TWI440241B - Film deposition apparatus - Google Patents

Description

Thin film deposition device

The present invention relates to a thin film deposition apparatus, and more particularly to a thin film deposition apparatus for depositing a thin film on a substrate and a thin film deposition system including the same.

An organic light-emitting diode (OLED) is a self-luminous element that does not require the use of a backlight and is therefore more efficient in power than an LCD. In addition, since the OLED has a wide viewing angle and a high response speed, a display formed using an OLED can display a high-quality image with neither a viewing angle nor a post-image problem.

Such OLEDs are fabricated by stacking a plurality of films (eg, organic films or metal films) on a glass substrate. Conventionally, in order to deposit a plurality of films, a clustering method is mainly used in which a series of unit processes are performed in a plurality of unit chambers disposed around a circular transport chamber and connected to the transport chamber. In this clustering method, the glass substrate is transported between the chambers in a horizontal position and then subjected to component processing. The clustering method can perform a series of programs continuously and quickly, and is therefore advantageous because the clustering method can easily replace the deposition mask necessary for manufacturing an OLED.

Recently, the so-called "three-color independent pixel scheme"-based OLED has attracted attention; this scheme uses a fine metal mask (FMM) to form blue (B), green (G), and red (R) on a large-sized substrate. ) luminescent layer. This three-color, stand-alone pixel solution delivers superior color purity and optical efficiency and is cost effective.

However, since the three-color independent pixel scheme must successively form blue (B), green (G), and red (R) light-emitting layers in separate program chambers, the program chambers of the execution unit program are configured as a column of in-line architecture. Suitable for this three-color independent pixel scheme. Therefore, it is necessary to convert the conventional clustering method into an inline architecture. However, the in-line architecture has the disadvantage of increasing the cost of establishing a production line due to the apparent overlap of the devices, and reducing productivity due to slow processing speed.

At the same time, since conventional clustering methods perform thin film deposition (organic thin film deposition) on a horizontally placed substrate, substrate deflection is conspicuous, causing many difficulties in fabricating components. Also, the deposition mask of the large-sized substrate reaches a few hundred kilograms due to its heavy weight, which makes the substrate deflection more conspicuous, and thus causes serious problems such as damage of the substrate.

Accordingly, the following description relates to a thin film deposition apparatus which can achieve high productivity by simultaneously processing a plurality of substrates and minimizing the deposition time of the deposition and arrangement of the substrate and the mask; and a film including the thin film deposition apparatus Deposition system.

Also, the following description relates to a thin film deposition apparatus which can save the cost of establishing a production line by sharing equipment commonly used in two or more program steps; and a thin film deposition system including the thin film deposition apparatus.

Further, the following description relates to a thin film deposition apparatus which can prevent the substrate from falling by performing film deposition after standing the substrate vertically; and a thin film deposition system including the thin film deposition apparatus.

According to a general aspect, a thin film deposition apparatus is provided, comprising: a chamber in which a reaction space is formed; first and second substrate holders for accommodating substrates therein and spaced apart from each other; a deposition source disposed at the same Between the first and second substrate holders for supplying a deposition material to the substrates; and a fixing unit for causing the first and second substrate holders to be respectively received in the first and second substrate holders The second substrate holder is secured to a designated location in the chamber for a predetermined period of time.

According to another general aspect, a thin film deposition system is provided, comprising: a plurality of cells; and first and second program lines respectively mounted in the plurality of cells; wherein at least one of the plurality of cells comprises: a first substrate Forming the first program line; forming a second substrate clip to form the second program line and being spaced apart from the first substrate; and a deposition source disposed between the first and second substrate holders To supply a deposition material to the substrates.

Therefore, according to the present invention, since a plurality of program lines provided in the respective program chambers are successively subjected to film deposition through a deposition source installed in the program chamber, cost and productivity can be simultaneously reduced.

Further, since the first and second substrate holders conveyed in the respective program chambers are fixed to specific positions in the program chamber, the reliability of the placement substrate/mask can be improved.

Further, since the deposition of the substrate and the arrangement of the substrate arrangement/mask with respect to the substrate are performed on one line on the other substrate on the other line, the lead time can be reduced, thereby improving the productivity.

Further, since the substrate is transported in a horizontal position to prevent damage of the substrate, and film deposition is performed on the substrate in a vertically standing state, the substrate is reduced in dropping, and the manufacture of the element is promoted.

The invention is described in detail below with reference to the drawings in which exemplary embodiments of the invention are shown. However, the invention may be embodied in many different forms and not limited to the exemplary embodiments described herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough In the drawings, the dimensions and relative sizes of layers and regions may be exaggerated for clarity. In the drawings, the same reference numerals are used to refer to the same elements.

1 is a plan view illustrating a thin film deposition system according to an embodiment, and FIG. 2 is a plan view illustrating a thin film deposition apparatus included in the thin film deposition system of FIG. 1.

Referring to Figures 1 and 2, the thin film deposition system is based on an in-line architecture in which a plurality of cells 200 and 600 are arranged in a row between the loading unit 110 as the front stage and the unloading unit 120 as the rear stage. Here, each of the units 200 and 600 includes two program lines PL1 and PL2 (hereinafter referred to as first and second program lines). The unit program can be continuously executed on the first and second program lines PL1 and PL2 in such a manner that the unit program preparation is completed on the second program line PL2 when the unit program is executed on the first program line PL1.

The loading unit 110 is configured to receive the substrate G for pretreatment under atmospheric pressure, and to place the substrate G into a program unit in a vacuum state. The unloading unit 120 is configured to receive the substrate G that has passed through a series of unit programs from the program unit 263, and take out the substrate G under atmospheric pressure for post-processing. Accordingly, the loading unit 110 and the unloading unit 120 are used to convert between atmospheric and vacuum conditions. Further, the loading unit 110 and the unloading unit 120 may be connected to a substrate conveying member such as a robot arm and a substrate loading member such as a substrate, respectively, which are not shown in the drawings.

Units 200 and 600 include a plurality of program units (200: 210, 220, 230, 240, 250, 260) that execute unit programs and a plurality of shock absorbers (600: 610, 620) interposed between program units 200. The shock absorber 600 provides a temporary space in which the substrate G temporarily stays before entering the next program. Also, one end of each program unit 200 is connected to the first mask housing unit 310 that supplies the first deposition mask M1 to the first program line PL1. Also, the other end of each program unit 200 is connected to the second mask housing unit 320 that supplies the second deposition mask M2 to the second program line PL2. The first mask housing unit 310 and the second mask housing unit 320 respectively store deposition masks M1 and M2 used in film deposition, or store additional deposition masks instead of deposition masks M1 and M2. However, the first mask housing unit 310 and the second mask housing unit 320 may be a single common mask housing unit to which each program unit 200 is connected. Further, a feeder that supplies material to the deposition source 540 can be connected to the partial units 200 and 600.

Unit 200 is used to execute a series of component programs on substrate G. For example, the present embodiment is for sequentially stacking a hole injection layer (HIL), a hole transport layer (HTL), an emission material layer (EML), and an electron transport layer (ETL) on a substrate G on which a positive hole is formed in advance. An electron injecting layer (OLED) is formed in this manner by an electron injecting layer (EIL) and a negative electrode. To this end, the HIL forming unit 210, the HTL forming unit 220, the EML forming unit 230, the ETL forming unit 240, the EIL forming unit 250, and the negative electrode forming unit 260 are connected in a row. The EML forming unit 230 may additionally include a blue-EML forming unit 231 that displays natural colors, a green-EML forming unit 232, and a red-EML forming unit 233, and the negative electrode forming unit 260 may additionally include a negative electrode formed in a multilayer structure. A plurality of negative electrode forming units 261, 262, and 263.

At least one of the plurality of elements having the above structure contained in the thin film deposition system may be the thin film deposition apparatus 200, and the structure of the thin film deposition apparatus 200 will be described in detail below with reference to FIG.

2 is a plan view illustrating a thin film deposition apparatus 200 included in the thin film deposition system of FIG. 1.

Referring to FIG. 2, the thin film deposition apparatus 200 includes a chamber 100, a first substrate holder 520 and a second substrate holder 530, a deposition source 540, and a fixing unit 10 (see FIG. 3).

The chamber 100 may have a hexahedral shape. The chamber 100 includes therein a reaction space for processing the substrates G1 and G2. The chamber 100 includes a first substrate inlet 511a, a first substrate holder 520, and a first substrate outlet 512a that are aligned along a first program line. Also, the chamber 100 includes a second substrate inlet 511b, a second substrate holder 530, and a second substrate outlet 512b that are also aligned along the second program line. The first substrate inlet 511a and the second substrate inlet 511b are formed in the wall of the chamber 100 and spaced apart from each other. The first substrate outlet 512a and the second substrate outlet 512b are formed in the other wall of the chamber 100 (opposite the chamber wall in which the first substrate inlet 511a and the second substrate inlet 511b are formed), and the first substrate outlet 512a and The second substrate outlets 512b are also spaced apart from each other. The first substrate inlet 511a and the second substrate inlet 511b, and the first substrate outlet 512a and the second substrate outlet 512b may be slit valves.

The first substrate holder 520 and the second substrate holder 530 respectively include a support plate 521 on the rear side of the support substrate G1 or G2, a clipper 522 attached to the support plate 521 to fix the substrate G1 or G2, and the support plate 521 standing vertically or horizontally Placed drive unit (not shown). Unlike the present embodiment, if the substrates G1 and G2 are placed in the vertical standing state into the individual program units 210, 220, 230, 240, 250, and 260, the driving unit is not required.

The temperature control unit 523 can be provided inside or below the support plate 521 to maintain the substrate G1 or G2 mounted on the support plate 521 at a temperature suitable for processing. The temperature control unit 523 may be a cooling unit that cools the substrate G1 or G2, a heating unit that heats the substrate G1 or G2, or a combination thereof. In the present embodiment, by using the cooling unit, the substrates G1 and G2 are maintained at the program temperature, and the reactivity between the substrates G1 and G2 and the deposition materials deposited on the upper surfaces of the substrates G1 and G2 is improved.

The clip 522 sandwiches the edges of the substrates G1 and G2, and prevents the substrates G1 and G2 from moving when the substrates G1 and G2 horizontally mounted on the support plate 521 stand vertically. In the present embodiment, deposition masks M1 and M2 each having a predetermined deposition pattern are formed on the substrates G1 and G2, respectively, to form a thin film pattern on the substrates G1 and G2. Therefore, the clip 522 can be used to firmly fix all of the substrates G1 and G2 and the deposition masks M1 and M2 on the support plate 521.

The first substrate holder 520 and the second substrate holder 530 are used to accommodate the substrates G1 and G2 therein, respectively. Also, the first substrate holder 520 and the second substrate holder 530 are spaced apart from each other by a predetermined distance on the same vertical plane, such that when either of the first substrate holder 520 and the second substrate holder 530 is rotated to its horizontal or vertical position, It does not touch or affect another substrate.

The deposition source 540 is disposed between the first substrate holder 520 and the second substrate holder 530. In detail, the deposition source 540 is positioned to face one of the substrates G1 and G2 that are rotated to the vertical position for the deposition process, and the deposition source 540 is used to supply the evaporation material toward the facing surface of the substrate G1 or G2 (that is, Deposition surface). The deposition source 540 has a chamber for storing material, a heating unit for evaporating material, and a dispenser for dispensing evaporation material, which are not shown in the drawings. The deposition source 540 can be a dot type, a line type, or a planar type. In the present embodiment, the deposition source 540 is of a dot type in which a plurality of dot deposition sources 541 and 542 are arranged in a column. The dot type deposition source 540 is moved and returned in the left and right direction by reciprocating the driving unit to evenly distribute the material onto the surface of the substrate G1 or G2. The procedure of dispensing material onto the substrate G1 or G2 is performed while the substrate G1 or G2 is standing vertically. In order to maintain the substrates G1 and G2 in the vertical position, the first substrate holder 520 and the second substrate holder 530 support the substrates G1 and G2 to be perpendicular to the ground.

In particular, the deposition source 540 is used to rotate the first substrate holder 520 by 180° in its dispensing direction to dispense material to the second substrate holder 530, or to rotate in the opposite direction by 180° to dispense material to the first substrate. Clip 520. Accordingly, a single deposition source 540 can be used for two program lines installed in a single device.

Now, referring to Fig. 1, a film deposition process performed by the thin film deposition system having the above structure will be roughly explained.

First, the substrate G which has been subjected to pretreatment to form a positive electrode is placed in the loading unit 110 under atmospheric pressure, and then the loading unit 110 becomes a vacuum condition. Next, the substrate G is successively placed into the program units 210, 220, 230, 240, 250, and 260, and a series of unit programs are executed along the alternately selected first and second program lines. In other words, the substrate G is successively placed in the HIL forming unit 210, the HTL forming unit 220, the blue-EML forming unit 231, the green-EML forming unit 232, and the red-EML forming unit 233 under vacuum conditions. Accordingly, HIL, HTL, and EML are successively formed on the positive electrode of each substrate G. Next, the substrate G is successively placed in the ETL forming unit 240, the EIL forming unit 250, and the negative electrode forming units 261, 262, and 263. As a result, an ETL, an EIL, and a plurality of negative electrodes are formed on the EML of each substrate G, and an OLED is formed in this manner. Thereafter, the obtained substrate G is transported to the unloading unit 120, and then released to the outside under atmospheric pressure.

Meanwhile, referring to FIGS. 3 and 4, the thin film deposition apparatus may include the fixing unit 10. When the first substrate holder 520 and the second substrate holder 530 accommodating the substrate G are transported into the chamber, the first substrate holder 520 and the second substrate holder 530 are caught by the fixing unit 10 at a specified position in the chamber, and are fixed. The specified time period continues for the specified time period. The designated position is a position at which the substrate G accommodated in the first substrate holder 520 and the second substrate holder 530 is precisely aligned with the mask. Accordingly, a correct film pattern can be formed on each substrate according to the manufacturer's design.

Accurate alignment between the substrate and the mask can be optically performed by an image pickup element such as a charge coupled device (CCD), a complementary metal oxide semiconductor (CMOS), or the like. In the above-described embodiment, since the first substrate holder 520 and the second substrate holder 530 accommodating the substrate G are stably fixed to the designated position by the fixing unit 10, stable alignment between the substrate G and the mask is achieved.

Meanwhile, the fixing unit 10 may include a fixing member 11 and a lifting member 12. The fixing member 11 catches the lifting member 12, and the lifting member 12 is inserted through the fixing member 11 into the bottom portions of the first substrate holder 520 and the second substrate holder 530. When the first substrate holder 520 and the second substrate holder 530 are fixed at the designated position, at least a part of the lifting member 12 is formed to be inserted into the fixing member 11. The lifting member 12 can include a hydraulic cylinder. Alternatively, the lifting member 12 can include a linear motor.

The fixing member 11 may be formed in a conical shape. The tip end of the lifting member 12 may also be formed in a conical shape so as to be received in the fixing member 11. Alternatively, the fixing member 11 may be formed in a cylindrical shape, and in this example, the tip end of the lifting member 12 may be formed in a hemispherical shape so as to be easily inserted into or withdrawn from the fixing member 11.

Meanwhile, referring to FIGS. 5 and 6, the thin film deposition apparatus may additionally include a plurality of travel control units 20. The travel control unit 20 limits the first substrate holder 520 and the second substrate holder 530 from traveling in a particular direction.

Each of the travel control units 20 may include a guiding member 21 and a driving member 22. The guiding members (each 21) are positioned adjacent to both sides of each of the first substrate holder 520 and the second substrate holder 530 to guide the advancement of the first substrate holder 520 and the second substrate holder 530. The driving member 22 causes the guiding member 21 to move closer to or away from the first substrate holder 520 and the second substrate holder 530. Each drive component 22 can be a linear motor. Alternatively, the drive component 22 can be a hydraulic cylinder.

The guiding member 21 may be a plurality of rollers disposed along one edge of each of the first substrate holder 520 and the second substrate holder 530. When the first substrate holder 520 and the second substrate holder 530 are placed in the chamber to distribute the deposition material on the substrate, the driving member 22 moves the roller closer to the first substrate holder 520 and the second substrate holder 530. The maximum interval between the rollers can be appropriately set to prevent the first substrate holder 520 and the second substrate holder 530 from being excessively inclined to be separated from the roller. The minimum interval between the rollers is set to be slightly narrower than the thickness of each of the first substrate holder 520 and the second substrate holder 530.

The first substrate holder 520 and the second substrate holder 530 are stably moved by moving the first substrate holder 520 and the second substrate holder 530 through the plurality of rollers. Moreover, the plurality of rollers are used to stably hold the first substrate holder 520 and the second substrate holder 530 when the deposition material is deposited on the substrate G, thereby providing resistance against vibration of the adjacent components. Therefore, the reliability of depositing the deposited material on the substrate can be improved.

Further, since the upper portion of the first substrate holder 520 and the second substrate holder 530 is sandwiched by the travel control unit 20 when the substrate G is aligned with the mask, stable alignment can be achieved.

At the same time, the conveying roller 30 can be provided under the bottom of the first substrate holder 520 and the second substrate holder 530. The conveying roller 30 is disposed in each chamber (not shown). The conveying roller 30 is used to move the first substrate holder 520 and the second substrate holder 530 in one direction. However, it is also possible to use a conveyor belt instead of the transport roller 30, and disposed below the bottom of the first substrate holder 520 and the second substrate holder 530.

At the same time, in the film deposition process, each substrate G is conveyed in a vertical standing position perpendicular to the ground. However, it is also possible to transport each substrate G parallel to the horizontal position of the ground. When the substrate G is transported at a horizontal position parallel to the ground, a program for standing the horizontal substrate G in the individual program units 210, 220, 230, 240, 250, and 260 is required. This procedure will be described in detail below with reference to Figs. 7 through 12 are plan views illustrating a unit procedure of a thin film deposition system in accordance with an embodiment.

As shown in FIG. 7, the first substrate G1 transported from the first program line in its horizontal position is placed in the program unit 200 through the first substrate inlet 511a, and then the first substrate G1 is mounted on the horizontally placed first substrate holder. 520's support plate. Next, the first deposition mask M1 is supplied from the first mask housing unit 310 connected to the program unit 200, and the first deposition mask M1 is placed on the first substrate G1 (see FIG. 8). Then, as shown in FIG. 8, the clip 522 of the first substrate holder 520 sandwiches the substrate G1 and the first deposition mask M1, and then rotates the first substrate holder 520 by 90° to become a vertical state. According to this, the surface of the first substrate G1 faces the distribution direction of the deposition source 540. When the deposition source 540 distributes the evaporation material toward the surface of the first substrate G1, a first thin film deposition process of depositing a thin film on the first substrate G1 is performed.

As shown in FIG. 9, when the first substrate G1 is placed in the program unit 200 or later, the second substrate G2 transported from the second program line at its horizontal position is placed in the program unit 200 through the second substrate inlet 511b. The second substrate G2 is mounted on the support plate of the horizontally placed second substrate holder 530, and from the second mask housing unit 320 connected to the program unit 200, supplies the second deposition mask M2 (see FIG. 10, and then The second substrate G52 is disposed and arranged on the second substrate G2. Next, as shown in FIG. 10, when the second substrate G2 and the second deposition mask M2 are sandwiched by the clip 512 of the second substrate holder 530, the second substrate holder 530 is disposed. The rotation is changed to 90° to become a vertical state. Here, the procedure of configuring/configuring the second substrate G2 and the second deposition mask M2 is performed during the first thin film deposition process to minimize the lead time and improve productivity.

Next, as shown in FIG. 11, after the termination of the first thin film deposition process, the dispensing direction of the deposition source 540 is rotated by 180[deg.] against the first substrate holder 520. According to this, the distribution direction of the deposition source 540 faces the surface of the second substrate G2, and when the deposition source 540 distributes the evaporation material onto the surface of the second substrate G2, the second film on which the thin film is deposited on the second substrate G2 is performed. Deposition procedure. Meanwhile, as shown in FIG. 12, when the second thin film deposition process is performed, the first substrate holder 520 returns to its horizontal state, and the first deposition mask M1 is separated from the first substrate G1. Thereafter, the first substrate G1 is released through the first substrate outlet 512a and then placed in the next unit program. Meanwhile, after the first and second thin film deposition processes, the first deposition mask M1 and the second deposition mask M2 separated from the first substrate G1 and the second substrate G2 remain in the corresponding unit, and are used in a subsequent deposition process. And the first deposition mask M1 and the second deposition mask M2 are transported to the first mask housing unit 310 and the second mask housing unit 320 when they have to be replaced due to dust, breakage, etc., and then taken out. Thereafter, the first deposition mask M1 and the second deposition mask M2 are reused by cleaning, repairing, and the like. However, the first mask housing unit 310 and the second mask housing unit 320 may also contain an additional deposition mask that replaces the used deposition mask.

In this manner, the single deposition source 540 provided in the individual program units 210, 220, 230, 240, 250, and 260 can be in the individual program units 210, 220, 230, 240, due to the thin film deposition system in accordance with the above-described embodiments. Continuous film deposition procedures are performed on a plurality of program lines PL1 and PL2 installed in 250 and 260, which can simultaneously reduce cost and increase productivity. In addition, since the deposition of the substrate and the arrangement of the substrate arrangement/mask with respect to the substrate are performed on a program line while performing film deposition on another substrate on another program line, the lead time can be reduced, thereby improving productivity.

Several examples have been described above. However, it should be understood that various modifications can be made. For example, if the techniques are performed in a different order, and/or if the components in the system, architecture, components, or circuits are combined in different ways and/or replaced or supplemented with other components or equivalents thereof, Achieve the appropriate results. Accordingly, other embodiments are within the scope of the following claims.

10. . . Fixed unit

11. . . Fixed part

12. . . Lifting parts

20. . . Travel control unit

twenty one. . . Guide member

twenty two. . . Drive unit

30. . . Transport roller

100. . . Chamber

110. . . Loading unit

120. . . Unloading unit

200. . . Thin film deposition device

210. . . HIL forming unit

220. . . HTL forming unit

230. . . EML forming unit

231. . . Blue-EML forming unit

232. . . Green-EML forming unit

233. . . Red-EML forming unit

240. . . ETL forming unit

250. . . EIL forming unit

260, 261, 262, 263. . . Negative electrode forming unit

200:210, 220, 230, 240, 250, 260. . . Program unit

310. . . First mask housing unit

320. . . Second mask housing unit

511a. . . First substrate inlet

511b. . . Second substrate inlet

512a. . . First substrate exit

512b. . . Second substrate exit

520. . . First substrate holder

521. . . Support plate

522. . . Clamp

523. . . Temperature control unit

530. . . Second substrate holder

540, 541, 542. . . Sedimentary source

600:610, 620. . . Shock absorber

G, G1, G2. . . Substrate

M1. . . First deposition mask

M2. . . Second deposition mask

PL1, PL2. . . Program line

The invention is further described in the accompanying drawings.

1 is a plan view illustrating a thin film deposition system in accordance with an embodiment.

Figure 2 is a plan view showing a thin film deposition apparatus included in the thin film deposition system of Figure 1.

Fig. 3 is a view for explaining a procedure in which the first or second substrate holder travels in one direction in the thin film deposition apparatus included in the thin film deposition system of Fig. 1.

Fig. 4 illustrates a state in which the first or second substrate is sandwiched by a fixing unit in the thin film deposition apparatus shown in Fig. 3.

Figure 5 illustrates a state in which the first or second substrate holder is guided by the travel control unit in the thin film deposition apparatus shown in Figure 3.

Fig. 6 is a view for explaining a procedure in which the travel control unit operates in the thin film deposition apparatus shown in Fig. 3.

7 through 12 are plan views illustrating a unit procedure of a thin film deposition system in accordance with an embodiment.

200. . . Thin film deposition device

310. . . First mask housing unit

320. . . Second mask housing unit

511a. . . First substrate inlet

511b. . . Second substrate inlet

512a. . . First substrate exit

512b. . . Second substrate exit

520. . . First substrate holder

521. . . Support plate

522. . . Clamp

523. . . Temperature control unit

530. . . Second substrate holder

540, 541, 542. . . Sedimentary source

G1, G2. . . Substrate

M1. . . First deposition mask

M2. . . Second deposition mask

Claims (9)

A thin film deposition apparatus comprising: a chamber in which a reaction space is formed; first and second substrate holders for accommodating substrates therein and spaced apart from each other; and a deposition source disposed on the first and second substrates Between the clips, to supply a deposition material to the substrates, wherein the first and second substrate holders support the substrates to be perpendicular to the ground; and a fixing unit, wherein the substrates are respectively accommodated in the first and When the second substrate is clamped, the first and second substrate holders are fixed to a designated position in the chamber for a predetermined time, wherein the fixing unit comprises: a fixing component for allowing the first and the first The bottom of the second substrate holder is inserted upward; and a lifting member is inserted into or withdrawn from at least a portion of the first and second substrate holders when fixed to a specific position. The thin film deposition apparatus of claim 1, further comprising a travel control unit that restricts the first and second substrate holders from traveling in one direction. The film deposition apparatus of claim 2, wherein the travel control unit comprises: a guiding member positioned adjacent to each side of each of the first and second substrate holders to guide the first And moving the second substrate holder; and a driving component causing the guiding member to move closer to or away from the first and second substrate holders. The thin film deposition apparatus of claim 3, wherein the guiding member is a plurality of rollers disposed in each of the first and second substrate holders. On both sides. The thin film deposition apparatus of claim 1, wherein each of the first and second substrate holders comprises: a support plate on which a substrate is mounted and the substrate is fixed; and a clipper, The substrate mounted on the support plate is fixed. The thin film deposition apparatus of claim 5, wherein each of the first and second substrate holders further comprises a driving unit such that the support plate stands vertically or the support plate is placed horizontally. The thin film deposition apparatus of claim 1, wherein the deposition source is rotatable between the first and second substrate holders. The thin film deposition apparatus of claim 1, wherein the deposition source is one of a one-point type, a one-line type, and a flat type. The thin film deposition apparatus of claim 1, wherein the chamber is connected to a mask chamber for respectively supplying a deposition mask to the first and second substrate holders, or for The deposition mask replaces the deposition mask.