TW201408133A - Manufacturing device of organic el device and method of manufacturing organic el device and layer forming device and layer forming method - Google Patents

Abstract

The invention provides an organic apparatus manufacturing installation and/or a production method thereof or a film-forming device and/or a film-forming method, which have the advantages of small material damage, good economical efficiency, high productivity and high running rate. The organic EL apparatus manufacturing installation provided by the invention is characterized in that, N (more than 2) pieces of base plates are stored in the vacuum cavity, when coating the first base plate of the first sheet by vaporization using the evaporation source, the Nth base plate of the Nth sheet is movedinto the vacuum cavity, when coating the second base plate of the second sheet by vaporization using the evaporation source, the first base plate is moved out the vacuum cavity, or when coating the first base plate by vaporization, the positioning of the second base plate ends, through the coating period by vaporization and the same evaporation source, when coating the second base plate by vaporization, the first base plate is moved out from the vacuum cavity.

Description

Organic electroluminescent device manufacturing device, manufacturing method thereof, film forming device and film forming method

The present invention relates to an apparatus for manufacturing an organic electroluminescence (hereinafter referred to as EL) apparatus, a method of manufacturing the same, a film formation apparatus and a film formation method, and more particularly to an organic electroluminescence light suitable for being produced by an evaporation method. Device manufacturing apparatus and method of manufacturing the same.

A powerful method for manufacturing an organic electroluminescent device is a vacuum evaporation method. With the increase in the size of the display device, the organic electroluminescent device is also required to be enlarged, and the substrate size is even 1500 mm × 1850 mm.

In the general vacuum evaporation method, in order to continue the stable vapor deposition, it is necessary to control the evaporation rate of the material from the evaporation source to be constant. When the vapor deposition material is heated by physical means such as resistance heating or induction heating to carry out physical vapor deposition (PVC), the evaporation speed must be stabilized in a certain period of time. Therefore, the evaporation of the material from the evaporation source cannot be easily controlled as if a switch was turned on and off.

The prior art for the production of the organic electroluminescent device by the vacuum evaporation method is as follows, for example, the following Patent Documents 1 and 2. Once upon a time, such as the following In the vacuum deposition chamber, a single substrate to be processed is placed in a vacuum deposition chamber for processing. Further, in Patent Document 1, in order to shorten the processing time, a method of performing alignment (position alignment) before the substrate is carried into the vacuum deposition chamber is employed, and Patent Document 2 employs a method of vapor-depositing the substrate vertically.

Further, as the size of the substrate increases, the demand for substrate transfer capable of performing high-precision vapor deposition by a simple mechanism is also increased. In the substrate transfer method of the general vacuum vapor deposition method, a lower conveyance method in which the vapor deposition surface is directed downward is vapor-deposited from below. In the following transfer method, the following is a vapor deposition surface, which cannot be supported as a vapor deposition surface, and it is necessary to support the transfer on a frame portion that is not used as a display surface. Further, as the size of the substrate is increased, a vertical transfer method in which a substrate is inserted into a tray and vertically transported is also proposed. Regarding the prior art of substrate transfer, for example, the following Patent Documents 1 and 3.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-259638

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2007-177319

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2006-147488

However, as described above, in order to keep the evaporation rate of the material constant, it is necessary to maintain evaporation. In other words, in the step of carrying out the substrate loading and unloading, the positioning step, and the like, which are not required to be vapor-deposited, it is necessary to evaporate, and evaporate therebetween. The source evaporated material does not contribute to the evaporation step and directly becomes a material loss. In the above-described Patent Document 1, the alignment time is shortened, and the productivity is improved, so that the material loss is reduced. However, it takes a long time to carry out the loading and unloading of the substrate, and this is not a fundamental solution.

In particular, organic electroluminescent materials are expensive, so that the products are expensive, which has a great influence on the popularity of organic electroluminescent devices. In addition, since the amount of material lost is increased, the frequency of exchange of materials is also increased, and thus the working time of the device is reduced.

In addition, the vapor deposition step is almost equal to the processing time of other steps, and there is a problem of poor productivity.

On the other hand, in the lower conveyance method, since only the frame portion is conveyed, the deflection accompanying the enlargement of the substrate also becomes large. If the deflection becomes large, only the holding force of the frame portion is required, so a special holding mechanism must be provided. In addition, if the holding power is insufficient, the risk of falling is also high. Further, the problem of deflection not only affects the conveyance, but also affects the deflection of the shadow mask when vapor deposition is performed below, and as a result of the influence of both, the problem of high-precision vapor deposition cannot be performed. In addition, although vertical conveyance can solve the problem of deflection, it is necessary to have a transfer tray, which is also a large object, and there is a problem that a tray may cause dust to be discharged during transportation or a tray recovery/cleaning mechanism.

Accordingly, a first object of the present invention is to provide an apparatus for producing an organic electroluminescent device, a method for producing the same, or a film forming apparatus or a film forming method, which has little loss of material and is economical.

Further, a second object of the present invention is to provide a highly productive organic electroluminescent device manufacturing apparatus, a method of manufacturing the same, or a film forming apparatus or film forming method. law.

Further, a third object of the present invention is to provide an apparatus for producing an organic electroluminescence device having a high operation rate, a method for producing the same, or a film formation device or a film formation method.

Further, a fourth object of the present invention is to provide an apparatus for manufacturing an organic electroluminescence device, a method for producing the same, or a film formation device or a film formation method, which can be transported on a simple mechanism.

Further, a fifth object of the present invention is to provide an apparatus for producing an organic electroluminescent device which can be vapor-deposited on the upper surface, a method for producing the same, a film forming apparatus or a film forming method.

In order to achieve the above object, the N (N is 2 or more) substrates are accommodated in the vacuum chamber, and when the first substrate is vapor-deposited by the evaporation source, the Nth Nth substrate is carried into the vacuum. When the second substrate of the second one is vapor-deposited by the evaporation source, the first substrate is carried out from the vacuum chamber as the first feature.

Further, in order to achieve the above object, when the first substrate is vapor-deposited, the alignment of the second substrate is completed, and the second substrate is deposited by the same evaporation source as that during the vapor deposition. The first substrate is carried out from the vacuum chamber to have a second feature.

Further, in order to achieve the above object, the substrate is carried in a loading-lock chamber, passed through at least one vacuum chamber, and transported to the loading and unloading chamber, and the vapor deposition material is vapor-deposited in the vacuum chamber. The aforementioned substrate In this case, the vapor deposition surface of the substrate is transported on the upper surface, and at least when the substrate is moved, the transfer surface of the substrate is prevented from slipping to the third feature.

Further, in order to achieve the above object, in addition to the first and second features, the evaporation source is moved to a vapor deposition position provided for each individual substrate as a fourth feature.

Further, in order to achieve the above object, in addition to the first and second features, the shielding mask necessary for the alignment is integrated with the substrate, and the movement to the evaporation source position is a fifth feature.

Further, in order to achieve the above object, in addition to the first and second features, the substrate is moved to the position where the vapor deposition is performed, and then the alignment is performed to be the sixth feature.

Furthermore, in order to achieve the above-described object, in addition to the first to third features, the substrate is subjected to the vapor deposition in a state in which the substrate is vertically raised, and the substrate that is conveyed in a horizontal state is turned into a seventh feature.

According to the present invention, it is possible to provide an apparatus for producing an organic electroluminescent device, a method for producing the same, or a film forming apparatus or a film forming method, which has little loss of material and is economical.

Further, according to the present invention, it is possible to provide a highly productive organic electroluminescent device manufacturing apparatus, a method of manufacturing the same, or a film forming apparatus or a film forming method.

Further, according to the present invention, it is possible to provide an apparatus for producing an organic electroluminescence device having a high operation rate, a method for producing the same, a film formation device or a film formation method.

Further, according to the present invention, it is possible to provide a simple structure and can be carried out An apparatus for producing an organic electroluminescence device, a method for producing the same, or a film formation device or a film formation method.

Further, according to the present invention, it is possible to provide an apparatus for producing an organic electroluminescence device which can be transported on the upper surface or to perform high-precision vapor deposition, a method for producing the same, a film formation device or a film formation method.

1‧‧‧Processing room

1bu‧‧‧vacuum evaporation chamber

2‧‧‧Transport room

3‧‧‧Loading group (cluster)

4‧‧‧Receiving room

5‧‧‧Transporting robotic arm

6‧‧‧Substrate

7‧‧‧Decanting Department

8‧‧‧Alignment Department

9‧‧‧Handling Department

10‧‧‧ gate valve

11‧‧‧Baffle

20‧‧‧Maintenance means (adhesive rubber)

31‧‧‧Load-lock room

41‧‧‧Substrate retention unit

71‧‧‧ evaporation source

81‧‧‧shadow mask (shadow:rmask)

92‧‧‧Substrate surface control

100‧‧‧Manufacturing device for organic electroluminescent device

A~D‧‧‧ group (cluster)

Fig. 1 is a view showing a manufacturing apparatus of an organic electroluminescent device according to an embodiment of the present invention.

Fig. 2 is a view showing the outline of the configuration of the transfer chamber 2 and the processing chamber 1 according to the embodiment of the present invention.

Fig. 3 is a schematic view and an operation explanatory view showing a configuration of a transfer chamber and a processing chamber according to an embodiment of the present invention.

Figure 4 is a diagram showing a shadow mask.

Fig. 5 is a view showing a conveying mechanism according to an embodiment of the present invention.

Fig. 6 is a view showing the processing flow of the processing chamber 1 according to the embodiment of the present invention.

Fig. 7 is a view for explaining the reason why the substrate is vertically erected and vapor-deposited.

Fig. 8 (a) is a view showing a second embodiment of the processing chamber of the present invention. (b) is a view showing a third embodiment of the processing chamber of the present invention.

Fig. 9 is a view showing a fourth embodiment of the processing chamber of the present invention.

A first embodiment of the present invention will be described with reference to Figs. 1 to 5 . Organic EL The device manufacturing device is not only a structure in which an electrode layer (EL layer) is formed but is sandwiched by electrodes, and includes a positive hole injection layer or a transport layer formed on the anode, an electron injection layer or a transport layer formed on the cathode, and the like. The material forms a film to form a multilayer structure, or a step of washing the substrate. Fig. 1 shows an example of the manufacturing apparatus.

In the organic EL device manufacturing apparatus 100 of the present embodiment, four groups (A to D) of the mounting group 3 and the processing substrate 6 of the substrate 6 to be processed are placed, and between groups or groups. The group consists of five receiving rooms 4 arranged between the loading group 3 or the next step (sealing step). In order to carry out the substrate after the next step, at least an unload-lock chamber (not shown) such as a load-lock chamber to be described later is provided.

The loading group 3 is inserted into the load-lock chamber 31 of the gate valve 10 for maintaining the vacuum before and after, and the substrate 6 (hereinafter referred to as the substrate) is picked up by the load-lock chamber 31, and the substrate 6 is inserted by rotation. The transport robot 5a of the reception room 4a is constituted. Each of the load lock chambers 31 and the receiving chambers 4 has a gate valve 10 in front and rear, and controls the opening and closing of the gate valve 10 to maintain a vacuum while receiving the substrate to the loading group 3 or the next group.

Each of the groups (A to D) has a transfer chamber 2 having one transfer robot arm 5, and a substrate is received by the transfer robot 5, and the two processing chambers 1 disposed on the upper surface of the substrate are subjected to specific processing (first Subscripts a~d represent groups, the second subscript u, d represents the upper side of the upper side). A gate valve 10 is provided between the transfer chamber 2 and the processing chamber 1.

FIG. 2 is a view showing the outline of the configuration of the transfer chamber 2 and the processing chamber 1. deal with The configuration of the chamber 1 differs depending on the processing contents. Here, a vacuum vapor deposition chamber 1bu in which an EL layer is formed by vapor deposition of a light-emitting material under vacuum will be described as an example. 3 is a schematic view and an operation explanatory view showing a configuration of the transfer chamber 2b and the vacuum vapor deposition chamber 1bu. The transport robot arm 5 of Fig. 2 has an arm 51 that can move up and down (see an arrow 53 in Fig. 3) and rotates left and right. The front end has two combs for substrate transport in two stages. Toothed hand 52. By making the upper and lower sections, the upper stage can be carried in, and the lower stage can be carried out, and the carry-in processing can be performed simultaneously in one operation. Making it 2 hands or 1 hand is determined by the content of the process. In the following description, in order to simplify the description, the description will be made with one hand.

On the other hand, the vacuum vapor deposition chamber 1bu is larger than the vapor deposition portion 7 which evaporates the light-emitting material on the substrate 6, and the alignment portion 8 which is required to be vapor-deposited on the substrate 6, and the conveyance mechanism. The processing and receiving unit 9 is configured such that the arm 5 and the substrate are transferred to and from the vapor deposition unit 7. The alignment unit 8 and the process receiving unit 9 are provided with two systems of a right R line and a left L line. The processing and receiving unit 9 has a comb-shaped hand portion 91 that can receive the substrate 6 without interfering with the comb-like hand portion 52 of the transport robot arm 6 and fix the substrate 6, and the comb tooth The handle portion 91 is rotated to move the substrate 6 upright and to face the alignment portion 8 or the substrate surface control means 92 of the vapor deposition portion 7. As means 94 for fixing the substrate 6, it is conceivable to use electromagnetic adsorption or a clip such as a clip in a vacuum operation.

The alignment portion 8 has a pair of alignment positions of the substrate 6 and the shielding mask 81 by the shielding mask 81 formed by the mask 81m and the frame 81f and the alignment mark 84 on the substrate 6 as shown in FIG. Quasi-drive unit 83. Evaporation department 7. The left and right drive bases 74 that move the evaporation source 71 along the rail 76 in the up and down direction and the upper and lower drive means 72, and move the evaporation source 71 along the rails 75 between the left and right alignment portions. The evaporation source 71 is a luminescent material having a vapor deposition material therein, and a stable evaporation rate is obtained by heating control (not shown) of the vapor deposition material. As shown in the extension diagram of FIG. 3, a plurality of ejections are arranged by linear arrangement. The configuration in which the nozzle 73 is ejected. If necessary, vapor deposition is carried out by simultaneously heating the additive in such a manner that stable vapor deposition is obtained.

As described above, in the embodiment, the transport mechanism is the load-lock chamber 31, the transfer robot 5a, the reception room 4, and the transport robot 5 of the transfer chamber 2; The processing unit 9 of the processing chamber 1 is processed. These can be roughly classified into a transfer robot arm 5, 5a having a comb-shaped hand, and a load-lock chamber 31, a receiving room 4, and a process receiving chamber 9 into which the hand is inserted. The substrate 6 is simultaneously transported through the interaction of the two groups.

FIG. 5 shows an example in which the comb-like hand 52 of the transport robot 5 is inserted into the substrate holding portion 41 of the receiving room 4, and the state and configuration of the substrate 6 are collected. The upper surface of the substrate 6 is a vapor-deposited surface of the display surface, and the lower surface thereof is a non-display surface. In other words, the conveyance from the front lower side is held only in the contactable frame portion, and the conveyance on the upper side includes the center portion, which can be used as the contact area, so that the conveyance with little flexibility can be achieved. In Fig. 5, two robot arms having comb-like hands 52 are shown, and three orbital substrate holding portions 41 are provided in the receiving chamber. The upper surface 52u of the comb-shaped hand portion 52 that is in contact with the substrate 6 is provided so as to prevent the substrate from slipping when the hand is rotated. The adhesive rubber 20 is held in a row. It is also possible to attach rubber to the surface, but if the adhesion is too strong, it must be considered that the detachment will be deteriorated. In addition to the adhesive rubber, electromagnetic adsorption or the like can be applied in consideration of a vacuum environment.

Second, focus on how to make high-precision evaporation possible. Fig. 6 is a view showing the processing flow of the processing chamber 1 shown in Figs. 1 to 3. There are two basic ideas for the processing of this embodiment.

First, when one of the production lines is vapor-deposited, the other production line prepares for substrate loading and unloading, positioning, and end of vapor deposition. As described in the problem to be solved by the invention, the step of vapor deposition is almost the same as the time required for other steps such as carrying out the substrate loading and unloading operation in the processing chamber 1, and in the present embodiment, each of them is approximately one minute. By performing this process interactively, the time for wasting evaporation can be reduced.

The second point is that the substrate conveyed on the upper side is vertically erected and conveyed to the alignment portion 8 to be vapor-deposited. When the bottom surface of the substrate 6 is conveyed, it is necessary to reverse the surface of the vapor deposition surface. However, since the upper surface is the vapor deposition surface, it may be vertically raised.

The reason why the substrate is vertically raised and vapor-deposited will be described with reference to Fig. 7 . As shown in FIG. 4, the size of the shielding mask 81 corresponding to the large substrate is about 1800 mm × 2000 mm, and the thickness of the mask 81 m is 40 μm, which tends to be thinner in the future. Here, when the vapor deposition is performed by the lower surface, the weight of the substrate is about 5 kg, and the weight of the mask 81 m is 200 kg. Therefore, the mask 81m is greatly deflected by the weight of both. Since the deflected substrate is vapor-deposited with the curved mask 81m, it is vapor-deposited to the adjacent color region, and the state of color turbidity causes the chroma to fall. Here, the substrate 6 and the mask are made 81 together become the state of the state to solve the deflection, in order to obtain high-precision and high-color color.

Next, the processing flow of this embodiment will be described with reference to Fig. 3 using Fig. 6 at the same time. In Fig. 3, the presence of the substrate 6 is indicated by a solid line.

First, the substrate 6R is carried in the R line (production line), and the substrate 6R is vertically erected and moved to the alignment portion 8R to be aligned (from step R1 to step R3). At this time, since the alignment is performed immediately after standing upright, the vapor deposition surface is placed on the substrate 6 to be transported. Positioning, as shown in the extension of FIG. 3, is photographed by the CCD camera 86 so that the alignment mark 84 provided on the substrate 6 enters the center of the window 85 provided in the mask 81m, so that the shielding mask 81R is as described above. The alignment is performed by the drive unit 83. In the case where the vapor deposition is a material that emits red (R) light, as shown in FIG. 4, a window portion is formed in a portion corresponding to R of the residual mask 81m, and the portion is vapor-deposited. The size of the window portion varies depending on the color, and is about 50 μm in width and 150 μm in height on average. The thickness of the mask 81m is 40 μm, and there is a tendency to be thinner in the future.

After the alignment is completed, the evaporation source 71 is moved to the R line side (step R4), and thereafter the linear evaporation source 71 is moved upward or downward to perform vapor deposition (step R5). In the R-line vapor deposition, the processing of steps L1 to L3 is performed in the same manner as the L line and the L line. That is, the other substrate 6L is carried in, and the substrate 6L is vertically erected and moved to the alignment portion 8L, and aligned with the position of the shielding mask 81L. After the vapor deposition of the substrate 6R of the R line is completed, the evaporation source 71 moves to the L line (step L4), and is vapor-deposited on the substrate 6L of the L line (step L5). At this time, before the evaporation source 71 is completely separated from the vapor deposition region of the R line, if the substrate 6R is separated by the alignment portion 8R, it may be unnecessary. Since it is possible to carry out vapor deposition, the operation of carrying out the substrate 6R by the processing chamber 1 is started, and then the preparation of the new substrate 6R is started. A partition 11 is provided between the production lines in order to avoid the aforementioned unnecessary evaporation. 3 shows the state of step R5 and step L1. That is, the vapor deposition is started on the R line, and the substrate is carried into the vacuum deposition chamber 1bu on the L line.

Thereafter, by continuously performing the above-described flow, according to the present embodiment, it is possible to perform vapor deposition without using a vapor deposition material in addition to the movement time of the evaporation portion 7. When the evaporation time required for the above-described evaporation time and the other processing time are about 1 minute, and the movement time of the evaporation source 71 is 5 seconds, the vapor deposition time of the wasteful time of up to 1 minute can be shortened to 5 in this embodiment. Seconds.

Further, according to the present embodiment, as shown in FIG. 6, the processing cycle of one substrate for the vacuum vapor deposition chamber 1bu is substantially the vapor deposition time + the movement time of the evaporation source 71, so that the productivity can be improved. When the processing time under the above conditions is evaluated, the present embodiment can be shortened to 1 minute and 5 seconds with respect to the previous 2 minutes, and the productivity is improved to approximately 2 times.

Further, the time required for the vapor deposition unit 7 to be the same amount of the vapor deposition material is not different from that of the previous example, but the production amount is doubled, so that the amount of material adhering to the vacuum chamber wall is reduced, so that the chamber wall or the like is used. The maintenance cycle time and the required time for attachment can also be shortened. As a result, according to the present embodiment, the operation rate of the apparatus can be improved.

In the above-described embodiment, the processing line of the two systems including the alignment unit 8 and the processing and receiving unit 9 is provided to one vapor deposition unit 7 in one processing apparatus. For example, the evaporation time is 30 seconds, and the other processing time is 1 minute. In the case where three processing lines are provided to one vapor deposition unit 7 in one processing apparatus, a large effect can be obtained in the same manner.

Further, according to the present embodiment, the apparatus having the vapor deposition device can achieve the above-described conveyance with a simple structure.

Further, according to the present embodiment, since the substrate is lifted up and vapor-deposited by the upper surface transfer, the substrate can be vapor-deposited with high precision and high chroma.

Next, the second and third embodiments will be described with reference to Fig. 8 . In the first embodiment, the evaporation source 71 is moved and processed. In the present embodiment, FIG. 8(a) shows an example in which the alignment unit 8 moves, and FIG. 8(b) shows an example in which the processing reception unit 9 moves. The basic operation is the same as that of the first embodiment.

First, an example will be described in which the processing unit 9 of FIG. 8(a) collects and holds the alignment unit 8 of the substrate 6 and moves it. Further, in Fig. 6, the substrate 6, the alignment portion 8, and the processing and receiving portion 9 are indicated by solid lines.

First, the substrate 6R is carried in the R line (production line), the substrate 6R is vertically raised, and the substrate 6R is moved to the alignment portion 8R to be aligned. Thereafter, the alignment portions 8R and 8L are integrally moved to the left side by reaching the vapor deposition unit by the alignment base 8B. Further, the alignment portions 8R and 8L may be configured to move individually to the left and right. As the moving mechanism (not shown), a method in which a rail is provided in the same manner as in the first embodiment and is moved thereon can be used. Next, vapor deposition of the substrate 6R is performed. When the substrate 6R is vapor-deposited, the alignment portion 8L comes before the process receiving portion 9L. Therefore, the other substrate 6L can be received and processed such as alignment. After the vapor deposition process of the substrate 6R is completed, the alignment portions 8R and 8L are integrated and moved to the right after reaching the vapor deposition unit 7, and the vapor deposition process of the substrate 6L is performed. This time, the alignment portion 8R comes to the processing receiving portion 9R. Before, the other substrate 6R can be prepared for the next vapor deposition. Further, Fig. 8(a) shows a case where the substrate 6R is received in the alignment portion 8R when the substrate 6L is vapor-deposited.

According to the present embodiment, effects such as reduction in the amount of use of the vapor deposition material and improvement in productivity can be obtained as large as in the first embodiment.

Next, an example in which the process receiving unit 9 of FIG. 8(b) moves and performs processing will be described. In this case, the alignment portion 8 and the vapor deposition portion 7 are fixed. The processing and receiving units 9R and 9L are integrated and moved to the left and right. Further, the process receiving units 9R and 9L may be configured to move individually to the left and right. In this example, the processing unit 9 is moved, the substrate is vertically raised, and the alignment is performed to perform vapor deposition. When performing vapor deposition, it is possible to carry in the other substrate and carry in the new substrate. Moreover, FIG. 6(b) shows a case where the substrate 6R is carried into the process receiving portion 9R when the substrate 6L is vapor-deposited.

That is, this embodiment has a smaller effect than the first two embodiments, but it is somewhat more effective than the previous example.

Further, according to the second and third embodiments, the upper surface can be conveyed with a simple structure, and the substrate that has been transported on the upper surface can be almost vertically erected, and the vapor deposition can be performed with high precision and high chroma.

Further, in the above embodiment, the vapor deposition unit 7, the alignment unit 8, and the process receiving unit 9 are disposed in the same vacuum chamber, but the gate valve is interposed to move between the vacuum chambers, and the vapor deposition may be performed. The portion 7 is provided in the processing chamber, and the alignment portion 8 and the processing receiving portion 9 are provided in the transfer chamber or the like.

The above embodiment will be described with respect to the case where the vapor deposition surface of the substrate 6 is transported up. As a method of transporting other substrates at this point, There is also a method of transporting the vapor deposition surface underneath, and a method of placing the substrate in the tank and lifting it. In the examples described below, the effect of the above conveyance cannot be exhibited, but the effect of reducing the time required for vapor deposition can be exhibited.

When the vapor deposition surface is placed below, it is necessary to carry out the vapor deposition treatment from the lower side. Therefore, in the vapor deposition process of the above-described embodiment, the positional relationship between the substrate 6, the alignment portion 8, and the vapor deposition portion 7 is maintained. Alternatively, the process of erecting the substrate vertically may be omitted as the processing flow. For example, FIG. 9 corresponds to the embodiment of the example of FIG. 3 in the case where the vapor deposition surface is below, and the alignment portions 8R and 8L are disposed under the processing receiving portions 9R and 9L, and the alignment portion 8R, Below the 8L, a vapor deposition portion 7 is provided, and the evaporation source 71 can be moved between the two alignment portions.

Next, in the case of erecting and transporting, the above embodiment can be applied as long as the process of vertically erecting the substrate is omitted.

As described above, the present invention can be applied to the decline in the effective use of the evaporation source regardless of the content of the transfer method.

On the other hand, the present invention relating to the above-described embodiment is described in the above embodiment, in which the transport system is configured in a vacuum, but as disclosed in Patent Document 3, it is disclosed that the vacuum processing chamber is provided outside the vacuum chamber. The slip device expands and contracts the robot arm before loading and unloading the substrate before the processing chamber. In such a device, the present invention can also be applied to a transport system including the slip device, the telescopic robot arm, the transport-loading unit to the processing chamber, and the processing and receiving unit in the processing chamber.

Finally, in the above description, an organic EL device will be described as an example, but a film deposition process having the same background as that of the organic EL device is performed. The device and the film forming method are also applicable.

1‧‧‧Processing room

5‧‧‧Transporting robotic arm

6‧‧‧Substrate

51‧‧‧ Arm

52‧‧‧ comb-toothed hand

53‧‧‧ arrow

71‧‧‧ evaporation source

73‧‧‧Multiple spray nozzles

74‧‧‧Drive base

75‧‧‧ Track

76‧‧‧ Track

81‧‧‧shadow mask

84‧‧‧ mark

85‧‧‧ window

86‧‧‧CCD camera

91‧‧‧ comb-toothed hand

92‧‧‧Substrate surface control

94‧‧ means

L, R‧‧‧ line

Claims (10)

An apparatus for manufacturing an organic electroluminescence device, comprising: a loading and loading chamber loaded into a substrate; and a mask having a position of the substrate and a vapor deposition position; and vapor-depositing the vapor deposition material in at least one vacuum chamber of the substrate, and carrying out a loading and unloading chamber of the substrate, and a transport mechanism for transporting the substrate from the loading and unloading chamber to the loading and unloading chamber, wherein the vacuum chamber has a substrate that is erected vertically or approximately vertically. The first processing receiving unit and the second processing receiving unit that face the substrate surface control means for the masking at the position where the vapor deposition is performed, and the first processing carried in the vapor deposition through the first processing receiving unit In the case of the substrate, the second substrate that has been transported through the second processing and receiving unit is aligned, and the second substrate is vapor-deposited by vapor deposition of the first substrate, and the first substrate is deposited. The deposition means is carried out by the vapor deposition means carried out in the vacuum chamber, and the transfer means transports the vapor deposition surface of the substrate to the upper surface in addition to the first process receiving portion and the second process receiving portion. The apparatus for manufacturing an organic electroluminescence device according to the first aspect of the invention, wherein the mechanism unit that moves the substrate is at least a holding means for holding the substrate. The apparatus for manufacturing an organic electroluminescence device according to the second aspect of the invention, wherein the holding means is an adhesive rubber provided on a surface of a mechanism portion for moving the substrate. The apparatus for manufacturing an organic electroluminescence device according to any one of claims 1 to 3, wherein the vapor deposition means has a driving base for moving the evaporation source between the first substrate and the second substrate . The apparatus for manufacturing an organic electroluminescence device according to any one of claims 1 to 3, wherein the vapor deposition means has the substrate and the mask to be aligned to the mask source Side means. The apparatus for manufacturing an organic electroluminescence device according to any one of claims 1 to 3, wherein the vapor deposition means has the first and second treatment receiving portions sequentially moved to the side of the shielding source Mobile agency. A method for manufacturing an organic electroluminescence device, wherein a substrate is carried into a loading chamber, passed through at least one vacuum chamber, and transported to a loading and unloading chamber, and the vapor deposition position of the substrate and the shielding mask is aligned at the vacuum chamber. The vapor deposition material is deposited on the substrate, and is characterized in that the vapor deposition surface of the substrate is transported on the upper surface, and the first or second processing in the vacuum chamber is performed by transferring the vapor deposition surface to the upper surface. When the first substrate loaded in the first processing receiving unit is vapor-deposited, the second substrate that has been transported through the second processing receiving unit ends the alignment, and the first portion is vapor-deposited. When the second substrate is deposited by the vapor deposition source of the substrate, the first substrate is carried out from the vacuum chamber, and the vapor deposition system causes the first and second substrates to stand vertically or approximately vertically to face each other. It is carried out by masking the mask at the position where the vapor deposition is performed. The method of manufacturing an organic electroluminescence device according to claim 7, wherein at least the substrate is moved so that the transfer surface of the substrate does not slide. A film forming apparatus having a loading and unloading chamber loaded into a substrate and having a shielding mask that is aligned with the substrate and the vapor deposition position to vaporize the material a transfer mechanism that vapor-deposits at least one vacuum chamber of the substrate, carries out the loading and unloading chamber of the substrate, and transports the substrate from the loading/unloading chamber to the loading and unloading chamber, wherein the vacuum chamber is provided with: In the substrate, the first processing receiving unit and the second processing receiving unit that face the substrate surface control means that are present in the mask mask at the position where the vapor deposition is performed, and the substrate is raised vertically or approximately vertically. When the first substrate carried in the first processing and receiving unit is plated, the second substrate that has been inserted through the second processing and receiving unit is finished, and the first alignment is performed to vaporize the vapor deposition source of the first substrate. When the second substrate is vapor-deposited, the first substrate is carried out by the vapor deposition means in the vacuum chamber, and the transfer means is made of the substrate other than the first process receiving portion and the second process receiving portion. The vapor deposition surface is transferred to the top. A film forming method is carried out by loading a substrate into a loading chamber, passing through at least one vacuum chamber, and transporting it to a loading and unloading chamber, aligning the vapor deposition position of the substrate and the mask in the vacuum chamber, and steaming the vapor deposition material. The substrate is plated on the substrate, and the vapor deposition surface of the substrate is transported on the upper surface, and the substrate that has been transported on the vapor deposition surface is placed in the first or second processing receiving portion of the vacuum chamber. When the first substrate carried in the first processing and receiving unit is vapor-deposited, the second substrate that has been transported through the second processing and receiving unit is finished, and the vapor deposition is performed on the first substrate. When the second substrate is vapor-deposited, the first substrate is carried out from the vacuum chamber, and the vapor deposition system causes the first and second substrates to stand vertically or approximately vertically, and faces the vapor deposition. The position is masked by the mask.