NO20006133D0 - Elektronisk halvlederkomponent - Google Patents

Elektronisk halvlederkomponent

Info

Publication number
NO20006133D0
NO20006133D0 NO20006133A NO20006133A NO20006133D0 NO 20006133 D0 NO20006133 D0 NO 20006133D0 NO 20006133 A NO20006133 A NO 20006133A NO 20006133 A NO20006133 A NO 20006133A NO 20006133 D0 NO20006133 D0 NO 20006133D0
Authority
NO
Norway
Prior art keywords
semiconductor component
electronic semiconductor
electronic
component
semiconductor
Prior art date
Application number
NO20006133A
Other languages
English (en)
Other versions
NO20006133L (no
Inventor
Ryuichi Tanaka
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of NO20006133D0 publication Critical patent/NO20006133D0/no
Publication of NO20006133L publication Critical patent/NO20006133L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1272—Semiconductive ceramic capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Ceramic Capacitors (AREA)
  • Led Device Packages (AREA)
NO20006133A 1999-12-03 2000-12-01 Elektronisk halvlederkomponent NO20006133L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34549399A JP2001167908A (ja) 1999-12-03 1999-12-03 半導体電子部品

Publications (2)

Publication Number Publication Date
NO20006133D0 true NO20006133D0 (no) 2000-12-01
NO20006133L NO20006133L (no) 2001-06-05

Family

ID=18376965

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20006133A NO20006133L (no) 1999-12-03 2000-12-01 Elektronisk halvlederkomponent

Country Status (4)

Country Link
US (1) US6385034B2 (no)
EP (1) EP1107265A3 (no)
JP (1) JP2001167908A (no)
NO (1) NO20006133L (no)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW412755B (en) * 1998-02-10 2000-11-21 Murata Manufacturing Co Resistor elements and methods of producing same
JP2003051423A (ja) * 2001-08-03 2003-02-21 Tdk Corp 電子部品
US20070007621A1 (en) * 2005-03-30 2007-01-11 Yamaha Corporation Fuse breakdown method adapted to semiconductor device
JP4525753B2 (ja) * 2005-08-19 2010-08-18 株式会社村田製作所 積層セラミックコンデンサ
JP2007134555A (ja) * 2005-11-11 2007-05-31 Matsushita Electric Ind Co Ltd 電子部品及びその製造方法
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
JP4600309B2 (ja) * 2006-02-13 2010-12-15 Ｔｄｋ株式会社 バリスタ及び発光装置
TWI427646B (zh) 2006-04-14 2014-02-21 Bourns Inc 具表面可裝設配置之傳導聚合物電子裝置及其製造方法
US20080057619A1 (en) * 2006-08-30 2008-03-06 Honeywell International Inc. Microcontainer for Hermetically Encapsulating Reactive Materials
JP4378370B2 (ja) * 2006-09-25 2009-12-02 Ｔｄｋ株式会社 積層コンデンサ
JP4378371B2 (ja) * 2006-09-29 2009-12-02 Ｔｄｋ株式会社 積層コンデンサ
JP4385385B2 (ja) * 2006-12-14 2009-12-16 Ｔｄｋ株式会社 積層コンデンサ
WO2009001842A1 (ja) * 2007-06-27 2008-12-31 Murata Manufacturing Co., Ltd. 積層セラミック電子部品及びその実装構造
JP4428446B2 (ja) * 2007-12-28 2010-03-10 Ｔｄｋ株式会社 積層コンデンサ
DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
US8446705B2 (en) 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
JP2010073759A (ja) * 2008-09-16 2010-04-02 Tdk Corp 積層型チップバリスタ及び電子部品
JP5472667B2 (ja) * 2011-02-04 2014-04-16 株式会社村田製作所 バリスタ機能付き積層型半導体セラミックコンデンサとその製造方法
DE102011109007A1 (de) * 2011-07-29 2013-01-31 Epcos Ag Verfahren zum Herstellen eines elektrischen Bauelements und elektrisches Bauelement
KR102126420B1 (ko) * 2013-06-10 2020-06-24 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터 실장 기판
US20150146340A1 (en) * 2013-11-26 2015-05-28 Qualcomm Incorporated Multilayer ceramic capacitor including at least one slot
JP2014220528A (ja) * 2014-08-13 2014-11-20 株式会社村田製作所 積層コンデンサ
JP2014222783A (ja) * 2014-08-13 2014-11-27 株式会社村田製作所 積層コンデンサ及び積層コンデンサの実装構造体
KR102236098B1 (ko) * 2015-02-16 2021-04-05 삼성전기주식회사 적층 세라믹 전자 부품
SG11201805724QA (en) * 2016-03-07 2018-09-27 Avx Corp Multi-layer electronic device
CN111542900B (zh) * 2017-12-01 2022-04-15 京瓷Avx元器件公司 低纵横比压敏电阻
JP7200499B2 (ja) * 2018-04-26 2023-01-10 Tdk株式会社 積層コイル部品
KR20200040429A (ko) * 2018-10-10 2020-04-20 삼성전기주식회사 적층 세라믹 전자부품
DE102019105116A1 (de) * 2019-02-28 2020-09-03 Tdk Electronics Ag Bauelement
KR20190116171A (ko) * 2019-09-17 2019-10-14 삼성전기주식회사 적층형 전자 부품

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3740624A (en) * 1972-06-21 1973-06-19 Sprague Electric Co Monolithic capacitor having corner internal electrode terminations
US4731697A (en) * 1987-05-05 1988-03-15 Avx Corporation Arc resistant trimable ceramic capacitor
JPH01312817A (ja) * 1988-06-09 1989-12-18 Murata Mfg Co Ltd 積層セラミックコンデンサの製造方法
JPH03178107A (ja) * 1989-12-06 1991-08-02 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JPH0590064A (ja) * 1991-09-26 1993-04-09 Nec Kansai Ltd 積層セラミツクコンデンサ及びその製造方法
JPH0590062A (ja) * 1991-09-26 1993-04-09 Matsushita Electric Ind Co Ltd 積層型粒界絶縁型半導体セラミツクコンデンサ
JPH06208903A (ja) * 1993-01-11 1994-07-26 Murata Mfg Co Ltd 正の抵抗温度特性を有する積層型半導体磁器
JPH0897071A (ja) * 1994-09-29 1996-04-12 Kyocera Corp 積層型磁器コンデンサ
US6153069A (en) * 1995-02-09 2000-11-28 Tall Oak Ventures Apparatus for amperometric Diagnostic analysis
JPH09260198A (ja) * 1996-03-25 1997-10-03 Taiyo Yuden Co Ltd 積層コンデンサ
US5872695A (en) * 1997-02-26 1999-02-16 International Business Machines Corporation Integrated electronic components having conductive filled through holes
JPH10275736A (ja) * 1997-03-28 1998-10-13 Tdk Corp 積層基板の切断位置の良否判定方法と積層セラミック電子部品
JP3684290B2 (ja) * 1997-06-16 2005-08-17 太陽誘電株式会社 積層電子部品とその製造方法
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor

Also Published As

Publication number Publication date
NO20006133L (no) 2001-06-05
EP1107265A2 (en) 2001-06-13
US6385034B2 (en) 2002-05-07
EP1107265A3 (en) 2006-03-29
JP2001167908A (ja) 2001-06-22
US20010002873A1 (en) 2001-06-07

Similar Documents

Publication Publication Date Title
NO20006133L (no) Elektronisk halvlederkomponent
DE60027515D1 (de) Elektronisches Gerät
DE69943120D1 (de) Integrierte Halbleiterschaltung
DE69927658D1 (de) Integrierte Halbleiterschaltung
DE69824972D1 (de) Integrierter halbleiterschaltkreis
DE60034070D1 (de) Integrierte Halbleitervorrichtung
DE50015308D1 (de) Elektronisches steuergerät
DE69940029D1 (de) Halbleiterbauelement
DE60227475D1 (de) Halbleiterbauelement
DE69937739D1 (de) Halbleitervorrichtung
DE60035580D1 (de) Halbleiter
DE60135728D1 (de) Integrierte Halbleiterschaltung
DE60025067D1 (de) Cmos Halbleiter integrierte Schaltung
DE60035917D1 (de) Elektronisches Bauteil
DE69920486D1 (de) Halbleiterschaltung
DE60005959D1 (de) Halbleiteranordnung
DE60225790D1 (de) Halbleiterbauelement
DE60032651D1 (de) Halbleitermodul
DE60042381D1 (de) Integrierte Halbleiterschaltungsanordnung
DE69830561D1 (de) Integrierte Halbleiterschaltung
DE60019144D1 (de) Halbleitervorrichtung
DE60028934D1 (de) Schaltungsanordnung
DE60041030D1 (de) Halbleiterbauelement
DE60041856D1 (de) Elektronisches bauteil
DE60139439D1 (de) LC-integriertes elektronisches Bauteil

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application