KR20110081128A - Manufacturing device of organic el device and method of manufacturing organic el device and layer forming device and layer forming method - Google Patents

Abstract

PURPOSE: A manufacturing device of an organic EL device and a method of manufacturing the organic EL device and a layer forming device and a layer forming method are provided to reduce production costs since the loss of raw material is low and to increase productivity. CONSTITUTION: In a manufacturing device of an organic EL device and a method of manufacturing the organic EL device and a layer forming device and a layer forming method, a shadow mask(81) aligns a deposition source, helping a depositing material to be deposited on a substrate(6), to be fitted to the substrate. In a vacuum chamber, a transfer unit moves a substrate. A controller moves the substrate to a deposition position. A deposition unit loads N substrates in a vacuum chamber, and it loads N-th substrate inside vacuum chamber when a first substrate is deposited and unloads the first substrate when second substrate is deposited.

Description

Organic EL device manufacturing apparatus and organic EL device manufacturing method and film-forming apparatus and film-forming method TECHNICAL FIELD

TECHNICAL FIELD The present invention relates to an organic EL device manufacturing apparatus, an organic EL device manufacturing method, a film forming apparatus and a film forming method, and more particularly, to an organic EL device manufacturing apparatus and organic EL device manufacturing method suitable for production by a vapor deposition method.

A viable method for producing an organic EL device is the vacuum deposition method. In addition to the enlargement of the display device, there is a demand for the enlargement of the organic EL device as well, and the substrate size reaches 1500 mm x 1850 mm.

In a general vacuum deposition method, it is necessary to control to keep the material evaporation rate constant from the evaporation source in order to maintain stable deposition. When physical vapor deposition (PVC) is performed by heating the vapor deposition material using a method such as resistance heating or induction heating, a constant time is required for stabilization of the evaporation rate. Therefore, it is not easy to control the evaporation of the material from the evaporation source as if the switch is on / off.

The following patent documents 1 and 2 are known as related arts for producing an organic EL device by such a vacuum deposition method. Conventionally, the substrates to be processed are put in a vacuum deposition chamber one by one, as in the following patent document, and processed. In addition, Patent Document 1 discloses a method of performing alignment (positioning) prior to loading a substrate into a vacuum deposition chamber in order to shorten the processing time, and Patent Document 2 also discloses that the substrate is vertically deposited.

In addition, as the size of the substrate increases, the demand for substrate conveyance capable of high-definition deposition with a simple mechanism is also increasing. As a substrate conveyance method in a general vacuum vapor deposition method, there exists a lower surface conveyance which conveys a vapor deposition surface downward in order to deposit from a lower part. In the lower surface conveyance, since the lower surface is a vapor deposition surface and cannot hold | maintain a vapor deposition surface, it is necessary to carry and convey the frame part which is not used as a display surface. Or with the enlargement of a board | substrate, the vertical conveyance which carries a board | substrate in a tray and conveys it vertically is also proposed. The following patent documents 1 and 3 are mentioned as a prior art regarding substrate conveyance.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2004-259638

[Patent Document 2] Japanese Patent Application Laid-Open No. 2007-177319

[Patent Document 3] Japanese Patent Application Laid-Open No. 2006-147488

However, as described above, it is necessary to always evaporate to keep the material evaporation rate constant. That is, it is necessary to evaporate even during the carrying out of the carrying out and positioning of the substrate which is not necessary for the vapor deposition in the above process, and during that time, the material evaporated from the evaporation source did not contribute to the vapor deposition process at all, resulting in material loss. In the said patent document 1, alignment time is shortened and productivity is improved, material loss is reduced by that, but it takes time to carry out the board | substrate etc., and it does not become a fundamental solution.

In particular, since organic EL materials are expensive, product prices have increased, which has greatly influenced the spread of organic EL devices. In addition, there is a problem that since the loss material increases, the frequency of material replacement increases, and the running time of the device is reduced.

Moreover, the processing time of a vapor deposition process and another process was nearly equivalent, and there existed a subject that productivity was not good.

On the other hand, in lower surface conveyance, since only a frame part is hold | maintained, curvature becomes large according to enlargement of a board | substrate. If the warpage is large, only the holding force of the frame portion is required, so a special holding mechanism is required. In addition, the lack of holding force also increases the risk of falling. Moreover, the problem of curvature has the problem that not only conveyance but also the curvature of a shadow mask not only at the time of vapor deposition at the time of lower surface but both effects cannot be deposited with high saturation. Moreover, in the vertical conveyance, the problem of curvature can be solved. However, the conveyance tray is required, and the tray is also enlarged, and there are problems such as generation of dust during conveyance by the tray and recovery and cleaning mechanism of the tray.

Therefore, a 1st object of this invention is to provide the organic electroluminescent device manufacturing apparatus, organic electroluminescent device manufacturing method, film-forming apparatus, or film-forming method that there is little material loss and is economical.

Moreover, the 2nd objective of this invention is providing the organic EL device manufacturing apparatus or organic electroluminescent device manufacturing method, or the film-forming apparatus or the film-forming method with high productivity.

Moreover, the 3rd objective of this invention is providing the organic electroluminescent device manufacturing apparatus, organic electroluminescent device manufacturing method, film-forming apparatus, or film-forming method with high operation rate.

Moreover, the 4th objective of this invention is providing the organic electroluminescent device manufacturing apparatus or organic electroluminescent device manufacturing method or the film-forming apparatus, or the film-forming method which a mechanism can perform top surface conveyance simple.

Moreover, the 5th objective of this invention is providing the organic electroluminescent device manufacturing apparatus, organic electroluminescent device manufacturing method, film-forming apparatus, or film-forming method which can be vapor-deposited with high precision also in an upper surface conveyance.

In order to achieve the above object, an N (N is 2 or more) substrate is embedded in a vacuum chamber, and the Nth Nth substrate is transferred into the vacuum chamber while the first substrate is deposited with the evaporation source. It carries in, and the 1st board | substrate is carried out from within the said vacuum chamber during vapor deposition of a 2nd board | substrate 2nd board | substrate to the said evaporation source. It is a 1st characteristic.

Further, in order to achieve the above object, during the deposition of the first substrate, the positioning of the deposition position of the second substrate and the shadow mask is terminated, and the second substrate is deposited during the deposition with the same evaporation source as the deposition. The second feature is to carry out the first substrate from within the vacuum chamber.

Moreover, in order to achieve the said objective, when carrying in a board | substrate from an carry-in load lock chamber, conveying to a carry-out load lock chamber through at least 1 vacuum chamber, and depositing a vapor deposition material in the said vacuum chamber to the said board | substrate, It is a 3rd characteristic that it hold | maintains so that the conveyance surface of the said board | substrate may not slide when carrying the vapor deposition surface of this as an upper surface, and moving at least the said board | substrate.

Further, in order to achieve the above object, in addition to the first and second features, the fourth feature is to move the evaporation source to a deposition position respectively provided on each substrate.

Further, in order to achieve the above object, in addition to the first and second features, the fifth feature is to move the shadow mask necessary for the alignment and the substrate integrally to the evaporation source position.

Further, in order to achieve the above object, in addition to the first and second features, the sixth feature is to move the substrate to the deposition position, and then perform the alignment.

In addition, in order to achieve the above object, in addition to any one of the features of the first to the third, the vapor deposition is carried out in a state in which the substrate is placed vertically, and the substrate conveyed in a horizontal state is made vertical. 7 features.

According to the present invention, it is possible to provide an organic EL device manufacturing apparatus, an organic EL device manufacturing method, a film forming apparatus, or a film forming method with little material loss and good economical efficiency.

Further, according to the present invention, a highly productive organic EL device manufacturing apparatus or organic EL device manufacturing method or a film forming apparatus or a film forming method can be provided.

Moreover, according to this invention, the organic EL device manufacturing apparatus or organic electroluminescent device manufacturing method and film-forming apparatus or film-forming method with high operation rate can be provided.

Moreover, according to this invention, the organic electroluminescent device manufacturing apparatus or organic electroluminescent device manufacturing method, the film-forming apparatus, or the film-forming method which can perform top surface conveyance with a simple structure can be provided.

Moreover, according to this invention, the organic electroluminescent device manufacturing apparatus, organic electroluminescent device manufacturing method, the film-forming apparatus, or the film-forming method which can be vapor-deposited with high precision also in an upper surface conveyance can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS The figure which shows the organic electroluminescent device manufacturing apparatus which is embodiment of this invention.
2 is a diagram showing an outline of the configuration of the transfer chamber 2 and the processing chamber 1 according to the embodiment of the present invention.
3 is a schematic view and an operation explanatory diagram of the configuration of the transfer chamber and the processing chamber according to the embodiment of the present invention.
4 illustrates a shadow mask.
5 is a view showing a transport mechanism that is an embodiment of the present invention.
FIG. 6 is a view showing a processing flow of the processing chamber 1 according to the embodiment of the present invention. FIG.
It is a figure explaining the reason for vapor deposition of a board | substrate standing upright.
FIG. 8A is a diagram showing a second embodiment of the processing chamber of the present invention, and FIG. 8B is a diagram showing a third embodiment of the processing chamber of the present invention.
Fig. 9 shows a fourth embodiment of the processing chamber of the present invention.

A first embodiment of the invention will be described with reference to FIGS. 1 to 5. The organic EL device manufacturing apparatus is not merely a structure in which a light emitting material layer (EL layer) is formed and inserted into an electrode, and various materials such as a hole injection layer or a transport layer on the anode and an electron injection layer or a transport layer on the cathode are formed as thin films. It is formed into a multilayer structure or the substrate is cleaned. 1 shows an example of the manufacturing apparatus.

The organic electroluminescent device manufacturing apparatus 100 in this embodiment distinguishes largely the load cluster 3 which carries in the board | substrate 6 of a processing object, and the four clusters A-D which process the board | substrate 6. It consists of five delivery chambers 4 provided between each cluster or between a cluster and the load cluster 3, or the next process (sealing process). At the rear of the next process, there is an unload lock chamber (not shown), such as at least the load lock chamber 31 described later, for carrying out the substrate.

The load cluster 3 receives the substrate 6 (hereinafter simply referred to as substrate) from the load lock chamber 31 having the gate valve 10 and the load lock chamber 31 to maintain the vacuum before and after. And the transfer robot 5a which turns and carries in the board | substrate 6 to the delivery chamber 4a. Each load lock chamber 31 and each transfer chamber 4 have gate valves 10 before and after, and control the opening and closing of the gate valve 10 to the load cluster 3 or the next cluster while maintaining a vacuum. Deliver the substrate.

 Each cluster A-D receives the board | substrate from the conveyance chamber 2 which has one conveyance robot 5, and the conveyance robot 5, and the two processes arrange | positioned up and down on the figure which performs predetermined | prescribed process. It has a chamber 1 (first subscripts a to d represent clusters, and second subscripts u and d represent upper and lower sides). The gate valve 10 is provided between the conveyance chamber 2 and the processing chamber 1.

2 shows an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the processing contents, the vacuum deposition chamber 1bu that forms the EL layer by depositing a light emitting material in a vacuum will be described as an example. FIG. 3: is a schematic diagram and operation explanatory drawing of the structure of the conveyance chamber 2b and the vacuum deposition chamber 1bu. The conveyance robot 5 in FIG. 2 can move the whole up and down (refer the arrow 53 of FIG. 3), has the arm 51 of the link structure which can be rotated left and right, and the front end part is for board | substrate conveyance It has two comb-shaped hands 52 in two steps of up and down. By setting the upper and lower stages, the upper part is used for carrying in and the lower part is used for carrying out, and the carrying in and taking out process can be performed simultaneously in one operation. Whether to use two hands or one hand is decided according to the processing contents. In the following description, for the sake of simplicity, one hand will be described.

On the other hand, the vacuum deposition chamber 1bu is classified into a vapor deposition unit 7 for evaporating a light emitting material to be deposited on a substrate 6, an alignment unit 8 for depositing a required portion of the substrate 6, and a transfer robot. The substrate is delivered by (5), and the process delivery section (9) moves the substrate (6) to the vapor deposition section (7). The alignment unit 8 and the process delivery unit 9 are provided in two systems, a right R line and a left L line. The process delivery part 9 can transmit the board | substrate 6, without interfering with the comb-shaped hand 52 of the transfer robot 5, and has the comb-tooth shaped hand which has the means 94 which fixes the board | substrate 6 to. (91) and the substrate surface control means 92 which rotates the comb-shaped hand 91 to stand up the board | substrate 6, and moves to the alignment part 8 or the vapor deposition part 7, and faces it. As the means 94 for fixing the substrate 6, in consideration of being in a vacuum, means such as electromagnetic adsorption, a clip or the like is used.

The alignment unit 8 positions the substrate 6 and the shadow mask 81 by the shadow mask 81 composed of the mask 81m and the frame 81f shown in FIG. 4 and the alignment mark 84 on the substrate. It has an alignment drive part 83 to fit. The vapor deposition unit 7 moves up and down driving means 72 for moving the evaporation source 71 in the vertical direction along the rail 76, and moves the left and right alignment parts of the evaporation source 71 along the rail 75. It has a left and right drive base 74. The evaporation source 71 has a light emitting material which is a vapor deposition material therein, and a stable evaporation rate is obtained by heating control (not shown) of the vapor deposition material, and is arranged in a line as shown in the drawing figure of FIG. It is a structure sprayed from the some injection nozzle 73. As shown in FIG. If necessary, additives are also heated and deposited at the same time so as to obtain stable deposition.

In the above-described embodiment, the transfer mechanism is constituted by the load lock chamber 31 of the load cluster 3, the transfer robot 5a, the transfer chamber 4, the transfer robot 5 of the transfer chamber 2, and the like. It is the process delivery part 9 of the process chamber 1. When these are largely distinguished, they are divided into the transfer robots 5 and 5a which have a comb-shaped hand, the load lock chamber 31 into which the hand is inserted, the transfer chamber 4, and the process transmission part 9. These two sets alternately work to transport the substrate 6.

FIG. 5 illustrates a situation and a configuration in which the comb-shaped hand 52 of the transfer robot 5 is inserted into the substrate holding portion 41 of the transfer chamber 4 to receive the substrate 6 as an example. . The upper surface of the board | substrate 6 is a to-be-deposited surface used as a display surface, and the lower surface is a non-display surface. Therefore, in the conventional lower surface conveyance, only the frame part which can be contacted was hold | maintained, but in upper surface conveyance, since it can use as a contact area including a center part, stable conveyance with little curvature is possible. In FIG. 5, the comb-shaped hand 52 has two arms, and has the three rail-shaped board | substrate holding part 41 in the delivery chamber. The upper surface 52u which contacts the board | substrate 6 of the comb-shaped hand 52 is provided with the adhesive rubber 20 as a holding means which hold | maintains so that a board | substrate may not slide at the time of a hand turn, and it is planar Although rubber may be affixed, when adhesiveness is too high, it will also need to consider the leaving property worsening. In addition to the adhesive rubber, electromagnetic adsorption and the like may also be applied in consideration of a vacuum environment.

Next, focusing on enabling high-definition saturation deposition will be explained.

FIG. 6 is a diagram showing a processing flow of the processing chamber 1 shown in FIGS. 1 to 3. There are two basic methods of considering the processing in this embodiment.

The first is to carry out the substrate on the other line while depositing on one line, to position and complete the preparation for deposition. As described in the part of the problem to be solved by the invention, the time required for the deposition process and other processes such as the substrate loading / unloading process into the processing chamber 1 are almost the same, and each embodiment is approximately one minute. . By alternately performing these processes, it is possible to reduce the time for which deposition is unnecessary.

Second, the upper surface conveyed substrate 6 is erected vertically, conveyed to the alignment part 8, and deposited. If the lower surface of the substrate 6 is a vapor deposition surface at the time of conveyance, it is necessary to invert it, but since the upper surface is a vapor deposition surface, it only needs to be placed vertically.

The reason why the substrate is placed upright and deposited is described with reference to FIG. 7. As shown in Fig. 4, the size of the shadow mask 81 corresponding to the large-sized substrate is about 1800 mm x 2000 mm, and the thickness of the mask 81 m is 40 µm, which tends to become thinner in the future. . Therefore, when deposited from the lower surface, the weight of the substrate is about 5 kg and the weight of the mask 81m is 200 kg, and the weight of both masks affects the mask 81m. Since the film is deposited on the film substrate with the film mask 81m, the film is deposited up to an adjacent color gamut, resulting in a color blurring state, resulting in poor saturation. Thus, the substrate 6 and the shadow mask 81 were both in an upright position, and the warpage caused by weight was eliminated to obtain a color with high precision saturation.

Next, the process flow of this embodiment is demonstrated in detail using FIG. 6, referring FIG. In FIG. 3, the part in which the board | substrate 6 exists is shown with the solid line.

First, in the R line, the board | substrate 6R is carried in, the board | substrate 6R is upright, it moves to the alignment part 8R, and alignment is performed (step R1 thru | or R3). At this time, the substrate 6 is transported with the vapor deposition surface as the top in order to perform the alignment immediately standing vertically. As shown in the drawing figure of FIG. 3, the alignment is imaged with the CCD camera 86, and the alignment mark 84 provided in the board | substrate 6 may come to the center of the window 85 provided in the mask 81m. The shadow mask 81R is controlled by the alignment driver 83. If the vapor deposition is a material that emits red (R), as shown in Fig. 4, a window is formed in a portion corresponding to R of the mask 81m, and the portion is deposited. The size of the window varies depending on the color, but on average it is about 50 µm wide and 150 µm high. The thickness of the mask 81m is 40 micrometers, and it tends to become thinner further.

When the alignment is finished, the evaporation source 71 is moved to the R line side (step R4), and then the evaporation source 71 on the line is moved to the upper or lower side and deposited (step R5). During the R line deposition, the processing of steps L1 to L3 is performed in the L line similarly to the R line. That is, another 6L of board | substrates are carried in, the said board | substrate 6L is erected vertically, it moves to the alignment part 8L, and alignment with the shadow mask 81L is performed. Upon completion of the deposition of the substrate 6R of the R line, the evaporation source 71 moves to the L line (step L4) to deposit the substrate 6L on the L line (step L5). At this time, if the substrate 6R is spaced apart from the alignment portion 8R before the evaporation source 71 completely exits from the deposition region of the R line, there is a possibility that it is unnecessarily deposited, and after completely exiting, the processing chamber of the substrate 6R ( The carrying out operation from 1) is started, and then the preparation of a new substrate 6R is started. Partition plates 11 are provided between the lines to avoid unnecessary deposition. 3 shows the state of step R5 and step L1. That is, deposition is started on the R line, and the substrate is loaded into the vacuum deposition chamber 1bu on the L line.

Then, by performing the said flow continuously, according to this embodiment, it can deposit without using a vapor deposition material except for the moving time of the evaporation part 7. As described above, the required deposition time and other processing time are approximately 1 minute, and if the moving time of the evaporation source 71 is 5 seconds, the conventional one minute waste deposition time can be shortened to 5 seconds in this embodiment. .

In addition, according to the present embodiment, as illustrated in FIG. 6, the processing cycle of one processing substrate of the vacuum deposition chamber 1bu becomes substantially the deposition time + movement time of the evaporation source 71, thereby improving productivity. Can be. When the processing time is evaluated under the conditions described above, in the present embodiment, it is 1 minute and 5 seconds, compared to the conventional two minutes, and the productivity can be improved approximately twice.

In addition, although the time spent by the vapor deposition unit 7 for the same amount of vapor deposition material is not changed from the conventional example, since the amount of adhesion of the material adhered to the wall or the like decreases as the production amount is doubled, Maintenance cycles and turnaround times are also shortened. As a result, according to this embodiment, the operation rate of an apparatus can be improved.

In the said embodiment, two system processing lines which consist of the alignment part 8 and the process delivery part 9 were provided with respect to one vapor deposition part 7 in one processing apparatus. For example, if the deposition time is 30 seconds and the other processing time is 1 minute, even if three processing lines are provided for one deposition unit 7 in one processing apparatus, similar effects can be obtained.

Moreover, according to this embodiment, upper surface conveyance can be performed with the simple structure in the apparatus which has a vapor deposition apparatus.

Moreover, according to this embodiment, it can deposit on a board | substrate with high precision by carrying out top surface conveyance and depositing.

Next, 2nd, 3rd embodiment is described using FIG. In the first embodiment, the evaporation source 71 is moved and processed. In this embodiment, Fig. 8A is an example in which the alignment unit 8 moves, and Fig. 8B is the process delivery unit 9. ) Shows an example of moving. The basic movement is the same as in the first embodiment.

First, the example in which the alignment part 8 which received and hold | maintained the board | substrate 6 from the process delivery part 9 of FIG. 8 (a) moves and processes it is demonstrated. 6, the part in which the board | substrate 6, the alignment part 8, and the process delivery part 9 exists is shown with the solid line.

First, in the R line, the board | substrate 6R is carried in, the board | substrate 6R is made upright, and the board | substrate 6R is moved to the alignment part 8R, and alignment is performed. Thereafter, the alignment portions 8R and 8L are integrated by the alignment base 8B and move leftward to the front of the vapor deposition portion 7. In addition, the alignment parts 8R and 8L may be the structure which moves left and right separately. As the moving mechanism (not shown), a rail may be provided in the same manner as in the first embodiment, and a method of moving the rail may be used. Next, the substrate 6R is deposited. When the substrate 6R is being deposited, the alignment portion 8L is in front of the process delivery portion 9L, so that the other substrate 6L can be received to perform processing such as alignment. When the vapor deposition process of the board | substrate 6R is complete | finished, the alignment parts 8R and 8L are united, it moves to the right until the vapor deposition part 7, and the vapor deposition process of the board | substrate 6L is performed. Since the alignment part 8R is in front of the process delivery part 9R this time, the other board | substrate 6R can be received and the next vapor deposition can be prepared. 8A shows the state in which the substrate 6L is being deposited and the substrate 6R is received by the alignment portion 8R.

According to this embodiment, the same effects as in the first embodiment can be obtained with respect to the reduction of the amount of vapor deposition material used and the improvement of productivity.

Next, an example in which the processing delivery unit 9 moves and processes in FIG. 8B will be described. In this case, the alignment part 8 and the vapor deposition part 7 are fixed. The process delivery units 9R and 9L are integrated to move from side to side. In addition, the process delivery parts 9R and 9L may be the structure which moves left and right individually. In this example, the process delivery unit 9 moves, and the substrate is placed vertically and aligned to deposit it. While depositing, it is possible to bring in the other substrate and to bring in a new substrate. 8B shows the state in which the substrate 6L is being deposited, and the substrate 6R is carried into the process delivery unit 9R.

Therefore, although this effect is small compared with the above two embodiment, compared with a prior art example, some effects can be acquired similarly.

Moreover, according to 2nd, 3rd embodiment, top surface conveyance can be carried out with a simple structure, and the board | substrate which carried out the top surface conveyance can be raised substantially vertically, and can be deposited with high precision saturation.

In addition, in the description of the above embodiment, although the vapor deposition part 7, the alignment part 8, and the process delivery part 9 were installed in the same vacuum chamber, the vapor deposition part 7 is performed by moving between chambers through a gate. ) May be provided in the processing chamber, and the alignment unit 8 and the process delivery unit 9 may be provided in the transfer chamber or the like.

All of the above embodiments have described the case where the vapor deposition surface of the substrate 6 is conveyed upward. As a conveyance method of the other board | substrate in this point, there exists a method of conveying with a vapor deposition surface downward, and the method of carrying up a board | substrate in a case etc., and conveying. Although the Example described below cannot exhibit the effect in upper surface conveyance, it can exhibit the effect of reducing the time which deposits unnecessarily.

In the case where the deposition surface is to be lower, the deposition process needs to be performed from below, and therefore, the positional relationship between the substrate 6, the alignment portion 8, and the deposition portion 7 at the time of deposition in the above embodiment. What is necessary is just to make it the arrangement structure which hold | maintained, and as a process flow, what is necessary is just the process which abbreviate | omitted the process which raises a board | substrate perpendicularly. For example, FIG. 9 is a view showing an embodiment corresponding to the case of FIG. 3 in the case where the deposition surface is the lower side, and structurally, the alignment portions 8R, 8L are disposed below the process delivery units 9R, 9L. ), And the vapor deposition part 7 is provided in the lower part of the alignment part 8R, 8L, and the evaporation source 71 can move between both alignment parts.

Next, when standing up and conveying, the said embodiment can be applied only by making into the process which abbreviate | omitted the process which raises a board | substrate vertically.

As described above, the present invention can be applied to the drop regarding the effective use of the evaporation source regardless of the conveyance method.

On the other hand, in the description of the above embodiments regarding the present invention related to the top surface conveyance, although the conveying system was configured in a vacuum, there is a slide device provided outside the vacuum in front of the vacuum processing chamber as shown in Patent Document 3, and the treatment Stretching an arm in front of a chamber and carrying out a board | substrate is disclosed. Also in such an apparatus, it is possible to apply the present invention to a conveying system composed of the slide device, the telescopic arm, the loading / unloading rod into and out of the processing chamber, and the processing delivery unit in the processing chamber.

Finally, in the above description, the organic EL device has been described as an example, but the present invention can also be applied to a film forming apparatus and a film forming method for performing vapor deposition on the same background as the organic EL device.

1: processing chamber
1bu: vacuum deposition chamber
2: conveying chamber
3: load cluster
4: delivery room
5: carrier robot
6: substrate
7: deposition unit
8: alignment part
9: processing delivery unit
10: gate valve
11: partition plate
20: holding means (adhesive rubber)
31: road lock room
41: substrate holding part of the transfer room
71: evaporation source
81: shadow mask
92: substrate surface control means
100: manufacturing apparatus for organic EL device
A to D: cluster

Claims (20)

An organic EL device manufacturing apparatus having an evaporation source for depositing a deposition material on a substrate in a vacuum chamber, and a shadow mask for aligning the deposition position with the substrate,
The vacuum chamber has a process transfer part for delivering the substrate, and a substrate surface control means for moving the substrate to a position for depositing the substrate, and the N (N is 2 or more) substrates in the vacuum chamber. While the first substrate of the first sheet is deposited into the evaporation source, the Nth substrate of the Nth sheet is brought into the vacuum chamber, and the second substrate is deposited into the evaporation source. And a vapor deposition means carried out from within the vacuum chamber. The organic EL device manufacturing apparatus according to claim 1, wherein N is 2. An organic EL device manufacturing apparatus having an evaporation source for depositing a deposition material on a substrate in a vacuum chamber, and a shadow mask for aligning the deposition position with the substrate,
The vacuum chamber has a process transfer portion for delivering the substrate, and the process transfer portion has substrate surface control means for moving the substrate to a position for depositing the substrate, and the second substrate is deposited during deposition of the first substrate. 2. An apparatus for producing an organic EL device, comprising: vapor deposition means for terminating the alignment of two substrates and carrying the first substrate out of the vacuum chamber during deposition of the second substrate to the same evaporation source as in the deposition; . 4. An organic EL device manufacturing apparatus according to claim 3, wherein the positioning and the deposition are performed in the same vacuum chamber. The organic EL device manufacturing apparatus according to claim 1, wherein the vapor deposition means moves the evaporation source from the first substrate to a vapor deposition position respectively provided on the Nth substrate. The organic EL device manufacturing apparatus according to claim 3, wherein the vapor deposition means moves the evaporation source from the first substrate to a vapor deposition position respectively provided on the second substrate. The organic EL device manufacturing apparatus according to claim 1 or 3, wherein the vapor deposition means moves the shadow mask and the substrate integrally to the evaporation source position. The organic EL device manufacturing apparatus according to claim 1 or 3, wherein the vapor deposition means moves the substrate to the evaporation source position, and then performs the alignment. The organic EL device manufacturing apparatus according to claim 1 or 3, wherein the substrate surface control means is a means for vertically aligning the substrate. A method of manufacturing an organic EL device in which a substrate and a shadow mask are positioned, and a deposition material is deposited on a substrate by an evaporation source in a vacuum chamber,
The N (N is 2 or more) substrates are embedded in the vacuum chamber, and the N-th sheet of N-th substrate is loaded into the vacuum chamber during the deposition of the first substrate of the first sheet to the evaporation source. And a vapor deposition step of carrying out the first substrate from within the vacuum chamber during vapor deposition of the second substrate of the vapor deposition source, wherein the vapor deposition step is carried out in a state where the substrate is placed vertically and conveyed in a horizontal state. The said board | substrate was made to be perpendicular, The organic electroluminescent device manufacturing method characterized by the above-mentioned. The method for producing an organic EL device according to claim 10, wherein N is two. A method of manufacturing an organic EL device in which a substrate and a shadow mask are positioned, and a deposition material is deposited on the substrate by an evaporation source in a vacuum chamber,
The alignment of the second substrate of the second sheet is terminated during the deposition of the first substrate, and the first substrate is taken out of the vacuum chamber during deposition of the second substrate to the same evaporation source as the deposition. It has a vapor deposition process to make it, The said vapor deposition process performs the said vapor deposition in the state in which the said board | substrate stood up perpendicularly, and makes the said board | substrate conveyed in the horizontal state vertical. 13. The method of manufacturing an organic EL device according to claim 12, wherein the deposition of the first substrate and the deposition of the second substrate are performed in the same vacuum chamber. The method for producing an organic EL device according to claim 10 or 12, wherein the vapor deposition step moves the evaporation source to a vapor deposition position provided on the first substrate and the second substrate, respectively. The organic EL device manufacturing method according to claim 10 or 12, wherein the deposition step moves the shadow mask and the substrate integrally to the evaporation source position. The organic EL device manufacturing method according to claim 10 or 12, wherein the vapor deposition step moves the substrate to the evaporation source position, and then performs the alignment. A film forming apparatus having an evaporation source for depositing a deposition material on a substrate in a vacuum chamber, and a shadow mask for aligning the substrate with the deposition position,
The vacuum chamber has a process transfer part for delivering the substrate, and a substrate surface control means for moving the substrate to a position for depositing the substrate, and the N (N is 2 or more) substrates in the vacuum chamber. While the first substrate of the first sheet is deposited into the evaporation source, the Nth substrate of the Nth sheet is brought into the vacuum chamber, and the second substrate is deposited into the evaporation source. And a vapor deposition means carried out from within the vacuum chamber. A film forming apparatus having an evaporation source for depositing a deposition material on a substrate in a vacuum chamber, and a shadow mask for aligning the substrate with the deposition position,
The vacuum chamber has a process transfer portion for delivering the substrate, and the process transfer portion has substrate surface control means for moving the substrate to a position for depositing the substrate, and the second substrate is deposited during deposition of the first substrate. 2. A film forming apparatus, comprising: vapor deposition means for ending the alignment of the substrate and carrying the first substrate out of the vacuum chamber during deposition of the second substrate to the same evaporation source as in the deposition. A deposition method in which a deposition material is deposited on a substrate by an evaporation source in a vacuum chamber by positioning the substrate and the shadow mask,
The N (N is 2 or more) substrates are embedded in the vacuum chamber, and the N-th sheet of N-th substrate is loaded into the vacuum chamber during the deposition of the first substrate of the first sheet to the evaporation source. And a vapor deposition step of carrying out the first substrate from within the vacuum chamber during vapor deposition of the second substrate of the vapor deposition source, wherein the vapor deposition step is carried out in a state where the substrate is placed vertically and conveyed in a horizontal state. The film forming method, characterized in that the substrate is vertical. A film forming method for positioning a substrate and a shadow mask and depositing a deposition material on the substrate by an evaporation source in a vacuum chamber,
The alignment of the second substrate of the second sheet is terminated during the deposition of the first substrate, and the first substrate is taken out of the vacuum chamber during deposition of the second substrate to the same evaporation source as the deposition. And a vapor deposition step, wherein the vapor deposition step is performed in a state in which the substrate is placed vertically, and the substrate conveyed in a horizontal state is vertical.

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