KR20040088238A - System and Method for vacuum deposition - Google Patents

Abstract

PURPOSE: A system and a method for vacuum deposition are provided to exchange rapidly a shadow mask and reduce a processing period by separating a transfer channel of the shadow mask from a substrate. CONSTITUTION: A shadow mask alignment/attachment/detachment chamber(20) includes a shadow mask alignment/attachment/detachment unit for aligning and attaching a shadow mask on a substrate or detaching the shadow mask from the substrate and a substrate transfer unit for transferring the substrate. A process chamber(10a) is used for performing a deposition process for the substrate on which the shadow mask is adhered. A mask storage chamber(40) is installed at one side of the shadow mask alignment/attachment/detachment chamber in order to extract the shadow mask separated from the substrate.

Description

System and Method for vacuum deposition

TECHNICAL FIELD The present invention relates to a vacuum deposition system, and more particularly, a shadow mask aligning and adhering to a substrate through a channel consisting of successive alternating shadow mask alignment and desorption chambers and a process chamber. And it relates to a vacuum deposition system to facilitate the replacement of the shadow mask by going through another channel consisting of a mask storage chamber disposed on one side with respect to the detachment chamber.

In vacuum deposition of an organic electroluminescent device, a shadow mask is disposed between a substrate and an evaporation source to define an opening. During this operation, if the material to be deposited on a specific part of the substrate is different, the mask is replaced and aligned. In particular, in the case of a natural organic electroluminescent device, at least three shadow masks must be used because three colors of red, green, and blue must be deposited at different positions.

As a method of realizing this, an evaporation source and a shadow mask are fixed to a deposition chamber, a method of depositing a specific material while the substrate moves through each chamber, and a method of depositing a specific material by transferring the substrate and the shadow mask together Used.

As a transfer method, a robot arm is disposed in the center and has process chambers in which a deposition process is performed around the robot arm, so that the robot arm is responsible for transfer between process chambers, or a substrate is moved along a specific rail. .

The method using a robot arm is often called a cluster system, where the initial shadow mask is placed in each process chamber, the substrate is transferred to a specific chamber where the shadow mask is located, then the substrate and the shadow mask are aligned, attached and deposited. Perform.

This arrangement also applies to so-called inline systems that are transported linearly. In the case of the in-line system, after placing the shadow mask in each process chamber, the substrate may be transferred to each process chamber, followed by the deposition process. Alternatively, the chamber for aligning the substrate and the shadow mask may be configured separately from the process chamber, and the deposition and alignment operations may be performed separately, and then the substrate and the shadow mask may be transferred to the process chamber for deposition. In this case, the substrate is moved to the position of the used shadow mask to drop the used shadow mask, and then the substrate is moved to the position of the shadow mask to be used, the shadow mask is aligned, and then attached to the substrate and transferred to the process chamber.

However, in the case of a cluster system, in order to position the shadow mask in each process chamber, the robot arm must be transferred. Therefore, when there are a plurality of process chambers around the robot must be transferred sequentially, thus, it takes a lot of time to transfer and remove the shadow mask to the process chamber.

In the case of the inline system, the shadow mask to be used and the shadow mask to be used are respectively positioned at different positions, and the substrate is alternately attached and removed at each position. In this case, not only takes a lot of time in the process but also has to provide a device for attaching and removing the shadow mask, there is a problem that the structure of the equipment is complicated.

Accordingly, an object of the present invention is to provide a vacuum deposition system capable of rapidly replacing a shadow mask by minimizing mutual interference by separating a channel through which a substrate to be subjected to a deposition process and a channel through which a shadow mask is attached to the substrate is transferred. .

Another object of the present invention is to provide a vacuum deposition system that can simplify the configuration of the device by performing the attachment and detachment of the shadow mask using the same device.

It is still another object of the present invention to provide a vacuum deposition system that can be managed more efficiently by automating the cleaning and returning of the shadow mask used and recovered.

Other objects and features of the present invention will be more clearly understood through the embodiments described below.

1 is a conceptual diagram showing a vacuum deposition system according to an embodiment of the present invention.

2 is a conceptual diagram illustrating a vacuum deposition system according to another embodiment of the present invention.

According to the first embodiment of the present invention, a shadow mask transfer unit and a shadow mask transfer unit and a shadow mask transfer unit for transferring a shadow mask and a shadow mask alignment and detachment unit for aligning and attaching or detaching a shadow mask to a substrate on which a material is to be deposited are provided. A shadow mask alignment and detachment chamber provided with a substrate transfer unit for transferring; A process chamber installed to be continuous with the shadow mask alignment and desorption chamber and performing a deposition process on a substrate having a shadow mask transferred from the shadow mask alignment and desorption chamber; And a mask storage chamber installed at one side of the shadow mask alignment and desorption chamber to draw out the shadow mask separated from the substrate.

Preferably, the mask storage chamber may be provided with a cleaning unit for cleaning the shadow mask transported separately.

In addition, the mask storage chamber may be provided with an entrance gate for withdrawing the separated and transferred shadow mask and the drawn in the cleaned shadow mask.

According to the second embodiment of the present invention, a shadow mask transfer unit and a shadow mask transfer unit and a shadow mask transfer unit for transferring a shadow mask and a shadow mask alignment and detachment unit for aligning and attaching or detaching a shadow mask to a substrate on which a material is to be deposited are provided. A shadow mask alignment and detachment chamber provided with a substrate transfer unit for transferring; A process chamber installed to be continuous with the shadow mask alignment and desorption chamber and performing a deposition process on a substrate having a shadow mask transferred from the shadow mask alignment and desorption chamber; A first mask storage chamber installed at one side of the shadow mask alignment and detachment chamber to provide a shadow mask to be attached to the substrate; And a second mask storage chamber installed at the other side of the shadow mask alignment and detachment chamber to draw out the shadow mask separated from the substrate.

Preferably, the second mask storage chamber is provided with a cleaning unit for cleaning the shadow mask transported separately.

Preferably, a plurality of sets may be continuously installed with the shadow mask alignment and detachment chamber, the process chamber, and the first and second mask storage chambers as one set.

Further, preferably, the first and second mask storage chambers provided on the side of one set of shadow mask alignment and detachment chambers are installed opposite to the other set of first and second mask storage chambers.

Also, withdrawal from the second mask storage chamber is between the second mask storage chamber of one set and the first mask storage chamber of the previous set, and between the first mask storage chamber of one set and the second mask storage chamber of the next set. The shadow mask return unit for returning the shadow mask to the first storage chamber is provided.

According to a third embodiment of the invention, a substrate is deposited through a single channel consisting of successive alternating shadow mask alignment and desorption chambers and a process chamber, the shadow being attached to or separated from the substrate. Disclosed is a vacuum deposition method in which a mask proceeds through another channel consisting of a mask storage chamber disposed on both sides around a shadow mask alignment and detachment chamber.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

1 is a conceptual view showing a vacuum deposition system according to an embodiment of the present invention, only a portion thereof is shown for convenience of description.

The shadow mask alignment and detachment chamber 20 is positioned between the process chambers 10a and 10b, and the mask storage chamber 40 is positioned at one side of the shadow mask alignment and detachment chamber 20.

In the process chambers 10a and 10b, deposition is performed using different shadow masks and materials. In the case of a color organic electroluminescent device, materials of red (R), green (G), and blue (B) are respectively deposited. .

In the shadow mask alignment and desorption chamber 20, a shadow mask corresponding to the deposition material is attached to the substrate on which the material is to be deposited and transferred to the process chamber 10b by the substrate transfer unit 24 or deposited in the process chamber 10a. The process is completed to separate the used shadow mask from the transferred substrate.

In addition, in the shadow mask alignment and detachment chamber 20, a shadow mask transfer unit 22 for transferring the supplied shadow mask to the substrate position or the shadow mask separated from the substrate to the mask storage chamber 40 is installed.

Preferably, the mask storage chamber 40 may be provided with a cleaning unit 44 for removing the deposition material attached to the extracted shadow mask.

In addition, without installing a cleaning unit in the mask storage chamber 40, a separate entrance gate is installed in the mask storage chamber 40 to draw out the shadow mask to which the deposition material is attached, and introduce the cleaned shadow mask. can do.

In addition, the mask storage chamber 40 may be configured to allow a plurality of shadow masks to be introduced at the same time to be cleaned at the same time.

The operation of the vacuum deposition system according to such an embodiment will be described.

When the substrate on which the red light emitting material has been deposited in the process chamber 10a is transferred to the shadow mask alignment and detachment chamber 20 by the substrate transfer unit 26, the shadow mask alignment and detachment unit 24 is used from the substrate. The shadow mask is separated from the substrate and transferred to the mask storage chamber 40 by using the shadow mask transfer unit 22.

At this time, preferably, the shadow mask transferred to the mask storage chamber 40 is cleaned and drawn out by the cleaning unit 44.

Then, when the shadow mask corresponding to the green light emitting material is supplied to the shadow mask alignment and detachment chamber 20, the shadow mask transfer unit 22 transfers the supplied shadow mask to the substrate position, and the shadow mask alignment and detachment unit 24 ) Attaches the transferred shadow mask for green light-emitting material to the substrate.

The substrate on which the shadow mask for the green light emitting material is attached is transferred to the process chamber 10b to deposit the green light emitting material through the deposition process.

When the deposition of the green light emitting material is completed, it is transferred to a continuous shadow mask alignment and desorption chamber, and the above process is repeated.

According to one such embodiment, the substrate proceeds through a single channel consisting of successive alternating shadow mask alignment and detachment chambers and a process chamber, and the shadow mask attached to the substrate is a shadow mask alignment and detachment chamber and its It is possible to quickly change the shadow mask without mutual interference by allowing it to proceed through another channel consisting of a mask storage chamber disposed at one side.

In addition, there is an advantage that the time can be shortened because the cleaning unit is cleaned by the cleaning unit together with the recovery of the shadow mask without requiring a separate moving path for cleaning.

2 is a conceptual diagram illustrating a vacuum deposition system according to another embodiment of the present invention.

The shadow mask alignment and detachment chamber 20 is positioned between the process chambers 10a and 10b, and the first mask storage chambers 30 and 60 and the second mask storage are respectively located at both sides of the shadow mask alignment and detachment chamber 20. Chambers 40 and 70 are located respectively.

In the process chambers 10a and 10b, deposition is performed using different shadow masks and materials. In the case of a color organic electroluminescent device, materials of red (R), green (G), and blue (B) are respectively deposited. .

In the shadow mask alignment and detachment chamber 20, a shadow mask corresponding to a deposition material is attached to a substrate and transferred to the process chamber 10b by the substrate transfer unit 24, or the deposition process is completed in the process chamber 10a. The shadow mask used is separated from the transferred substrate.

Also, in the shadow mask alignment and detachment chamber 20, the shadow mask supplied from the first mask storage chamber 30 is transferred or the shadow mask separated from the substrate is transferred to the second mask storage chamber 40. The transfer unit 22 is installed.

The first mask storage chambers 30 and 60 provide a shadow mask to the shadow mask alignment and detachment chamber 20 for use in the next deposition process, and the second mask storage chambers 40 and 70 provide the shadows used in the previous deposition process. The mask is withdrawn from the shadow mask alignment and detachment chamber 20.

Preferably, the second mask storage chambers 40 and 70 may be provided with a cleaning unit 44 for removing the deposition material attached to the extracted shadow mask.

In addition, the shadow masks from the second mask storage chambers 40 and 70 may be returned to be used again in the corresponding shadow mask alignment and detachment chambers 20. To this end, it is possible to reverse the positions of the shadow mask alignment centered on the inline and the first and second mask storage chambers positioned on both sides of the detachable chamber 20. In addition, a shadow mask return unit 80 that reciprocates between the first and second mask storage chambers may be installed.

This will be described in more detail as follows.

The shadow mask alignment and desorption chamber 20, the first and second mask storage chambers 30 and 40, and the process chamber 10b are referred to as a set, in order to deposit red, green and blue light emitting materials. The first to third sets are installed in succession.

In this case, when one set of the first and second mask storage chambers 30 and 40 is disposed opposite to the other set of the first and second mask storage chambers 60 and 70, the second set of the second mask storage chambers ( 70 and one set of first mask storage chambers 30 are on the same side. Therefore, if the shadow mask return unit 80 is provided between them, the shadow mask cleaned and drawn out from another set of second mask storage chambers 70 will be supplied to one set of first mask storage chambers 30. Can be.

The operation of the vacuum deposition system having such a configuration will be described. The shadow mask alignment and detachment chamber located at the center of the present invention will be described so that the features of the present invention can be well represented.

For example, the substrate on which deposition of the red light emitting material is completed is transferred to the shadow mask alignment and desorption chamber 20 with the shadow mask for the red light emitting material attached thereto.

The shadow mask alignment and detachment unit 24 transfers the shadow mask used from the substrate to the second mask storage chamber 40 using the shadow mask transfer unit 22, as indicated by arrow B of FIG. 2. At the same time, as indicated by arrow A in FIG. 2, the other shadow mask transfer unit 22 receives the shadow mask for depositing the green light emitting material from the first mask storage chamber 30, for example, the shadow mask alignment and detachment chamber. Transfer to 20.

Subsequently, the shadow mask alignment and detachment unit 24 is operated to attach the transferred shadow mask for the green light emitting material to the substrate.

The substrate on which the shadow mask for the green light emitting material is attached is transferred to the process chamber 10b to deposit the green light emitting material through the deposition process.

When the deposition of the green light emitting material is completed, the shadow mask is transferred to the alignment and desorption chamber 50, and the above-described process is repeated, and the shadow mask for the green light emitting material is separated and transferred to the second mask storage chamber 70. The shadow mask for the luminescent material is transferred and attached to the substrate.

At this time, the shadow mask for the green light emitting material transferred to the second mask storage chamber 70 is removed by the shadow mask return unit 80 after the green light emitting material attached by the cleaning unit 44 is removed. 1 is transferred to the mask storage chamber 30.

Therefore, the substrate proceeds through one channel consisting of successively arranged shadow mask alignment and detachment chambers and a process chamber, and the shadow mask attached to or detached from the substrate is disposed on both sides of the shadow mask alignment and detachment chamber. The shadow mask can be quickly exchanged by allowing it to proceed through another channel consisting of a mask storage chamber.

In addition, by appropriately adjusting the arrangement of the adjacent mask storage chambers on the inline and disposing the shadow mask transfer unit therebetween, the used shadow mask can be quickly and smoothly recovered and used again.

Although the above has been described based on the preferred embodiment of the present invention, it can be appropriately changed or modified by those skilled in the art without departing from the spirit of the present invention. It is natural that such changes or modifications fall within the scope of the present invention without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the claims described below.

According to the present invention has various advantages.

First, since the transfer channel between the substrate and the shadow mask is separated, the shadow mask can be quickly replaced by minimizing mutual interference, thereby reducing the process time.

In addition, there is an advantage in simplifying the configuration of the device by implementing the detachment, attachment and alignment of the shadow mask in the same device.

Furthermore, there is an advantage that the cleaning is performed at the same time as the shadow mask is recovered and the management is easy by automatically performing a cycle to be returned to the process.

Claims (9)

Shadow masks for aligning and attaching or detaching the shadow masks onto the substrate on which the material is to be deposited. Alignment and desorption chambers; A process chamber installed to be continuous with the shadow mask alignment and desorption chamber and performing a deposition process on a substrate having a shadow mask transferred from the shadow mask alignment and desorption chamber; And And a mask storage chamber installed at one side of the shadow mask alignment and detachment chamber and extracting the shadow mask separated from the substrate. The vacuum deposition system according to claim 1, wherein the mask storage chamber is provided with a cleaning unit for cleaning the separated and transported shadow mask. The vacuum deposition system according to claim 1, wherein the mask storage chamber is provided with an entrance gate for withdrawing the separated and transferred shadow mask and for introducing the cleaned shadow mask. Shadow masks for aligning and attaching or detaching the shadow masks onto the substrate on which the material is to be deposited. Alignment and desorption chambers; A process chamber installed to be continuous with the shadow mask alignment and desorption chamber and performing a deposition process on a substrate having a shadow mask transferred from the shadow mask alignment and desorption chamber; A first mask storage chamber installed at one side of the shadow mask alignment and detachment chamber to provide a shadow mask to be attached to the substrate; And And a second mask storage chamber installed at the other side of the shadow mask alignment and detachment chamber to draw out the shadow mask separated from the substrate. 5. The vacuum deposition system according to claim 4, wherein the second mask storage chamber is provided with a cleaning unit for cleaning the separated and transported shadow mask. 5. The vacuum deposition system according to claim 4, wherein a plurality of sets are continuously installed with the shadow mask alignment and detachment chamber, the process chamber, and the first and second mask storage chambers as one set. 7. The method of claim 6, wherein the first and second mask storage chambers installed on the side of one set of shadow mask alignment and detachment chambers are installed opposite to the other adjacent first and second mask storage chambers. Vacuum deposition system. 8. The method of claim 7, wherein between the one set of second mask storage chambers and the previous set of first mask storage chambers, and between the one set of first mask storage chambers and the next set of second mask storage chambers. And a shadow mask returning unit for returning the shadow mask drawn out from the second mask storage chamber to the first storage chamber, respectively. The substrate on which the material is to be deposited is run through a single channel consisting of alternating shadow mask alignment and desorption chambers and a process chamber, and the shadow mask attached to or separated from the substrate is a shadow mask alignment and desorption chamber. A vacuum deposition method characterized in that it proceeds through another channel consisting of a mask storage chamber disposed on both sides with a center.