WO2010114274A3 - Apparatus for depositing film and method for depositing film and system for depositing film - Google Patents

Apparatus for depositing film and method for depositing film and system for depositing film Download PDF

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Publication number
WO2010114274A3
WO2010114274A3 PCT/KR2010/001919 KR2010001919W WO2010114274A3 WO 2010114274 A3 WO2010114274 A3 WO 2010114274A3 KR 2010001919 W KR2010001919 W KR 2010001919W WO 2010114274 A3 WO2010114274 A3 WO 2010114274A3
Authority
WO
WIPO (PCT)
Prior art keywords
film
depositing
depositing film
substrate holders
deposition source
Prior art date
Application number
PCT/KR2010/001919
Other languages
French (fr)
Other versions
WO2010114274A2 (en
Inventor
Kyung Bin Bae
Hyung Seok Yoon
Chang Ho Kang
Hyun Goo Kwon
Original Assignee
Snu Precision Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snu Precision Co., Ltd filed Critical Snu Precision Co., Ltd
Priority to JP2012503318A priority Critical patent/JP5364200B2/en
Priority to CN201080015804.9A priority patent/CN102369306B/en
Publication of WO2010114274A2 publication Critical patent/WO2010114274A2/en
Publication of WO2010114274A3 publication Critical patent/WO2010114274A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Abstract

Provided are an apparatus for depositing a film, including: a chamber configured to provide a reaction space; first and second substrate holders spaced apart from each other and installed in the chamber; and a deposition source which is installed between the first and second substrate holders and configured to sequentially supply a deposition raw materials in directions of the first and second substrate holders, a method for depositing a film suitable for the apparatus, and a system for depositing a film including the apparatus. According to the present disclosure, since sequential film processes can be performed with respect to two or more process lines provided in each of the process chambers through the single deposition source provided in each of the process chambers, fabrication costs can be saved and at the same time productivity can be enhanced.
PCT/KR2010/001919 2009-03-31 2010-03-30 Apparatus for depositing film and method for depositing film and system for depositing film WO2010114274A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012503318A JP5364200B2 (en) 2009-03-31 2010-03-30 Thin film deposition apparatus, thin film deposition method and thin film deposition system
CN201080015804.9A CN102369306B (en) 2009-03-31 2010-03-30 Apparatus for depositing film and method for depositing film and system for depositing film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090027351A KR101097737B1 (en) 2009-03-31 2009-03-31 Apparatus for depositing film and method for depositing film and system for depositing film
KR10-2009-0027351 2009-03-31

Publications (2)

Publication Number Publication Date
WO2010114274A2 WO2010114274A2 (en) 2010-10-07
WO2010114274A3 true WO2010114274A3 (en) 2010-12-23

Family

ID=42828832

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001919 WO2010114274A2 (en) 2009-03-31 2010-03-30 Apparatus for depositing film and method for depositing film and system for depositing film

Country Status (5)

Country Link
JP (1) JP5364200B2 (en)
KR (1) KR101097737B1 (en)
CN (1) CN102369306B (en)
TW (1) TWI427178B (en)
WO (1) WO2010114274A2 (en)

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US20100279021A1 (en) 2009-05-04 2010-11-04 Samsung Mobile Display Co., Ltd. Apparatus for depositing organic material and depositing method thereof
KR101151234B1 (en) * 2010-03-30 2012-06-14 주식회사 케이씨텍 Upright type deposition apparatus and transfer method for substrate
JP2013167001A (en) * 2012-02-16 2013-08-29 Hitachi High-Technologies Corp Vacuum deposition system and vacuum deposition method
KR102106414B1 (en) * 2013-04-26 2020-05-06 삼성디스플레이 주식회사 Depositing chamber, depositing system comprising the same and method for manufacturing organic light emitting diode display
KR20150053161A (en) * 2013-11-07 2015-05-15 삼성디스플레이 주식회사 Deposition apparatus, method for manufacturing organic light emitting display apparatus using the same
JP6328766B2 (en) * 2013-12-10 2018-05-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Evaporation source for organic material, deposition apparatus for depositing organic material in vacuum chamber, and method for evaporating organic material
KR102229761B1 (en) 2014-03-17 2021-03-23 삼성디스플레이 주식회사 Atomic layer deposition apparatus
CN107002223B (en) * 2014-12-05 2019-11-05 应用材料公司 Material deposition system and method for the deposition materials in material deposition system
DE102016110884A1 (en) 2016-06-14 2017-12-14 Aixtron Se Apparatus and method for depositing organic layers on one or more substrates
CN106435482A (en) * 2016-10-27 2017-02-22 安徽恒致铜铟镓硒技术有限公司 Independent box type evaporation source device
WO2018144107A1 (en) * 2017-02-03 2018-08-09 Applied Materials, Inc. Apparatus and method for continuous evaporation having substrates side by side
EP3394881A1 (en) * 2017-03-17 2018-10-31 Applied Materials, Inc. Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system
US11133430B2 (en) * 2017-08-09 2021-09-28 Kaneka Corporation Photoelectric conversion element production method
CN109423610B (en) * 2017-08-24 2020-12-04 京东方科技集团股份有限公司 Evaporation device and evaporation method
KR101921648B1 (en) * 2017-12-28 2018-11-26 주식회사 올레드온 Cluster type manufacturing equipment using vertical type plane source evaporation for high definition AMOLED devices
KR102355814B1 (en) * 2020-03-20 2022-01-26 주식회사 선익시스템 Deposition apparatus and organic material depositing method using the same
KR102430349B1 (en) * 2020-04-14 2022-08-08 주식회사 선익시스템 Cluster deposition system
KR102413664B1 (en) * 2020-04-20 2022-06-28 주식회사 선익시스템 Cluster deposition system
KR102407505B1 (en) * 2020-04-29 2022-06-13 주식회사 선익시스템 Deposition apparatus and in-line deposition system
CN111663104A (en) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 Vapor deposition system and vapor deposition method
CN114875363A (en) * 2022-03-24 2022-08-09 广州华星光电半导体显示技术有限公司 Evaporation device and manufacturing method of display panel

Citations (4)

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JPH051378A (en) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd Substrate holder conveyor for in-line film forming device
KR20040088238A (en) * 2003-04-09 2004-10-16 (주)네스디스플레이 System and Method for vacuum deposition
JP2007077493A (en) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg Coating machine and method for operating a coating machine
JP2007239071A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Vacuum vapor deposition apparatus

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JP3232646B2 (en) * 1992-05-07 2001-11-26 日本板硝子株式会社 Method for producing transparent conductive glass for liquid crystal display element
JPH0941142A (en) * 1995-07-26 1997-02-10 Balzers & Leybold Deutsche Holding Ag Device for alternately positioning substrates to be coated in vacuo
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JP4843873B2 (en) * 2001-07-05 2011-12-21 ソニー株式会社 Oblique deposition apparatus and oblique deposition method
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH051378A (en) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd Substrate holder conveyor for in-line film forming device
KR20040088238A (en) * 2003-04-09 2004-10-16 (주)네스디스플레이 System and Method for vacuum deposition
JP2007077493A (en) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg Coating machine and method for operating a coating machine
JP2007239071A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Vacuum vapor deposition apparatus

Also Published As

Publication number Publication date
JP2012522137A (en) 2012-09-20
JP5364200B2 (en) 2013-12-11
KR20100108994A (en) 2010-10-08
TWI427178B (en) 2014-02-21
KR101097737B1 (en) 2011-12-22
CN102369306B (en) 2014-01-22
CN102369306A (en) 2012-03-07
WO2010114274A2 (en) 2010-10-07
TW201104008A (en) 2011-02-01

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