TW201246435A - Substrate processing apparatus - Google Patents

Abstract

To enable continuous and efficient conveyance of a substrate between a single wafer processing apparatus and a batch processing apparatus, thereby improving throughput when single wafer and batch processing are combined. A substrate processing apparatus, in which a rectangular process station 10 is placed at the center of the system so as to link a loader 12 and an unloader 14 positioned at either end of the process station in the lengthwise direction (X direction). The process station 10 comprises a wafer collection block 10A, a combined single wafer/batch processing block 10B, and a wafer collection block 10C, positioned in the order of the process flow from the loader 12 toward the unloader 14. In the central combined single wafer/batch processing block 10B, one or more single wafer working electrode deposition units 36, one or more single wafer gridline deposition units 38, a batch heat treatment device 40, and a batch sintering device 42 are provided.

Description

201246435 VI. Description of the Invention: " [Technical Fields of the Invention] [0001] A substrate processing process in which a micro-machining process is applied to a surface of a board, and a processing device for transferring the sheets to each process [Prior Art] [0002] A variety of processes for the production process of the solar cell such as the solar cell, such as a semiconductor wafer or a glass substrate. In particular, the substrate is processed. Processing 4 sets 'to perform a series of steps is(10)=required time is === (4) tree setting situation, due to the single-chip processing of the process and the batch processing of the cracked building line == the shape f, Different, and very difficult to achieve a single-chip online system, the batch-type processing of the single-chip line is purely finished, the whole single is separated and shouted, and will be in the box, and the truck After loading into the batch = the substrate is temporarily stored in the wafer n. From the wafer to be loaded, the batch processing device is loaded into the batch processing device and the substrate is loaded into the batch processing sheet each time. , the whole batch of batch processing is applied in the device, compared to the ^^ device (chamber Then, the wafer boat is moved out of the container to remove the processed substrate and the processing, and then removed from the processing capacity [Practical Technical Document] 至0 boat to the wafer cassette. 201246435 [0004] [Problem to be Solved by the Invention] As described above, conventionally, it has not been possible to continuously and efficiently transport a substrate between monolithic processing units. The technology, and 'over-rule! District to accept the substrate to accept, to mix the single-chip processing ^ batch mixing processing processing is very difficult. /, batch-person processing early film [0006 The invention solves the above-mentioned prior art (4) problem-solving device, which can carry the monolithic/^H device between the single-chip processing device and the wide and efficient substrate transfer [0007] The amount of treatment of the mosquito/batch-human 4 treatment is improved. Moreover, the present invention also provides a substrate processing apparatus, 处理. Processing amount. ~ _ 'The efficiency of moving i; [Technical means to solve the problem] [0008] Input the butterfly ίί第单=The period from time ^ and repeat this The second monolithic processing; ^ u from the time period of the substrate, and the number of the single-chip processing single-chip processing batch processing number into the Guhai Dihao, the soil board to the mother batch collection s In the first batch of the 2012-0435 processing unit, the Haihedi 1 batch recognition processing unit has collectively removed the 2nd batch. The board has been processed, and the batch is processed from the first batch. The base single-chip processing unit of the number of times of processing is carried out from the substrate of the first processing unit to the first processing substrate, and the processing unit is carried out one by one. The second processing unit is completed. Batch processing sheet number The substrate carried out by the early sheet processing unit is collectively carried out by the first batch type processing unit from the ith batch processing unit, and the batch is batched from the i-th substrate. The number of processed batches of the batch [0009] The substrate carried out at the location is transported to the subsequent stage. Processing Department - No. The J plate-surface is subjected to the first monolithic processing by the jus unit in the first monolithic processing unit i, and the second monolithic processing is performed by the second unit, and the second monolithic processing is performed. It was moved to the back section. , the first batch: the human processing unit accepts the second batch [0010] The rational basis:: 5: = 丄: second processing, the mediation of the processing unit of the first single piece is carried out one by one. Moreover, the transporting sheet 4;: the first batch type is carried into the second single i=plate one by one, and then the unloaded substrate is processed by a single piece t; the intermediate type is a batch type processing unit- (2) The batch processing method is carried out to the first batch of the textual 'plates, and the batch processing unit and the batch processing medium processing unit are used to act as the second single piece. [0011] As described above, the interleaving is performed. The substrate is transported in batches and transported in batches, so it can be carried out not only between the two sets, but also between the batch processing devices, even between the single piece = 201246435 5 Continuous and efficient substrate transfer [0012] 吏 片 片 / batch: The processing capacity of human mixing processing is greatly improved. The processing cost of the 1 ϊ ί 1 1 兼 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理 处理[0013] The substrate processing apparatus according to the first aspect includes a batch type processing unit that repeatedly performs a desired batch process for each of the substrates that are continuously injected in a cycle of the production time interval; a plurality of wafer boats, holding the column for 'to perform the batch processing; moving the wafer boat' until the batch processing number is reached, and the batch is completed from the round boat every time The processed ί ϋ ϋ ΐΐ ΐΐ 清空 清空 清空 清空 清空 清空 清空 清空 清空 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆Any one of the wafer boats is moved from the position picked up by the transport mechanism to the batch processing unit, and any other part of the batch processed substrate is transferred to the transport mechanism for accessing s position. (4) k-human-process [0014] observing the basic miscellaneous towel, the single or single-piece transport unit of the transport mechanism to the substrate processing of the batch processing unit (4) other batch processing units on the downstream side or The base L of the batch type conveying unit is conveyed continuously and efficiently. [0015] For the 3_ shouting reduction device, there is included: a subtraction part, a mother-to-person substrate that is injected into the tablet, each time for a given batch processing piece 201246435 • ί desired batch processing; For a plurality of wafer boats, the batch is placed in the ϊϊΐίϊϋ® boat, and the substrate before the batch processing is to be received in each order; TM ^ 5 ^ until the wafer is formed:: ί after the batch is processed The substrate and the batch processing unit are disposed at the position of the transport mechanism at the position of the transport mechanism, and the transport mechanism can access the transport mechanism to the wafer transporter. The sub-processing unit shifts [0016], and the batch processing unit or the batch type in the above-mentioned configuration is such that the batch-type sub-processing unit on the upstream side goes to the downstream side and is transported from the batch. Integrated, continuous and efficient or early-type transfer unit substrate [0017] The route theory contains: the first and second transport in the first "normal transport road = on the first transport route, in the first 2 Transfer route: 2:: _ brother 2 fci line other end (four) m - position, and the second transport path 1 transport : To the first «substrate transport! Or the same ^2^=== in the second process. 15, arranged at the other end of the first line, the first discharge position is provided between the first row and the row U, and the first transport path has a secondary load. The base of the predetermined number is 'the second transport shuttle, and the other end of the line is provided with the second and second war positions, and the first structure is set to be movable with the third and second movements; the first transporter ϊϊ, One or a plurality of substrates of the transport substrate; the first one is used to transport the substrate in the first one. The pick-up is provided for transporting the heart at the base of the second transport route. At least one of the second regions is configured to apply a desired single-piece process or batch process to the substrate, and the first transport mechanism uses the first transfer arm to mount the first transfer arm at the first and second loading positions The predetermined number of substrates are loaded into the i-th and second transport shuttles. 2 The transport mechanism uses the second transport arm, and is removed from the first and second transport shuttles at the second and second discharge positions. And the substrate of the predetermined number of sheets; and independently performing: the operation of transporting the substrate from the second loading position to the first discharge position by the first transport shuttle, and the second transport shuttle The substrate is transported from the second loading position to the discharge position. [0018] In the substrate processing apparatus according to the fourth aspect, the shuttle tray is independently moved from the first loading position to the first (fourth) position as described above. The operation of transporting a single piece or a single piece, and the operation of transporting the substrate from the second position to the second discharge position by the second transfer shuttle in a single piece or in a batch. [_] The force 1 transport mechanism is only in the first or Any one of the second transport shuttles stays on the ί\2 ί load position during the loading of one substrate or a whole batch of multiple sheets, and the configuration is as long as any of the first or second transport shuttles. = Matching = 1, 2 The transfer shuttle is fixed and cares about the transmission or transmission of the transport mechanism on the other side. There is no need to [0020] The route contains the first and second transports. The second phase of μ of the predetermined number of sheets; the line loading position, the number of the predetermined number of sheets to be transported to the first transport path, and the movement; the second transport shuttle, the other end of the transport route is provided with the second The loading position, the second and the second unloading position are moved back and forth; No. 201246435 • Carrier Provided to be accessible to the first and second loading positions, and having one or a plurality of first transport arms for transporting the substrate in the first region; and the second transporting structure, a is further settable ???said first and second discharge positions are picked up, and one or a plurality of second transfer arms for transporting the substrate in the second region; and a processing portion disposed in the first and second regions At least one of which is used to apply a desired single-piece processing or batch processing to the substrate; and the third transporting means uses the third transporting arm, and the predetermined number of substrates are at the first and second loading positions Loading the second and second transport shuttles, the second transport mechanism using the second transport arm, and removing the predetermined number of sheets from the first and second transport shuttles at the first and second discharge positions And the substrate is alternately carried out. The first transport shuttle transports the substrate from the second loading position to the i-th discharge position, and the substrate is transported from the second loading position by the second transport shuttle. § Hai's second unloading position action. [0021] In the substrate processing apparatus according to the fifth aspect, the parent is replaced by a predetermined production time as described above: the substrate is transferred from the second loading position to the first processing position by the i-th handling shuttle. The recording and relocation operation and the transfer of the substrate from the 2nd loading position to the second unloading position by the second transport shuttle are carried out in a single piece or in a batch. [0022] ί 5 The transport mechanism is provided in the first and second transport shuttles. After the production time interval: one substrate or one load substrate can be loaded during the first and second loading positions. In the second transport mechanism, the first and second transports may be alternately placed in the second and second discharge positions of the second and second discharge positions, or the plurality of substrates may be unloaded in a batch. Each of the transport mechanisms can directly transfer or transport the substrate as long as the transport shuttle is fixed and periodically reciprocating, and there is no need to care about the operation or condition of the transport mechanism on the other side. [0023] The substrate processing apparatus according to the sixth aspect includes a transport line that is transported horizontally, and a handle that is transported from the upstream side to the downstream side of the processing flow, and the first transport (four)' § on the miscellaneous line. The processing unit performs substrate transfer every time the mosquitoes are placed in the same order as the 201246435 first single sheet, and the second transport mechanism is disposed on the transport line from the first transport mechanism to the downstream side, and the predetermined number of sheets is set each time. The substrate transfer is performed by the two single-piece processing units disposed in the vicinity of the ground, and the first and second transfer shuttles are reciprocally movable, and one section of the transfer line is formed, and the substrate is connected to the predetermined number of sheets. The first and second loading positions adjacent to the first transport mechanism are loaded at the first and second discharge positions of the second transport mechanism and are individually transported. [0024] In the substrate processing skirt of the sixth aspect of the present invention, it is possible to independently enter the ^, the shuttle board from the third position to the first

Pj is placed in the early film or batch handling action. Therefore, the first conveyor; the batch can be loaded with a plurality of wires. In the second transport mechanism, either the first or second transport shuttle is in the second or second unloading position, and the plurality of substrates can be removed in batches. It is only necessary to pay attention to the transfer or transfer of the Ϊ, and it is not necessary to care about the other side of the transporter == [Effect of the invention] [0025] The single-chip processing apparatus can be processed by the chip by the above-described configuration and action μ^^, the throughput is increased by the efficiency of each sheet. [Embodiment] Embodiments of the present invention will be described with reference to the additional drawings 201246435. [0028] FIG. 1 is a system of a substrate processing apparatus according to an embodiment of the present invention. Composition. This substrate processing apparatus is a step of producing a laminate assembly on the transparent substrate side before bonding to the counter electrode on the line in the manufacturing process of the dye-sensitized solar cell having the cross-sectional structure shown in Fig. 23, for example. [0029] The dye-sensitized solar cell has a basic configuration in which a plurality of semiconductor fine particle layers (working electrodes) carrying a sensitizing dye are sandwiched between a transparent electrode electrode 300 and a counter electrode (anode) 302. 304 and electrolyte layer 3〇6. Here, the 粒子 particle layer =04 is divided into a unit unit by the transparent electrode 300, the electric boundary layer 3〇6, and the counter electrode 3〇2, and is formed on the transparent substrate 3〇8 via the transparent electrode 300. The counter electrode 302 is formed on the counter substrate 31A via the base electrode 305. The single transparent electrode 300 is electrically connected to the adjacent counter electrode 3〇2, and is connected to a plurality of single tL series in-line or in parallel. In the type shown, ',, the transparent electrode is shaped and the individual particles are discriminated; and the grid-like wiring 312 for collecting electricity is extended in parallel with the crucible, and the opposite electrode (positive; ^) 302 The same lattice-like wiring 314 is also formed on the side. Further, the 配线-shaped wirings 312 and 314 are respectively covered with a protective insulating film 316. [0030] In the dye-sensitized solar cell of such a configuration, when the light is seen from the transparent substrate 3, the dye held by the semiconductor fine particle layer 304 is excited by (f) electrons. The emitted electrons are guided to the bright electrode 300 via the semiconductor fine particle layer 3G4, and are sent out to the outside. The dye received in the g j particle layer 3ΰ4 is received, and the light energy is instantaneously transferred. [0031] The substrate processing apparatus of the If, the transparent electrode 300 is formed by the substrate G. Then, on the line for each substrate G, 13 201246435 electrode 300 patterning, semiconductor fine particle layer 3〇4 film formation, semiconductor fine particle layer 304 quenching, and dye adsorption to the semiconductor layer The main process, the plaque accompanying-recording layer 304, the heat and simplicity. Mei, axis ===== #层组件 on the side of the substrate 308 (difficult _ 〇 月 ^ 透 308, the laminated component to the base of the next step = = is the processed substrate G. Again, this ramie The substrate (10) in the heart shape is formed to have four corners [constitution of the device as a whole] [0032] In the process of processing, the machine and the unloader 14 are in the side direction (Χ) Mounting at both ends of the direction) [0033] The surface carrier 12 is a stacker that carries the Fulu self-propelled van in units of wafer cassettes, and includes: In the width direction (Υ direction), a plurality of wafers I are placed in parallel with each other, and the body 18a is moved on the body 18a. And the board transfer table 20 can be miscellaneously connected (10), and the substrate (4) can be transmitted and received through the fixed base [0034] and the joint MG#. All 11^ are 0 units and will be processed on the substrate. When the mounting is completed, the substrate G that the Japanese person has processed is, for example, removed from the self-propelled transport vehicle, and the substrate G that is arranged in the width direction (Y direction) of the θ22α/1 system is Level 1: The solid-core C system will hold a plurality of pieces (25 pieces) in the longitudinal direction of the water and maintain the water; and the unloading machine handling mechanism 24, 14 201246435 will process the substrate (3 pieces by piece, the unloader The transport mechanism 24 JL is housed in γ 7 A, one wafer cassette C, and a main body 24a that can move forward and backward on the main body 24a or move on the private, θ, f-axis, and a fixed substrate transfer table 26, and盥 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 处理 处理 处理 处理 处理 处理 处理 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 The block in the upstream side of the loader 12 or the plurality of single-chip cleaning units is provided with an i-unit 34. Each of the single-chip cleaning units 32 has a device for cleaning one by one by pattern. And each monolithic type, the surface to be processed of G, touches the surface of the substrate g to be processed into a transparent electrode 300. The electric layer is patterned and sliced one by one [0037] The middle single > { / batch mixed block Cong, the chip working electrode film forming unit 36, i A ^ has 1. or a plurality of single The monolithic grid-like wiring of the membrane unit 38 and the batch type heat treatment device is formed into a working electrode film forming unit 36 and a dummy burning device 42. The surface of the monolithic substrate G to be processed is formed into a film one by one. = coating to apply the film forming unit 38 as a single electrode in the monolithic grid-like wiring. 3 〇 4. The cloth is applied to the surface to be treated of the substrate G, and the protective film 316 is applied by, for example, printing. The surface to be treated of the substrate G after the large-scale wiring of the heat treatment apparatus 4 is coated and baked (printed (10) sheets). In addition, the number of batches of the dummy processing (for example, the surface to be processed of the substrate G (4) afterwards] [0038] 201246435 #1014, the single-chip concentrated block 10C on the downstream side of the carrier 14 is equipped with a complex μ I ί 1 type dye adsorption unit 44. Each of the monolithic dye adsorption units 44 has a porous surface formed by the surface of the semiconductor semiconductor to be processed, and is provided with a longitudinal or a tour. In the blocks 1A, 10B, and 10C, the substrate α is transported in the order of processing. The ship's single-chip concentrated block 10Α's substrate transfer table 20, single-chip transporter, and cymbal transport shuttle transport The portion 50 is disposed in one section of the two conveyance lines 46 along the longitudinal direction of the system (X direction), and is in the left Hi single-chip cleaning unit 32 and the one-chip pattern sing unit 34 of the single-piece conveyance mechanism 48. -H The detailed configuration in the brain of the single-chip/batch mixed block is displayed. As shown in the mixed block _, the single-chip concentrated area from the upstream side is introduced, i static t early shuttle transport unit 50. The transport shuttle transport unit 50 ί is provided with a single-piece transport mechanism 52, a substrate transfer table, a cup piece 56, and a single-piece transport at a predetermined position. The shuttle transport unit 58, the single-piece transport mechanism 60, the single-subsidiary transport mechanism 64, the batch transport shuttle transport unit 66, the batch-to-person transport _ 68, the batch transport shuttle transport unit 7〇, the lot, and the single chip = _ part 74, _ structure, tb: single-chip operation lightning-pole film forming unit 36 disposed around the single-piece conveying mechanism 52, single-piece conveying shuttle conveying unit 50 (discharging position) and substrate Μ ϊΓ ϊΓ The ff structure 56 can be accessed from any of its adjacent batch-type hot mouths _, 80C, _ transfer station 54, and single-chip = ^ two-load position. Green is 58 (4 [0043] The single-piece transport mechanism 60 can be formed in a single-piece grid-like wiring arranged around it. 16 201246435 • Element %, single-piece transport shuttle transport unit 58 (discharge position) and substrate transfer a 62 , 隹-g. 曰 mechanism 64 can be adjacent to the batch type heat treatment unit = factory 0 boat placement σ 82, 84 placed on the second wafer boat 88d, _ position), substrate transfer station 62 and batch The secondary shuttle shuttle unit 66 (bag loading [0044] ▲ transport mechanism 68 and batch: trial weaving I set 42 is the third round 96 96 98 ^ day on the 3 wafer boat 9 仏,働, the fourth wafer boat is loaded with the Taiwanese; the ίί日日舟1〇〇Α, 1〇〇Β, the batch handling shuttle transport unit 66 (unloading, position) and the batch: the person transporting the shuttle transport unit 7 〇(褒载位置) is taken in. [0045] 曰The rounding mechanism 72 can be combined with the gamma-a device 42 on the 5th: ιό4, 5th wafer boat, _, 6th wafer- The sixth wafer boat 112A, 112B, the batch transport shuttle [Ou ΐΓ and the single-piece transport shuttle transport unit 74 (aged) are accessed. The f+fr underheat thermal device 40 includes one vertical batch. The secondary heat treatment furnace 114 has the first and second in the second: The boat transfer machines 116 and U8 are disposed with three first wafer boat mounting tables 75, 76, and 78 around the first wafer machine m, and three second crystals are disposed around the wafer boat transfer machine 118. The boat mounting table 82, 〇4 '86 ° [0047] The 1 wafer boat mounting table 75, 76, 78, the wafer boat mounting table 75, Δ used for the substrate G before processing and the processed substrate G The wafer boat loading port 78 is used to cool the substrate G that has just been subjected to heat treatment. Further, in the second wafer boat 82, 84, 86, the wafer boat mounting table 84 is used after the substrate G before processing. In the modification of the substrate G, the wafer boat mounting table 82 is used for standby of the wafer boat in which the pre-process substrate G has been loaded in the batch, and the wafer boat mounting table 86 is used for the heat treatment just received. The substrate G is cooled. [0048] As described in detail later, the batch type heat treatment apparatus 40 sequentially repeats the first wafer boat 80, 80B, 80C by the first wafer boat transfer machine 116. Perform the following actions: Action 1, placing two of the wafer boats on the modified crystals that can be picked up from the single-piece transport mechanism % On the boat mounting tables 76 and 75, the substrate 〇 after the processing is taken out and the substrate G before the processing is loaded; and in the operation 2, the remaining i wafer boats are placed in the vertical batch heat treatment furnace 114. The heat treatment is performed, or one crystal® boat is placed on the cooling_wafer boat mounting table 78, and the heat is cooled after the heat treatment. Ding] Fancheng [0049] π ^ two-type heat treatment device 40 utilizes the second crystal The boat transfer machine U8 repeats the following operations for the three second wafer boats 88D, 88Ε, and 88F in sequence: =1 'Place one of the wafer boats in a single piece/batch The mechanism 64 performs the processing on the wafer boat mounting table 84 for processing. The mounting of the substrate G is carried out; the operation 2 'the other wafer boat that has finished the batch processing of the boat carrying the substrate G is placed in the wafer 114 for standby ^ 3 ' One of the wafer boats is placed in the vertical batch furnace boat or the remaining one wafer boat is placed on the wafer boat mounting σ 86 for cooling to perform the cold after the heat treatment is completed. 0050] (10), = a plurality of vertical stacks, for example, four vertical batches, a third wafer boat transfer machine 128,

^Multi-carrier 130, the third squirrel 124 and the fifth wafer carrier L

The sixth wafer boat transfer machine 134 is disposed between the fourth n5/boat transfer machine 132, the fourth fire floor 126, and the sixth wafer boat. In addition, the third to the sixth 72#liS^ 'Γ〇〇5ί] the rear substrate and the financial substrate G modified. 201246435 As explained in detail later, also on the top (3), in order to replace the squid ^ burned the £42 coffee third wafer boat transfer machine action: action 1, the third wafer boat 94A, 94B repeated The following was moved to the first simmering furnace 12 〇. The two boats are burned from the first stack of the wafer boat mounts 90, 92 from the first stack; and the action 2, the other one is processed, the substrate G is taken from the boat, 92 Either one of them is taken out in [0052] J and loaded in the substrate G before processing. In sequence, the G pair device 42 uses the fourth wafer boat transfer machine 130 to perform the operation 1, and the ι'Γ-/wafer boat 1〇〇Α, 100Β is repeatedly subjected to the following operations to perform the wave burning process; And in the action 2, the other one of the slabs 122 is moved to the wafer boat mounting table 96, 98 to perform the unloading and the loading of the substrate G before the processing. The sixth lane secondary burning device 42 uses the fifth wafer boat transfer machine 132, sequentially or = two second wafers, and the B (two) ΐ one wafer boat is moved from the wafer boat mounting platform. The younger brother ^: U Lu 124 to perform the smoldering treatment; and the action, the third; the smoldering furnace 124 is moved to the wafer boat mounting table (10), (10), one of the ones = the substrate G after the boat is taken out, and The substrate G before processing [0054] and the "batch-type pseudo-sintering device 42" uses the sixth crystal|boat transfer machine 134, and the second and sixth wafer boats 112A and (4) repeatedly perform the following operations. : moving the one of the wafer boats from the wafer boat mounting table 1 to 8, 110 to the 4' W for firing; and the action 2, removing the other substrate 1 And the loading of the substrate G before the processing. [0055] In the monolithic concentrated block 1〇c on the downstream side, the single-piece transport shuttle transport unit 74 and the single-piece transport mechanism introduced from the secondary mixed block 10B are 13# 19 201246435 The substrate transfer table 26 is arranged in a row along the longitudinal direction of the system (X direction) to form a section (final section) of the transport line 46, and a plurality of sheets are arranged on the left and right sides of the single-piece transport mechanism 136. A sheet dye adsorption unit 44. [Sequence of all processing steps] [0056] Here, the sequence of all processing or transporting steps performed by the substrate processing apparatus on one substrate will be described. First, in the loader 12, the loader transport mechanism 18 extracts one substrate Gn from any of the platforms 16, and places the extracted substrate Gn on the base [0058], α and then the monolithic transport mechanism. The substrate Gn is removed from the substrate transfer table 20 and fed into the one-chip cleaning unit 32. At this time, before the substrate is transferred to the one-piece cleaning unit 32, the unit 32 carries out the other clear cleaning that has just completed the cleaning process. Washing the main unit 32, for the surface to be processed of the substrate Gn (two === of the cover layer. By the cleaning process), from the end of the single-chip cleaning process of the film [0060], the single-chip handling The mechanism 48 applies a one-piece patterning process from the single m4 _ 彳 completion pattern 之 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Tiioo*4ίΐ*

20 201246435 [0062] The indium tin oxide electrode 300 is made of, for example, fluorine-doped Sn〇2 (FTO) from, for example, quartz or glazed rice. Moreover, the transparent plastic material such as the transparent substrate 308 of the base material G, or the like, or the polyester, acryl, or polyimine [0063], when the single-piece processing is completed, the single-piece conveying mechanism 48 5〇. The substrate Gn' is carried out in a single piece and loaded into the single-piece transport shuttle transport unit. The transport unit 5G transports the loaded substrate 仏 from the loading position to the loading position. [0064] The transport unit 2 sends the transport shuttle f At the unloading position of the 5G part, the single piece is moved to % ^ ± _ 11 Ρ and moved into any one of the single-chip working electrode film formation 36, before the substrate is moved into the The monolithic working electrode film forming unit is formed by a film forming process; the ni plate is just completed with the working electrode (semiconductor particle layer) [0065] r chip working electrode thin unit 36, for example, screen printing method for the substrate grain 22 Wang's formation of patterned semiconductors on the surface of the substrate quot" Further, the semiconductor fine particle layer 304 is made of, for example, a metal oxide of Ti〇2, Zn0, and Sn02. ^nU2 [0066] 52 From the end of the ϋ-type working f-electrode film forming process, the monolithic transport mechanism Li Γ type 乍 electrode forming unit 36 1 out of the substrate Gn and transferred to the substrate 54. Subsequently, the opposite side single (four) transport mechanism 52 is turned off from the substrate transfer table 54 5, and the removed substrate Gn is placed on the neighboring wafer =, 7" 6 placed on the first! The wafer boat is 8〇A, _, or any of them. Here, the wafer boat in which the substrate Gn is loaded onto the wafer boat mounting table 75 is calculated. [0067] 201246435 When the number of sheets of the substrate (including the substrate Gn) that has been loaded into the wafer boat 80A reaches the number of batch processing sheets (one wafer), the first wafer boat transfer machine 116 will be used. The wafer boat 8M is moved from the wafer boat mounting table 75 to the side of the vertical batch heat treatment furnace 114, and then placed in a heat treatment furnace 114. Then, when the heat treatment time is determined, the wafer boat 8GA is taken out to the heat treatment furnace m, and the wafer boat transfer machine is moved to the wafer boat mounting table for cooling, so that the wafer boat is tender. The held substrate 011 is cooled together with other substrates in the air space for a certain period of time. Thereafter, the wafer boat transfer machine 116 moves the wafer boat from the wafer boat mounting table 78 to the modified wafer boat mounting table 76. [0068] In this way, the single-chip transport mechanism 56 draws the substrate raft on the wafer boat on the predetermined cis 76, and transports the extracted substrate 口 口 运 职 职 【 【 【 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 When the unloading position of the shuttle conveyance portion 58 is reached, the single piece is moved to the bottom, and the transfer is carried out until the table is wired in the grid to form the unit 38, and the substrate is loaded into the single-piece grid-like wiring. Film formation; 316 film formation treatment ^ substrate 0 ' ' = [0070] plate / sub-shape = fine unit 38 'off the screen version _ method for the base material in a lattice shape is indeed a grid-like wiring layer The second surface (fine 312 is made of, for example, Ag#, which has a low resistivity, j: a wiring layer such as UV (ultraviolet) hardening resin, etc.; constitutes Bao Yun 316 by example [0071] 22 201246435 . When the order is completed, the film is processed, and the film transfer unit 38 carries out the substrate & and transfers the transfer table 62 to take the sheet on the back side. The sheet/batch handling mechanism 64 is placed on the wafer boat from the substrate/84; it is loaded into the neighboring one. In this example, the two 8E, 88F [0072] ° is also calculated to load the substrate into the wafer boat 88E. ^Into the wafer board 88 (including the substrate G) of the wafer boat: ^^^ to the crystal for standby The boat mounting table 82 is next to the predetermined: '' furnace 114. Then, when the heat treatment furnace 1 is finished, the film 88E ^ ^ 118 is moved to the wafer boat mounting table for cooling, so that Fight

Hi clever board Gn and other substrates - from the cooling in the atmosphere ^ time :. The wafer boat transfer machine 118 transfers the wafer boat 88E to the wafer boat mounting table 84 for retrofitting. Round 廿 1 1 86 Move [0073] In this way, the single-chip/batch handling mechanism 64 纽 纽 纽 纽 帽 舟 ΐ ΐ Γ Γ ΐ ΐ ΐ ΐ ΐ , , , , , , , , , , , , , , , , , , , , , , , , , , , , The substrate is in the same manner as the portion 66. The batch transporting portion 66 carries the loaded substrate Gn) from the loading position in a fine manner. [0074] When the plurality of substrates G including the substrate Gn arrive at the batch handling shuttle transport portion At the unloading position of 66, the batch transfer mechanism 68 collects the scalar number #substrate G. Then, the batch transport mechanism 68 distributes the plurality of substrates G (which also include the substrate Gn) that are collectively detached to 4 Any one of the vertical batch type simmering furnaces 12, 122, 124, and 126. In this example, the fourth sintering furnace 126 is designed as a distribution target. [0075] 23 201246435 Auntie this situation 'batch The secondary transport mechanism 68 transports the plurality of sheets including the substrate Gn to the secondary transport shuttle #70. The batch transport shuttle transport unit 70 transports the carry G from the loading position to the unloading position in a batch. The sub/H structure 72 removes the plurality of substrates G including the substrate Gn from the batch. The sixth wafer loading station 108, 110 is any one of the wafer boat 112''112β. In this example, the crystal is designed to be loaded onto the wafer boat mounting table 110 together with other substrates G. The boat [0076] also 'when the number of sheets of the substrate G (which also includes the substrate Gn) that has been loaded into the wafer boat 112B reaches the number of batch processing (segmentation), the sixth wafer is used to move the The wafer boat 112B is moved to the fourth crucible furnace U6 such that the substrate Gn is crystallized, and the other substrates on the boat 112B are subjected to the smoldering treatment. The sintered body of the semiconductor fine particle layer 304 is obtained by the dummy burning treatment on the surface to be processed of the f-substrate Gn. When the batch type simmering treatment is completed, the wafer boat n2B is taken out to the crucible furnace 126. The substrate Gn on the wafer 112B is cooled together with the other substrates in the atmospheric space for a certain period of time. Thereafter, the 'batch/monolithic transport mechanism 72 picks up the wafer boat on the boat loading port 11 at a predetermined time point, and in a predetermined order, from the wafer boat 112B in units of one piece. The substrate Gn is extracted, and the extracted substrate Gn is loaded into the single-piece transport shuttle transport unit 74. The one-piece transport shuttle transport unit 74 transports the loaded substrate Gn from the loading position to the discharge position. When the substrate Gn reaches the discharge position of the single-piece conveyance shuttle conveying unit 74, the single-piece conveyance mechanism 136 removes the substrate Gn and carries it into the one-piece single-piece dye adsorption unit 441. Before the substrate cassette 11 is carried into the monolithic dye adsorption unit 44, the substrate outside the dye processing is taken from the unit 44, and the substrate is removed from the unit. [_] The monolithic dye adsorption unit 44 loaded with the substrate Gn is fed with a dye solution from the nozzle to the surface to be processed (porous semiconductor fine particle layer 3〇4) of the substrate Gn, and the material 24 adsorption unit 44 201246435 The 4&sublayer wide layer f4/ and the sensitizing dye are used. Further, the dye may be an organic dye such as a metal phthalocyanine or a basic dye such as a metal phthalocyanine. Further, the solvent can be transported from the single sheet conveying mechanism 136 26 from the end of the dyeing treatment. Γΐΐ 兀 贱 贱 贱 贱 贱 贱 贱 贱 贱 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 载 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其A crystal with box C. [0080] The single-chip Si element=page is set in the center portion of the flat 140 of [0081] of the substrate processing apparatus of the present embodiment. The substrate G is placed on the ground, and the substrate 142 is used. Applying ^&^4' to the surface of the substrate G (the singulation unit 34 to be placed, or the monolithic pattern element 38 for smashing, and the use of nozzle dyes) The cans of the single = bismuth and the attached 44 are for this type! In this case, the nozzle 144 of the etch device is equipped with a laser exit unit, i nozzle 144, spout nozzle and attachment device The nozzle of the spit. The conductor is laminar, slit or round, etc. 25 201246435 [0082] The second type of Figure 3B is in the same room with the processing chamber or cavity $ (10) By using the head 1S2 which can listen to the straight chicken in the horizontal direction above the rotating chuck 150, the table raft of the substrate G is adsorbed as early as 44 for this type 2. In the case of the single = device, Or in the nozzle of the pattern dye adsorption head 152, the nozzle for ejecting the etching liquid is carried out. ' [0083], the base LI and the load [0084] (Fig. 4A) When the processed substrate Gi and the substrate (4) of the disk are exchanged on the stage 142, initially, the plurality of lift pins 154 are pushed up from the substrate Gi of t'(4). Therefore, the second spoon: the spoon I is transported from the side wall of the processing chamber (10) to the processing chamber 14° from the side wall of the processing chamber (10), and the substrate 1 is received from the lifting pin 154, and the substrate is received. The Gi is taken away from the processing chamber 140, and the lift pin is temporarily lowered. Subsequently, the lower holding arm ML, which will be described later, should be fed to the substrate Gj, which is received by the one-chip processing unit, into the processing chamber 140, and the subsequent πτϋ54 rises again to receive the substrate Gj. After that, it has become empty. White =. After the transfer of the arm to the processing chamber (10), the lift pin 154 is lowered to the flat σ 42 and the substrate q is placed on the platform ία. In the type 2 (Fig. 4B), the lift pin 156 in the rotary drive unit 148 or the lift pin 156 may be attached to the transfer arm 同样 in the same manner as the lift pin 154. 26 201246435 ML! The lifting operation is carried out in cooperation with the ML, and the substrate is heated and the substrate is subsequently received. [0086] This is a batch-type heat treatment device. 4 sides of the vertical batch batch heat treatment furnace 114 with n and cylinder wm, and in the first! Wafer boat transfer machine boat mounting table 75, 76, 78, and the name flute 9 曰 ... solid, set with 3 brothers 1 crystal, 3 second wafer boat mounted a 82, 84 曰 two boat transfer machine 118 is arranged around the table 75, 76, 78; round; 8^. As described above, the first wafer boat is placed on the wafer, and the boat mounts 75 and 76 are used to retrofit the substrate G, and J11; i 怃 the heat-treated substrate G is cooled. In addition, the younger day boat row 82, 84, 86 Φ, 曰m are 32 y. The substrate g, the wafer boat mounting table 82 is used for #^曰y σ 4, and the processing front for the number of modified sheets (for example, the sheet) is used for the substrate that has just been subjected to the heat treatment. 】 116, ^ Γ 1 % installed with insulation tube 160, and using the wafer boat transfer machine 80B.80C φ ΐΐ ^ 1 -® ^ 8 〇Α ^ BSE 3 ^ 2 88D'. Further, the H f ® boat is alternately placed on the substrate G of the heat-insulating cylinder 160 = the number of under-processed sheets (10), and is placed on the wafer [0089] 80A to HI on the wafer boat support arm 158. The wafer boat (the wafer boat mechanism in FIG. 5 is the boat 108E) is placed in the heat treatment furnace 27 201246435 by the lifting drive of the lifting mechanism 162 formed by, for example, a linear motor or a ball screw. 'After a predetermined temperature, the heat treatment time is taken out of the heat treatment furnace 114.丹力乂 [0090] The heat treatment furnace 114 is internally provided with, for example, a resistance heating type heater, and, for example, during the period of batch processing (heat treatment), it is not necessary to carry out the wafer boat 2 two-out period. It also keeps the heater in an active state. [0091] ~, the holding and transporting mechanism 56 as detailed in the following, the financial-secondary each transporting agency% will be placed on the wafer boat mounting platform %% = take =, 80B, 80C (In Figure 5, the wafer surface, (4) is connected to an apricot and operates in the following manner: the board G in the single-piece carrier arm_wide paper is loaded one by one to the other of the objects to be picked up. The base cited in the section [0092] 'Detailed description, and energy-physical! Μ Η The substrate is called batch handling arm rain H), MU, ML can be 猸 ☆ 山 山 山 山 山 山 山 山 , , , Carrying the arm-like transporter for horizontal advancement or retraction. Moreover, the single piece / 82'84 2 is picked up, and any one of them is shown in Fig. 6 as a crystal 151 boat 88D, 88F) The action of picking up the object: using the batch handling arm should be]. And, from the substrate G, and taking out the processed object to the pick-up object using the single-chip wafer, the substrate g before processing is loaded into pieces one by one [0093] 曰曰: Minor: Burning In the batch 苐 1 and the fourth vertical batch sizzling furnaces 12 〇 and 126 assembled in the substrate processing apparatus of the embodiment, 201224 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Around the 124, the [0094] cylindrical vertical 90, 92 which is closed at the upper end is also formed. There are two 3rd day Japanese boat loading platforms arranged side by side. [0095] 128 is equipped with a heat insulating tube 166 at ί f Vt, and the crystal boat is moved. In addition, the long-term 曰F曰 囫 n Ba囫 boat is placed on the wafer in the state of the substrate G of the insulating tube 16 ό Β Β 固 固 固 固 固 固 固Boat support [0096] For the boat support arm 16 94Α), it is carried out by the lifting mechanism 168, in Figure 7, in the boat, so that (10) accepts the temperature in the Γ ΐ ΐ 120 120 After the burning time, add 12 煆 煆 〇;;;; and Γ尧 Γ尧 Γ Γ Γ Α Α 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 94 The transfer machine 128 will have [0097] a built-in electric furnace 120, for example, a resistance heating device, during which the heating process is performed, so that the addition (4) is performed; and the second period is The heater stops working again: one flat has water

1 (or 2) batch handling arm ma10 such as 10) substrate G is placed on the wafer boat mounting table 90, 92, the 3' batch mechanism 68 will be associated with the third wafer boat Any of the 29 201246435 of 94A, 94B (wafer boat 94B in Fig. 5) is picked up, and the batch handling arm is used. And taking out the processed substrate G′ from each of the plurality of wafers from which the object is picked up and/or loading the substrate G before processing into each of the plurality of sheets (one wafer) It is suitable to pick up the wafer boat of the object. On the other hand, in FIG. 8, the lot/monolithic transport mechanism 72 is the same as the single-piece/batch transport mechanism 64, and has a batch transport capable of holding a plurality of substrates (for example, a Kawasaki) substrate g at a time. The arm MU (1) and the single-piece transport arm ML' of each of the energy-retaining cymbal substrates G can be independently advanced and retracted or telescopically moved by the respective transport arms MU1G and ML!. Further, the 'batch/monolithic transport mechanism 72 and any of the sixth wafer boats 112A and 112B sequentially placed on the wafer boat mounts 108 and 110 (the wafer boat 112A in FIG. 8) The pick-up is carried out and the batch-handling arm is used, and the base G before processing will be used. Each time a plurality of pieces (1 piece) are loaded into the wafer boat of the object to be picked up, and the single-piece carrying arm ML is used, and the wafer boat from which the object is taken is taken out one by one, and the G has been processed. . [Configuration of the transport shuttle transport unit] [0100] Fig. 9 shows the configuration of the transport shuttle shuttle unit 50 and the movement of the transport shuttle. The other single-piece transport shuttle transport units 58 and 74 also have a configuration and a function similar to the single-piece transport shuttle transport unit 5. [0101] As shown in the figure, the single-piece transport shuttle transport unit 5〇 (58, 7 172, vacant in the wrong direction - a fixed interval or a space two = the long side direction (x direction) of the 平行 system extends in parallel; And the lower single-piece SLi' is independently moved linearly on the transport routes m and 172. The force of the transport shuttles SU1 and SL1 has a carriage for carrying one substrate G horizontally. Each material: a holding portion 176 for holding the four corners of the substrate G; and a plurality of lifting pins 178 for loading and lowering the substrate G to rise and fall in a horizontal posture. Further, the two-in-one straight-forward private system is a motor or a rice. The cylinder is used as a driving source, and the linear operation is used.

30 201246435 • Move in a straight moving mechanism such as a screw or belt. There is a ======== respectively stop to temporarily stop to load the downstream side of the US board two ^ i shuttle %, SLl (the right side of the figure has a wide m = two, for two orders Suspension shuttle Sy(3)= [0103] H ^H ΐM shuttle SU1 is in the upper loading position FU just stays - timing fl ΊΓ to load the substrate G, and then move the Tpu in the upper part to move the time along the direction of travel ( χ 亩 亩 亩 亩 亩 乂 或 或 或 或 或 或 或 或 或 或 或 或 或 亩 亩 亩 亩 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The clearing of the substrate is not performed on the upper conveying path m at a constant speed or = ^, and the (-X direction) is moved straight, and ^ ' Β〗 /; σ is stopped here. And just stay at the Y point...the upper loading position FU, and the upper single piece moves α ^ B Fu to load the new substrate G. The loading, Ϊ Ϊ Ϊ ϋ 即 即 即 即 即 即 2 2 2 2 2 2 2 2 2 2 2 2 2 -, return movement constitutes a series of actions. Here, ίοΐοΐ] board in the substrate processing device production distance ^ 日士门5 sample f 1 lower single piece The shuttle SLl* lower loading position FL pity stops - when the 172 part discharge position WL is stopped, and if I leave ^^ = = the discharge of the substrate G. Then, f Twl has been carried out in the direction of the Hai Straight, blood when 201246435 ϊίίί relocation; loading of the new substrate G. Also, loading [3 = moving, unloading, returning movement, m complex; ^ by the above-mentioned (4) handling shuttle% single-piece handling Shuttle SUl stays in the eye = relationship: that is to say, the base is on the I stop to load the substrate G, and the single-piece transport from the upper part of the shuttle mode, on the upper hand to == /, = When the direction of the position is set to the direction of the direction (X direction), the same as (2) Deceleration _-Moving = [0106] The 4 ΐΐ single-piece transport shuttle SUl stays in the upper discharge position. The lower single-piece transport shuttle SLi * the lower loading position hole is just stopped to load the substrate G, that is, Tfl=Twu. Then,

When entering the substrate G' and moving from the lower loading position hole toward the lower portion: the bucket position =, when the straight movement is performed on the lower conveyance path 172 with a certain value of WL ΐΐ = (χ direction), the same time = In the empty state of the substrate, the straight forward movement is performed at the same speed or with the same direction (= X direction) on the upper conveyance path 17〇 from the upper discharge position_toward=set FU. In the end, the relationship between TFL and TWU is the same. TFU-TWL=[0107] In the above-described substrate processing apparatus of the present embodiment, the upper portion is the base from the upper loading position FU to the upper discharge position, and the lower single (four) touch SL1 is recorded from the lower portion. The substrate transport of FL to the lower portion == 32 201246435 . is alternately performed every time interval L.

The substrate of the tablet is G ι〇^τ%Λ ^ SL^ and is formed by overlapping into a body. The L1 is transported in a manner that is separated by a certain gap [0109]. After loading the upper loading weave, the fixed time is fixed, and after the loading of the fixed speed, the upper moving path 170 is moved to the end. 'And when it is to 捍 捍 Η ΊΠ ΊΠ 、 、 甘 甘 甘 甘 甘 甘 甘 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼 礼Then, after the dwell time has elapsed, the shame is lifted, and the upper unloading position of the m ϊ 碰 古 古 / / - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The two basically reverse the relationship of ΐϊί inverse phase. Therefore, for example, the upper ❹ and the secondary transport shuttle SL1G can be reciprocated in the same phase, ί if rf shuttle SUl. or the lower batch transport shuttle SLiq The operation of the single-handed shuttle shuttle transport unit 50, 58 and the batch is performed by the resident-to-missing shuttle SU1 or the lower batch transport shuttle SLi〇. In the transport shuttle transport unit 66, 33 201246435, a rotation mechanism for rotating the substrate in the horizontal plane may be provided in the transport shuttle. [Configuration of Monolithic Transport Mechanism] [0112] FIGS. 11 and 12 show the single-piece transport mechanism 48. The configuration and the transfer arm movement range are also provided. The other single-piece conveyance mechanisms 52, 56' 60, 136 also have the same configuration and function as the single-piece conveyance mechanism 48. [0113] Single-piece conveyance mechanism 48 (52, 56, 60) , 136) single-piece transport arm with upper and lower sections, ML 】, the carrying arms can be rotated in the azimuthal direction (0 direction), and can be raised and lowered in the gold direction, the straight direction (Z direction), and the horizontal advance and retreat collapsing movement can be independently performed. More specifically, As shown in FIG. U, the single-piece conveying mechanism 48 is mounted on the lifting/lowering shaft 182 of the lifting/lowering portion (10) having, for example, a linear motor or a ball screw mechanism, and is mounted on the upper and lower sides in a two-stage manner. 184U, 184L, and on the lifting and lowering drive shaft 182, the respective conveying bodies 184U, 184^ = can be rotated in the direction (θ direction) to form an arbitrary square body circle, and the two single-piece conveying arms MU], hidden] Standing forward and backward or telescopic movement. In addition, each single (four) arm is secret |, holding.] The rectangular substrate G can be detachably placed, carried or fixed [0114] Single-piece transport mechanism 48 (52, 56 = two: ί plate transfer table (upper placement) 邶 邶 early transport shuttle JSL]) or base (four) single-piece transport shuttle transport section = (four) (10) tender ===== 0115] Also, the substrate transfer table 2 at the beginning of the transfer line 46 can be used to turn the work substrate/ς 3 34 2012464 35 • The plate G is placed on a pair of mounting tables 2^U that are horizontally supported by a plurality of support pins or lift pins, and is arranged by overlapping the upper and lower sections. From the side of the single-piece conveyor t i8u, The upper stage 2A corresponds to the upper side of the upstream side of the discharge position: the rsR 'lower stage 2GL corresponds to the lower single-piece transport shuttle JSLi on the upstream side of the discharge position. [0116 Similarly, the substrate transfer table 26 at the end of the transfer line 46 is also the same as the substrate transfer table 20, which is capable of placing one substrate G on a plurality of support pins or lift pins. The mounting tables 26U and 26L are arranged in a vertically stacked manner. The upper mounting table 26u corresponds to the upper single-piece transporting shuttle KSU on the downstream side of the stationary position at the loading position, and the lower mounting table is provided. The ML is loaded with the lower single shuttle KSL1 on the downstream side of the stationary position. Monolithic working electrode film forming unit % side single-piece conveying mechanism 批次 and batch type: substrate transfer table % provided between the single-sheet conveying mechanism % on the processing side 40, is capable of one substrate G It is placed on a plurality of support pins or lift pins placed on a plurality of levels, and the horizontal pair of mounts 5411 and 5 are arranged in a vertical manner. 4, the upper stage 5W corresponds to the upper single-piece conveyance shuttle KsUi on the static side of the loading position, and the lower stage 54l corresponds to the lower single-piece conveyance shuttle on the downstream side of the loading stand # KSL〗. On the other hand, from the side of the single piece, the upper stage 54U corresponds to the above position at the discharge position. The soap sheet transporting shuttle JSU1 and the lower mounting table 54L correspond to the lower single-piece transport shuttle JS on the upstream side of the discharge position month f. [0118] μ, and the end portion of the single-piece/normal shuttle transport unit 50 (unloading) The opening portion (recording position FU/FL) of the position WU/WL) and the single transport shuttle movement % may be vertically overlapped with the substrate transfer table 54. [0119] The single-piece transport mechanism 60 on the side of the chip-type grid-like wiring forming unit 38 and the substrate 35 provided in the single-piece/batch transport mechanism 64 on the processing device 40 side are transported to the substrate 35 201246435. The table 62' is still arranged to be horizontally supported by the chip substrate G placed thereon. The pair of mounting tables 62u and 6 are arranged in a second shape. The lower two & type reloading position is on the downstream side of the stationary side: on the downstream side of the lower single piece moving = Ξ 2 64 side, the upper mounting leg corresponds to the lower part of the upstream side of the HI position stationary... Move the load to move the shuttle: the shuttle 62 overlaps vertically. 1 卩 (loading position FU/FL) can also be used with the substrate transfer table [basic operation of the single-chip transport mechanism] [0121] and each structure TM'136) Come = "Touch and carry the pick-up arm. The single-piece transport mechanism has moved the two single-pieces to the U, the fox return position, so that each transport MU, ML ship y ^ lifting shaft and rotational movement, will Two single-piece transport arm single-piece transport arm === at the front of the second unit (not shown). At this time, both of them are, for example, the substrate QL of the single-piece transfer arm of the lower material transport arm gauge 1 and the other one, that is, the upper (10) empty portion 13 (8) of the upper state, so that the upper arm of the empty state is _ Receiving == = = = 201246435 • 13A^(c)f indicates that the upper single-piece transfer arm MU1 is moved backward or contracted to the original position, and the processed substrate is carried out from the processing unit. [0124] After the processed substrate Gi is carried out as described above, the single-piece transport mechanism is then moved up and down as shown in FIG. Litd) (in the case of the ascending movement in the illustrated case), and the substrate Gj before the solid JJ process is used. The T-part single-piece transport arm paper cassette is aligned with the silk plate for transmission. Then, as shown in FIG. 13(4), the lower single-piece transport arm fox is advanced, extended (four) to the forward position, and the substrate Gj before the processing is moved to the processing unit and then 'as shown in FIG. 13B (1). Show, so that it has become empty. The early delivery arm MLi moves back or retracts to its original position. [0125] The single-piece transport mechanisms 48, 52, %, (10), and 136 of the embodiment can be operated simultaneously or in parallel using the sheet transport arms MU!, ML]: , the single-piece transport shuttle rib]/JSLi (or the substrate transfer table) is removed from the upstream side of the 盥=妾4, and the one-piece substrate G is loaded to the downstream side of the adjacent one. KSL / or substrate transfer station). Fig. 14A shows the operation of each of the single-piece transporting mechanisms 48, 5 to transport the shuttle L-shaped substrate 〇j and the lower-side downstream single-piece transport shuttle KSL1. In this case, the single piece = as shown in (8) of FIG. 14A, in which the two single-piece carrying arms = (four) τ of the return position, so that each of her is _, jumped to the lower part == the carrying arm _ is cleared. , clear i-like. The lower single-piece transport shuttle KSL1 carrying the 3' downstream side is formed. [0127] Next, the single-piece transport mechanism is shown in FIG. 14A (9), and the upper green sheet is transported.

S 37 201246435 Arm MU] Advancing or stretching, and the upper single piece from the upstream side; the general shuttle Jsu removes the substrate Gj' while advancing or stretching the lower single-piece transfer arm w, and the substrate Gi loads ^post) to the lower single-piece transport shuttle KSL on the downstream side. Then, as shown in (c) of f 14A, the upper single-piece carrier arm and the lower single piece are pulled back to the original position. 1 [0128] Figure 14B shows the single-piece handling mechanism 48, 52, % lower single (10) shuttle muscle removal 1 silk plate Gj God as ^ anti

Hlf ΐ The action of the single-piece handling shuttle KSUl on the top. In this case, the single piece is configured as shown in (a) of FIG. 14B in a state in which the two single arms _, paper | are pulled back to the position or the return position, so that the respective transport bodies 18w, mL are provided. Move 'to lower the single-piece transport arm to abut on the upstream side of the qi: ρ, the transport plate JSL, 'the upper single-piece transport arm's inscription on the downstream side is transported to the fixed-holding substrate Gi. In addition, the lower single piece on the upstream side is removed and the i-shaped silver 1 carries the substrate]', and the upper single-piece transfer shuttle KSU| on the downstream side is formed [0129]. The arm mechanism is shown in Fig. 14B. ! It is moved and the 17 single-piece transport shuttle JSL1 is removed from the upstream side to advance or extend the upper single-piece (4) arm, and the upper single-piece transport shuttle KSU1 is transferred to the downstream side. Then, if ί returns to ίΓί Γ, the upper material and the lower material handling arm of the first and second material handling arms are combined with each other, and the single-piece conveying mechanisms 48, 52, 56, 60, and 136 of the present embodiment are additionally: - In terms of handling mode, the arm MU can be moved in parallel or 6, W *, the main chest is made to be 1 in two early films, from the upstream _ single >; handling | then, the monolithic handling arm cylinder r. Pure a, LJJ/JSL1 (or substrate transfer table) removes one substrate G, and action 2, mainly uses the other one, that is, the lower single-piece transfer arm paper] sheet 38 201246435 . Loaded to the downstream side of the single-piece transport shuttle KSIVKSL (or substrate transfer [0131] For example, 'Use the upper single-piece transfer arm shuttle JSU1 to remove one substrate Qi, and use the lower single-t-t parallel or simultaneous action = 曰 t t 3 3 时 可 可 可 可 可 可 可 可 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游 上游I84U > i84L ί^ S i , the upper part of the downstream side of the 妾f transports the shuttle. Then, as shown in Fig. Gj, the lower single-piece transport arm that has become empty is = Pull = [0133] Then 'the single piece handling mechanism is as shown

Teng and fox move up and down and rotate, and the main body transport arm _ abuts the lower part of the upstream side to move: ^^==, single piece fe) does not make the upper single piece transport arm 1 'and'口,15B « 〇j ° ^ 15ΒΪ^ Pull back to the original position [0134] *The downstream side of the single (four) battle = 39 201246435

In the above, the upstream single-chip transport shuttle JS can be connected to the single-chip cleaning unit 32 and the single-chip processing unit of the single-chip processing unit. A and the latter step of the single ^ ^, the single piece of processing (single piece of cleaning n plus the time point of t4 ~ _ between the production of Ts ^ column as the snack arm ML), waiting to wear (4) The lower single-piece conveying plate G2 of the lower morning conveying mechanism stays in the single/inside of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The number of the substrate 〇3 stops early. The film [= 咖] is loaded into the fourth substrate g4 and reaches the upper unloading 4A. After the second f, the 5 hai single-chip transport mechanism moves as shown in item 14A, and you fff μ MU] The upper single-piece conveying shuttle σ from the upstream side. At the same time, the lower single-piece conveying arm, the spleen and the spleen, the 4th tiger substrate G4', the single-piece handling shuttle KSLl (t ^ 2) 1 Downstream side

[0138J Just after the order, the transport mechanism will pick up the single-chip processing unit A, and / < the upper single-piece transport shuttle * ^ 111 unloaded the fourth 泸 柘 (^ force step 3 of the time step The substrate is exchanged; 22. The substrate is taken out at 5 and replaced by a piece: [0/39] The 4th wire plate 4 at the bottom is moved into the single processing unit 2012 201246435

ItTit °2 =^t:>〇ίί; The front No. 3 substrate G3 is moved into the single-chip processing unit ^Processing = Transportation... into the No. 5 substrate [_] Subsequently, the monolithic handling mechanism is as shown in Fig. 14B The movement of the paper ίτί paper 1 from the lower side of the f-side transporting shuttle | remove the fifth piece while using the upper single-piece carrying arm, the second base = 5' single-piece handling shuttle KSU1 (t = t5 ~t6). ^上上上上上上 [0141] Next ' § hai single-chip handling mechanism and single-piece processing to just remove the single piece from the upstream side of the shuttle to remove the (5) f = 妾 ^ and f now The No. 4 substrate G of the previous step is completed; u: 5 and the upper single-piece conveyance which is used to form the empty state is carried out, and the processed No. 4 substrate & is removed, and the fifth before the arm is replaced. The substrate G5 is carried into the single sheet, and the single sheet transport mechanism is transported to the fourth substrate & The third county board G3 is exchanged (t = t7~w. Here, the single sheet conveys the f paper 1 from the single processing unit B, and the j brother 3 5 tiger substrate is moved out (3⁄4, and the upper single piece is used instead) = Ϊ Ϊ 搬 搬 搬 搬 搬 搬 搬 搬 t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t t 2 41 201246435 For the reference period, repeat the above-mentioned series of substrate transfer [transfer mode of single-chip transport mechanism 2] [0143] It is shown that the second base printing conveyance mechanism is suitable for the following cases, and is provided with a single processing unit = two cases, two f (Al, A2) and three (8), B2, B3). , single two, a2 with the time difference of the production time Ts, and repeatedly into the ^ ^ 士 巧 巧 , , , , 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 另 另 另 另 另 另 另 另 τ τ τ τ τ The hue repeat of the production time τ =] the difference between the subsequent steps of the substrate retention time of 3Ts is required] and half of the Λ shape, at the time point (4), the above two consecutive (pre-step and German = scale) early processing The first substrate Gi is held by the lower single-piece transfer machine, and the lower single-piece transport shuttle KSLi is mounted on the downstream side. The No. 2 and No. 1 substrates G2, G3 and G4 respectively stay at the sheet of the post-execution step, and the element r 5A and the sixth base w stay in the Ϊ 7 r . At this time, the upper single-piece conveyance shuttle on the upstream side is loaded into the No. 7 substrate G to reach the upper discharge position. ^夂叫战 [0145] Subsequently, the monolithic handling mechanism is operated as shown in Fig. 14A, and Yutian μ is added with β. μ Same part of the SUi to remove the 7th wire =====«1 wire_into the next [0146] The side of the ΪΙ ΪΙ 与 is taken with the single-chip processing unit ,ι, and at this time _ unloading The seventh substrate g7 is exchanged (4) 2 to t3) on the fifth substrate G5 in the previous step of the U. Just after the single-chip processing unit ^ is picked up from the crucible, the No. 5 substrate Gs carried out by 1 is exchanged with the No. 2 substrate G2 which is just after the 42 201246435 step (t = tt). . — The lower single-piece transport shuttle jSLl is loaded with No. 8 its = aspect, upstream side WL (t = t4). The earthboard 8 reaches the lower discharge position [0148] Subsequently, the single-piece transport mechanism transports the shuttle from the lower side of the upstream side with the transport arm w shown in FIG. 14B, and the upper single-piece transport arm MU1 No. 2 substrate = 'partial early transport shuttle KSU/tn). Upper [0149] of the lower shooting side Next, the single >} transporting mechanism and the single # processing single take the second incoming 7 that has just been transported from the lower side of the upstream side, and the point is just completed. The sixth substrate 〇6 is exchanged (two y/14 ±• this [0150] 6 1}. Then, the single-piece transport mechanism and the single-chip processing unit are just loaded from the single-chip processing unit and the sixth substrate G is carried out. Ϊ́ί Γ Γ 搬运 搬运 搬运 f f f f f f f 搬运 搬运 f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f f Thereafter, the series transfer operation as described above is repeated with the production time Ts as the reference position. [Configuration of the piece/batch conveying mechanism] [0151] The figure π shows the configuration of the single piece/batch conveying mechanism 64. Further, the lot/monolithic transport mechanism 72 also has the same configuration as the single/batch transport mechanism 64. [0152] The single/batch transport mechanism 64 has a batch transfer arm and a single transport arm called upper and lower stages. 'The transport arms can be rotated in the azimuthal direction (θ direction) and can be raised and lowered in the vertical direction (Ζ direction), and the horizontal advance or retreat or telescopic movement can be independently performed. More specifically, the single-piece/batch handling mechanism 64 is shown in Fig. 18, and is used in the lift lift «19TM & H, ί of the fixed lifting drive # 186 having the Mabda ball ball mast mechanism of 43 201246435 On the transport body _, i9ql, the two transport arms ^ Μ i Α τ can be moved forward and backward or telescopically. Here, the batch transfer arm hall 将 将 复 复 复 将 ( 例如 ( ( ( ( ( ( ( ( ( ( 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次 批次. # January substrate [0153] The monolithic/batch transport mechanism 64 of such a configuration can be straight around a = the feeding portion 58, the substrate transfer table 62, and the batch type heat: 4 =; The second wafer boat _, the coffee maker, and the batch t transport shuttle transport unit 66 are placed on the 82 and 84, and the substrate G can be carried out in units of sheets or 10 sheets. Grant. [Operation of Monolithic/Batch Handling Mechanism] [0154] (4) The following steps are described for the t J leg: single green delivery = 64 for the second wafer boat mounting table 82 of the batch type heat treatment device 4 Any one of the wafer loading boats 88D, 88E, and 88F, the substrate Q) to Gj+9 after the removal of the 2 wafers at one time, and the substrate before the processing of the cymbal processing is replaced by [0155]. First, as shown in the figure As shown in (8) of 19A, the single-piece/batch transport mechanism 64 moves the transport bodies 19GU and 19GL up and down and rotates in a state where the two transport arms MU10 and ML are pulled back to the home position or the return position. The two transport arms ^U1〇 and ML are abutted on the front side of the second wafer boat (not shown) to be picked up. At this time, the single-piece transfer arm MLi is firmly held by the cymbal substrate Gi immediately removed from the substrate transfer table 62, and the batch transfer arm_1 () is formed in a free state without the substrate G. Further, the height of the batch transfer arm]vnj1() in the empty state is aligned with one slit (not shown) of the object to be picked up. 201246435 [0156] Next, the 'single piece/batch handling mechanism is as shown in Fig. 19A. The carrier arm>Viu+, (b) does not, so that the second round of the empty state is moved or extended to the forward position, and the connection is made. Take the f曰曰0 in the boat, _ 1 狭缝 slit, and the batch transfer arm of the substrate (4) 9 after 1 = === [0157] This will treat 10 substrates Gj~Qj+ 9 —-Unloading the 屮 留 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Then, as shown in the figure, it will handle the handling of the first side of the f fox or the secret to the inspection position.

Gl is loaded inside the slit. The money, as shown in Fig. 19B, shows that the single-piece carrying arm 胤1 of the 〇1 is retracted or retracted to the original position. In the case of f, the following operation will be described: the single-chip/batch transport mechanism 64 has a board == 圆 助 助 助 助 接 接 接 接 反复 如 t t t t t t t t t t t t t t t When the person is in the position, the board is transferred to each other. [The olS transport shuttle unit 66 performs the coordinated action. In the arm diagram ^, at the time of the hour, the batch transport of the single/batch transport mechanism 64 [ίίοΓ transport arm fox 1 is formed in a state in which no substrate is emptied. 2 诘 诘 诘 搬 搬 搬 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 The batch handling mechanism 64 $ uses the person to transport the arm _. The substrate ho after the omega chip processing is taken out from the wafer boat 8 (t==ta~tb). [0161] • Next 'single piece/batch The secondary transport mechanism 6M applies the single-piece transport arm ML to receive the substrate G4()1 on the upper portion of the 201246435 partial mount 62U, and on the other hand advances the batch transport arm MU10 to load the processed substrate Gj-Gw to Batch handling shuttle 66 (t = tc) [0162] The batch handling shuttle 66 loaded with 10 processed substrates 0 〜 0 0 随后 is then loaded from the loading position to the discharging position The movement of the line (t = te). Further, the single-piece/batch transport mechanism 64 loads the substrate G401 before the one-piece processing held by the single-piece transfer arm ML into the predetermined slit of the wafer boat 88D (t = [0163] Subsequently, the 'single sheet transport mechanism 6' (FIG. 2) places the substrate g402 before the next processing on the lower stage 62L of the substrate transfer table 62 (t = tf). On the other hand, the single piece / The batch transport mechanism 64 uses the batch transport arm MU10 to take out the next batch of the substrates Gn to Gm processed from the wafer boat 88D in batches (t = tg), and then uses the single-piece transport arm ML to take The substrate G4G2 on the lower stage mounting table 62L is advanced, and the batch transfer arm MU丨〇 is advanced to load the processed substrates Gn to G2〇 into the batch handling shuttle % (t = th ti ti). [0164] The batch handling shuttle 66 loaded with the 10 processed substrates Gn to G2G then goes from the loading position to the discharging position. On the other hand, the single-piece/batch handling mechanism 64 holds the single-piece conveying arm ML. The front substrate g402 is loaded into the corresponding slit (t = tj) of the wafer boat 88D. [0165] Thereafter, the wafer boat 88D is also repeatedly repeated with the wafer boat 88D. In the same operation, the processed substrate is taken out repeatedly in units of a plurality of sheets, and the substrate before the processing is loaded in units of one sheet. When the wafer boat 88D is repeated, all of the processed substrates Gi to Gi will be taken out and disappeared, and the substrate G4 (1) before the processing of the wafer is replaced. ~G410 status. Then, the subsequent (9-inch film) conveyed from the single-piece transport mechanism 6〇 via the substrate transfer cassette 62 (the upper stage 62U/lower stage 62L) in the TS period of the production period TS 201246435 • The front substrate G411 to G%0 are processed, and the single/batch transport mechanism 64 is loaded into the corresponding slits of the wafer boat 88D one by one using the single-piece transport arm ML] (that is, only the single-chip loading is repeated) Into the action). [Operation in Batch Type Heat Treatment Apparatus] [0167] The procedure of the batch type heat treatment apparatus 4 will be described with reference to Figs. 21A and 21B. In addition, in FIG. 21A and FIG. 21B, the response, the 80C, and the second wafer boat 88D, and the ship, respectively, are abbreviated as a, ^, D, E, and F, respectively. [0168] FIG. 21A(a) is shown below. At the time of each part of the time point 114, the batch of the wafer boat

114 ^ 2 0θ3«# 88F HI end secret is not long, and the release [0169] TS is 1 cycle, and the two pieces of transport mechanism (10) per cycle time to take out the processed substrate piece by piece? : 5 = the slit of each of the slits of the boat. And loading the wafer into the wafer from the wafer boat 80C in order, and sequentially removing the processed substrate G during the period of the first half of the furnace 114, and sequentially processing the wafer boat 80B one by one, and [0Π0 】 乂 邛 + 邛 (50 pieces) before the processing of the substrate G. Taiwan ^_, picking the boat to set the structure 64 to produce time τ; ^ brother 2 曰曰 舟 Zhou Qing, 88E. The single-piece/batch carrier 5 is one cycle' and is periodically removed from the substrate transfer table 62 piece by piece 47 201246435. The processed substrate G' is removed and loaded into the wafer boat 88E. During the heat treatment furnace 114, the number of the batch processed sheets (10) which should be accommodated in the crystal S-di are followed by the heat treatment furnace 114, and the number of (100 sheets) of the pre-process substrate G is Storage.钱枇-人处理片 [0171] ^ For the batch of the substrate 〇 on the first wafer boat 8〇A, the lifting mechanism 168 (Fig. 7) is activated, and the counter is a cabinet & ,,. The beam is outside the furnace. In this way, the wafer boat δ0Α is taken out to the heat treatment 164. The Japanese yen is transferred to the boat on the day of the day.

From the second day at the 2nd day, the day boat transfer machine 118 operates the second wafer boat 88D 168, and (4) 2 a boat supports #164. After that, the lifting mechanism [Ϊΐ72Γ, the boat 88D is placed in the heat treatment furnace 114. On the 2nd day, the Japanese boat 88D was placed in the heat treatment 燐 114 wafer boat 88E from the wafer boat placed on the eve 8:^2) as 'should « s6rJ:;: ^; " ' — as for the heat treatment furnace 14 The nickname, i to be said, does not act during the period of taking out the wafer boat, and as long as there is no fault, the heating temperature becomes a stop. Batch; the processing is in operation 40 [0174] Figure _ shows the batch takeout / single port = j boat 88F, as shown in Figure 19A and the second plurality (9) pieces have been removed, and from the wafer (four) F Each of the substrates G and the conventional batch handling shuttle 48 201246435. The conveying unit 66 transmits. Then, after the processed substrate G is sent to the batch type of 煆婷梦署^, only the wafer narration is performed one by one. Further, the second wafer boat 8' that is moved to the wafer boat mounting table 82 is placed in the second wafer boat of the heat treatment furnace 114, and the number of wafers (100 wafers) before the processing is performed. Cracked into. Subtraction-People Handling [0175] On the other hand, the 'single-chip handling mechanism 56 in the second wafer boat _ at 114 __ ' also takes the production period (four) as the working cycle, and each cycle of operation. From the wafer boat 80C The slits are taken out one by one, and the substrates g of the processed substrates are taken out one by one, and the corresponding substrates are inserted into the wafer boat 80B. The substrate G of the second half (5G sheets) is sequentially ordered. The sheet is loaded into the substrate of the second half (5 () sheet). I耵万, [0176], ΞΪ 耵 ί ί 进行 批次 批次 批次 批次 批次 批次 ϋ 辟 辟 辟 辟 辟 ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ ϋ 2 2 2 2 2 2 2 2 2 2 2 2 118 118 118 118 118 118 118 118 118 118吏 3 ^ set on 86. Silk, replaced by the second wafer; = 1 day of the Japanese boat 80 Β moved from the wafer boat mounting platform 75, the younger plough will be after the third wafer (four) domain 'When the first wafer boat is placed in the heat treatment furnace n On the other hand, the younger brother 1 wafer boat transfer machine 1 wafer boat 80C moved from the wafer boat mounting table 76 ^ (0, 'will round the boat = 】 crystal 嶋 set (four) moved to ^ boat ^ ^. 75, and the crystal structure: during the period in the furnace 114, (10) the interval between 3 and 1 cycle', and the following operation is performed every cycle: from the crystal 49 201246435 substrate G, sent to the single piece g, and loaded into the wafer The boat 54 removes the front half of the substrate before and after processing, and removes the first half (9) one by one: ================================================================= The secondary transport mechanism 64 continues to perform the following operations at the production time % a 1 ^ = week f: the wafer carrier is placed on the wafer boat mounting table 84 from the fourth substrate of the substrate transfer table. The part (5 (Γ片)'s 形形形''''''''''''''''''''''''' 1 The number of processed sheets (10) is processed before the state of the substrate G Standby. At the time of the batch heat treatment of the substrate 0 on the 8GB of the boat, the end of the batch heat treatment is completed 1 ^ 4, ^ i lift Lin 168 to take the wafer boat out to the heat treatment furnace as shown in (9) of the round boat 1捭21B , the first wafer boat transfer machine 116 core tit14 Γ wafer boat _ ' and moved to the first ί 2 曰 ^ ^ for cooling, instead, the second wafer boat transfer machine 118 J ^ boat The 8th wafer boat mounting table 82 is moved to the wafer boat support arm 164. After Ik, the second wafer boat 88 is placed in the heat treatment crucible 114. [0181] The second wafer boat 88E of the field is placed When the heat treatment furnace 114 is placed in the heat treatment furnace 114, the substrate G of the number of batch processed sheets (one wafer) held by the wafer boat 88E is heat-treated. Thus, during the period in which the second wafer boat 88E is in the heat treatment furnace m, The single-piece/batch handling mechanism 64 picks up the wafer boat 88D on the wafer boat mounting table 84, and takes the batch take-out/single>} manned composite action, from the wafer age to each multiple film (9) The processed substrate G' is taken out and transferred to the conventional batch transport shuttle unit 66. Then, the processed substrate G is transferred to the batch type calcining apparatus 42 (1〇〇) After the delivery, the operation of loading the front substrate G into the wafer boat 88F is repeated. The second wafer boat 88F moved to the wafer boat mounting table 82 is then placed in the heat. At the 201246435 round boat, and the batch processing (100 pieces) of the batch processing the number of the first front substrate G of the processing furnace 114. [0182] The feeding mechanism 56 continues every cycle. The production time Ts is one cycle, and the wafer picking portion 58' and the slit that is transferred from the substrate are loaded into the wafer board 8's, and the moon is in the month. The wafer boat 80A sequentially takes out the processed substrate G of the wafer of Defeng Qiuqi 50 pieces one by one, and the substrate G before the processing of the crystal (chip). ® Zhou 8〇C is loaded into the second half piece by piece in sequence (50 [0183]], the batch heat treatment of the substrate on the round 〇 ends the boat support _ remove the wafer boat, the first wafer boat The stage 86 is placed on the stage 86. Then, the vertical batch heat treatment furnace 114 is taken up and then the "1st wafer boat 8GC is placed in [0184] 哕曰C: 0曰 is placed in the heat treatment furnace 114" for

t moo G Another brother on the 1st, the Japanese boat transfer machine 116 is protected as shown in Fig. 21B), the spleen wafer boat δ〇Α is moved from the wafer boat mounting table % to the wafer = = and the boat is again From the pure boat rest 78 to the wafer listening table 76. During the period in which the 曰曰[0185] is placed in the heat treatment furnace 114, the single-piece carrier ΠROR hh S cycle, and the following operations are performed every cycle: the processed substrate g is taken out from the wafer ,, and the processed substrate g is taken The substrate is sent out to the single sheet, and the substrate before the processing is removed from the substrate transfer table 54 one by one and loaded into the respective slits of the aa canoe 80A. During this period, the substrate G after the processing of the first half (9) is taken out from the crystal 51 201246435, and the substrate G before the processing of the first half (5 wafers) is sequentially and sequentially sliced. . On the other hand, the single-chip/batch transport mechanism 64 continues to perform the following operations: the substrate transfer table 62 is loaded into the corresponding slits of the wafer boat 88D piece by piece. In this case, ^ the substrate G before the processing of the second half (5 〇) is sequentially loaded one by one. When the heat treatment by the substrate G on the first boat 8 () C is completed, the wafer carrier 80C is taken out of the heat treatment furnace ΐ4. In this way, the first round boat movement fine 116 is moved from the wafer boat support arm 164 g r to the first wafer boat mounting table % for cooling. The wafer "the ϊΛ ϊΛ 第 2nd / 曰 移 移 118 118 118 118 118 118 118 第 第 第 118 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第Subsequently, the second wafer is fine. [0188] When the wafer bank 8 is placed in the heat treatment furnace 114, it is opened for the operation of ^G ^ =:===. Further, the f88E is loaded one by one to process the substrate (10) of the front substrate G. Returning to the boat and processing the number of batches in Yuancheng (extension [0189] and the 4th machine? Day 56 continues with the production time μ 1 cycle, depending on the following actions. From the slits of the wafer surface. The film is taken out from the substrate G which has been disposed at 52 201246435, and sent to the I η gamma, the window is sent, the sealed yarn 58 is fed, and the processed substrate is transferred from the substrate to the processed substrate. ; the substrate G before the processing of the second half (9). The round boat 8〇A is loaded into the second half piece by piece in sequence (50 [0190]. Then, the same action is repeated as shown in Fig. 21A and Fig. 91 p, /1%. The figure + 1B (8), He), He) Two "Γ! The above - "Alternative treatment of the heat treatment furnace 114" =, accepting the monolithic work

1 80A 'BOB ^ 80C 00 ^ Freshly obtained from the second wafer boat 88D, 88E of the m 片J (slice) substrate G. In addition, the heater of the heat treatment furnace 114 always has a certain three hearts... It is irrelevant to the heat treatment furnace U4, the first wafer boat or the second wafer boat, 俜##an: Z2sa0 boat is repeatedly repeated the same - The process of the process. The replacement time of the boat back, and even [0191] In addition, the towel of this embodiment has made the 丨a round boat carry 6 2 82 . 84.86 ΪΪ 3 in the == fixed mode. For example, it is also possible to commonize the functions of the second wafer boat mounting tables 82 and 84 by omitting the first pair of cows. Move the second step on it. And ^ use the movable wafer boat mounting table 'to reduce the wafer boat transfer machine 1] 6, 118 ^ work 0 [the sequence of the batch type calcining device] [0192] 'm = 煆Ϊ device 42 As described above, there are four vertical batch simmering furnaces 120, [^], and the time difference of '', and the same ugly burning process is repeated. 53 201246435 The substrate G which has been subjected to the second heat treatment in the batch type heat treatment apparatus 40 is transported to the batch hatchery unit 42 via the batch transport shuttle unit 66 in units of a plurality of sheets (10 sheets). The batch transport mechanism 68 uses the batch transport arm, and directly dispenses a plurality of (10) substrates detached from the batch transport shuttle unit 66 into the first to fourth crucibles 120 and 122. Any of 124, 126. [0194] In more detail, when the batch transport mechanism 68 distributes the plurality of (1 〇) substrates G that are received to the first sizzling furnace 12, the plurality of sheets (1 〇) are The substrate g2 is loaded in one batch to any of the third wafer boats 94A and 94B placed on the third wafer decks 9 and 92. Further, when the second sinter furnace 122 is allocated, the plurality of (10) substrates G are collectively loaded into the fourth wafer boat placed on the 晶圆4 wafer rigs 96 and 98. Any one of 100 Α and 1 〇 [0195] However, when it is assigned to any of the crucible furnaces 124 and 126, the batch conveyor furnace = the plurality of sheets (1G sheets) of the substrate G are transmitted through The batch transport shuttle transport unit % and 2"/single transport mechanism 72. When the batch/single transport_feed unit 70 removes the plurality of ((4)) substrates G ^ = 2, the plurality of sheets (10) The occupational board G is set; the =f^, the set 1〇2, the fifth wafer boat that was placed on the first 1/6/1〇^, which is placed on the fourth furnace, will be These ^ ^ are loaded into the sixth wafer boat in the whole batch, and the U-tubes (〇^substrate day = 112A, 112B) are used. The sixth wafer boat [0196] is as described above. For example, for the third wafer knife: == the number of processed wafers (i〇0), the substrate G-time is taken out every time _ (1 w) Handling of the substrate G before processing 54 201246435 • Alternating each time The substrate g is taken out after the processing of the sheet (i), and the substrate G is loaded before the processing of each of the plurality of sheets (10 sheets). [0197] The next/monolithic transport mechanism 72 is, for example, the fifth crystal. The fifth wafer boat mounted on the boat mounting table 1〇2 is loaded into the base of the batch processing number (lion piece), and in the case of G, the batch handling is performed in the same manner as the batch conveying mechanism 68. The arm MUm is repeated, and the whole batch is loaded in a plurality of pieces (10 pieces). However, from the wafer boat (10) A = the processed substrate G is taken away, the single-piece transfer arm is used for The single sheet of the sheet is ejected, and the one substrate G taken out is sent to the single sheet conveying shuttle portion %. The substrate G that has been subjected to the general firing treatment in the first or second calcining furnaces 120 and 122, (1G) /) is the unit 'from the batch transport mechanism 68 via the batch transport shuttle = single piece, chaos, and has arrived at the batch transport shuttle;: unloading the processing piece by piece ^ [the main effect of the embodiment] 0199] The basic domain of the real state is interposed on the transport line 46 or along the = line 46, and the miscellaneous configuration is monolithic. Between the settings, even between the single set, can be continuously and efficiently moved - the clothing directly processing - the processing capacity of the human processing equipment is greatly improved. The substrate is transported, the wrong batch is mixed by batch [0200 】 •, 5 fine handling. Another aspect 55 201246435 between (for example, 40, 42) 'through two batch handling mechanisms that can be accessed with each batch processing device (4〇, 42) (64 68) transporting the substrate G in a plurality of sheets. [0201] ^1 In this case, the upstream batch processing device (40) passes through the single/batch handling mechanism 64, and from the upstream side The sheet processing device (38) receives the substrate G' before the processing piece by piece and transfers the processed button G to the batch processing device (42) on the downstream side thereof. Further, the lower-age (10) batch type processing apparatus (4) passes through the batch transport mechanism 68, and receives the processing_New G from the batch processing unit (42) on the upstream side thereof. The job unit 72 is moved, and the substrate G is transferred monthly to the single-chip processing device (44) on the downstream side. Further, a monolithic processing apparatus (for example, 36) - a batch processing apparatus (4) - a single processing apparatus (10). In the substrate transport of 38), the individual sheet transport mechanisms 52, 56, and 60 on the transport line 46 are provided with processing equipment in each of the commitment areas.

In the cycle of the production time Ts, the single G-swelling system of each of the substrates G on the substrate G iff 46 is repeatedly repeated with the production time Ts as a reference, and the effect of high processing quantization can be achieved. In the substrate processing apparatus, one batch type heat treatment package t is applied to the base of the completed single-receiving electrode electrode treatment, and the film formation process for the single-chip grid wiring is completed for 6 Since the substrate is processed by ",,,,,, the hardware cost of the heat treatment device can be reduced by half, and the wire power can be reduced. The heat treatment device is cooled after being repeatedly added to the tif. The state is heated to the set force and the port = the heater is continuously operated during the operation, and the heater is generated = heat == the mode of rest is effective. 'Therefore, the power use efficiency is greatly improved," [0204] In the substrate processing apparatus of the present embodiment, the single-sheet transport shuttle transport units 5G, 58, 74 and the mass transport shuttle transport units 66 and 7 are provided on the transport line 46. 56 201246435 [0205] From the period of time Ts, the substrate G is smashed to him, and (52). In this case, the single-piece transport mechanism 48 is transported to the downstream side SwSLl at 绔=8). Can 'don't care about the monolithic handling mechanism 5 loading the substrate G In other words, the structure 52 is only required to be removed from the upper/lower part of the shuttle, and the substrate G can be removed during the single-body transport of the muscles, and both of them remain in the unloading position. [_] In the same relationship, the single-sheet transport mechanism 56 and the single-piece transport 6 are separated by a single piece, and the row substrate G-receiving sheet transport mechanism is located at the upper/right side. The single-loading position Hm on the upstream side. _ _ ^ ^ = (4) 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任 任Time ^| ° ° ^ This, the single-chip handling mechanism at the upstream side can be used at the time - the transport mechanism removes the substrate Gi [0207] The load zone ί, 48, f, 56, 60, W in order to move in each load Rotate the movement ^Special & '/, to carry the water + private movement of the early transport mechanisms 48, 52 of the transport body 18, mL. Therefore, each of the two: two: fast and efficient base transfer The parts 50, 58, and 74 only have a single-piece conveying shuttle sul/SLl having a gj74 carried by a single-axis conveying mechanism, _Structural and extremely simple, the production of 57 201246435 raw particles is also less. [0209] Moreover, each single-piece transport shuttle transport part % phase 'and repeat the same structure 7, to reverse cycle or reverse and lower The fixed-moving movable transporting shuttle SL1 of the single-piece transporting shuttle SL1 can be stopped-returned, so that it can be loaded, such as stay-to-go move-unloading, and the cost can be reduced. The transport-type (software) is significantly simplified. [0210] For the whole middle two, the operation of the single-piece transport shuttle transport units 50, 58, and 74 is stepped on, and the simplification of the motion of the system//4 can be simplified. @ (4) (Software) advance - [0211] Μ ° In addition, the batch transport shuttle transport unit 66, 7 〇 彳 不 不 不 不 不 不 不 不 不 不 不 不 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆Manufactured in the batch processing unit and the single-chip processing unit _ every 3 i base 2 [Other embodiment or modification] [0212] Sending table-shaped/iff-red towel, _岐 (10) on the substrate transfer The substrate transfer table 2G of △ 26 or the base [〇ll3] of the unloader 14 side can also be partially or completely replaced with a single The sheet transports the transport unit. The genius ϊΐ 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 令 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概 概Transfer the 1 Μ Μ soil board. However, another point of view is as follows: after the substrate transporting mechanism has taken the substrate from the substrate transfer table, the side of the substrate transfer side is 4 and the other substrate is placed on the substrate transfer table. In short, the operation of the substrate transporting mechanism for placing the substrate on the substrate transfer table and the substrate receiving side are not simultaneously performed by the transfer mechanism from the substrate transfer table. Although the two transport mechanisms independently carry out the intrinsic transport work independently, it is necessary to confirm the emptying of the substrate transfer table when the base is being exchanged between the two sides, and the interrupt control must be performed depending on the situation. Therefore, not only the transportation efficiency is lowered, but also the control program (software) of the transport mechanism is large and expensive. By replacing the substrate transfer table with a single-piece transport shuttle transport unit, it is possible to simplify the simplification and cost reduction of the transport program. As an extension of the substrate processing apparatus of the above-described embodiment, as shown in Fig. 22, for example, a processing system in which all the processing units used in the manufacturing process of the dye-sensitized solar cell (Fig. 23) are integrated can be constructed. [0215] In the processing system, as in the above embodiment, the first stacking unit (3〇8/3〇〇/3〇4/312) on the side of the transparent substrate 308 is produced by the second processing station 1〇, and The second stacking unit (310/305/302/318) on the side of the counter substrate 31 is produced by the second processing station 200, and the second stacking unit is formed by the bonding unit 2〇2 (Xiao Gangji·2) And the second laminated component (Su Xiaorui. [0216], the mouth is the same as the above-described embodiment in the same manner as in the above embodiment, and the loader 12 is formed from the loader 12 The transparent electrode 3 is placed on the transparent substrate of the cover transparent conductive layer before being patterned as an unprocessed substrate G. On the other hand, for the second processing station 2, the cycle of the production time Ts is The counter wire 31G on which the base electrode 3〇5 is patterned (such as FTO) is formed as an untreated base (4) from the loader 2〇4. = There is a face money 12 with the lion structure New Wei, and contains a few fines ^ Yun 59 [0217] 201246435 [0218] On the upstream side of the stagnation 204, ^ ^ 1 or a plurality of single-chip cleaning units And the soil ^ 2,: equipped with a case unit 210. Each of the single-chip cleaning units is configured to clean the surface of the substrate, and each substrate is used to form a substrate for forming a substrate on the surface to be processed (10) of the substrate G to form a base electrode. 305. The transparent conductive layer is patterned one by one. [0219] The single y unit 212, the batch type heat treatment device 2M, and the batch g are completed to be printed on the surface to be processed of the substrate G, for example, a coating 302 . The monolithic lattice counter electrode conductive layer (relative to the wire 314 and (4) amine (10) H ί on the piece by piece of film into a lattice-like distribution; i =: r after baking the to-be-processed surface [0220] Inside, there is a moving or line 218 that runs through or in each block, and is used to carry the substrate G in the order of the processing flow. LJ 1 She pulls the monolithic block in the side of the tour. The substrate transfer table 220, the single-piece transport π, and the soap sheet transport shuttle transport unit 224 are disposed along the longitudinal direction of the system (χ direction) to form one section of the transport line 218, and are disposed 210% in the single-piece transport mechanism. There is a one-piece cleaning unit 2〇8 and a one-piece patterning unit. The inside of the batch-mixing block 2_, although the detailed arrangement is omitted, is substantially the same as FIG. 201246435 [0222] At the second processing station 200, the substrate Η face down along the transfer line 218, and sequentially receives a series of single-piece processing or batch processing. Then, it becomes the second stacked assembly (310/305/ The processed substrate 302 of 302/314) will be in the period of the production time Ts, and the handling mechanism 228 of the bonding unit 202 will be The discharge position (WU/WL) of the transport shuttle transport unit 220 is removed. [0223] On the one hand, in the first processing station 10, as in the above embodiment, the substrate G is carried down along the transport line 46. The sequence accepts a series of single-piece processing or batch processing. Then, the processed substrate that has become the first stacked component (3〇8/3〇〇/3〇4/312) = the period of the production time ts The transport mechanism 228 of the bonded unit 202 is taken out from the unloading position of the single-piece transport shuttle unit 45. [0224] The composite unit 202 is bonded using, for example, an adhesive: from the first processing station 10 Introducing a first layer assembly (308/300/304/312) and a second layer assembly (310/305/302/314) introduced from the second processing station 200 to form a unitary laminated assembly (308/300/304/312/302/305/310/314) [0225], and then, the laminated assembly (3〇8/3〇〇/3〇4/312/302/305) /310/314) is moved to the electrolyte injection unit 23〇 of the next stage, and in the unit 23〇, in the integrated tantalum layer assembly, in detail, the porous semiconductor fine particle layer 3〇4 and the opposite direction An electrolyte is injected between the electrodes 302. ^ 0226] Finally, the sealing unit 232 of the next stage applies a sealing ΓΓ1) to the integrated laminate assembly so that the 电解液ί electrolyte does not leak, and the dye sensitized solar cell module G/H of the final product, ie, 23, is obtained. Then, the dye-sensitized solar cell module G/H is removed from the unloader 14 in units of the wafer cassette Cs. [0227] Further, in the bonding unit 2〇2, the electrolyte injection unit 23〇 The single-piece conveying mechanism and the conveying shuttle conveying portion of the present invention are not used between the sealing unit 232, and the substrate or the respective laminated assembly is used by a conventionally known or well-known conveying mechanism (not shown) from 61 201246435. The laminated component substrate G/Η is transported piece by piece. [0228] In another modification, the single-piece transport shuttle transport unit can perform the reciprocating motion of the upper transport shuttle in an independent or asynchronous manner depending on the system specifications (loading, forward movement, unloading, and return movement). Reciprocating motion with the lower transport shuttle (loading · ^_ moving, unloading, returning movement). '[B229] The batch type heat treatment apparatus 40 of the above embodiment includes a single piece/batch moving mechanism 64 for conveying the substrate 〇 to the heat treatment apparatus at a plurality of sheets, and the batch type simmering apparatus 42. However, in the case of the batch type heat treatment apparatus 4, in the case of the early sheet processing apparatus, the single sheet/batch conveying mechanism 6 J is described as the same single sheet conveying mechanism of the sheet conveying mechanism 56, and it is expected that it is owed by the following: The substrate (4) (4) is sent to the weaving processing device [0230] (4) 样 地 'In the preceding stage of the batch type heat treatment device 40, there is a batch processing of the Mengjin single-chip handling mechanism% replaced with, for example, the above-mentioned batch 2 ^ 片 ίί The same batch/single-piece conveyor of the same structure 72 is used to carry out the batch type of the previous section of the processing unit 40. From the heat batch to the crystal toilet, *...曰二一衣置母稷稷片The substrate is subjected to the substrate, and the heat-treated substrate is subjected to batch-type t-type heat treatment of the agricultural substrate 40 to complete the chip-type braid-shaped wiring film forming unit 38). Early processing device in the latter stage (for example, single [industrial use] [0231], the meta and the batch are described in a general manner, and all the processing units in the single butterfly system are η: The invention is applicable to an on-line system such as all processing unit units in the system, or to a part or whole of any system in which the processing sequence is substantially along the horizontal direction 62 201246435 juxtaposed 7 = gf. The present invention is not limited to the dye-sensitized solar cell device of the above embodiment, and the substrate processing apparatus for manufacturing a semiconductor element or an FPD can be manufactured by the fourth embodiment. [Simple Description of the Drawings] [0026] Embodiment of the present invention is shown. The substrate processing apparatus is displayed on the system to display the processing sheet H in the single-edge sub-mixing block in the substrate processing apparatus, and is displayed on the single-chip processing unit H assembled by the basic processing apparatus. The substrate at the substrate is displayed in the unit type of the first type of single-chip processing monofilament, and the second type of single-chip processing unit is taken out. Batches in the batch + cis (four) 3 type smoldering device of the TM processing device for the human substrate at the time of the human substrate: ^ The composition of the smashing device in the smashing device Fig. 11 is a plan view showing the movement range of the vertical 464 transport mechanism in which the single-piece transport mechanism is not disposed in the substrate processing I. Show the feeding (4) The movement of the conveyor shaft from the upstream shuttle === force, and the substrate is carried to the downstream side of the lower side of the transport side of the lower age of the material handler _ from the upstream Figure 15A (8) ~ 15A (c), L5B(d) to 15B_ show the steps of the operation of removing the substrate from the upstream lower transfer shuttle and the operation of loading the substrate to the downstream upper transfer shuttle. Fig. 16 shows the above-mentioned single The sheet transporting mechanism is in the order of one of the first H1 transport modes. Fig. 17 is a view showing the sequence of motions of the single transport mechanism in the second transport mode. The system displays the single/batch in the substrate processing apparatus. The structure of the secondary transport mechanism n Figure 19 Butterfly ~ 19A (C), Cong (6) to (7) show that the above-mentioned single-piece/batch handling, 冓 continuous substrate removal in units of a plurality of sheets, and substrate and unit operation in units of q-pieces. Fig. 20 shows the above-mentioned single piece/batch The transport mechanism cooperates with the surrounding parts when the substrate is taken out and the substrate is loaded before the processing is repeated. Fig. 21A(a) to 21A(c) and 21B(4) to 21B(f) are used to explain the above batch. Sub-heat 64 201246435 Approximate top view of the operation in the processing device. Figure 22 is a diagram showing the steps of the integration of the dye-sensitized solar cell (Fig. 23) manufacturing delay and integration. A longitudinal sectional view showing the basic configuration of the dye-sensitized solar cell. [Description of main component symbols] [0233] 10 to 1st processing station l〇A, l〇c to monolithic concentrated block 10B to monolithic/batch mixed block 12 to loader 14 to unloader 16 to wafer平台 cassette platform 18 to loader transport mechanism 18a to main body 18b to transport arm 20, 26 to substrate transfer table 20U, 26U to upper stage 20L, 26L to lower stage 22 to wafer cassette platform 24 to unloader Mechanism 24a to body 24b to transport arm 32 to monolithic cleaning unit 34 to monolithic patterning unit 36, 2J1 to monolithic working electrode film forming unit 38 to monolithic grid wiring forming unit 40 to batch Heat treatment device 42 to batch type calcining device 44 to monolithic dye adsorption unit 65 201246435 45, 50, 58, 74 to single-piece conveying shuttle conveying unit 46 to conveying line 48, 52, 56, 60 to single-piece conveying Mechanisms 54, 62 to substrate transfer tables 54U and 62U to upper mounts 54L and 62L to lower mount 64 to single/batch transport mechanisms 66 and 70 to batch transport shuttle transport unit 68 to batch transport mechanism 72 to batch Secondary/single sheet transport mechanisms 75, 76, 78 to first wafer boat mounts 80A, 80B, and 8 0C (abbreviated as A, B, and C in FIG. 21) - first wafer boat 82, 84, 86 to second wafer boat mounting table 88D, 88E, and 88F (abbreviated as D, E, and F in FIG. 21). The second wafer boat 90, 92 to the third wafer boat mounting table 94A, 94B to the third wafer boat 96, 98 to the fourth wafer boat mounting table 100A, 100B to the fourth wafer boat 102, 104 to 5 wafer boat mounting tables 106A and 106B to fifth wafer boats 108 and 110 to sixth wafer boat mounting tables 112A and 112B to sixth wafer boat 114 to vertical batch heat treatment furnaces 116 and 118 to 1 The second wafer boat transfer machine 120, 122, 124, 126 to the first to fourth vertical batch batch furnaces 128, 130, 132, 134 to the third to the sixth wafer boat transfer machine 136 to single Sheet conveying mechanism 140, 146 to processing chamber (chamber) 142 to platform 144, 152 to head 66 201246435 145, 155 to substrate inlet and outlet * 148 to rotary driving portion 150 to rotating chuck 154, 156 to lifting pin 158, 164 ~ Wafer boat support arms 160, 166 ~ Insulation cylinders 162, 168 ~ Elevating mechanism 170 - Upper conveyance path 172 - Lower conveyance path 174 - Bracket 176 - Retaining portion 178 - Lifting pins 180, 186 - Elevating drive units 182, 188 ~ Lifting drive shaft 18 4U, 190U to upper transport main body 184L, 190L to lower transport main body 200 to second processing station 200A to monolithic concentrated block 200B to single/batch mixed block 202 to laminating unit 204 to loader 206 to loader Transport mechanism 208 to monolithic cleaning unit 210 to monolithic patterning unit 212 to monolithic grid wiring forming unit 214 to batch type heat treatment device 216 to batch type calcining device 218 to transfer line 220 to substrate Transfer station 222 to monolithic transport mechanism

S 67 201246435 224, 226 to single-piece transport shuttle transport unit 228 to transport mechanism 230 to electrolyte injection unit 232 to seal unit 300 to transparent electrode 302 to counter electrode (opposite electrode conductive layer) 304 to semiconductor fine particle layer (work Electrode) 305 to base electrode 306 to electrolyte layer 308 to transparent substrate 310 to opposite substrate 312, 314 to grid-like wiring 316, 318 to insulating film (protective film) A, A, A2, B, B, B2 B3~monolithic processing unit C, CA, CB, cs~ wafer cassette FU~ upper loading position FL~ lower loading position G, Gi, Gj_Gj+9, Gi_Gi〇〇' G401 — G410, H ~ Substrate MU! ~ Upper transport arm MU ~ Lower transport arm JSUi - Upper single transport shuttle JSL from the upstream side - Lower single transport shuttle KSLh on the upstream side - Upper single transport shuttle KSL · on the downstream side - Downstream side Lower single-piece transport shuttle MU!, ML, ~ Monolithic transport arm MU1Q, MA1Q ~ Batch transport arm SU, ~ Upper single transport shuttle SL! ~ Lower single transport shuttle SU10 ~ Upper batch transport shuttle SL1 () ~ Lower batch handling shuttle 68 201246435 t〇-ts, ta~tj~ time point WIJ~ upper unloading Location WL~ the lower discharge position 69

Claims (1)

201246435 VII. Patent application scope: Each of the health boards that continue to apply the first paste is sequentially connected to the first processing unit, and the single-chip early-type processing unit is repeatedly performed with a predetermined period of time of production. In the cycle of time, the second iteration is repeated, and the alternately processed bases are moved out of the substrate that has completed the first single piece of the batch processing. And the base single-chip processing unit that divides the first n't" by the number of miscellaneous items; the substrate that is carried out from the human part is moved to the second processed substrate one by one, and ^From g to piece by piece, the second single batch processing unit has been completed. 隼 Λ, ♦: 乐1 batch long processing unit; from the first substrate, and the second batch is processed. The number of sheets processed in this batch is 2. If the substrate that is carried out by the human processing unit and the human processing unit is transported to the rear. Contains: The substrate processing apparatus according to the first aspect of the present invention, wherein the substrate is arranged in a row by a fixed number of times, and the first wafer carrier is sequentially completed. i should accept the substrate before the first batch of processing and load it into pieces one by one; until the number of processed pieces of the batch is reached, and i is formed into the first batch from any other empty state. After the plate, until the crystal 201246435. The Ministry of Science and the structure of the first batch type _ any ===== move to the first! The batch processing unit moves the fixed-held processed portion to the first-order transport mechanism; and receives the mm-plate processing device from the first batch-type wafer boat, at least the first In the case of the removal of the substrate after the period of the first ice treatment or any one of the boats before the treatment, the substrate processing device for processing the second or third patent of the patent dry circumference may be carried out. ^The first and second m I1 1 ^ ^; ^ in the carrying arm, which is rotated in the azimuth direction and can be moved in the wrong direction, the forward and backward movement or the telescopic movement of the arm. i and the second substrate, and the piece that has been received by f== uses the first and second squad t to take one of the first day of the day boat, and one takeout has completed the i-th In one of the first wafer boats, the substrate is processed to the second one-month substrate, and the removed substrate is as described in the patent application. The substrate processing device of the member-item, the plurality of wafer boats, which hold the 兮A, to perform the column of the second batch=the number of substrates In the second transport mechanism, the second wafer boat is connected to the second wafer processing, and the wafer boat is completed in sequence, until the substrate is processed into pieces one by one. The round boat is counted in multiples, and from any other crystal until the wafer boat becomes the substrate after the empty batch of the postal processing, 71 201246435 邻之Γ Γ部' is located in the second modification department and the first 1 batch processing to the next position that the second transport mechanism can pick up: H fr type processing unit, and hold any other wafer that has completed the first batch of processed substrates The boat can be picked up from the first batch type processing. The device, in the second row of sound = two if Ϊ mechanism for any of the other second wafer boats, the substrate after the processing is taken out or the substrate before the processing is loaded. The substrate processing apparatus of claim 5, wherein in the latter stage of the transport p, the third substrate is repeatedly used to hold the third substrate, and the (four) arm energy-second solid-day period The substrate before the processing is loaded into the second wafer boat, and the second wafer boat is loaded with the substrate; when the substrate is stacked from the wafer carrier, the fourth substrate is used. The substrate processing apparatus of the seventh aspect of the present invention, wherein the second wafer boat of the second one is used, the wafer boat is taken out, the plurality of m is used, and the fourth transport arm is used. The entire batch is sent to the second batch processing unit, and the substrate is taken, and Lai has already accepted the recognition to 72 201246435. All the boards will complete the second batch of processing. 'The substrate connected by the third transfer arm is inserted into the substrate, and the water can be moved up and down in the wrong direction of the transfer arm. Each of the third and fourth transfer arms can hold the second transport mechanism at any time in the wafer boat of the production time, and use the same 3 third single wafer processing unit ί frequency processing chip conveyance surface of the substrate 1, any one of the second and the other of the second wafer boat. f 〆 〆 〆 基板 基板 基板 〆 〆 〆 〆 〆 〆 〆 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板In the first monolithic path, the ui=: another: on the transport route, in the second _ route = at the other end of the second transport 2 transport route, the second unloading position is provided. 'Operation from the first loading position 1 ^ 1 transporting the substrate to the substrate, and transporting the substrate from the second loading position to the second unloading by the second transport 73 201246435 The substrate of any one of the range of items i to 3 is placed, and the respective first and second conveying paths 'each are adjacent to the second one-piece processing portion, and the four water ends are mutually Parallel to the other end; test & ten direction 攸 The ^ 1 transport shuttle 'has the - the first load i # 1 transport route - the end is equipped with the first load ΐ = after the transport, the material μ) 1 ? The carriage for carrying one substrate can be reciprocated between the second position of the second conveyance path and the second discharge position of the second conveyance path. Move; the shuttle will reduce the base 2 money 2 to move ί as in the patent application, to 3 items 2 = board: ^ Department, next to the second single-piece processing of the first shuttle, with - 1 Christine 1 , online ' _ i-transportation route 2 _ 1st moving = the other end of the transport route is provided with the i i J load, and the transport route, the bracket of the 1 2 plate, In the second movement, the other 1 tTm^201246435.2 loads the operation type substrate processing apparatus transported to the unloading_, and includes: (4) operation. Holding, the number of substrates is juxtaposed into a column-and-fixing mechanism 'for the plural wafer boat', in order to receive the substrate, until the end; the r has completed the batch processing; Between the management departments, the pair: crystal: boat 'can enter from the handling mechanism; connect 1 and f solid money has completed the batch processing of the batch at the batch ΐ, from the miscellaneous type of material According to the substrate processing crack of claim 13 of the patent application scope, the transport mechanism has the ability to rotate the gold in the azimuthal direction, and to perform the horizontal advance or retreat movement or the telescopic movement with a slight degree to ensure that the several arms can be held at one time. 1 piece of substrate, the 2 transfer arm energy-retaining sigma transport mechanism mounts the substrate before processing to the first transfer arm, and the wafer carrier is mounted on the wafer, in ^3:== When the substrate of 2 is used, the two transfer arms are used to shoot from the substrate of the wafer boat, and the substrate that has completed the batch processing stays in any one of the crystals. In the i period of the production time interval, the second transfer arm is used to take out the plurality of pieces from the wafer. The batch-processed substrate is sent to the transport unit or the processing unit in the subsequent stage in a batch, and the ith transport arm is used to carry the transport unit or the processing unit from the front stage. a slab substrate, and the received substrate is loaded into any one of the other wafer boats; and any one of the substrates that have completed the batch processing is taken out by the wafer boat, at the time of production In the first cycle, the i-th transfer arm is used to receive the i-piece substrate conveyed from the transfer unit or the processing unit of the front stage, and the received substrate is loaded into any other of the wafer boats. 16. A substrate processing apparatus comprising: a batch type processing unit that repeats a desired batch process for each of a plurality of substrates that are loaded in a predetermined number of times for each of the number of batches processed; a plurality of wafer boats, the batch processing the number of substrates is juxtaposed in a row and held for the batch processing; = mechanism, for the plurality of wafer boats, the batch processing will be accepted in sequence, The board is loaded into any one of the wafer boats each time until the wafer is reached and the substrate after the batch processing has been completed is removed from the other wafers until the wafer boat is empty. And: ΐ : : : : : : : : : : : : : : : : : ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ The position is moved to the batch processing as it is: the position of the substrate in which the batch has been processed by the batch. Day:: The batch processing unit is moved to the transport mechanism to receive the substrate processing apparatus of the 16th patent scope, and the first and second transport arms are provided. And the second transfer arm can be moved forward and backward _1^ in the wrong direction, and can also independently carry out a number of water----one substrate, the two transfer arms can be used to hold the wafer boat , the 5 hai transport mechanism in the processing _ substrate is loaded into any - 76 201246435 ' 2: 2 in the wafer boat each time the plurality of pieces are loaded into the substrate, after being processed from the wafer 1 In the case of the substrate, the base area of the 17th arm mechanism (4) is used, and the towel is transported to the front of the substrate. The substrate is not processed until the batch is processed. In the one cycle of the predetermined production time interval, the substrate of the plurality of substrates transported by the transporting portion or the processing unit of the second transport arm is used, and the plurality of substrates of the military and the military are displayed on the wafer boat. And using the first pick 1 "to hold any other wafer boat H that has completed the batch processing of the substrate, and to take it out The substrate is added to the transport unit or the process in the subsequent stage (4). The first transfer arm is used to hold the first transfer arm in one cycle before the processing of the wafer boat is completed. One of the other wafer banks of the processed substrate takes out one substrate, and the taken-out substrate is sent to the transport unit or the processing unit in the subsequent stage. The substrate processing apparatus includes: extending the first and second Carrying a carriage that moves along the water village and parallels each other. The first shuttle has a bracket that carries a predetermined number of substrates, and the first position is provided at the end of the first conveyance route. ^弟.^ Yun Road, the other end of the spring is provided with the ith unloading position to move back and forth between the whistle and the shuttle, which has the carrier that carries the predetermined number of substrates, and can be placed at the same time. ϊίΓTransportation path ^The second loading position is provided at one end ^The second discharge position is provided at the other end to the star-shaped mechanism, which is set to be connected to the 1st and 2nd loading positions, within the domain One or a plurality of first transfer arms for transporting substrates; And being provided in the second and second discharge positions, 77 201246435 having one or a plurality of second transfer arms for transporting the substrate in the second region; and a processing unit disposed on the first And at least one of the second region is used for raking, desired single-piece processing or batch processing; and the first transport mechanism uses the ith transport arm, and the second and second positions The predetermined number of substrates are loaded into the first and second transport shuttles, and the second transport mechanism uses the second transport arm, and the first and second transport shuttles are located at the second and second positions. And removing the substrate of the predetermined number of sheets; and performing the operation of transporting the substrate from the first loading position by the first transporting shuttle to the first unloading position and the substrate from the second transporting shuttle The load position is transported to the second discharge position. A substrate processing apparatus comprising: a carrier that extends the first and second conveyance paths and is parallel to each other in a horizontal direction with an arbitrary length, and has a carrier that carries a predetermined number of substrates at a time. On the conveyance route, 'the first load position f = g is provided at one end of the first conveyance path. The first conveyance path is further provided with the first discharge 彳m, the second transfer, and the return f 2 a truss having a plurality of substrate slabs for a predetermined number of sheets, and on the second transport path, a second/position and one of the second transport routes are provided at one end of the second transport path The second discharge position is provided at one end to move back and forth; the first transport mechanism is provided to be accessible to the i-th and second loading positions, and the first transport mechanism is configured to transport one or more of the substrates in the first region. a second transport arm; the second transport mechanism is provided to be connectable to the second and second discharge positions, and has one or a plurality of second transport arms for transporting the substrate in the second region; and The p processing unit is disposed in at least one of the first and second regions and is used for slave substrate application Desirable single-piece processing or batch processing; and the first transport mechanism uses the first transport arm, and the predetermined number of substrates are loaded into the first and second at the second loading position The second shuttle arm is used by the second transport mechanism, and the predetermined number of substrates are removed from the first and second transport shuttles at the position of the second and second discharges 78 201246435; and the parent The operation of transporting the substrate from the first loading position to the first material position by the first transport shuttle, and transporting the substrate from the second loading position to the second unloading by the second transport shuttle The action of the material position. 21. A substrate processing apparatus comprising: a transport line for transporting a substrate to be processed from a downstream side of a processing flow in a horizontal direction; Η a first transport mechanism 'provided on the transport line' The substrate transfer is performed by the first monolithic processing unit disposed therein; and the second transport mechanism is disposed on the transport line, which is downstream of the third job structure: Γΐ: the number and the second place The single-piece processing unit transmits the slabs; the first and second transport hoppers are reciprocally movable, and the system =1 and 4 2 are loaded at the position where the money is adjacent to the second and second unloading mechanisms of the second transport mechanism. The material positions are loaded and handled individually. 79