JP5735809B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP5735809B2 JP5735809B2 JP2011004968A JP2011004968A JP5735809B2 JP 5735809 B2 JP5735809 B2 JP 5735809B2 JP 2011004968 A JP2011004968 A JP 2011004968A JP 2011004968 A JP2011004968 A JP 2011004968A JP 5735809 B2 JP5735809 B2 JP 5735809B2
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M14/00—Electrochemical current or voltage generators not provided for in groups H01M6/00 - H01M12/00; Manufacture thereof
- H01M14/005—Photoelectrochemical storage cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
- Hybrid Cells (AREA)
Description
[装置全体の構成]
[全処理工程の手順]
[処理部の構成]
[シャトル搬送部の構成]
[枚葉搬送機構の構成]
[枚葉搬送機構の基本動作]
[枚葉搬送機構の転送形態1]
[枚葉搬送機構の転送形態2]
[枚葉/バッチ搬送機構の構成]
[枚葉/バッチ搬送機構の動作]
[バッチ式熱処理装置内の動作]
[バッチ式焼成装置の動作手順]
[実施形態における主な作用効果]
[他の実施形態または変形例]
10A,10C,200A 枚葉集中ブロック
10B 枚葉/バッチ混載ブロック
12 ローダ
14 アンローダ
18 ローダ搬送機構
24 アンローダ搬送機構
40,214 バッチ式熱処理装置
42,216 バッチ式焼成装置
44 枚葉式色素吸着ユニット
46 搬送ライン
48,52,56,60 枚葉搬送機構
50,58,74 枚葉シャトル搬送部
32,208 枚葉式洗浄ユニット
34,210 枚葉式パターンニング・ユニット
36,211 枚葉式作用極成膜ユニット
38,212 枚葉式グリッド配線成膜ユニット
MU1,ML1 枚葉搬送アーム
MU10 バッチ搬送アーム
SU1 上部枚葉シャトル
SL1 下部枚葉シャトル
Claims (4)
- 連続的に投入される各々の基板に対して枚葉処理とバッチ処理とをこの順序で連続的に施す基板処理装置であって、
前記バッチ処理を繰り返し行うバッチ式処理部と、
プロセスフローの順に基板を搬送するための搬送ライン上で前記バッチ式処理部の周囲に設けられる搬送機構と
を有し、
前記搬送機構は、鉛直方向に昇降可能であって、各々独立に方位角方向の回転移動と水平方向の進退移動または伸縮移動とを行える第1および第2の搬送アームを有し、
前記第1の搬送アームは一度に1枚の基板を保持可能であり、前記2の搬送アームは一度に複数枚の基板を保持可能であり、
前記搬送機構は、前記バッチ式処理部に搬入されるべき基板を前記プロセスフローの上流側から前記第1の搬送アームにより1枚受け取る動作と、前記バッチ式処理部より搬出された基板を前記第2の搬送アームにより複数枚一括して前記プロセスフローの下流流側に送り出す動作とを同時に行う、
基板処理装置。 - バッチ処理枚数の基板を一列に並べて保持するように構成された複数のボートと、
前記バッチ式処理部と前記搬送機構との間に設けられ、前記複数のボートに対して順番に、前記バッチ処理枚数までの基板の装入が完了したいずれかのボートを前記搬送機構のアクセス可能な位置から前記バッチ式処理部へ移し、前記バッチ処理が済んだ前記バッチ処理枚数の基板を保持している他のいずれかのボートを前記バッチ式処理部から前記搬送機構のアクセス可能な位置へ移すボート移送部と
を有し、
前記搬送機構は、前記バッチ式処理部から前記搬送機構のアクセス可能な位置へ移されたいずれかの前記ボートに対して、1回のアクセスで、前記第2の搬送アームを用いて前記バッチ処理の済んだ基板を複数枚一括して取り出す動作と、前記第1の搬送アームを用いて前記バッチ処理を受ける前の基板を1枚装入する動作とを連続して行う、
請求項1に記載の基板処理装置。 - 連続的に投入される各々の基板に対してバッチ処理と枚葉処理とをこの順序で連続的に施す基板処理装置であって、
前記バッチ処理を繰り返し行うバッチ式処理部と、
プロセスフローの順に基板を搬送するための搬送ライン上で前記バッチ式処理部の周囲に設けられる搬送機構と
を有し、
前記搬送機構は、鉛直方向に昇降可能であって、各々独立に方位角方向の回転移動と水平方向の進退移動または伸縮移動とを行える第1および第2の搬送アームを有し、
前記第1の搬送アームは一度に1枚の基板を保持可能であり、前記2の搬送アームは一度に複数枚の基板を保持可能であり、
前記搬送機構は、前記バッチ式処理部に搬入されるべき基板を前記プロセスフローの上流側から前記第2の搬送アームにより複数枚一括して受け取る動作と、前記バッチ式処理部より搬出された基板を前記第1の搬送アームにより1枚単位で前記プロセスフローの下流側に送り出す動作とを同時に行う、
基板処理装置。 - バッチ処理枚数の基板を一列に並べて保持するように構成された複数のボートと、
前記バッチ式処理部と前記搬送機構との間に設けられ、前記複数のボートに対して順番に、前記バッチ処理枚数までの基板の装入が完了したいずれかのボートを前記搬送機構のアクセス可能な位置から前記バッチ式処理部へ移し、前記バッチ処理が済んだ前記バッチ処理枚数の基板を保持している他のいずれかのボートを前記バッチ式処理部から前記搬送機構のアクセス可能な位置へ移すボート移送部と
を有し、
前記搬送機構は、前記バッチ式処理部から前記搬送機構のアクセス可能な位置へ移されたいずれかの前記ボートに対して、1回のアクセスで、前記第1の搬送アームを用いて前記バッチ処理の済んだ基板を1枚取り出す動作と、前記第2の搬送アームを用いて前記バッチ処理を受ける前の基板を複数枚一括して装入する動作とを連続して行う、
請求項3に記載の基板処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011004968A JP5735809B2 (ja) | 2011-01-13 | 2011-01-13 | 基板処理装置 |
TW100143528A TW201246435A (en) | 2011-01-13 | 2011-11-28 | Substrate processing apparatus |
PCT/JP2012/000024 WO2012096144A1 (ja) | 2011-01-13 | 2012-01-05 | 基板処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011004968A JP5735809B2 (ja) | 2011-01-13 | 2011-01-13 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012146862A JP2012146862A (ja) | 2012-08-02 |
JP5735809B2 true JP5735809B2 (ja) | 2015-06-17 |
Family
ID=46507053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011004968A Expired - Fee Related JP5735809B2 (ja) | 2011-01-13 | 2011-01-13 | 基板処理装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5735809B2 (ja) |
TW (1) | TW201246435A (ja) |
WO (1) | WO2012096144A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019167235A1 (ja) * | 2018-03-01 | 2019-09-06 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6243784B2 (ja) * | 2014-03-31 | 2017-12-06 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置 |
JP6559976B2 (ja) * | 2015-03-03 | 2019-08-14 | 川崎重工業株式会社 | 基板搬送ロボットおよび基板処理システム |
WO2018182505A1 (en) * | 2017-03-31 | 2018-10-04 | Neitas Pte. Ltd. | Microdevice manufacturing system |
JP6751735B2 (ja) * | 2018-07-25 | 2020-09-09 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP7336955B2 (ja) | 2019-10-10 | 2023-09-01 | 東京エレクトロン株式会社 | 基板処理システム、及び基板処理方法 |
JP7536582B2 (ja) | 2020-10-01 | 2024-08-20 | ニデックインスツルメンツ株式会社 | 搬送システム |
JP2024029982A (ja) * | 2022-08-23 | 2024-03-07 | 株式会社Screenホールディングス | 基板処理装置 |
JP2024044507A (ja) * | 2022-09-21 | 2024-04-02 | 株式会社Screenホールディングス | 基板処理装置 |
CN115841976B (zh) * | 2023-02-21 | 2023-05-05 | 无锡江松科技股份有限公司 | 一种硅片转运设备和方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05214535A (ja) * | 1992-02-03 | 1993-08-24 | Dainippon Screen Mfg Co Ltd | 基板移載装置 |
TW276353B (ja) * | 1993-07-15 | 1996-05-21 | Hitachi Seisakusyo Kk | |
JP2929260B2 (ja) * | 1993-12-31 | 1999-08-03 | 東京エレクトロン株式会社 | 塗布膜形成方法及びその装置 |
JP2003152047A (ja) * | 2001-11-09 | 2003-05-23 | Sharp Corp | 半導体装置の生産システム |
JP4378114B2 (ja) * | 2003-06-18 | 2009-12-02 | 東京エレクトロン株式会社 | 処理システム |
JP4436689B2 (ja) * | 2004-01-28 | 2010-03-24 | マルヤス機械株式会社 | ガラス基板の搬送システム |
JP4464993B2 (ja) * | 2007-06-29 | 2010-05-19 | 東京エレクトロン株式会社 | 基板の処理システム |
JP2009147266A (ja) * | 2007-12-18 | 2009-07-02 | Mitsubishi Heavy Ind Ltd | 薄膜太陽電池製造装置システム及び共通基板保管ラック |
JP5355908B2 (ja) * | 2008-03-05 | 2013-11-27 | 住友電気工業株式会社 | 無線通信システム及び基地局装置 |
JP4980978B2 (ja) * | 2008-04-17 | 2012-07-18 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2011
- 2011-01-13 JP JP2011004968A patent/JP5735809B2/ja not_active Expired - Fee Related
- 2011-11-28 TW TW100143528A patent/TW201246435A/zh unknown
-
2012
- 2012-01-05 WO PCT/JP2012/000024 patent/WO2012096144A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019167235A1 (ja) * | 2018-03-01 | 2019-09-06 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
Also Published As
Publication number | Publication date |
---|---|
JP2012146862A (ja) | 2012-08-02 |
TW201246435A (en) | 2012-11-16 |
WO2012096144A1 (ja) | 2012-07-19 |
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