20090045A1 ITUD20090045A1 (it) 2010-08-24
IT1392993B1 true IT1392993B1 (it) 2012-04-02

Family

ID=40949295

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2009A000045A IT1392993B1 (it) 2009-02-23 2009-02-23 Materiale di supporto substrato migliorato utile per procedimenti di stampa serigrafica

Country Status (6)

Country Link
US (1) US20120034382A1 (it)
EP (1) EP2399434A1 (it)
CN (1) CN102326459A (it)
IT (1) IT1392993B1 (it)
TW (1) TW201034852A (it)
WO (1) WO2010094347A1 (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
IT1402241B1 (it) * 2010-09-13 2013-08-28 Applied Materials Inc Unita' per il trasporto di un supporto di stampa in un impianto per la deposizione di tracce di stampa su tale supporto di stampa, e relativo procedimento per il trasporto
CN102700237B (zh) * 2012-05-09 2015-08-26 华南理工大学 一种具有双平台的全自动视觉硅片印刷装置
ITUD20120122A1 (it) * 2012-07-06 2014-01-07 Applied Materials Italia Srl Procedimento ed apparato per il controllo dell'avanzamento di un materiale di supporto per un nido di stampa e materiale di supporto per un nido di stampa
DE102013103837A1 (de) 2013-04-16 2014-10-16 Teamtechnik Maschinen Und Anlagen Gmbh Aufbringen von Leitkleber auf Solarzellen
GB2514102A (en) * 2013-05-11 2014-11-19 Dtg Int Gmbh Workpiece handling system and method
WO2015069279A1 (en) * 2013-11-08 2015-05-14 Empire Technology Development Llc Apparatus and methods for detecting substrate alignment during a printing process
EP2918410A1 (en) * 2014-03-10 2015-09-16 Applied Materials Italia S.R.L. Rotary table and solar cell processing system
DE102017204630A1 (de) 2017-03-20 2018-09-20 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
CN107809847A (zh) * 2017-11-20 2018-03-16 上海御渡半导体科技有限公司 一种能适应不同形状电路板的夹持和打孔机构
PT3725523T (pt) * 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1228277B (de) * 1963-03-28 1966-11-10 Zimmer Johannes Einrichtung zum Festhalten eines flaechenfoermigen Materials
US3741116A (en) * 1970-06-25 1973-06-26 American Screen Process Equip Vacuum belt
IT1252949B (it) * 1991-09-30 1995-07-06 Gisulfo Baccini Procedimento per la lavorazione di circuiti tipo green-tape e dispositivo adottante tale procedimento
DE19509313A1 (de) * 1995-03-15 1996-09-19 Schmid Gmbh & Co Geb Verfahren und Vorrichtung zum Behandeln von plattenförmigen Gegenständen, insbesondere Leiterplatten
IT1310555B1 (it) 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronici
US20020112632A1 (en) * 2001-02-21 2002-08-22 Creo Ltd Method for supporting sensitive workpieces during processing
TWI232509B (en) * 2001-07-25 2005-05-11 Tokyo Electron Ltd Processing apparatus and processing method

Also Published As

Publication number Publication date
WO2010094347A1 (en) 2010-08-26
EP2399434A1 (en) 2011-12-28
TW201034852A (en) 2010-10-01
CN102326459A (zh) 2012-01-18
US20120034382A1 (en) 2012-02-09
ITUD20090045A1 (it) 2010-08-24

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