WO2016186386A1 - Apparatus and method for depositing organic film, and organic film apparatus - Google Patents

Abstract

The present invention relates to an organic film deposition apparatus. The organic film deposition apparatus of the present invention carries out an organic film deposition process using a joule heating method. To this end, the organic film deposition apparatus deposits an organic film on a device substrate using two donor substrates. The present invention is capable of reducing loss of organic matter and shortening a processing time by depositing an organic film on a device substrate by a joule heating method, using first and second donor substrates, and repeating the deposition.

Description

Organic film deposition apparatus, method and organic film apparatus

The present invention relates to an organic film deposition apparatus, a method and an organic film apparatus, and more specifically, to improve the productivity by ensuring uniformity of the deposited organic film, reducing organic material loss, and reducing process time (TACT time). The present invention relates to an organic film deposition apparatus for depositing an organic film layer on an element substrate using two donor substrates and an organic film deposition process, a method, and an organic film apparatus.

Among the flat panel displays, the organic light emitting display device has a high response speed with a response speed of 1 ms or less, low power consumption, and self-luminous light, so that there is no problem in viewing angle, and thus it is advantageous as a moving image display medium regardless of the size of the device. There is this. In addition, low-temperature manufacturing is possible, and the manufacturing process is simple based on the existing semiconductor process technology has attracted attention as a next-generation flat panel display device in the future. In addition, since the organic film used in the organic light emitting display device emits light by itself, the organic film may be used in an OLED lighting device by applying an electric field to the upper and lower ends of the organic film. OLED lighting is attracting great attention as the next generation lighting because conventional LED lighting is a surface light source, whereas an existing LED light is a surface light source.

The formation of the organic thin film in the organic light emitting display device and the OLED lighting manufacturing process can be largely divided into a high molecular type device using a wet process and a low molecular type device using a deposition process according to the materials and processes used. For example, in the inkjet printing method of forming a polymer or a low molecular weight light emitting layer, the materials of the organic layers other than the light emitting layer are limited, and there is a need to form a structure for inkjet printing on the substrate. In addition, when the light emitting layer is formed by the deposition process, a separate metal mask is used. As the size of the flat panel display increases, the size of the metal mask must increase in size. In this case, the deflection phenomenon increases as the size of the metal mask increases in size. There is a problem that occurs, there is a difficulty in manufacturing a large device.

On the other hand, the technique of forming an organic light emitting layer using Joule heating is already disclosed. In this technique, an organic light emitting layer is first formed on a donor substrate, and then positioned so as to face the donor substrate and the element substrate, and then Joule heat is heated on the donor substrate to deposit the organic light emitting layer formed on the donor substrate onto the element substrate.

However, the technique of forming the organic light emitting layer using Joule heating has a problem that the process time (TACT time) increases as unnecessary processes are added, such as inverting the donor substrate or the device substrate.

An object of the present invention is to provide an organic film deposition apparatus for depositing an organic film on an element substrate using two donor substrates, a method, and an organic film apparatus for processing an organic film deposition process using a Joule heating method.

Another object of the present invention is to provide an organic film deposition apparatus, a method and an organic film apparatus in order to ensure uniformity of the deposited organic film and to reduce the loss of organic matter.

Another object of the present invention is to provide an organic film deposition apparatus, a method and an organic film apparatus in order to shorten the process time.

The organic film deposition apparatus according to the idea of the present invention for solving the above problems, the first donor substrate or the element substrate is coated with an organic film, the deposition apparatus is placed so as to face the second donor substrate on which the conductive film is formed; Including, but the deposition apparatus, by applying an electric field to the conductive film of the first donor substrate coated with an organic film to generate joule heat to deposit an organic film coated on the first donor substrate on the second donor substrate, An organic film deposited on the second donor substrate may be deposited on the device substrate by generating Joule heat by applying an electric field to the conductive film of the second donor substrate on which the organic film is deposited.

In addition, the organic film deposition apparatus according to the present invention may further include a coating device for coating an organic film on the first donor substrate on which the conductive film is formed.

In addition, the organic film deposition apparatus according to the present invention, the load lock receiving the first donor substrate on which the organic film is deposited from the coating apparatus is introduced into the deposition apparatus, or receives the first donor substrate discharged from the deposition apparatus. The chamber may further include.

In addition, according to the present invention, the deposition apparatus, the deposition chamber; A fixed stage installed at one side of the deposition chamber to seat the second donor substrate; A fixing part installed on the other side of the deposition chamber to fix the first donor substrate to face the second donor substrate and to move up and down; A driving unit to move the fixing part such that the first donor substrate is adjacent to or spaced apart from the second donor substrate; And a power supply device configured to apply an electric field to the conductive film of the first donor substrate or the second donor substrate.

In addition, according to the present invention, the deposition apparatus, the deposition chamber; A fixed stage installed at one side of the deposition chamber to seat the first donor substrate; A fixing part positioned to face the first donor substrate and provided to fix the second donor substrate to move up and down; A power applying device for applying an electric field to the first donor substrate or the second donor substrate; And a driving unit for moving the fixing unit.

In addition, according to the present invention, the coating apparatus, the coating chamber to form an inner space in which the first donor substrate is accommodated; A stage installed below the coating chamber to seat the first donor substrate; An organic material supply device for supplying an organic material; And an injection head configured to receive an organic material from the organic material supply device and spray an organic material onto the first donor substrate seated on the stage to coat the organic film on the first donor substrate.

In addition, the organic film deposition apparatus according to the present invention may further include a side support portion provided in the deposition chamber to support the device substrate introduced into the deposition chamber.

In addition, according to the present invention, the lower portion of the end portion is protruded to the upper side of the lower stage in the deposition chamber to prevent sagging of the central portion of the device substrate while supporting the device substrate introduced into the deposition chamber Support; Alternatively, one or more central supports may be installed on the stage.

In addition, according to the present invention, the deposition apparatus may be part of a cluster type of equipment connected to a plurality of coating apparatuses and a loading and unloading apparatus for loading and unloading the device substrate into the deposition apparatus.

On the other hand, the deposition apparatus according to the idea of the present invention for solving the above problems, the deposition chamber; A fixed stage installed at one side of the deposition chamber to seat the second donor substrate; A fixing part positioned to face the second donor substrate and provided to fix the first donor substrate to move up and down; A power applying device for applying an electric field to the first donor substrate or the second donor substrate; And a driving unit for moving the fixing unit.

On the other hand, the deposition apparatus according to the idea of the present invention for solving the above problems, the deposition chamber; A fixed stage installed at one side of the deposition chamber to seat the first donor substrate; A fixing part positioned to face the first donor substrate and provided to fix the second donor substrate to move up and down; A power applying device for applying an electric field to the first donor substrate or the second donor substrate; And a driving unit for moving the fixing unit.

In addition, according to the present invention, in order to support the device substrate introduced into the deposition chamber, a side support portion may be installed in the deposition chamber.

In addition, according to the present invention, the lower support portion protruding from the upper side of the stage in the deposition chamber so as to support the device substrate introduced into the deposition chamber to prevent sagging of the central portion of the device substrate. Alternatively, one or more central supports may be installed on the stage.

On the other hand, the organic film deposition method according to the idea of the present invention for solving the above problems, the step of coating the organic film on the first donor substrate on which the conductive film is formed; Injecting an organic film-coated first donor substrate into a deposition apparatus; Supplying power from the power supply to the first donor substrate to apply an electric field to the conductive film of the first donor substrate; Transferring the organic film coated on the first donor substrate to which the electric field is applied to the second donor substrate to deposit the organic film; Ejecting the first donor substrate from the deposition chamber; Injecting the element substrate into the deposition apparatus using the transfer apparatus; Supplying power from the power supply to the second donor substrate to apply an electric field to the conductive film of the second donor substrate; Transferring the organic film deposited on the second donor substrate to which the electric field is applied to the device substrate, and depositing the organic film; And discharging the device substrate on which the organic film is deposited from the deposition apparatus.

On the other hand, the organic film device according to the idea of the present invention for solving the above problems can be manufactured by the organic film deposition method.

As described above, the organic film deposition apparatus, the method, and the organic film apparatus of the present invention process an organic film deposition process using two donor substrates and an element substrate, thereby ensuring uniformity of the deposited organic film, and loss of organic matter. Can be prevented.

In addition, the organic film deposition apparatus, the method, and the organic film apparatus of the present invention are advantageous in the fabrication of a large sized device by processing the organic film deposition process using two donor substrates and an element substrate, and can reduce the process time.

In addition, the organic film deposition apparatus, the method, and the organic film apparatus of the present invention can reduce the loss of organic matter by forming an organic film on a donor substrate in a wet process.

In addition, the organic film deposition apparatus, the method and the organic film apparatus of the present invention comprises a coating chamber, a load lock chamber and a deposition chamber in a series of forms, it is easy to implement the equipment, can reduce the manufacturing cost, process time It can be shortened.

1 is a block diagram showing a schematic configuration of an organic film deposition apparatus using Joule heating according to an embodiment of the present invention.

2 is a cross-sectional view showing the configuration of the coating apparatus shown in FIG.

3 is a cross-sectional view showing the configuration of the vapor deposition apparatus shown in FIG. 1.

FIG. 4 is a cross-sectional view illustrating a configuration in which the fixed part descends and the first donor substrate and the second donor substrate are disposed at a predetermined distance from each other in the deposition apparatus shown in FIG. 3.

FIG. 5 is a cross-sectional view illustrating a configuration in which the device substrate is lowered after being fed into the deposition chamber by the transfer apparatus and disposed to be spaced apart from the second donor substrate in a deposition apparatus illustrated in FIG. 3.

FIG. 6 is a cross-sectional view illustrating a structure in which a side support part is provided on a side of a deposition chamber in the deposition apparatus illustrated in FIG. 3 according to another embodiment.

FIG. 7 is a cross-sectional view illustrating a structure including a support part and a central support part provided in the fixing stage in the deposition apparatus shown in FIG. 3 according to another embodiment.

FIG. 8A is a plan view illustrating an embodiment of a central support unit in the deposition apparatus illustrated in FIG. 7.

FIG. 8B is a plan view showing another embodiment of the central support in the deposition apparatus shown in FIG.

9 is a flowchart illustrating an organic film deposition method using Joule heating according to the present invention.

10 is a plan view showing a schematic configuration of an organic film deposition apparatus using Joule heating according to another embodiment of the present invention.

FIG. 11 is a cross-sectional view showing a configuration of the coating apparatus shown in FIG. 10.

12 is a cross-sectional view illustrating a configuration of the vapor deposition apparatus shown in FIG. 10.

FIG. 13 is a cross-sectional view illustrating a configuration in which the fixed part is lowered in the deposition apparatus illustrated in FIG. 12 so that the second donor substrate and the first donor substrate are spaced at a predetermined distance, and the first deposition is performed.

FIG. 14 is a cross-sectional view illustrating a configuration in which an element substrate is introduced into a deposition chamber by a transfer apparatus in the deposition apparatus illustrated in FIG. 13.

FIG. 15 is a cross-sectional view illustrating a configuration in which the second donor substrate is lowered and spaced apart from the device substrate by a predetermined distance in the deposition apparatus illustrated in FIG. 14, and the secondary deposition is performed.

FIG. 16 is an enlarged cross-sectional view illustrating an example of the first donor substrate in the deposition apparatus illustrated in FIG. 12.

FIG. 17 is an enlarged cross-sectional view illustrating an example of a second donor substrate in the deposition apparatus illustrated in FIG. 14.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the components in the drawings, etc. have been exaggerated to emphasize a more clear description.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 9.

1 is a view showing a schematic configuration of an organic film deposition apparatus using Joule heating according to the invention, Figure 2 is a view showing the configuration of the coating apparatus shown in Figure 1, Figure 3 is shown in Figure 1 FIG. 4 is a view illustrating a configuration of the deposition apparatus, and FIG. 4 is a view illustrating a configuration in which the first donor substrate and the second donor substrate are disposed at a predetermined distance apart from each other by the fixed part descending in the deposition apparatus illustrated in FIG. 3. FIG. 5 is a view illustrating a configuration in which a device substrate is placed in a deposition chamber by a transfer apparatus and then lowered to be spaced apart from a second donor substrate in a deposition apparatus illustrated in FIG. 3, and FIG. 6 is another embodiment. 3 is a view illustrating a configuration in which a side support portion is provided on a side of a deposition chamber in the deposition apparatus illustrated in FIG. 3, and FIG. 7 is a fixed stage in the deposition apparatus illustrated in FIG. 3 according to another embodiment. FIG. 8A is a view illustrating a configuration including a provided support portion and a central support portion. FIG. 8A is a view illustrating an embodiment of a central support portion in the deposition apparatus illustrated in FIG. 7, and FIG. 8B is a center portion of the deposition apparatus illustrated in FIG. 7. Figures showing another embodiment of the support.

Referring to FIG. 1, the organic film deposition apparatus 100 of the present invention secures uniformity of an organic film when fabricating a large organic light emitting device (OLED) and an OLED lighting substrate. In order to reduce the loss and to shorten the process time, a Joule heating organic film deposition process is performed to deposit the organic film on the device substrate using, for example, first and second donor substrates made of glass, ceramic or plastic. .

To this end, the organic film deposition apparatus 100 of the present invention is a coating device 110 for coating an organic film on the first donor substrate 200 and the first donor substrate 200 coated with an organic material deposition device 150 A load lock chamber 130 for inputting to or discharging from the deposition apparatus 150 and an organic film coated on the first donor substrate 200 using a Joule heating method through the second donor substrate 210. A deposition apparatus 150 for depositing onto the substrate 220 and a control unit 102 for controlling the overall operation of the organic film deposition apparatus 100 to be processed.

The control unit 102 includes, for example, a notebook, a personal computer, a touch panel, a programmable logic controller (PLC), and the like, and controls the coating apparatus 110, the load lock chamber 130, and the deposition apparatus 150. Control to process the overall operation of the organic film deposition apparatus 100. Details of the control unit 102 will be described in detail with reference to FIG. 9.

In the organic film deposition apparatus 100 of the present invention, the first and second donor substrates 200 and 210 are transferred between the coating apparatus 110, the load lock chamber 130, and the deposition apparatuses 150. A transfer device (not shown) is provided. The transfer device may include a conveyor, a transfer robot, and the like.

In addition, the organic film deposition apparatus 100 includes a wet or dry cleaning apparatus (not shown) for removing remaining organic materials from the first donor substrate 200 on which the organic film deposition is completed on the device substrate 220. A drying device (not shown) may be further provided to dry the cleaned first donor substrate 200.

Here, a conductive film is formed on the first and second donor substrates so as to generate Joule heat in a subsequent deposition process. The conductive film is formed of, for example, a metal or a metal alloy, and is formed in the same shape as that of the organic film pattern to be stacked on the element substrate. Such a conductive film is for depositing an organic film on a second donor substrate or an element substrate by generating an Joule heat by applying an electric field to the electrode, evaporating the organic film through the generated Joule heat.

Specifically, referring to FIG. 2, the coating apparatus 110 coats the organic layer by a wet process using, for example, a spray head, a spin nozzle, etc. in order to reduce the process time and the process cost. The coating apparatus 110 of this embodiment includes a coating chamber 112, a stage 116, at least one spray head 118 and an organic material supply apparatus 120.

The coating chamber 112 forms an inner space for coating the organic film on the first donor substrate 200 introduced therein. The coating chamber 112 is provided with a door 114 having one side opened and closed and a first door 132 opened and closed between the load lock chamber 130 at the other side, and the coating chamber 112 is formed through the door 114. 1 donor substrate 200 is introduced. In the coating chamber 112, a stage 116 on which a first donor substrate 200 is seated is disposed, and an injection head 118 is disposed on an upper portion thereof. The coating chamber 112 is sealed by the door 114 and the first door 132 of the load lock chamber 130 to form an organic film on the first door substrate 200, and forms a nitrogen atmosphere therein. do.

The stage 116 seats the first donor substrate 200 introduced into the coating chamber 112. The stage 116 is provided with, for example, a vacuum chuck, an electrostatic chuck or a stone plate so that the large first donor substrate 200 is seated and fixed.

The spray head 118 is provided in a spray type to spray the organic material to coat the organic material on the surface of the first donor substrate 200 seated on the stage 116 in the coating chamber 112. At least one spray head 116 is provided on the first donor substrate 200 to correspond to the size of the first donor substrate 200.

The organic material supply device 120 supplies the organic material to the spray head 118. In addition, the coating apparatus 110 may be provided with a recovery device (not shown) for recovering the organic material remaining after the organic film is coated on the first donor substrate 200 to the organic material supply device 120. For convenience of description, a spray coating apparatus using a spray head has been described, but a coating apparatus by a known wet process such as spin coating is also possible.

In the coating apparatus 110, when the first donor substrate 200 is introduced into the coating chamber 112 and seated on the stage 116, the organic material is supplied from the organic material supply apparatus 120 to the spray head 118. The organic material is sprayed onto the first donor substrate 200 from the spray head 118. The sprayed organic material is stacked on the first donor substrate 200 to coat the organic film. In this case, the organic film coated on the first donor substrate 200 may be thick enough to sufficiently cover the conductive film formed on the first donor substrate 200. This is because the thickness of the organic film deposited on the device substrate 220 of FIG. 4 may be controlled by controlling the electric field application condition applied to the electrode of the first donor substrate 200 in the deposition apparatus 150 of the subsequent process. The first donor substrate 200 coated with the organic film is transferred to the load lock chamber 130 by a transfer device.

As shown in FIG. 3, the load lock chamber 130 is provided at one side to receive the first donor substrate 200 from the coating apparatus 110, and is provided at the other side to the deposition apparatus. The first donor substrate 200 is introduced, and the second donor substrate 200 is introduced into the deposition apparatus 150 or the second door 134 is discharged from the deposition apparatus 150. Accordingly, the load lock chamber 130 may inject the first donor substrate 200 coated with the organic film into the deposition apparatus 150 or the first donor substrate 200 in which the coated organic film is deposited on the second donor substrate 210. To discharge.

3 to 5, the deposition apparatus 150 deposits an organic layer on the device substrate using the first and second donor substrates. The deposition apparatus 150 of this embodiment includes a deposition chamber 152, a fixing stage 154, a fixing portion 156, a driver 158, and a power supply device 160.

The deposition chamber 152 deposits an organic film from the first donor substrate 200 introduced from the load lock chamber 130 onto the second donor substrate 210 by using a Joule heating method, and from the second donor substrate 210. An internal space in which an organic layer is deposited is formed on the device substrate 220 using a Joule heating method. In the deposition chamber 152, a second door 134 of the load lock chamber 130 in which the first donor substrate 200 is inserted and discharged is disposed at one side thereof, and a door in which the device substrate 220 is inserted and discharged at the other side thereof. 162 is provided.

In addition, a lower stage is provided with a fixing stage 154 provided to fix the second donor substrate 210 so that the second donor substrate 210 is fixedly positioned on the fixing stage 154.

In the deposition chamber 152, when the first donor substrate 200 is input, the internal space is formed in a vacuum atmosphere by the second door 134 and the door 162 of the load lock chamber 130. In the deposition chamber 152, in a state where the second donor substrate 210 is fixedly positioned on the fixing stage 154, the fixing part 156 on which the first donor substrate 200 is fixed is positioned on the first stage. The substrate 200 moves up and down so that the second donor substrate is spaced apart by a minimum distance d. The deposition chamber 152 is sealed by the second door 134 and the door 162.

The fixed stage 154 is provided under the deposition chamber 152 to fix the second donor substrate 210 on the seat. At this time, the second donor substrate 210 serves as a medium for depositing the organic film coated on the first donor substrate 200 on the element substrate 220 during the organic film deposition process using Joule heating according to the present invention. Play a role.

The fixing part 156 is provided at an upper portion of the deposition chamber 152 so as to be bent at a lower end portion thereof to fix the first donor substrate 200 introduced from the load lock chamber 130. In order to process the process, the first donor substrate 200 is moved up and down by the driver 158 to maintain a minimum constant distance between the second donor substrates 210.

In this case, the fixing part 156 is not limited to a shape in which a lower end portion is bent so that the first donor substrate 200 can be covered as described above. If it can lower, it is not limited to a specific form, It can also fix the 1st donor substrate 200 from the top using a chuck like an electrostatic chuck.

When the organic film deposition process is completed from the first donor substrate 200 to the second donor substrate 210, the first donor substrate 200 is elevated and discharged from the deposition chamber 152 through the second door 134. Then, it is introduced into the coating apparatus 112 again through the first door 132.

When the first donor substrate 200 is discharged from the deposition chamber 152, the device substrate 220 is introduced into the deposition chamber 152 by the transfer device 170 from the door 162 of the deposition chamber 152 and then transferred. It is lowered by the device 170 and positioned to maintain a minimum distance d from the second donor substrate 210 on which the organic film is deposited. As the transfer apparatus 170, a conventional transfer apparatus such as a robot arm may be used.

In this case, in order to accurately maintain the minimum distance d between the second donor substrate 210 and the device substrate 220, as shown in FIG. 6, the side support part 164 is provided on the side of the deposition chamber 152. can do.

In addition, in the case of the large-area device substrate 220, the central portion of the substrate may be sag, and thus, the support part is fixed to the lower portion of the deposition chamber 152, as shown in FIG. The lower support part 166 may be provided to protrude and be bent at a portion thereof. In this case, the fixing stage 154 may be provided with at least one central support part 168. As shown in FIGS. 8A and 8B, the central support part 168 is installed outside the region where the second donor substrate 210 is located, and may be provided as a continuous protrusion, but is spaced apart in the form of tweezers. It may be installed.

The driving unit 158 is coupled to the upper portion of the deposition chamber 152 and is controlled by the control unit 102 to transfer the fixing unit 156 to which the first donor substrate is fixed and the transfer device 170 for transferring the element substrate 220. Move up and down.

The power supply device 160 supplies power to apply an electric field to the electrodes of the first donor substrate 200 or the second donor substrate 210. To this end, the power supply device 160 applies an electric field in contact with the conductive films formed on the first and second donor substrates 200 and 210. At this time, the electric field application condition may be determined by various factors such as resistance, length, thickness of the conductive film. In this embodiment, the current applied may be direct current or alternating current, the electric field application may be about 1 Kw / cm 2 to 1,000 Kw / cm 2, and the one-time application time of the electric field may be about 1 / 1,000,000 to 100 seconds.

As shown in FIG. 3, when the first donor substrate 200 coated with an organic film is introduced into the deposition chamber 152 from the load lock chamber 130, the first donor substrate 200 may be used. ) Is fixed to the fixed part 156. The deposition apparatus 150 descends the first donor substrate 200 fixed to the fixing unit 156 to be adjacent to the second donor substrate 210 positioned on the fixing stage 154 by the driving unit 158 by a predetermined distance. After being spaced apart, power is supplied from the power supply device 160 to the first donor substrate 200 to apply an electric field to the first donor substrate 200. Accordingly, the organic film coated on the first donor substrate 200 is Joule heated to deposit the organic film on the second donor substrate 210. That is, when an electric field is applied to the first donor substrate 200, Joule heat is generated in the conductive film formed on the first donor substrate 200, and the generated Joule heat is organically formed on the first donor substrate 200. The organic film formed on the conductive film is evaporated and transferred to the second donor substrate 210 by the transferred string heat, and the organic film is deposited on the second donor substrate 210.

In the deposition apparatus 150, when the organic film is deposited on the second donor substrate 210, the fixing unit 156 is raised by the driving unit 158 to raise the second donor substrate 210 and the first donor substrate 200. After spaced apart, the first donor substrate 200 is discharged to the load lock chamber 130.

After the process is completed, the deposition apparatus 150 is lowered after the device substrate 220 is introduced into the deposition chamber 152 by the transfer apparatus 170 through the door 162 as shown in FIG. 5. The second donor substrate 210 is positioned to maintain a predetermined distance.

In addition, the deposition apparatus 150 supplies electric power to the second donor substrate 210 by supplying power from the power supply device 160 to the second donor substrate 210, and thus on the second donor substrate 210. The deposited organic film is transferred onto the device substrate 220 to deposit an organic film on the device substrate 220. In this case, when an electric field is applied to the second donor substrate 210, Joule heat is generated in the conductive film formed on the second donor substrate 210, and the generated Joule heat is formed on the second donor substrate 210. The organic film formed on the conductive part of the second donor substrate 210 is evaporated to deposit an organic film on the device substrate 220, and the organic film is heated by Joule heating on one device substrate 220. The film deposition process is complete.

Subsequently, the deposition apparatus 150 raises the device substrate 220 on which the organic film is deposited by the transfer apparatus 170, and then discharges it from the deposition chamber 152, and the other first donor through the load lock chamber 130. The substrate 200 is introduced and the above organic film deposition process is repeated. In addition, the first donor substrate 200 discharged after the organic film deposition process is completed from the deposition apparatus 150 is cleaned and dried through a cleaning apparatus and a drying apparatus.

In this embodiment, the first donor substrate 200 or the element substrate 220 is fixedly moved to the deposition apparatus 150 by the fixing unit 156 or the transfer apparatus 170 above the deposition chamber 152. Although described as a configuration in which the 2 donor substrate 210 is disposed on the fixed stage 155, a configuration in which the first donor substrate 200 or the element substrate 220 and the second donor substrate 210 face each other may be various. Can be changed and modified in shape.

In this embodiment, the first donor substrate 200 or the element substrate 220 is moved up and down to be driven adjacent to the second donor substrate. As another example, the second donor substrate 210 is moved to move the first donor substrate. Obviously, the substrate 200 may be adjacent to the substrate 200 or the element substrate 220.

As described above, the organic film deposition apparatus 100 of the present invention deposits an organic film on the device substrate 220 by using the first and second donor substrates 200 and 210 by Joule heating, and repeatedly processes the same. This can reduce the loss of organic matter and shorten the process time.

9 is a flowchart showing an organic film deposition method using Joule heating according to the present invention. This order is an organic film deposition process using Joule heating, which is processed by the organic film deposition apparatus 100, and is processed under the control of the control unit 102 of the organic film deposition apparatus 100.

Referring to FIG. 9, in the organic film deposition apparatus 100 of the present invention, the coating apparatus 110 first coats an organic film on the first donor substrate 200 on which the conductive film is formed in step S300. In this embodiment, the organic film is coated on the first donor substrate 200 through the spray head 118 to coat the organic film. The first donor substrate 200 coated with the organic layer is transferred to the load lock chamber 130 using a transfer device.

In operation S310, the first donor substrate 200 coated with the organic layer is loaded from the load lock chamber 130 into the deposition apparatus 150. The injected first donor substrate 200 is fixedly disposed on the fixing part 156 so as to face the second donor substrate 210 seated on the fixing stage 154. The first donor substrate 200 moves the fixing part 156 in the direction of the fixing stage 154 through the driving unit 158 so that the first donor substrate 200 is adjacent to the second donor substrate 210.

In operation S320, power is supplied from the power supply device 160 to the first donor substrate 200 to apply an electric field to the conductive film of the first donor substrate 200. In operation S330, the organic film coated on the first donor substrate 200 to which the electric field is applied is transferred to the second donor substrate 210 to deposit the organic film. When the organic film is deposited on the second donor substrate 210 in step S340, the first donor substrate is transferred to the load lock chamber and discharged.

In operation S350, the device substrate 220 is introduced by the transfer apparatus 170 to the deposition apparatus 150 using the transfer apparatus. In this case, the injected device substrate 220 is fixedly disposed to face the second donor substrate 210 seated on the fixed stage 154. In addition, the device substrate 220 controls the driving unit 158 to be adjacent to the second donor substrate 210 to move the transfer device 170 in the direction of the fixed stage 154.

In operation S360, power is supplied from the power supply device 160 to the second donor substrate 210 to apply an electric field to the conductive film of the second donor substrate 200. In operation S370, the organic film deposited on the second donor substrate 210 to which the electric field is applied is transferred to the device substrate 220 to deposit the organic film. Subsequently, in operation S380, the device substrate 220 having the organic film deposited thereon is discharged from the deposition apparatus 150.

Then, another first donor substrate 200 is introduced through the load lock chamber 130 to repeat the above-described organic film deposition process steps S300 to S380.

The present invention may include an organic film device including an organic film, an organic light emitting device, an organic light emitting panel, and the like produced by the organic film deposition method described above.

10 is a plan view showing a schematic configuration of an organic film deposition apparatus using Joule heating according to another embodiment of the present invention, Figure 11 is a cross-sectional view showing the configuration of the coating apparatus shown in FIG. 12 is a cross-sectional view showing the configuration of the deposition apparatus illustrated in FIG. 10, and FIG. 13 is a fixed portion descending in the deposition apparatus illustrated in FIG. 12 so that the second donor substrate and the first donor substrate are spaced apart by a predetermined distance. 14 is a cross-sectional view showing a configuration in which deposition is performed, and FIG. 14 is a cross-sectional view showing a configuration in which an element substrate is introduced into a deposition chamber by a transfer device in the deposition apparatus shown in FIG. 13, and FIG. It is sectional drawing which shows the structure which the 2nd donor board | substrate descend | falls, is arrange | positioned at a predetermined distance, and the secondary deposition is performed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 10 to 15.

Referring to FIG. 10, an inline manufacturing system 300 of an organic light emitting device according to an embodiment of the present invention includes a rod for injecting or discharging an organic-coated first donor substrate 200 to or from the deposition apparatus 150. The first donor substrate 200 using a plurality of coating apparatus 110 and a Joule heating method for coating the organic film on the first donor substrate 200 with respect to the lock chamber 130 (transfer device or transfer module). The deposition apparatus 150 for depositing the organic film coated on the device onto the device substrate 220 through the second donor substrate 210 is formed in the radiation phase so that the path of the device substrate 220 reciprocates in the radiation phase. It may be a device of a cluster type.

Here, the deposition apparatus 150 may be part of a cluster type equipment connected to a plurality of coating apparatus 110 and a loading and unloading apparatus for loading and unloading the device substrate 220 into the deposition apparatus 150. .

In the inline manufacturing system 300 of the organic light emitting device of the present invention, the coating device 110 and the first and second donor substrates 200 and 210 are disposed between the load lock chamber 130 and the deposition devices 150. A conveying device (not shown) for conveying is provided. The transfer apparatus may be a conveyor apparatus, a transfer arm, a transfer robot, or the like using a roller, a belt, a chain, a wire, or the like.

Specifically, referring to FIG. 11, the coating apparatus 110 may include, for example, a spray apparatus having at least one spray head 118 and an organic material supply apparatus 120 in order to reduce process time and process cost. , Coating chamber 112, curing device 119, and donor substrate transfer device 117.

Here, the donor substrate transfer device 117 may be provided with a multi-stage transfer arm capable of stretching and stretching. However, the present invention is not necessarily limited thereto, and a conveyor apparatus, a transfer arm, a transfer robot, etc. using a roller, a belt, a chain, a wire, or the like may be applied.

The coating chamber 112 forms an inner space for coating the organic layer 1 on the first donor substrate 200 introduced therein. The coating chamber 112 is provided with a door 114 having one side opened and closed and a first door 132 opened and closed between the load lock chamber 130 at the other side, and the coating chamber 112 is formed through the door 114. 1 donor substrate 200 is introduced. In the coating chamber 112, a donor substrate transfer device 117 on which the first donor substrate 200 is seated is disposed, and an injection head 118 capable of reciprocating by the forward and backward driving device is disposed on the upper portion of the coating chamber 112. do. The coating chamber 112 is hermetically sealed by the door 114 and the first door 132 of the load lock chamber 130 to coat the organic film 1 on the first door substrate 200. To form a nitrogen atmosphere.

The donor substrate transfer device 117 may be provided with a seating table on which the first donor substrate 200 inserted into the coating chamber 112 is seated. The mounting table is provided with, for example, a vacuum chuck, an electrostatic chuck, or a stone platform so that the large first donor substrate 200 is seated and fixed.

The spray head 118 is provided in a spray type, and sprays an organic substance to coat the organic layer 1 on the surface of the first donor substrate 200 seated on a seating table in the coating chamber 112. In addition to the spray nozzle, the jet head 116 may be applied to an inkjet nozzle.

The organic material supply device 120 supplies the organic material to the injection head 118. In addition, the coating device 110 may be provided with a recovery device (not shown) for recovering the organic material remaining after the organic film 1 is coated on the first donor substrate 200 to the organic material supply device 120. For convenience of description, a spray coating apparatus using a spray head has been described, but a coating apparatus by a known wet process such as spin coating is also possible.

In addition, the curing device 119 is for curing the organic film 1 on the first donor substrate 200 by volatilizing a volatile medium in a mixture of an organic material and a volatile medium, and a baking plate or a light irradiation device may be applied. .

In the coating apparatus 110, when the first donor substrate 200 is introduced into the coating chamber 112 and seated on the stage 116, the organic material is supplied from the organic material supply apparatus 120 to the spray head 118. The organic material is sprayed onto the first donor substrate 200 from the spray head 118. The sprayed organic material is stacked on the first donor substrate 200 to coat the organic film 1. Subsequently, the first donor substrate 200 coated with the organic layer 1 is transferred to the deposition apparatus 150 through the load lock chamber 130, which may implement a vacuum environment, by the donor substrate transfer apparatus 117.

12 to 15, the deposition apparatus 150 deposits the organic layer 1 on the device substrate 220 using the first donor substrate 200 and the second donor substrate 210. The deposition apparatus 150 of this embodiment includes a deposition chamber 152, a fixing stage 154, a fixing portion 156, a driver 158, and a power supply device 160.

As illustrated in FIG. 12, the deposition chamber 152 may be formed using the Joule heating method from the first donor substrate 200 introduced from the load lock chamber 130 onto the second donor substrate 210. Is deposited and an internal space in which the organic film 1 is deposited is formed from the second donor substrate 210 onto the device substrate 220 by using a Joule heating method. In the deposition chamber 152, a second door 134 of the load lock chamber 130 in which the first donor substrate 200 is inserted and discharged is disposed at one side thereof, and a door in which the device substrate 220 is inserted and discharged at the other side thereof. 162 is provided.

In addition, a fixing part 156 provided to fix the second donor substrate 210 is provided at an upper portion thereof so that the first donor substrate 200 is fixedly positioned on the fixing stage 154.

In the deposition chamber 152, when the first donor substrate 200 is input, the internal space is formed in a vacuum atmosphere by the second door 134 and the door 162 of the load lock chamber 130. In the deposition chamber 152, the first donor substrate 200 is positioned on the fixed stage 154 at the lower portion thereof, and the pad P may be electrically lifted and lowered by the actuator A while being seated on the lift pin L. As shown in FIG. 13, the lift pin L is lowered so that the first donor substrate 200 is electrically connected to the power supply device 160, and the second donor substrate 210 is disposed on the upper side thereof so as to be in contact. The fixing part 156, which is fixed thereto, moves up and down so that the second donor substrate 210 and the first donor substrate 200 are spaced apart by a minimum distance d. The deposition chamber 152 is sealed by the second door 134 and the door 162.

The fixing stage 154 is provided below the deposition chamber 152, and when the lift pin L is lowered, the first donor substrate 200 is seated and fixed. At this time, the second donor substrate 210 deposits the organic film 1 coated on the first donor substrate 200 on the device substrate 220 during the organic film deposition process using Joule heating according to the present invention. It acts as a vehicle for

The fixing part 156 is provided on the deposition chamber 152 to fix the second donor substrate 210, and the second donor substrate 210 is connected to the power supply device 160 through the pad P. FIG. Removably assembled with the second donor substrate 210 by a bolt or screw so as to be electrically connected.

In addition, the fixing unit 156 is moved up and down by the driving unit 158 so as to maintain a minimum constant distance between the first donor substrate 200 and the second donor substrate 210 to process the organic film deposition process. .

In this case, the fixing part 156 may fix the second donor substrate 210 to the upper part by using a chuck such as an electrostatic chuck, a vacuum chuck, or a magnet.

Subsequently, as shown in FIG. 13, when the organic film deposition process is completed from the first donor substrate 200 to the second donor substrate 210, the first donor substrate 200 passes through the second door 134. It is discharged from the deposition chamber 152 and introduced into the coating apparatus 112 through the first door 132.

Subsequently, as shown in FIG. 14, when the first donor substrate 200 is discharged from the deposition chamber 152, the device substrate 220 is transferred from the door 162 of the deposition chamber 152 to the device substrate transfer device 170. ) May be introduced into the deposition chamber 152.

Subsequently, as shown in FIG. 15, the device substrate 220 is positioned to maintain a minimum distance d from the second donor substrate 210 on which the organic film 1 is deposited. At this time, the driving unit 158 is coupled to the upper portion of the deposition chamber 152, and under the control of the control unit 102 to move the fixing portion 156 fixed to the second donor substrate 210 up and down.

Subsequently, power is supplied from the power supply device 160 to the second donor substrate 210 to apply an electric field to the second donor substrate 210, thereby forming an organic film deposited on the second donor substrate 210. The organic layer is deposited on the device substrate 220 by transferring onto the substrate 220.

In this embodiment, the first donor substrate 200 or the element substrate 220 is disposed below the deposition chamber 152 and the second donor substrate 210 is disposed on the deposition apparatus 150. However, as long as the first donor substrate 200 or the element substrate 220 and the second donor substrate 210 face each other, they may be changed and modified in various forms.

In this embodiment, the second donor substrate 210 is moved up and down to be driven adjacent to the first donor substrate 200 or the element substrate 220. As another example, the first donor substrate 210 or the element substrate is driven. Obviously, it is also possible to move 220 adjacent to each other. Although not shown, an inverting device capable of inverting the device substrate 220 or the donor substrates 200 and 210 may be provided between the devices as necessary.

As described above, the in- line manufacturing system 100 and 300 of the organic light emitting device of the present invention deposits an organic film on the device substrate 220 using the first and second donor substrates 200 and 210 by Joule heating. By repeating this process, the loss of organic matter can be reduced, and the process time can be shortened.

FIG. 16 is an enlarged cross-sectional view illustrating an example of the first donor substrate in the deposition apparatus illustrated in FIG. 12.

As shown in FIG. 16, the first donor substrate 200 for depositing the above-described organic film 1 is formed on the first base layer 201, the first base layer 201, and the first base layer 201. The organic material 1-1 is formed on the first base layer 201 and the first base layer 201 to apply an electric field to the first heat transfer layer 203 and the first heat transfer layer 203 which can be coated with the first solution. The first conductive layer 202 may be formed to be electrically connected to the first heat transfer layer 203.

For example, the first conductive layer 202 and the first heat transfer layer 203 are both kinds of conductive films, and the first conductive layer 202 includes copper, aluminum, platinum, and gold components having excellent conductivity, and thus, the first heat transfer. The layer 203 may serve to evenly distribute and transfer current in the layer 203 or serve as a terminal.

In addition, for example, the first heat transfer layer 203 includes a component such as nickel, chromium, carbon, and quartz, which are excellent in heat transfer, and receives a current from the first conductive layer 202 to convert it into resistive thermal energy. can do.

Accordingly, the first heat transfer layer 203 is temporarily heated by Joule heat, and the coated organic film 1 may be deposited on the second donor substrate 210 in plan view.

FIG. 17 is an enlarged cross-sectional view illustrating an example of a second donor substrate in the deposition apparatus illustrated in FIG. 14.

As shown in FIG. 17, the second donor substrate 210 for depositing the organic film 1 described above is formed on the second base layer 211 and the second base layer 211, and An electric field is applied to the first donor substrate 200 so that the first organic material 1-1 coated on the first donor substrate 200 may be secondly deposited. A second conductive layer 212 electrically connected to the second heat transfer layer 213 may be formed to correspond to the second heat transfer layer 213 and the second heat transfer layer 213. .

For example, the second conductive layer 212 and the second heat transfer layer 213 are both kinds of conductive films, and the second conductive layer 212 includes copper, aluminum, platinum, and gold components having excellent conductivity, so that the second heat transfer is performed. The layer 213 may uniformly distribute and transmit current, or serve as a terminal.

In addition, for example, the second heat transfer layer 213 includes components such as nickel, chromium, carbon, and quartz, which are excellent in heat transfer, and receives a current from the second conductive layer 212 to convert it into resistive thermal energy. can do.

Accordingly, the second heat transfer layer 213 may be temporarily heated by Joule heat, and the first organic layer 1 deposited thereon may be secondarily deposited on the device substrate 220 in plan view.

In the above, the configuration and operation of the organic film deposition apparatus using Joule heating according to the present invention has been shown in accordance with the detailed description and drawings, but this is merely described by way of example, and do not depart from the spirit of the present invention. Various changes and modifications are possible.

As described above, the organic film deposition apparatus, the method, and the organic film apparatus of the present invention comprises a coating chamber, a load lock chamber, and a deposition chamber in a series of forms, thereby facilitating the implementation of equipment and shortening the process time. In addition, the production cost of the organic light emitting display device can be reduced.

Claims (15)

1. And a deposition apparatus in which the first donor substrate or the element substrate coated with the organic film is inserted and seated to face the second donor substrate on which the conductive film is formed.

   The vapor deposition apparatus,

   By applying an electric field to the conductive film of the first donor substrate coated with an organic film to generate joule heat, an organic film coated on the first donor substrate is deposited on the second donor substrate, and the second donor on which the organic film is deposited. An organic film deposition apparatus for applying an electric field to a conductive film of a substrate to generate joule heat to deposit an organic film deposited on the second donor substrate on the device substrate.
2. The method of claim 1,

   A coating device for coating an organic film on the first donor substrate on which the conductive film is formed;

   Further comprising, an organic film deposition apparatus.
3. The method of claim 2,

   And a load lock chamber which receives the first donor substrate on which the organic film is deposited from the coating apparatus and feeds it into the deposition apparatus, or receives the first donor substrate discharged from the deposition apparatus.
4. The method of claim 1,

   The vapor deposition apparatus,

   A deposition chamber;

   A fixed stage installed at one side of the deposition chamber to seat the second donor substrate;

   A fixing part installed on the other side of the deposition chamber to fix the first donor substrate to face the second donor substrate and to move up and down;

   A driving unit to move the fixing part such that the first donor substrate is adjacent to or spaced apart from the second donor substrate; And

   And a power supply device for applying an electric field to the conductive film of the first donor substrate or the second donor substrate.
5. The method of claim 1,

   The vapor deposition apparatus,

   A deposition chamber;

   A fixed stage installed at one side of the deposition chamber to seat the first donor substrate;

   A fixing part positioned to face the first donor substrate and provided to fix the second donor substrate to move up and down;

   A power applying device for applying an electric field to the first donor substrate or the second donor substrate; And

   And a driving unit for moving the fixing unit.
6. The method of claim 1,

   The coating device,

   A coating chamber defining an inner space in which the first donor substrate is accommodated;

   A stage installed below the coating chamber to seat the first donor substrate;

   An organic material supply device for supplying an organic material; And

   And an injection head configured to receive an organic material from the organic material supplying device, and spray an organic material onto the first donor substrate seated on the stage to coat an organic film on the first donor substrate.
7. The method according to claim 4 or 5,

   And a side support part provided in the deposition chamber to support the device substrate introduced into the deposition chamber.
8. The method according to claim 4 or 5,

   One of the lower supports or the upper part of the stage where the terminal part is bent so as to protrude from the upper side of the lower stage so as to support the device substrate introduced into the deposition chamber and to prevent sagging of the central portion of the device substrate. The organic film vapor deposition apparatus in which the above-mentioned center support part is provided.
9. The method of claim 3, wherein

   And the deposition apparatus is a part of a cluster type equipment connected to a plurality of coating apparatuses and a loading and unloading apparatus for loading and unloading the device substrate into the deposition apparatus.
10. A deposition chamber;

    A fixed stage installed at one side of the deposition chamber to seat the second donor substrate;

    A fixing part positioned to face the second donor substrate and provided to fix the first donor substrate to move up and down;

    A power applying device for applying an electric field to the first donor substrate or the second donor substrate; And

    And a driving unit for moving the fixing unit.
11. A deposition chamber;

    A fixed stage installed at one side of the deposition chamber to seat the first donor substrate;

    A fixing part positioned to face the first donor substrate and provided to fix the second donor substrate to move up and down;

    A power applying device for applying an electric field to the first donor substrate or the second donor substrate; And

    And a driving unit for moving the fixing unit.
12. The method of claim 10 or 11,

    And a side support part installed in the deposition chamber to support the device substrate introduced into the deposition chamber.
13. The method of claim 10 or 11,

    One or more lower supports or protruded upper ends of the stage side of the deposition chamber so as to prevent sagging of the central portion of the device substrate while supporting the device substrate introduced into the deposition chamber. A deposition apparatus, wherein a central support is provided.
14. Coating an organic film on the first donor substrate on which the conductive film is formed;

    Injecting an organic film-coated first donor substrate into a deposition apparatus;

    Supplying power from the power supply to the first donor substrate to apply an electric field to the conductive film of the first donor substrate;

    Transferring the organic film coated on the first donor substrate to which the electric field is applied to the second donor substrate to deposit the organic film;

    Ejecting the first donor substrate from the deposition chamber;

    Injecting the element substrate into the deposition apparatus using the transfer apparatus;

    Supplying power from the power supply to the second donor substrate to apply an electric field to the conductive film of the second donor substrate;

    Transferring the organic film deposited on the second donor substrate to which the electric field is applied to the device substrate, and depositing the organic film; And

    Discharging the device substrate on which the organic film is deposited from the deposition apparatus;

    Including, the organic film deposition method.
15. An organic film device manufactured by the organic film deposition method of claim 14.

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