WO2010128811A3 - Thin film deposition apparatus and thin film deposition system comprising same - Google Patents

Thin film deposition apparatus and thin film deposition system comprising same Download PDF

Info

Publication number
WO2010128811A3
WO2010128811A3 PCT/KR2010/002887 KR2010002887W WO2010128811A3 WO 2010128811 A3 WO2010128811 A3 WO 2010128811A3 KR 2010002887 W KR2010002887 W KR 2010002887W WO 2010128811 A3 WO2010128811 A3 WO 2010128811A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
film deposition
substrate holder
present
chamber
Prior art date
Application number
PCT/KR2010/002887
Other languages
French (fr)
Korean (ko)
Other versions
WO2010128811A2 (en
Inventor
배경빈
윤형석
강창호
Original Assignee
에스엔유 프리시젼 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스엔유 프리시젼 주식회사 filed Critical 에스엔유 프리시젼 주식회사
Priority to CN201080020337.9A priority Critical patent/CN102421933B/en
Priority to JP2012509732A priority patent/JP5506917B2/en
Publication of WO2010128811A2 publication Critical patent/WO2010128811A2/en
Publication of WO2010128811A3 publication Critical patent/WO2010128811A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The present invention provides a thin film deposition apparatus comprising: a transfer chamber for transferring substrates; and a first process chamber and a second process chamber coupled to both sides of the transfer chamber, respectively, wherein each of the first process chamber and the second process chamber includes: a first substrate holder and a second substrate holder spaced apart from each other; and a spray unit interposed between the first substrate holder and the second substrate holder to consecutively supply deposition materials in the direction of the first and second substrate holders. The present invention also provides a thin film deposition system comprising the apparatus. The thus-configured apparatus of the present invention has multiple process chambers which perform the same process and which are connected to both sides of the transfer chamber, respectively, thus performing a thin film process simultaneously on multiple substrates and improving processing speed.
PCT/KR2010/002887 2009-05-07 2010-05-06 Thin film deposition apparatus and thin film deposition system comprising same WO2010128811A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201080020337.9A CN102421933B (en) 2009-05-07 2010-05-06 Thin film deposition apparatus and thin film deposition system comprising same
JP2012509732A JP5506917B2 (en) 2009-05-07 2010-05-06 Thin film deposition apparatus and thin film deposition system including the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090039826A KR101119853B1 (en) 2009-05-07 2009-05-07 Apparatus for depositing film and system for depositing film having the same
KR10-2009-0039826 2009-05-07

Publications (2)

Publication Number Publication Date
WO2010128811A2 WO2010128811A2 (en) 2010-11-11
WO2010128811A3 true WO2010128811A3 (en) 2011-03-17

Family

ID=43050634

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002887 WO2010128811A2 (en) 2009-05-07 2010-05-06 Thin film deposition apparatus and thin film deposition system comprising same

Country Status (5)

Country Link
JP (1) JP5506917B2 (en)
KR (1) KR101119853B1 (en)
CN (1) CN102421933B (en)
TW (1) TWI386500B (en)
WO (1) WO2010128811A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101151234B1 (en) * 2010-03-30 2012-06-14 주식회사 케이씨텍 Upright type deposition apparatus and transfer method for substrate
KR101700608B1 (en) * 2011-04-15 2017-02-01 이찬용 Substrate treatment system
JP5846780B2 (en) * 2011-06-30 2016-01-20 株式会社アルバック Vacuum processing apparatus, vacuum processing method, and method for manufacturing lithium ion secondary battery
KR101467195B1 (en) * 2013-05-14 2014-12-01 주식회사 아바코 Gas sprayer and thin film depositing apparatus having the same
KR102426712B1 (en) * 2015-02-16 2022-07-29 삼성디스플레이 주식회사 Apparatus and method of manufacturing display apparatus
EP3394881A1 (en) * 2017-03-17 2018-10-31 Applied Materials, Inc. Methods of handling a mask device in a vacuum system, mask handling apparatus, and vacuum system
CN110998869B (en) * 2017-08-09 2022-12-27 株式会社钟化 Method for manufacturing photoelectric conversion element
JP2019528370A (en) * 2017-08-17 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ Method for handling several masks, method for processing a substrate, and apparatus for coating a substrate
KR101921648B1 (en) * 2017-12-28 2018-11-26 주식회사 올레드온 Cluster type manufacturing equipment using vertical type plane source evaporation for high definition AMOLED devices
KR20210081597A (en) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 Film forming system, and manufacturing method of electronic device
KR102407505B1 (en) * 2020-04-29 2022-06-13 주식회사 선익시스템 Deposition apparatus and in-line deposition system
CN111663104A (en) * 2020-06-24 2020-09-15 武汉华星光电半导体显示技术有限公司 Vapor deposition system and vapor deposition method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051378A (en) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd Substrate holder conveyor for in-line film forming device
KR20040088238A (en) * 2003-04-09 2004-10-16 (주)네스디스플레이 System and Method for vacuum deposition
JP2007077493A (en) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg Coating machine and method for operating a coating machine
JP2007239071A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Vacuum vapor deposition apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299959U (en) * 1989-01-24 1990-08-09
JPH0941142A (en) * 1995-07-26 1997-02-10 Balzers & Leybold Deutsche Holding Ag Device for alternately positioning substrates to be coated in vacuo
JP2000277585A (en) * 1999-03-23 2000-10-06 Hitachi Ltd Substrate conveyor and vacuum treatment apparatus
JP2004146369A (en) * 2002-09-20 2004-05-20 Semiconductor Energy Lab Co Ltd Manufacturing method of manufacturing device and light emitting device
WO2004028214A1 (en) * 2002-09-20 2004-04-01 Semiconductor Energy Laboratory Co., Ltd. Fabrication system and manufacturing method of light emitting device
JP4397655B2 (en) * 2003-08-28 2010-01-13 キヤノンアネルバ株式会社 Sputtering apparatus, electronic component manufacturing apparatus, and electronic component manufacturing method
JP2008019477A (en) * 2006-07-13 2008-01-31 Canon Inc Vacuum vapor deposition apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051378A (en) * 1991-03-25 1993-01-08 Shin Meiwa Ind Co Ltd Substrate holder conveyor for in-line film forming device
KR20040088238A (en) * 2003-04-09 2004-10-16 (주)네스디스플레이 System and Method for vacuum deposition
JP2007077493A (en) * 2005-09-15 2007-03-29 Applied Materials Gmbh & Co Kg Coating machine and method for operating a coating machine
JP2007239071A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Vacuum vapor deposition apparatus

Also Published As

Publication number Publication date
CN102421933A (en) 2012-04-18
JP5506917B2 (en) 2014-05-28
KR20100120941A (en) 2010-11-17
WO2010128811A2 (en) 2010-11-11
CN102421933B (en) 2014-07-23
TW201107507A (en) 2011-03-01
KR101119853B1 (en) 2012-02-28
TWI386500B (en) 2013-02-21
JP2012526199A (en) 2012-10-25

Similar Documents

Publication Publication Date Title
WO2010128811A3 (en) Thin film deposition apparatus and thin film deposition system comprising same
WO2010114274A3 (en) Apparatus for depositing film and method for depositing film and system for depositing film
WO2007120776A3 (en) Plasma deposition apparatus and method for making solar cells
WO2012148801A3 (en) Semiconductor substrate processing system
TW201130074A (en) Process module, substrate processing apparatus, and method of transferring substrate
WO2011034751A3 (en) Hot wire chemical vapor deposition (cvd) inline coating tool
EP2131387A3 (en) Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
WO2012096466A3 (en) Thin film deposition apparatus and substrate treatment system including same
WO2008120716A1 (en) Substrate processing apparatus, substrate processing method and computer readable storage medium
WO2012118955A3 (en) Apparatus and process for atomic layer deposition
WO2007123763A3 (en) Articles having localized molecules disposed thereon and methods of producing same
WO2013012549A3 (en) Multi-chamber cvd processing system
WO2013082488A3 (en) Optical coating method, apparatus and product
WO2008106545A3 (en) Pecvd process chamber backing plate reinforcement
WO2008085681A3 (en) Wet clean system design
TW200628619A (en) Vacuum coating system
WO2009072426A1 (en) Vacuum processing apparatus and substrate processing method
SG195119A1 (en) Method of transferring thin films
GB201121034D0 (en) Apparatus and method for depositing a layer onto a substrate
WO2008156152A1 (en) Transfer method and transfer apparatus
TW200638566A (en) Apparatus for depositing a multilayer coating on discrete sheets
WO2007109448A3 (en) Apparatus and method for carrying substrates
WO2009029954A3 (en) Improved solution deposition assembly
WO2009050849A1 (en) Substrate processing apparatus
WO2011085010A3 (en) System for batch processing of magnetic media

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080020337.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10772271

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2012509732

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10772271

Country of ref document: EP

Kind code of ref document: A2