KR20180046667A - An manufacturing system for organic light emitting device and manufacturing method - Google Patents

Abstract

The present invention relates to a system for manufacturing an organic light emitting device. The system for manufacturing an organic light emitting device includes a process chamber for forming high vacuum pressure in which a second donor substrate is installed with a top-down method, and a load rock chamber for forming first middle vacuum pressure and a buffer chamber for forming second high vacuum pressure in order to form stepwise vacuum pressure between process chambers for forming low vacuum pressure or atmospheric pressure for coating a first donor substrate with an organic material. Accordingly, the present invention can secure the uniformity of an organic film which is deposited and prevent a loss of the organic material.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED)

The present invention relates to a manufacturing system and a manufacturing method of an organic light emitting diode, and more particularly, to an organic light emitting diode manufacturing method and a manufacturing method thereof, more specifically, to improve productivity by securing uniformity of an organic film deposited, reducing organic material loss, And more particularly, to a manufacturing system and a manufacturing method of an organic light emitting diode that deposit an organic layer on an element substrate using a donor substrate and an organic film deposition process.

Among the flat panel display devices, the organic light emitting display device has a response speed of 1 ms or less and has a high response speed, low power consumption, and self light emission, so there is no problem with the viewing angle, . In addition, since it can be manufactured at a low temperature and the manufacturing process is simple based on the existing semiconductor process technology, it is attracting attention as a next generation flat panel display device. In addition, since the organic layer used in the organic light emitting display device emits light by itself, it can be used in an OLED lighting device by applying an electric field to the upper and lower ends of the multi-layer organic film after the entire deposition. OLED lighting is a point light source, while LED light is a point light source.

The formation of the organic thin film in the organic light emitting display device and OLED lighting manufacturing process can be broadly classified into a polymer type device using a wet process and a low molecular type device using a deposition process depending on the materials and processes used. For example, in the case of an inkjet printing method among the methods of forming a polymer or a low molecular weight light emitting layer, the materials of the organic layers other than the light emitting layer are limited, and there is a need to form a structure for inkjet printing on the substrate. When a light emitting layer is formed by a vapor deposition process, a separate metal mask is used. In a metal mask, the size of the metal mask must be increased as the size of the flat panel display increases. At this time, There is a problem that it is difficult to manufacture a large-sized device.

On the other hand, a technique of forming an organic light emitting layer by using line heating has already been disclosed. In this technique, an organic light emitting layer is first formed on a donor substrate, and then the donor substrate and the element substrate are positioned to face each other. Then, the row heat is heated on the donor substrate to deposit an organic light emitting layer formed on the donor substrate as an element substrate.

However, the technique of forming the organic light emitting layer using the row heating has a problem in that the process time (TACT time) increases due to the addition of unnecessary processes such as the inversion of the donor substrate or the device substrate.

Korean Patent Registration No. 10-1405502 (Published on June 27, 2014) Korean Registered Patent No. 10-1169002 (Published on July 26, 2012) Korean Registered Patent No. 10-1169001 (public date July 26, 2012) Korean Patent Laid-Open Publication No. 10-2012-0129507 (public date November 28, 2012

It is an object of the present invention to quickly perform a process from a low vacuum to a high vacuum using a load lock chamber and a buffer chamber in order to process an organic film deposition process using a row heating method, And to provide a manufacturing system and a manufacturing method of an organic light emitting device for depositing an organic film on a substrate.

It is another object of the present invention to provide a manufacturing system and a manufacturing method of an organic light emitting diode, in order to ensure uniformity of a deposited organic film and to reduce loss of an organic material.

It is still another object of the present invention to provide a manufacturing system and a manufacturing method of an organic light emitting device in order to shorten the processing time.

According to an aspect of the present invention, there is provided a system for manufacturing an organic light emitting diode, including: a processor chamber for forming a vacuum pump having a second donor substrate installed in a top-down manner; an atmospheric pressure or low- A load lock chamber for forming a primary heavy pneumatic pressure and a buffer chamber for forming a secondary high vacuum pneumatic pressure may be provided in order to form a stepwise vacuum pressure between the forming processor chambers.

As described above, the manufacturing system and the manufacturing method of the organic light emitting diode of the present invention can quickly perform a process from a low vacuum to a high vacuum using a load lock chamber and a buffer chamber, and use two donor substrates and an element substrate By treating the organic film deposition process, uniformity of the deposited organic film can be ensured and loss of organic matter can be prevented.

In addition, the manufacturing system and the manufacturing method of the organic light emitting diode of the present invention are advantageous for manufacturing a large-sized device by processing the organic film deposition process using two donor substrates and an element substrate, and the process time can be shortened.

In addition, the manufacturing system and the manufacturing method of the organic light emitting diode of the present invention can reduce the loss of organic matter by forming an organic film on the donor substrate by a wet process.

In addition, the manufacturing system and the manufacturing method of the organic light emitting diode of the present invention can easily realize the facility, reduce the manufacturing cost, and shorten the process time by constituting the coating chamber, the load lock chamber and the deposition chamber in a series form .

FIG. 1 is a block diagram showing a schematic configuration of an organic light emitting device manufacturing system using line heating according to an embodiment of the present invention. Referring to FIG.
2 is a cross-sectional view showing the configuration of the coating apparatus shown in Fig.
3 is a cross-sectional view showing the configuration of the deposition apparatus shown in FIG.
FIG. 4 is a cross-sectional view illustrating a structure in which the fixing unit is lowered in the deposition apparatus shown in FIG. 3 so that the first donor substrate and the second donor substrate are spaced apart from each other by a predetermined distance.
FIG. 5 is a cross-sectional view illustrating a configuration in which, in the deposition apparatus shown in FIG. 3, an element substrate is introduced into a deposition chamber by a transfer device and then is lowered and spaced apart from the second donor substrate by a predetermined distance.
FIG. 6 is a cross-sectional view showing a configuration having a side support portion on a side of a deposition chamber in the deposition apparatus shown in FIG. 3 according to another embodiment.
FIG. 7 is a cross-sectional view illustrating a structure including a support portion and a center support portion provided on a fixed stage in the deposition apparatus shown in FIG. 3 according to another embodiment.
FIG. 8A is a plan view showing an embodiment of a center support in the deposition apparatus shown in FIG. 7; FIG.
8B is a plan view showing another embodiment of the center support in the deposition apparatus shown in FIG.
9 is a flowchart illustrating a method of manufacturing an organic light emitting diode according to an embodiment of the present invention.
10 is a plan layout view showing a schematic configuration of a manufacturing system of an organic light emitting device using line heating according to another embodiment of the present invention.
11 is a cross-sectional view showing the configuration of the coating apparatus shown in Fig.
12 is a cross-sectional view showing the configuration of the deposition apparatus shown in FIG.
13 is a cross-sectional view illustrating a configuration in which the fixing unit is lowered in the deposition apparatus shown in FIG. 12 to arrange the second donor substrate and the first donor substrate so as to be spaced apart from each other by a predetermined distance and to perform the first deposition.
FIG. 14 is a cross-sectional view illustrating a configuration in which an element substrate is inserted into a deposition chamber by a transfer device in the deposition apparatus shown in FIG. 13;
FIG. 15 is a cross-sectional view illustrating a structure in which the second donor substrate is lowered in the deposition apparatus shown in FIG. 14 and is disposed apart from the element substrate by a predetermined distance to perform secondary deposition.
FIG. 16 is an enlarged cross-sectional view enlarging and showing an example of a first donor substrate in the deposition apparatus shown in FIG. 12;
FIG. 17 is an enlarged cross-sectional view enlarging and showing an example of a second donor substrate in the vapor deposition apparatus shown in FIG. 14;
18 is a plan layout view showing a schematic configuration of an organic light emitting device manufacturing system using line heating according to another embodiment of the present invention.
19 is a cross-sectional view showing another example of the load lock chamber of Fig.
Fig. 20 is a cross-sectional view showing another example of the deposition apparatus of Fig. 12;
21 is a cross-sectional view illustrating an organic light emitting device manufactured by a method of manufacturing an organic light emitting device according to an embodiment of the present invention.
22 is a flowchart showing a method of manufacturing an organic light emitting diode according to another embodiment of the present invention.
23 is a side view showing a manufacturing system of an organic light emitting diode according to another embodiment of the present invention.
24 is a plan view showing a manufacturing system of the organic light emitting element of Fig.
25 is a conceptual view showing a processor chamber of a system for manufacturing an organic light emitting diode according to another embodiment of the present invention.
26 is a plan view of donor substrates of the organic light emitting device manufacturing system of Fig.

The embodiments of the present invention can be modified into various forms and the scope of the present invention should not be interpreted as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 9 attached hereto.

FIG. 1 is a view showing a schematic configuration of a manufacturing system of an organic light emitting diode using a row heating according to the present invention, FIG. 2 is a view showing the configuration of the coating apparatus shown in FIG. 1, 4 is a view illustrating a configuration in which the fixing unit is lowered in the deposition apparatus shown in FIG. 3 so that the first donor substrate and the second donor substrate are spaced apart from each other by a predetermined distance And FIG. 5 is a view illustrating a configuration in which an element substrate in a deposition apparatus shown in FIG. 3 is inserted into a deposition chamber by a transfer device and then is lowered and spaced apart from a second donor substrate by a predetermined distance. FIG. 7 is a view illustrating a configuration including a side support portion on the side of a deposition chamber in the deposition apparatus shown in FIG. 3 according to an embodiment. FIG. 7 is a cross-sectional view of a deposition apparatus shown in FIG. FIG. 8A is a view showing an embodiment of a center support part in the deposition apparatus shown in FIG. 7, and FIG. 8B is a sectional view of the deposition apparatus shown in FIG. 7, FIG. 3 is a view showing another embodiment of the center support in FIG.

Referring to FIG. 1, the organic light emitting device manufacturing system 100 of the present invention ensures the uniformity of an organic film when manufacturing a large-sized organic light emitting display device (OLED) and an OLED illumination substrate, In order to reduce the loss of organic matter and shorten the processing time, a line heating type organic film deposition process is used to deposit an organic film on the element substrate using, for example, first and second donor substrates made of glass, ceramic or plastic .

A system 100 for manufacturing an organic light emitting diode includes a coating unit 110 for coating an organic layer on a first donor substrate 200 and a first donor substrate 200 coated with an organic material, A load lock chamber 130 for loading or unloading the organic semiconductor layer on the first donor substrate 150 or the deposition apparatus 150 and a second donor substrate 210 for applying an organic film coated on the first donor substrate 200 A deposition apparatus 150 for deposition onto the device substrate 220 through the substrate 100 and a control unit 102 for controlling the overall operation of the manufacturing system 100 of the organic light emitting device.

The controller 102 controls the coating apparatus 110, the load lock chamber 130, and the deposition apparatus 150, for example, by a notebook computer, a personal computer, a touch panel and a programmable logic controller And controls all operations of the organic light emitting diode manufacturing system 100. The contents of the control unit 102 will be described in detail with reference to FIG.

The first and second donor substrates 200 and 210 are transported between the coating apparatus 110 and the load lock chamber 130 and the deposition apparatus 150 in the organic light emitting device manufacturing system 100 of the present invention. (Not shown) is provided. The transfer device may include a conveyor, a transfer robot, and the like.

A wet or dry type cleaning apparatus (not shown) for removing organic matters remaining from the first donor substrate 200 on which the organic layer is deposited on the element substrate 220 is provided in the organic light emitting diode manufacturing system 100, And a drying device (not shown) for drying the cleaned first donor substrate 200 may be further provided.

Here, a conductive film is formed on the first and second donor substrates in order to generate heat in the subsequent deposition process. The conductive film is formed of, for example, a metal or a metal alloy, and is formed in the same shape as the pattern of the organic film to be laminated on the element substrate. Such a conductive film is for applying an electric field to an electrode to generate heat of line, and evaporating the organic film through the generated line heat to deposit an organic film on the second donor substrate or the element substrate.

2, the coating apparatus 110 may coat the organic film by a wet process using, for example, a shower head, a spin nozzle, or the like so as to reduce the processing time and the processing cost. The coating apparatus 110 of this embodiment includes a coating chamber 112, a stage 116, at least one showerhead 118, and an organic feeder 120.

The coating chamber 112 forms an inner space for coating the organic film on the first donor substrate 200 inserted therein. The coating chamber 112 is provided with a door 114 having one side opened and closed and a first door 132 having the other side opened and closed between the load lock chambers 130. The coating chamber 112 is connected to the door 114 via a door 114, 1 donor substrate 200 is inserted. The coating chamber 112 is provided with a stage 116 on which a first donor substrate 200 is placed, and a showerhead 118 is disposed on the stage. The coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130 so as to coat the organic film on the first door substrate 200, do.

The stage 116 places the first donor substrate 200 that has been put into the coating chamber 112. The stage 116 is provided with, for example, a vacuum chuck, an electrostatic chuck, a stone quartz, or the like so that the large-size first donor substrate 200 can be seated and fixed.

The shower head 118 is provided in a spray type and injects organic matter to coat the organic material on the surface of the first donor substrate 200 that is placed on the stage 116 inside the coating chamber 112. At least one showerhead 116 is provided on top of the first donor substrate 200, corresponding to the size of the first donor substrate 200.

The organic material supply device 120 supplies the organic material to the shower head 118. In addition, the coating apparatus 110 may be provided with a recovery device (not shown) for coating the organic film on the first donor substrate 200 and recovering the remaining organic materials to the organic material supply device 120. For convenience of explanation, a spray coating apparatus using a shower head has been described, but a coating apparatus using a known wet process such as spin coating is also possible.

When the first donor substrate 200 is placed in the coating chamber 112 and is placed on the stage 116, the coating apparatus 110 supplies organic matter to the showerhead 118 from the organic matter supply apparatus 120, And spray organic matter from the showerhead 118 onto the first donor substrate 200. The injected organic material is laminated on the first donor substrate 200 to coat the organic film. At this time, the thickness of the organic layer coated on the first donor substrate 200 is sufficient to sufficiently cover the conductive layer formed on the first donor substrate 200. This is because it is possible to control the thickness of the organic film deposited on the element substrate (220 in FIG. 4) by controlling the electric field application condition applied to the electrode of the first donor substrate 200 in the deposition apparatus 150 of the subsequent process. The first donor substrate 200 coated with the organic layer is transferred to the load lock chamber 130 by the transfer device.

3, the load lock chamber 130 includes a first door 132 provided at one side thereof for receiving the first donor substrate 200 from the coating apparatus 110 and a second door 132 provided at the other side for receiving the first donor substrate 200, And a second door 134 for introducing the first donor substrate 200 and supplying the first donor substrate 200 to the deposition apparatus 150 or discharging the first donor substrate 200 from the deposition apparatus 150. Therefore, the load lock chamber 130 may be formed by depositing a first donor substrate 200 coated with an organic film on a deposition apparatus 150 or by depositing a coated organic film on a second donor substrate 210, .

Referring to FIGS. 3 to 5, the deposition apparatus 150 deposits an organic layer on the element substrate using the first and second donor substrates. The deposition apparatus 150 of this embodiment includes a deposition chamber 152, a fixing stage 154, a fixing unit 156, a driving unit 158, and a power supply unit 160.

The deposition chamber 152 deposits an organic film from the first donor substrate 200 injected from the load lock chamber 130 onto the second donor substrate 210 using a line heating method, An internal space for depositing an organic film is formed on the element substrate 220 by using a line heating method. The deposition chamber 152 is provided with a second door 134 of the load lock chamber 130 to which the first donor substrate 200 is charged and discharged and a second door 134 to which the element substrate 220 is charged / (Not shown).

The second donor substrate 210 is fixed on the fixing stage 154 with a fixing stage 154 provided to fix the second donor substrate 210 thereunder.

When the first donor substrate 200 is inserted into the deposition chamber 152, the inner space of the deposition chamber 152 is formed in the vacuum atmosphere by the second door 134 and the door 162 of the load lock chamber 130. In the deposition chamber 152, the second donor substrate 210 is fixed on the lower surface of the fixing stage 154, and the fixing unit 156, on which the first donor substrate 200 is fixed, The substrate 200 is lifted and lowered such that the second donor substrates are spaced apart by a minimum distance d. The deposition chamber 152 is sealed by the second door 134 and the door 162.

The fixed stage 154 is provided at a lower portion of the deposition chamber 152, and the second donor substrate 210 is seated and fixed. At this time, the second donor substrate 210 may be formed as a medium for depositing an organic film coated on the first donor substrate 200 on the element substrate 220 in the course of the organic film deposition process using the row heating according to the present invention. It plays a role.

The fixing portion 156 is provided at an upper portion of the deposition chamber 152 so that the lower end portion is bent to fix the first donor substrate 200 inserted from the load lock chamber 130, The first donor substrate 200 is raised and lowered by the driving unit 158 so as to maintain a minimum distance between the second donor substrates 210 in order to process the process.

At this time, the fixing portion 156 is not limited to a shape in which the lower end portion is bent so that the first donor substrate 200 can be covered, as described above, The first donor substrate 200 may be fixed from above by using a chuck such as an electrostatic chuck.

When the organic film deposition process is completed from the first donor substrate 200 to the second donor substrate 210, the first donor substrate 200 is lifted and discharged from the deposition chamber 152 through the second door 134 And is introduced into the coating apparatus 112 through the first door 132 again.

When the first donor substrate 200 is discharged from the deposition chamber 152, the element substrate 220 is transferred from the door 162 of the deposition chamber 152 to the deposition chamber 152 by the transfer device 170, And is lowered by the device 170 so as to maintain a minimum distance d with the second donor substrate 210 on which the organic film is deposited. As the transfer device 170, a conventional transfer device such as a robot arm can be used.

At this time, in order to accurately maintain the minimum distance d between the second donor substrate 210 and the element substrate 220, a side support portion 164 is provided on the side of the deposition chamber 152, as shown in FIG. can do.

7, the supporting portion is fixed to the lower portion of the deposition chamber 152, and the lower portion of the lower stage 154 is provided with the upper portion And may include a lower support portion 166 protruding and partially bent at a distal end. At this time, one or more central supports 168 may be provided on the upper portion of the fixed stage 154. 8A and 8B, the center support portion 168 may be provided in a region other than the region where the second donor substrate 210 is located, and may be provided as a continuous protrusion portion. However, May be installed.

The driving unit 158 is coupled to the upper portion of the deposition chamber 152 and receives the control unit 102 to control the fixing unit 156 to which the first donor substrate is fixed and the transfer device 170 for transferring the device substrate 220 Move it up and down.

The power supply 160 supplies power to the electrodes of the first donor substrate 200 or the second donor substrate 210 to apply an electric field. To this end, the power supply 160 contacts the conductive layers formed on the first and second donor substrates 200 and 210 to apply an electric field. At this time, the electric field application condition can be determined by various factors such as resistance, length, and thickness of the conductive film. In this embodiment, the current applied may be DC or alternating current, the electric field application may be about 1 Kw / cm2 to 1,000 Kw / cm2, and the electric field application time may be about 1 / 1,000,000 to 100 seconds.

3, when the first donor substrate 200 coated with an organic layer is charged into the deposition chamber 152 from the load lock chamber 130, the first donor substrate 200 Is fixed to the fixing portion 156 and then fixed. The deposition apparatus 150 descends the first donor substrate 200 fixed to the fixing unit 156 by the driving unit 158 so as to be adjacent to the second donor substrate 210 located on the fixed stage 154, And then power is supplied from the power supply unit 160 to the first donor substrate 200 to apply an electric field to the first donor substrate 200. The organic film coated on the first donor substrate 200 is subjected to line heating to deposit an organic film on the second donor substrate 210. That is, when an electric field is applied to the first donor substrate 200, a line heat is generated in the conductive film formed on the first donor substrate 200, And the organic film formed on the portion where the conductive film is present is evaporated by the transferred row heat and transferred to the second donor substrate 210 to deposit the organic film on the second donor substrate 210.

When the organic layer is deposited on the second donor substrate 210, the deposition unit 150 raises the fixing unit 156 by the driving unit 158 to move the second donor substrate 210 and the first donor substrate 200, And then the first donor substrate 200 is discharged to the load lock chamber 130.

5, after the device substrate 220 is put into the deposition chamber 152 by the transfer device 170 through the door 162, the device substrate 220 is lowered And is spaced apart from the second donor substrate 210 by a predetermined distance.

The deposition apparatus 150 supplies power from the power supply unit 160 to the second donor substrate 210 to apply an electric field to the second donor substrate 210, The deposited organic film is transferred onto the element substrate 220 to deposit an organic film on the element substrate 220. In this case, when an electric field is applied to the second donor substrate 210, the conductive film formed on the second donor substrate 210 generates line heat, The organic film formed on the conductive layer of the second donor substrate 210 is evaporated to deposit the organic film on the element substrate 220 and the organic film formed on the element substrate 220 The film deposition process is completed.

The deposition apparatus 150 then raises the element substrate 220 on which the organic film is deposited by the transfer device 170 and then discharges the deposition substrate from the deposition chamber 152. Then, The substrate 200 is put in, and the above-described organic film deposition process is repeatedly performed. The first donor substrate 200 discharged from the deposition apparatus 150 after the organic film deposition process is completed is cleaned and dried through the cleaning apparatus and the drying apparatus.

In this embodiment, the first donor substrate 200 or the element substrate 220 is fixedly moved to the deposition apparatus 150 by the fixing unit 156 or the transfer device 170 on the deposition chamber 152, 2 donor substrate 210 is disposed on the fixed stage 155. However, if the first donor substrate 200 or the element substrate 220 and the second donor substrate 210 are opposed to each other, And the like.

In this embodiment, the first donor substrate 200 or the element substrate 220 is moved up and down to move adjacent to the second donor substrate. Alternatively, the second donor substrate 210 may be moved to move the first donor substrate 200, And it may be adjacent to the substrate 200 or the element substrate 220.

As described above, in the organic light emitting diode manufacturing system 100 of the present invention, an organic film is deposited on the element substrate 220 by using the first and second donor substrates 200 and 210 in a line heating manner, By this treatment, the loss of organic matter can be reduced, and the processing time can be shortened.

FIG. 9 is a flow chart showing an organic film deposition procedure in a manufacturing system of an organic light emitting device using row heating according to the present invention. This procedure is an organic film deposition process using line heating, which is processed by the organic light emitting device manufacturing system 100, and is processed under the control of the control unit 102 of the organic light emitting device manufacturing system 100.

Referring to FIG. 9, in the organic light emitting diode manufacturing system 100 of the present invention, in step S300, the coating apparatus 110 coatings an organic film on a first donor substrate 200 on which a conductive film is formed. In this embodiment, the organic material is supplied onto the first donor substrate 200 through the showerhead 118 to coat the organic film. The first donor substrate 200 coated with an organic layer is transferred to the load lock chamber 130 using a transfer device.

In step S310, the first donor substrate 200 coated with the organic film is loaded into the deposition apparatus 150 from the load lock chamber 130. [ The inserted first donor substrate 200 is fixed to the fixing portion 156 so as to face the second donor substrate 210 which is seated on the fixed stage 154. The first donor substrate 200 is moved adjacent to the second donor substrate 210 in the direction of the fixed stage 154 via the driving unit 158.

Power is supplied from the power supply 160 to the first donor substrate 200 to apply an electric field to the conductive film of the first donor substrate 200 in step S320. In step S330, an organic layer coated on the first donor substrate 200 to which an electric field is applied is transferred to the second donor substrate 210 to deposit an organic layer. When an organic film is deposited on the second donor substrate 210 in step S340, the first donor substrate is transferred to the load lock chamber and discharged.

In step S350, the element substrate 220 is charged into the deposition apparatus 150 by the transfer apparatus 170 using the transfer apparatus. At this time, the loaded element substrate 220 is fixedly arranged to face the second donor substrate 210 which is seated on the fixed stage 154. The element substrate 220 controls the driving unit 158 to move the transfer device 170 in the direction of the fixed stage 154 so as to be adjacent to the second donor substrate 210.

Power is supplied from the power supply 160 to the second donor substrate 210 to apply an electric field to the conductive film of the second donor substrate 200 in step S360. In step S370, the organic layer deposited on the second donor substrate 210 to which the electric field is applied is transferred to the element substrate 220 to deposit the organic layer. Subsequently, in step S380, the element substrate 220 on which the organic film is deposited is discharged from the deposition apparatus 150.

Then, the other first donor substrate 200 is loaded through the load lock chamber 130, and the above organic film deposition process steps (S300 to S380) are repeated.

FIG. 10 is a plan layout view showing a schematic configuration of a manufacturing system of an organic light emitting device using line heating according to another embodiment of the present invention, FIG. 11 is a sectional view showing the configuration of the coating apparatus shown in FIG. 10 , FIG. 12 is a sectional view showing the configuration of the deposition apparatus shown in FIG. 10, FIG. 13 is a view showing a state where the fixing unit is lowered in the deposition apparatus shown in FIG. 12 so that the second donor substrate and the first donor substrate are spaced apart from each other 14 is a cross-sectional view illustrating a configuration in which an element substrate is introduced into a deposition chamber by a transfer device in the deposition apparatus shown in FIG. 13, and FIG. 15 is a cross- FIG. 2 is a cross-sectional view illustrating a configuration in which the second donor substrate is lowered from the device and is spaced apart from the device substrate by a predetermined distance, and secondary deposition is performed.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 10 to 15 attached hereto.

10, the organic light emitting device manufacturing system 400 of the present invention includes a first coating apparatus 110-1, a second coating apparatus 110-2, a third coating apparatus 110-3, And a fourth coating apparatus 110-4 and a fifth coating apparatus 110-1, and a deposition apparatus 150. The coating apparatus 110 includes a first coating apparatus 110-1 and a fourth coating apparatus 110-4.

For example, the first coating apparatus 110-1 is a device for coating a first organic material 1-1 on a donor substrate DS1 for a first organic material, and the second coating apparatus 110-1 is a device for coating a first organic material The third coating device 110-3 is a device for coating the organic material 1-2 on the donor substrate DS1 for organic material and the third organic material 1-2-3 on the donor substrate DS1 for the third organic material, The fourth coating apparatus 110-4 is a device for coating the fourth organic material 1-4 on the donor substrate DS1 for the second organic material and the fifth coating apparatus 110- 5 may be a device for coating the fifth organic material 1-5 on the donor substrate DS1 for the fifth organic material.

For example, the first coating apparatus 110-1 may include a first lateral coating chamber 110-1a disposed in a first width direction with respect to a longitudinal direction of the deposition apparatus 150, And a second lateral coating chamber 110-1b installed in a second width direction with respect to the longitudinal direction of the first lateral coating chamber 110-150.

Accordingly, since the time required for coating in the coating apparatus 110 is relatively long and the time required for deposition in the deposition apparatus 150 is relatively short, the donor substrates coated in both directions are supplied to improve the productivity And reduce the TACT time.

For example, the manufacturing system 400 of the organic light emitting diode of the present invention includes a loading device (LD) for loading the device substrate 220 to a first position of the deposition device, (UD) for unloading from the apparatus and a total of ten of the coating apparatuses 110, the deposition apparatus 150, the loading apparatus (LD) and the unloading apparatus (UD) And may further include a control unit 102 that can apply the control signal.

However, the coating apparatus 110 is not limited to a total of ten coating apparatuses, but may be an n-type coating apparatus, that is, an n-th coating apparatus for coating the n-th organic material on the donor substrate for the n-th organic material and n is a positive integer).

FIG. 11 is a sectional view showing the construction of the coating apparatus shown in FIG. 10, and FIG. 12 is a sectional view showing the construction of the deposition apparatus shown in FIG.

12, the deposition apparatus 150 is connected to the n-th coating apparatus, and the device substrate 220 transferred to the n-th position by applying an electric field to the donor substrate for the n-th organic material is deposited And the manufacturing system 400 of the organic light emitting device of the present invention may further include an element substrate transferring apparatus 170 capable of transferring the element substrate 220 from the n-th position to the n + 1-th position have.

More specifically, for example, the n may include any one of 1 to 5, and the first coating apparatus 110-1 may include a HIL coating chamber for spray coating a HIL organic material (HIL) The second coating apparatus 110-2 includes an HTL coating chamber for spray coating an HTL organic material (HTL), and the third coating apparatus 110-3 includes an EML coating (spray coating) of EML organic material Wherein the fourth coating apparatus 110-4 comprises an ETL coating chamber for spray coating an ETL organic material ETL and the fifth coating apparatus 110-5 comprises an EIL organic material EIL, Lt; RTI ID = 0.0 > EIL < / RTI > coating chamber. Here, the HIL organic material (HTL), the HTL organic material (HTL), the EML organic material (EML), the ETL organic material (ETL) and the EIL organic material (EIL) One or more of them can be selected and applied, and the respective technical ideas are well known and detailed description is omitted.

21 is a cross-sectional view illustrating an organic light emitting device manufactured by a manufacturing system of an organic light emitting device according to an embodiment of the present invention.

Therefore, as shown in FIG. 21, the organic light emitting device 1000 manufactured by the organic light emitting device manufacturing system 400 according to an embodiment of the present invention includes the HIL organic material (HIL), the HTL organic material (HTL), the EML organic material (EML), the ETL organic material (ETL), and the EIL organic material (EIL).

In this case, the EML coating chamber may include a first donor substrate for the EML organic material (EML), a second donor substrate for the EML organic material (EML), and a second donor substrate The EML organic material (EML) is coated on the substrate 200. The deposition apparatus 150 applies an electric field to the first donor substrate 200 for the EML organic material transferred by the donor substrate transfer device 180, The EML organic material (EML) is deposited on the second donor substrate 210 for the EML organic material and an electric field is applied to the second donor substrate 210 for the EML organic material, Can be deposited.

13 is a cross-sectional view illustrating a configuration in which the fixing portion is lowered in the deposition apparatus shown in FIG. 12 to arrange the second donor substrate and the first donor substrate so as to be spaced apart from each other by a predetermined distance, and FIG. 14 FIG. 15 is a cross-sectional view illustrating a structure in which a device substrate is inserted into a deposition chamber by a transfer device in a deposition apparatus in which the second donor substrate is moved downward by a certain distance from the device substrate, Sectional view illustrating the structure in which the secondary deposition is performed.

11 to 15, the first donor substrate 200 for the EML organic material may be vertically installed in the EML coating chamber and horizontally transported by the donor substrate transport device 180, and the EML The second organic donor substrate 210 is installed at a first height H1 in a downward direction and is connected to the first donor substrate 200 for EML organic material horizontally transported by the deposition apparatus 150 and a first distance d The element substrate 220 may be lowered below the second donor substrate 210 for the EML organic material and may be lowered to the second height H2 by the driving unit 158. [ have.

FIG. 16 is an enlarged cross-sectional view enlarging and showing an example of a first donor substrate in the deposition apparatus shown in FIG. 12; FIG. 17 is an enlarged cross-sectional view enlarging and showing an example of a second donor substrate in the vapor deposition apparatus shown in FIG. 14;

16, the first donor substrate 200 for an EML organic material includes an unpatterned rectangular thin film layer in which a pattern is not formed in the heat transfer layer 203, 2, the EML organic donor substrate 210 includes a patterned rectangular thin film layer 210 in which a pattern is formed on the heat transfer layer 203 or a partition wall layer W having a pattern formed on the heat transfer layer 203 is formed. . ≪ / RTI >

For example, the donor substrate DS1 for the first organic material may be formed so that the first organic material 1-1 is coated with the first solution, A first donor substrate 200 installed in the first coating apparatus 110-1 and a second donor substrate 200 applied with an electric field to the first donor substrate 200, And a second donor substrate 210 installed in the deposition apparatus 150 so that the organic material 1-1 can be deposited in a second order.

11 to 15, the first coating apparatus 110-1 is formed by mixing a volatile medium and a first organic material 1-1 with a first donor substrate 200 for a first organic material The deposition device 150 applies an electric field to the first donor substrate 200 for the first organic material transferred by the donor substrate transfer device 180 to form the first organic material The first organic material 1-1 is deposited on the first donor substrate 210 for the first organic material and an electric field is applied to the second donor substrate 210 for the first organic material, Can be deposited on the substrate 220.

The second coating apparatus 110-2 may be formed by coating a first liquid material mixed with a volatile medium and a second organic material 1-2 on a surface of a first donor substrate 200 for a second organic material, The deposition apparatus 150 applies an electric field to the first donor substrate 200 for the second organic material transferred by the donor substrate transfer device 180 to transfer the second organic material 1-2 to the second organic material 2 donor substrate 210 and an electric field is applied to the second donor substrate 210 for the second organic substance to form the second organic substance 1-1 on the second organic substance 1- 2). ≪ / RTI >

In the organic light emitting device manufacturing system 400 of the present invention, the first and second donor substrates 200 and 210 are provided between each coating apparatus 110, the load lock chamber 130 and the deposition apparatus 150 (Not shown) for conveying the sheet. The conveying apparatus may be a conveyor apparatus using a roller, a belt, a chain, or a wire, a conveying arm, a conveying robot, or the like.

11, the coating apparatus 110 may include a spray apparatus having at least one spray head 118a and an organic matter supply apparatus 120, for example, in order to reduce the processing time and the processing cost A coating chamber 112, a hardening device 119, and a donor substrate transfer device 117. [

For example, the first coating apparatus 110-1 may include a first coating chamber 112 and a second coating chamber 112 installed in the first coating chamber 112, A spray device 118a spray-coating the donor substrate DS1; a curing step of curing the first organic material 1-1 coated on the donor substrate DS1 for a first organic material by a baking plate or a light irradiation device; And a donor substrate transfer device 180 for transferring the apparatus 119 and the donor substrate DS1 for the first organic material to the deposition apparatus 150. [

Here, the first coating chamber 112 may be a load-lock chamber spraying chamber capable of forming a vacuum environment after spray coating.

The spray device 118a may be a vacuum spray device capable of spray coating the first organic material 1-1 in a vacuum environment.

The donor substrate transfer device 117 may be provided with a multi-stage transfer arm capable of extending and expanding. However, the present invention is not limited to this, and a conveyor apparatus using a roller, a belt, a chain, or a wire, a transfer arm, a transfer robot, and the like can be applied.

The coating chamber 112 forms an inner space for coating the organic film 1 on the first donor substrate 200 inserted therein. The coating chamber 112 is provided with a door 114 having one side opened and closed and a first door 132 having the other side opened and closed between the load lock chambers 130. The coating chamber 112 is connected to the door 114 via a door 114, 1 donor substrate 200 is inserted. A donor substrate transfer device 117 in which a first donor substrate 200 is mounted is disposed in a lower portion of the coating chamber 112 and an injection head 118a capable of reciprocating motion by a forward / do. The coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130 so as to coat the organic film 1 on the first door substrate 200, Thereby forming a nitrogen atmosphere.

The donor substrate transfer device 117 may be provided with a mounting table on which the first donor substrate 200 loaded in the coating chamber 112 is mounted. The seat is provided with, for example, a vacuum chuck, an electrostatic chuck, or a stone quartz so that the large-size first donor substrate 200 can be seated and fixed.

The spray head 118a is provided in a spray type so as to spray the organic material to coat the organic film 1 on the surface of the first donor substrate 200 that is seated within the coating chamber 112 on the mount table. In addition to the spray nozzles, the nozzles of the ink jet type may also be applied to the jet heads 116.

The organic material supply device 120 supplies the organic material to the injection head 118a. The coating apparatus 110 may be provided with a recovery device (not shown) for coating the organic film 1 on the first donor substrate 200 and recovering the remaining organic materials to the organic material supply device 120. For convenience of explanation, a spray coating apparatus using a spray head has been described. However, it is also possible to use a coating apparatus by a known wet process such as spin coating.

The curing device 119 is for curing the organic film 1 on the first donor substrate 200 by volatilizing the volatile medium in a mixture of the organic material and the volatile medium, and a baking plate or a light irradiation device can be applied .

The coating apparatus 110 supplies the first donor substrate 200 to the coating chamber 112 and supplies the organic material from the organic material supply apparatus 120 to the ejection head 118a. Organic matter is sprayed onto the donor substrate 200. The injected organic substances are laminated on the first donor substrate 200 to coat the organic film 1. The first donor substrate 200 coated with the organic film 1 is transferred to the deposition apparatus 150 via the donor substrate transfer device 117 via the load lock chamber 130 capable of implementing a vacuum environment.

12 to 15, the deposition apparatus 150 deposits the organic layer 1 on the element substrate 220 by using the first donor substrate 200 and the second donor substrate 210. The deposition apparatus 150 of this embodiment includes a deposition chamber 152, a fixed stage 154, a fixing unit 156, a driving unit 158, a first power supply 160-1, And a feeding device 160-2.

Here, the first power supply unit 160-1 is a unit that is installed on one side of the deposition chamber 152 and is capable of applying an electric field to the first donor substrate 200, The second donor substrate 160-2 is disposed on the other side of the deposition chamber 152 and is capable of applying an electric field to the second donor substrate 210. [

The first power supply unit 160-1 and the second power supply unit 160-2 may be integrated into one power supply unit.

12, the deposition chamber 152 is connected to the organic layer 1 by a line heating method from the first donor substrate 200, which is loaded from the load lock chamber 130, onto the second donor substrate 210, And an internal space for depositing the organic film 1 from the second donor substrate 210 onto the element substrate 220 using a line heating method is formed. As shown in FIG. 10, A partition or gate G is formed in the longitudinal direction so that one side can be connected to each of the plurality of coating apparatuses 110 and a communication hole is formed therein, And may be a communication type rectangular chamber.

The deposition chamber 152 is provided with a second door 134 of the load lock chamber 130 to which the first donor substrate 200 is charged and discharged and a charging port And a discharge port through which the substrate 220 is discharged.

The first donor substrate 200 is fixed on the lift pin L by providing a fixing portion 156 for fixing the second donor substrate 210 on the upper portion.

When the first donor substrate 200 is inserted into the deposition chamber 152, the inner space of the deposition chamber 152 is formed in the vacuum atmosphere by the second door 134 and the door 162 of the load lock chamber 130. In the deposition chamber 152, the first donor substrate 200 is placed on the lift pin L so that the first donor substrate 200 can be electrically contacted with the pad P, which can be lifted and lowered by the actuator A, As shown in the figure, the first donor substrate 200 is electrically connected to the power supply unit 160, and the fixing unit 156, on which the second donor substrate 210 is fixed, 210 and the first donor substrate 200 are spaced apart by a minimum distance d. The deposition chamber 152 is sealed by the second door 134 and the door 162.

The first donor substrate 200 is fixed to the lift pin L at a lower portion of the deposition chamber 152. At this time, the second donor substrate 210 is formed by depositing the organic film 1 coated on the first donor substrate 200 on the element substrate 220 during the organic film deposition process using the row heating according to the present invention As a medium to make.

The fixing part 156 is provided on the upper part of the deposition chamber 152 to fix the second donor substrate 210 and the second donor substrate 210 is electrically connected to the power supply unit 160 And is detachably assembled with the second donor substrate 210 by bolts, screws or the like so as to be electrically connected.

The fixing portion 156 is moved up and down by the driving portion 158 so as to maintain a minimum distance between the first donor substrate 200 and the second donor substrate 210 so as to process the organic film deposition process .

At this time, the fixing portion 156 can fix the second donor substrate 210 on the upper portion using a chuck such as an electrostatic chuck or a vacuum chuck or a magnet.

13, when the organic film deposition process is completed from the first donor substrate 200 to the second donor substrate 210, the first donor substrate 200 is transferred through the second door 134 Is discharged from the deposition chamber 152 and is introduced into the coating apparatus 112 through the first door 132 again.

14, when the first donor substrate 200 is discharged from the deposition chamber 152, the element substrate 220 is transferred from the door 162 of the deposition chamber 152 to the element substrate transfer apparatus 170 To the deposition chamber 152. In this case,

14 shows the conveyor apparatus using the rollers in FIG. 14, the present invention is not limited to this, and various conveyor apparatuses, conveying arms, conveying robots, etc. using rollers, belts, chains, Can be applied. In addition, the device substrate transfer device 170 may further include a transfer carriage or a tray for receiving the device substrate 220.

Then, as shown in Fig. 15, the element substrate 220 is positioned so as to maintain a minimum distance d with the second donor substrate 210 on which the organic film 1 is deposited. At this time, the driving unit 158 is coupled to the upper part of the deposition chamber 152, and moves the fixing unit 156, to which the second donor substrate 210 is fixed, up and down under the control of the control unit 102.

Subsequently, power is supplied from the power supply unit 160 to the second donor substrate 210 to apply an electric field to the second donor substrate 210, thereby transferring the organic film deposited on the second donor substrate 210 And transferred onto the substrate 220 to deposit an organic film on the element substrate 220. [

The first donor substrate 200 or the element substrate 220 is disposed below the deposition chamber 152 and the second donor substrate 210 is disposed above the deposition apparatus 150 However, if the first donor substrate 200 or the element substrate 220 and the second donor substrate 210 are opposed to each other, various modifications and variations are possible.

In this embodiment, the second donor substrate 210 is moved up and down to drive the first donor substrate 200 or the element substrate 220 adjacent to the first donor substrate 210 or the element substrate 220. Alternatively, It will be apparent that the movable member 220 can be moved and adjoined.

As described above, in the organic light emitting device manufacturing system 100 (300) of the present invention, an organic film is deposited on the element substrate 220 using the first and second donor substrates 200 and 210 in a line heating manner By repeating this treatment, the loss of organic matter can be reduced and the processing time can be shortened.

FIG. 16 is an enlarged cross-sectional view enlarging and showing an example of a first donor substrate in the deposition apparatus shown in FIG. 12;

16, the first donor substrate 200 for depositing the organic film 1 described above includes a first base layer 201 and a second base layer 201 formed on the first base layer 201, A first heat transfer layer 203 in which an organic material 1-1 can be coated with a first solution and a first heat transfer layer 203 formed in the first base layer 201 so that an electric field can be applied to the first heat transfer layer 203, A first conductive layer 202 electrically connected to the first heat transfer layer 203 may be formed.

For example, the first conductive layer 202 and the first heat transfer layer 203 are both a kind of conductive film. The first conductive layer 202 includes copper, aluminum, platinum, gold, It is possible to distribute the current uniformly to the layer 203 and to transfer the current to the layer 203 or to serve as a terminal.

In addition, for example, the first heat transfer layer 203 includes components such as nickel, chromium, carbon, and quartz, which are excellent in heat conduction, and receives a current from the first conductive layer 202 to convert the current into resistance heat energy can do.

Accordingly, the first heat transfer layer 203 is heated at a time by the Joule heat, and the coated organic film 1 can be deposited on the second donor substrate 210 in a planar manner.

FIG. 17 is an enlarged cross-sectional view enlarging and showing an example of a second donor substrate in the vapor deposition apparatus shown in FIG. 14;

17, the second donor substrate 210 for depositing the organic film 1 described above includes a second base layer 211 and a second base layer 211 formed on the second base layer 211, The first heat transfer layer 203 and the second heat transfer layer 203 are formed on the first donor substrate 200 so that the first organic material 1-1 coated with the first donor substrate 200 may be secondarily deposited. A second conductive layer 212 electrically connected to the second heat transfer layer 213 may be formed so that an electric field may be applied to the corresponding second heat transfer layer 213 and the second heat transfer layer 213 .

For example, the second conductive layer 212 and the second heat conductive layer 213 are both a kind of conductive film, and the second conductive layer 212 includes copper, aluminum, platinum, gold, The layer 213 may serve as a role of distributing and delivering the current uniformly or as a terminal.

In addition, for example, the second heat transfer layer 213 includes components such as nickel, chromium, carbon, and quartz, which are excellent in heat conduction, and receives a current from the second conductive layer 212 to convert the current into resistance heat energy can do.

Thus, the second heat transfer layer 213 is heated at a time by the joule heat, through which the primary deposited organic film 1 can be secondarily deposited on the element substrate 220 in a plane.

18 is a plan layout view showing a schematic configuration of an organic light emitting device manufacturing system using line heating according to another embodiment of the present invention.

As shown in FIG. 18, a system 500 for manufacturing an organic light emitting diode using row heating according to another embodiment of the present invention is installed between the loading apparatus (LD) and the deposition apparatus 150 A first electrode forming apparatus 191 for forming a first electrode layer P1 on the element substrate 220 and a second electrode forming apparatus 191 disposed between the deposition apparatus 150 and the unloading apparatus UD, A second electrode forming apparatus 192 for forming a second electrode layer P2 on the substrate 220 and a second electrode forming apparatus 192 disposed between the second electrode forming apparatus 192 and the unloading apparatus UD, And an encapsulation device 193 for encapsulating with an encapsulating material (C).

Although not shown, a reversing device capable of reversing the element substrate 220 or the donor substrates 200 and 210 may be installed between the devices, if necessary.

21, an organic light emitting device 1000 manufactured by a manufacturing system 500 of an organic light emitting device according to an embodiment of the present invention includes, on the device substrate 220, The first electrode layer P1, the HIL organic material (HIL), the HTL organic material (HTL), the EML organic material (EML), the ETL organic material (ETL), the EIL organic material (EIL) And the encapsulating material C for protecting the encapsulating material C from external moisture or foreign substances can be manufactured in a state of encapsulating the encapsulation material C, thereby performing the organic luminescence function.

19 is a cross-sectional view showing another example of the load lock chamber of Fig.

For example, a load lock chamber 130 may be provided between the deposition apparatus 150 and the first coating apparatus 110-1 or between the loading apparatus (LD) and the deposition apparatus 150. [

As shown in FIG. 19, for example, the load lock chamber 130 may include a plurality of load lock chambers 130, Or a vertically stackable load lock chamber capable of loading the substrate 220 in the vertical direction on the tray T which can be raised and lowered by the driving unit 131. [ Therefore, the vacuum environment can be sequentially formed using the load lock chamber 130, productivity can be improved, and the process time can be shortened.

Fig. 20 is a cross-sectional view showing another example of the deposition apparatus of Fig. 12;

20, the first donor substrate 200 or the element substrate 220 for the first organic material may be deposited on at least one of the first coating apparatus 110-1 and the deposition apparatus 150, An aligning device (AL) capable of being aligned can be installed.

For example, such alignment devices may be implemented in a wide variety of alignment devices, such as various alignment pins, alignment stages, alignment protrusions, alignment grooves, or multi-axis alignment devices capable of multi-axis alignment.

22 is a flowchart showing a method of manufacturing an organic light emitting diode according to another embodiment of the present invention.

10 to 22, a method of manufacturing an organic light emitting diode according to another embodiment of the present invention includes coating a first organic material 1-1 on a first donor substrate 200 for a first organic material A first coating step S401, a second coating step S402 coating the second organic material 1-2 on the first donor substrate 200 for the second organic material, ) And the second coating device 110-2 and applying an electric field to the first donor substrate 200 for the first organic material transferred by the donor substrate transfer device 180 to form the first organic material 1 -1) is deposited on the first donor substrate 210 for the first organic material, a second donor substrate preparation step (S403) for the first organic material, and a second donor substrate transfer step A second organic donor substrate (210) for depositing the second organic material (1-2) on the second organic material donor substrate (210) by applying an electric field to the donor substrate (200) A preparation step S400 including a preparing step S404; A loading step (S410) of loading the element substrate (220) to a first position of the deposition apparatus (150); A first organic material deposition step S420 for applying an electric field to the first organic material donor substrate 210 to deposit the first organic material 1-1 on the device substrate 220 located at the first location, ); An element substrate transfer step S430 for transferring the element substrate 220 from the first position to the second position; A first organic material is deposited on the first organic material (1-1) of the device substrate (220) positioned at the second location by applying an electric field to the second organic material second donor substrate (210) 2 Organic material deposition step S440; And an unloading step (S450) of unloading the element substrate 220 from the deposition apparatus 150.

The present invention is not limited to the above-described organic light emitting device manufacturing system and manufacturing method, but includes the organic light emitting device 1000 manufactured through the above process, the first donor substrate 200 and the second donor substrate 210 described above The donor substrate set may be included.

23 is a side view showing a manufacturing system of an organic light emitting diode according to another embodiment of the present invention.

23, the manufacturing system for an organic light emitting diode according to another embodiment of the present invention includes a processor chamber for forming a vacuum pump having a second donor substrate installed downward, A load lock chamber for forming a primary heavy pneumatic pressure and a buffer chamber for forming a second high vacuum pneumatic pressure can be provided in order to form a stepwise vacuum pressure between the atmospheric pressure or low vacuum pneumatic pressure forming process chamber.

Accordingly, the primary donor substrate is spray-coated in a process chamber for forming an atmospheric pressure or low vacuum pressure capable of spray coating, and a heavy pneumatic environment is first formed through the load lock chamber for forming the primary heavy pneumatic pressure, A high vacuum pneumatic environment capable of being deposited can be formed while passing through a buffer chamber for forming a high vacuum air pressure and organic materials can be deposited on the secondary donor substrate in the processor chamber for forming high vacuum pneumatic pressure.

Therefore, it is possible to form high vacuum pressure step by step while passing through a plurality of load lock chambers and buffer chambers at low vacuum pressure, so that it is possible to greatly improve equipment productivity by reducing vacuum pressure forming time and cost.

24 is a plan view showing a manufacturing system of the organic light emitting element of Fig.

Therefore, as shown in FIG. 23, in order to form a vacuum stepwise between the processor chamber for forming the vacuum pressure and the processor chamber for forming the atmospheric pressure or the vacuum pneumatic pressure for coating the organic material on the primary donor substrate, The load lock chamber for forming the primary heavy pneumatic pressure and the buffer chamber for forming the second high vacuum pneumatic pressure can be installed in multiple rows.

Thus, a large amount of organic light emitting devices can be produced by inline systemization.

25 is a conceptual view showing a processor chamber of a system for manufacturing an organic light emitting diode according to another embodiment of the present invention.

As shown in FIG. 25, the processor chamber of the system for manufacturing an organic light emitting diode according to another embodiment of the present invention includes a second donor substrate on an upper portion thereof, a first donor substrate on a middle portion thereof, , The target substrate, that is, the panel, can be installed on the up-stage and rise in the direction of the secondary donor substrate.

At this time, the up-page can be aligned with the vision on the XY theta axis stage. Further, a metal mask (FMM) may be additionally provided between the panel and the second donor substrate if necessary.

Thus, a primary donor substrate comes over the fixed mask to deposit organic material on the secondary donor substrate. Then, the robot places the panel on the pin through the gate. Next, identify the mask (FMM) and the markers on the panel with vision and move the pins to align the panel with the mask. At this time, the mask is fixed in the chamber. Then, the upstage comes up to contact the panel and the mask. Subsequently, the secondary donor substrate can be lowered to deposit organic materials on the panel.

26 is a plan view of donor substrates of the organic light emitting device manufacturing system of Fig.

As shown in Fig. 26, the planar size of the donor substrates of the organic light emitting device manufacturing system of Fig. 25 is, for example, the largest for the first donor substrate, then the second donor substrate, The size of the target substrate, that is, the size of the panel.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Various changes and modifications are possible within the scope of the invention.

100: Manufacturing System of Organic Light Emitting Device
102:
110: Coating device
130: load lock chamber
150: Deposition device
200, 210: donor substrate
220: element substrate

Claims (1)

In order to form a vacuum step-by-step between the processor chamber for forming a high-vacuum pneumatic pressure in which the secondary donor substrate is installed in a top-down manner and the chamber for forming atmospheric pressure or low pneumatic pressure coating the organic material in the primary donor substrate, And a buffer chamber for forming a second high vacuum pneumatic pressure.

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