CN109728051B - Film evaporation method for transfer substrate and display panel - Google Patents
Film evaporation method for transfer substrate and display panel Download PDFInfo
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- CN109728051B CN109728051B CN201910002597.6A CN201910002597A CN109728051B CN 109728051 B CN109728051 B CN 109728051B CN 201910002597 A CN201910002597 A CN 201910002597A CN 109728051 B CN109728051 B CN 109728051B
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Abstract
The invention relates to the technical field of display, and discloses a film evaporation method for a transfer substrate and a display panel, which comprises the following steps: coating an evaporation material on a transfer printing substrate with a pixel area heating resistor; the pixel area heating resistor at least has a pattern at a position corresponding to a pixel evaporation area of the backboard to be evaporated, and the evaporation material at least covers the pixel area heating resistor; aligning and attaching the transfer printing substrate coated with the evaporation material and the back plate to be evaporated; the method comprises the steps of evaporating an evaporation material to a pixel evaporation area corresponding to a back plate to be evaporated by heating a pixel area through a heating resistor, adopting a transfer substrate to replace a fine metal mask to prepare a film layer of a display panel, evaporating the evaporation material on the transfer substrate to the pixel evaporation area corresponding to the back plate to be evaporated by heating the pixel area through the heating resistor, and further forming an evaporation material layer with a corresponding pattern in the pixel evaporation area corresponding to the back plate to be evaporated. The production cost is reduced, and the product yield is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a film evaporation method for a transfer printing substrate and a display panel.
Background
In the field of display technology, an Organic Light-Emitting Diode (OLED) display is considered as a third generation display technology following a Liquid Crystal Display (LCD) by its advantages of lightness, thinness, self-luminescence, low driving voltage, high luminous efficiency, fast response speed, wide viewing angle, rich colors, high brightness, low power consumption, high and low temperature resistance, etc., and is considered as a display device with the greatest potential for development.
At present, a fine metal mask is generally adopted in a preparation process of a display panel of an OLED display to prepare an RGB light emitting layer, but the fine metal mask has high manufacturing cost, so that the production cost of the OLED display is high, the fine metal mask is easy to deform in an evaporation process, and further the problems of folds, bending and the like are caused, the phenomena of color mixing and the like are easily caused, on one hand, the product is poor, and on the other hand, the preparation process is difficult to prepare the OLED display with ultra-high definition display.
Therefore, it is important to provide a film evaporation method for a display panel without using a fine metal mask.
Disclosure of Invention
The invention provides a transfer printing substrate and a film evaporation method of a display panel.
In order to achieve the purpose, the invention provides the following technical scheme:
a film evaporation method of a display panel comprises the following steps:
step S101, coating an evaporation material on a transfer substrate with a pixel area heating resistor; the pixel area heating resistor at least has a pattern at a position corresponding to a pixel evaporation area of the backboard to be evaporated, and the evaporation material at least covers the pixel area heating resistor;
step S102, aligning and attaching the transfer printing substrate coated with the evaporation material and the back plate to be evaporated;
and step S103, evaporating the evaporation material to a pixel evaporation area corresponding to the backboard to be evaporated in a mode of heating the pixel area by a heating resistor.
In the film evaporation method of the display panel, the transfer substrate is adopted to replace a fine metal mask plate to prepare the film of the display panel, so that the production cost is reduced, the product yield is improved, and the specific process is as follows: through step S101, an evaporation material is coated on a transfer substrate, and since the transfer substrate has a pixel region heating resistor, the pixel region heating resistor has a pattern at least at a position corresponding to a pixel evaporation region of a backplane to be evaporated, and during coating, the evaporation material covers at least the pixel region heating resistor, so that the pixel region heating resistor and the evaporation material are sequentially stacked at a position corresponding to the pixel evaporation region of the backplane to be evaporated on the transfer substrate; by the step S102, the transfer printing substrate coated with the evaporation material is aligned and attached to the back plate to be evaporated, at the moment, the pattern of the pixel area heating resistor on the transfer printing substrate corresponds to the pixel evaporation area of the back plate to be evaporated, and the evaporation material is arranged on the pattern; through step S103, the pixel area heating resistor is heated, so that the evaporation material on the pattern at the position corresponding to the pixel evaporation area of the to-be-evaporated backplane of the pixel area heating resistor is evaporated to the pixel evaporation area corresponding to the to-be-evaporated backplane, and then an evaporation material layer having a corresponding pattern can be formed in the pixel evaporation area corresponding to the to-be-evaporated backplane.
Preferably, the evaporating the evaporation material to the pixel evaporation region corresponding to the backplane to be evaporated by heating the pixel region with a heating resistor specifically includes:
the heating resistor of the pixel region is electrified with a sub-millisecond internal current of 10 2 A-10 3 And the pulse current of A enables the evaporation material to be evaporated in the pixel evaporation area corresponding to the backboard to be evaporated.
Preferably, the transfer substrate coated with the evaporation material and the back plate to be evaporated are attached to each other in an aligned manner, and specifically includes:
fixing the transfer printing substrate, and then respectively clamping a heating wire positive electrode and a heating wire negative electrode which are connected with two ends of each pixel area heating resistor through an electrifying clamp;
and aligning the backboard to be evaporated with the transfer printing substrate, and attaching after aligning.
Preferably, after the alignment, the distance between the transfer printing substrate and the back plate to be evaporated is 1mm-5 mm; after the transfer printing substrate is attached to the back plate to be subjected to vapor deposition, the distance between the transfer printing substrate and the back plate to be subjected to vapor deposition is smaller than 1 mm.
Preferably, the method for coating the evaporation material on the transfer substrate with the pixel region heating resistor comprises the following steps:
and coating an evaporation material on a transfer printing substrate with a pixel area heating resistor by adopting an ink-jet printing mode.
Preferably, the coating of the evaporation material on the transfer substrate having the pixel region heating resistor specifically includes: and coating the whole surface of the transfer printing substrate with an evaporation material by adopting an ink-jet printing mode.
In addition, the invention also provides a transfer printing substrate for the film evaporation method of the display panel according to any one of the above technical schemes, which comprises a substrate, a pixel region heating resistor arranged on the substrate; the pixel area heating resistor at least has a pattern at a position corresponding to a pixel evaporation area of the backboard to be evaporated.
Preferably, the transfer substrate further includes: the heating wire comprises a heating wire positive electrode connected with one end of each pixel area heating resistor and a heating wire negative electrode connected with the other end of each pixel area heating resistor.
Preferably, the material of the pixel region heating resistor is a metal material.
Preferably, the metal material is molybdenum.
Drawings
FIG. 1 is a flowchart illustrating a method for vapor deposition of a film layer on a display panel according to the present invention;
FIG. 2 is a schematic structural diagram of a transfer substrate according to the present invention;
FIG. 3 is a schematic structural diagram of another transfer substrate provided in the present invention;
FIG. 4 is a schematic diagram of a film layer evaporation method for a display panel according to the present invention;
fig. 5 is a schematic view illustrating a coating of an evaporation material in a film evaporation method for a display panel according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, 3 and 4, a method for depositing a film layer on a display panel includes:
a step S101 of coating a vapor deposition material 3 on a transfer substrate 1 having a pixel region heating resistor 11; the pixel area heating resistor 11 at least has a pattern at a position corresponding to a pixel evaporation area of the backboard 2 to be evaporated, and the evaporation material 3 at least covers the pixel area heating resistor 11;
step S102, aligning and attaching the transfer printing substrate 1 coated with the evaporation material 3 and a backboard 2 to be evaporated;
step S103, evaporating the evaporation material 3 to the pixel evaporation region corresponding to the backplane 2 to be evaporated by heating the pixel region heating resistor 11.
In the film evaporation method of the display panel, the transfer substrate 1 is adopted to replace a fine metal mask to prepare the film of the display panel, so that the production cost is reduced, the product yield is improved, and the specific process is as follows: in step S101, a vapor deposition material 3 is coated on a transfer substrate 1, and since the transfer substrate 1 has a pixel region heating resistor 11, the pixel region heating resistor 11 has a pattern at least at a position corresponding to a pixel vapor deposition region of a backplane 2 to be vapor deposited, and when coating, the vapor deposition material 3 covers at least the pixel region heating resistor 11, so that the pixel region heating resistor 11 and the vapor deposition material 3 are sequentially stacked at a position corresponding to the pixel vapor deposition region of the backplane 2 to be vapor deposited on the transfer substrate 1; through step S102, the transfer substrate 1 coated with the evaporation material 3 is aligned and attached to the backplane 2 to be evaporated, at this time, the pattern of the pixel region heating resistor 11 on the transfer substrate 1 corresponds to the pixel evaporation region of the backplane 2 to be evaporated, and the evaporation material 3 is provided on the pattern; through step S103, the pixel area heating resistor 11 is heated, so that the evaporation material 3 on the pattern at the position where the pixel area heating resistor 11 corresponds to the pixel evaporation area of the backplane 2 to be evaporated is evaporated to the pixel evaporation area corresponding to the backplane 2 to be evaporated, and then the layer of the evaporation material 3 having the corresponding pattern can be formed in the pixel evaporation area corresponding to the backplane 2 to be evaporated.
In order to ensure that evaporation material 3 is evaporated as soon as possible by means of heat transfer, in a preferred embodiment, as shown in fig. 4, evaporation material 3 is evaporated in a pixel evaporation area corresponding to back plate 2 to be evaporated by means of heating by pixel area heating resistor 11, which specifically includes:
the current in sub-millisecond is 10 when the heating resistor 11 in the pixel region is electrified 2 A-10 3 The pulse current of A enables the evaporation material 3 to be evaporated in the pixel evaporation area corresponding to the backboard 2 to be evaporated.
On the display surfaceIn the method for vapor deposition of a film layer on a plate, the surface source vapor deposition of the vapor deposition material 3 is performed in a high vacuum environment in which the degree of vacuum is 10, and the heat transfer is mainly performed by heat conduction to evaporate the vapor deposition material 3 as quickly as possible by the heat transfer -4 Pa-10 -3 Pa. The evaporation material 3 is arranged on the pixel region heating resistor 11, the pixel region heating resistor 11 is electrified to generate heat and conducts the heat to the evaporation material 3 on the pixel region heating resistor 11 through heat transfer, the evaporation material 3 is heated and evaporated, and the process can select sub-second and sub-millisecond pulse large current (10) 2 A～10 3 A number level, specifically depending on the pulse time), the evaporation process can be completed in a very short time, ensuring that the material outside the pixel region heating resistor 11 is not heated and evaporated onto the backplane 2 to be evaporated. The pulse current may be 100A, 200A, 300A, 400A, 500A, 600A, 700A, 800A, 900A, or 1000A in a sub-millisecond period, the pulse current may be 100A, 200A, 300A, 400A, 500A, 600A, 700A, 800A, 900A, or 1000A in a sub-second period, and a specific value of the pulse current may be selected according to an actual condition of a film deposition method of the display panel. The pixel evaporation area corresponding to the backplane 2 to be evaporated is not in direct contact with the pixel area heating resistor 11, and because no heat-conducting medium exists in a high vacuum environment, the display panel is hardly affected by heat, that is, the peripheral components 22 are not affected by the pulse current heating mode. In addition, the heating of the pixel region heating resistor 11 may be not only a pulse current heating manner, but also other instantaneous strong electric heating manners capable of meeting the requirement, and the specific manner may be selected according to the actual situation of the film evaporation method of the display panel.
As shown in fig. 4, in order to ensure the evaporation precision, in a preferred embodiment, the transfer substrate 1 coated with the evaporation material 3 and the back plate 2 to be evaporated are aligned and attached, and specifically includes:
after the transfer substrate 1 is fixed, a heating wire positive electrode 12 and a heating wire negative electrode 15 which are connected with two ends of each pixel region heating resistor 11 are respectively clamped by an electric clamp 4;
and aligning the backboard 2 to be evaporated with the transfer printing substrate 1, and attaching after the alignment is finished.
In the above-mentioned film layer evaporation method of display panel, at first transfer printing substrate 1 is fixed, then pinch heater wire positive electrode 12 and heater wire negative electrode 15 connected with both ends of each pixel zone heating resistor 11 respectively through adding electric clamp 4, make each pixel zone heating resistor 11 electrically connect with external power, then remove and wait to evaporate the coating by vaporization backplate 2, through waiting to evaporate the coating by vaporization backplate 2 and make waiting to evaporate coating by vaporization backplate 2 and transfer printing substrate 1 to counterpoint with counterpoint mark 13 on transfer printing substrate 1, guarantee that the pattern of pixel zone heating resistor 11 on the transfer printing substrate 1 and the coating by vaporization material 3 that is equipped with on it correspond with the pixel evaporation by vaporization region of waiting to evaporate coating by vaporization backplate 2, and then the steam of the coating by vaporization material 3 in the evaporation process directly falls into the pixel evaporation by vaporization region of waiting to evaporate coating by vaporization backplate 2, guarantee the coating by vaporization precision. Continue to treat the coating by vaporization backplate 2 in order will treat coating by vaporization backplate 2 and the laminating of rendition base plate 1 along the removal of perpendicular to rendition base plate 1 towards rendition base plate 1 after the counterpoint is accomplished, guarantee that the steam transmission route of the coating by vaporization material 3 among the coating by vaporization process is shorter for steam more falls into the pixel coating by vaporization region of treating coating by vaporization backplate 2, guarantees the coating by vaporization precision. In order to ensure the attachment is neat, the size of the transfer substrate 1 may be slightly larger than that of the substrate 1 to be transferred, so as to ensure that the pixel evaporation region of the backplane 2 to be evaporated is completely covered by the evaporation material 3 during evaporation.
In order to further ensure the evaporation precision, specifically, the distance between the transfer printing substrate 1 and the back plate 2 to be evaporated after alignment is 1mm-5 mm; after the transfer printing substrate 1 is attached, the distance between the transfer printing substrate 1 and the back plate 2 to be evaporated is less than 1 mm.
In the above film layer evaporation method for a display panel, in order to ensure the alignment accuracy, the back plate 2 to be evaporated is moved so that the distance between the transfer substrate 1 and the back plate 2 to be evaporated after alignment is 1mm, 2mm, 3mm, 4mm, or 5mm, and the specific value of the distance between the transfer substrate 1 and the back plate 2 to be evaporated after alignment can be selected according to the actual situation of the film layer evaporation method for a display panel. In order to control the evaporation shadow, the backboard 2 to be evaporated is continuously moved along the direction perpendicular to the transfer substrate 1 toward the transfer substrate 1 after the alignment is completed, the distance between the transfer substrate 1 and the backboard 2 to be evaporated is controlled within 1mm after the lamination, at this time, the distance may be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, or 0.9mm, and the specific value of the distance between the transfer substrate 1 and the backboard 2 to be evaporated after the lamination may be selected according to the actual situation of the film evaporation method of the display panel.
As shown in fig. 5, in a preferred embodiment, the coating of the evaporation material 3 on the transfer substrate 1 having the pixel region heating resistors 11 specifically includes:
the evaporation material 3 is applied to the transfer substrate 1 having the pixel region heating resistors 11 by an ink jet printing method.
In the above method for coating a film layer on a display panel, in order to uniformly coat the material 3 to be coated on the transfer substrate 1 having the pixel region heating resistor 11, the material may be sprayed by inkjet printing, and the method for coating the material 3 may be convenient, fast, and easy to implement, may be formed by spin coating, or may be formed by other coating processes that can meet the requirements.
As shown in fig. 5, specifically, the coating of the evaporation material 3 on the transfer substrate 1 having the pixel region heating resistors 11 includes: the entire surface of the transfer substrate 1 is coated with the vapor deposition material 3 by an ink jet printing method.
In the film evaporation method of the display panel, an ink-jet printing mode is adopted, evaporation materials 3 are uniformly sprayed on the whole surface of a transfer printing substrate 1 through an ink-jet head 5, and the evaporation materials 3 are sprayed in the area of a pixel area heating resistor 11, but the evaporation materials 3 are not required to be sprayed in the areas of a heating wire positive electrode 12 and a heating wire negative electrode 15 connected with two ends of each pixel area heating resistor 11, and are directly exposed so as to be convenient for the subsequent circuit connection; when there are pixel heating wirings in the transfer substrate 1 at positions corresponding to the non-display regions of the rear plate 2 to be vapor-deposited, it is necessary to appropriately avoid the spraying of the vapor deposition material 3 in the regions when the vapor deposition material 3 is sprayed. After the vapor deposition material 3 is sprayed, it is necessary to first perform a volatilization process of the solvent in which the vapor deposition material 3 is dissolved in a nitrogen atmosphere, and only the vapor deposition material 3 is formed on the transfer substrate 1 after the solvent is volatilized.
In addition, as shown in fig. 2, fig. 3 and fig. 4, the present invention further provides a transfer substrate 1 for use in the method for evaporation of a film layer of a display panel according to any of the above technical solutions, including a substrate 14, a pixel region heating resistor 11 disposed on the substrate 14; the pixel area heating resistor 11 has a pattern at least at a position corresponding to the pixel evaporation area of the back plate 2 to be evaporated.
In the above-mentioned transfer substrate 1, as shown in fig. 2 and fig. 3, the pattern of the pixel region heating resistor 11 is different according to the different pixel evaporation regions of the back plate 2 to be evaporated, since the transfer substrate 1 has the pixel region heating resistor 11, the pixel region heating resistor 11 has a pattern at least at the position corresponding to the pixel evaporation region of the back plate 2 to be evaporated, the evaporation material 3 covers at least the pixel region heating resistor 11, the pixel region heating resistor 11 and the evaporation material 3 are sequentially laminated at the position corresponding to the pixel evaporation region of the back plate 2 to be evaporated on the transfer substrate 1 during the evaporation, after the pixel region heating resistor 11 is heated, the evaporation material 3 corresponding to the pixel region of the back plate 2 to be evaporated on the transfer substrate 1 falls into the pixel region of the back plate 2 to be evaporated, and is connected with the anode of the pixel region to form a light emitting region, and the material at the position of part of the non-pixel region of the transfer substrate 1 may be heated and evaporated on the back plate 2, however, the backplane 2 to be vapor-deposited has a certain aperture ratio, the anode structure 21 is only arranged in the pixel region of the backplane 2 to be vapor-deposited, and the pixels are separated by the pixel definition layer, so that the rest of the vapor-deposition material 3 which possibly falls on the pixel definition layer cannot be subsequently formed to emit light, and the product yield is ensured.
Therefore, the transfer substrate 1 can replace a fine metal mask to prepare a film layer of a display panel, production cost is reduced, and product yield is improved.
In order to facilitate the pixel area heating resistor 11 to turn on heating, in a preferred embodiment, the transfer substrate 1 further includes: a heating wire positive electrode 12 connected to one end of each pixel area heating resistor 11, and a heating wire negative electrode 15 connected to the other end of each pixel area heating resistor 11.
In the above-described transfer substrate 1, the heating line positive electrode 12 and the heating line negative electrode 15 connected to both ends of each pixel area heating resistor 11 are respectively sandwiched by the charging nip 4, so that each pixel area heating resistor 11 is electrically connected to an external power supply, and therefore, the pixel area heating resistors 11 are conveniently energized and turned on to be heated after the transfer substrate 1 is fixedly disposed by providing the heating line positive electrode 12 and the heating line negative electrode 15.
In a preferred embodiment, the material of the pixel area heating resistor 11 may be a metal material.
In the transfer substrate 1, the pixel area heating resistors 11 are used to generate heat after being energized and transfer heat, and therefore, the material of the pixel area heating resistors 11 may be a metal material or other materials that meet the needs. The pixel region heating resistor 11 is formed by sputtering a metal material layer on the substrate 14 and then patterning the metal material layer by exposure, development, etching, etc., so that the material of the pixel region heating resistor 11 can be a high temperature resistant and easily etched metal material.
In particular, the metallic material may be molybdenum.
In the transfer substrate 1, the metal material may be molybdenum, titanium, aluminum, or other high temperature resistant and easily etched metal materials meeting the requirement, and the specific metal material may be selected according to the film evaporation method of the display panel and the actual situation of the transfer substrate 1.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (3)
1. A film evaporation method of a display panel is characterized by comprising the following steps:
coating an evaporation material on a transfer printing substrate with a pixel area heating resistor; the pixel area heating resistor at least has a pattern at a position corresponding to a pixel evaporation area of the backboard to be evaporated, and the evaporation material at least covers the pixel area heating resistor; the pixel evaporation area corresponding to the back plate to be evaporated is not in direct contact with the pixel area heating resistor; two adjacent pixels are separated by a pixel defining layer, the positions of partial non-pixel areas of the transfer printing substrate are provided with evaporation materials, and the positions of the non-pixel areas are overlapped with the pixel defining layer;
will coat with the coating material's transfer-printing base plate with treat that the coating by vaporization backplate is counterpointed the laminating, specifically include:
fixing the transfer printing substrate, and then respectively clamping a heating wire positive electrode and a heating wire negative electrode which are connected with two ends of each pixel area heating resistor through an electrifying clamp; aligning the backboard to be evaporated with the transfer printing substrate, and attaching the backboard to be evaporated and the transfer printing substrate after aligning; after the alignment, the space between the transfer printing substrate and the back plate to be evaporated is 1mm-5 mm; after the transfer printing substrate is attached to the back plate to be evaporated, the distance between the transfer printing substrate and the back plate to be evaporated is smaller than 1 mm;
evaporating the evaporation material to a pixel evaporation area corresponding to the backboard to be evaporated in a mode of heating the pixel area by a heating resistor;
the mode through pixel district heating resistance heating will evaporation coating material evaporation coating by vaporization the pixel evaporation coating region that treats the evaporation coating backplate corresponds specifically includes:
the current in sub-millisecond is 10 when the heating resistor of the pixel region is switched on 2 A-10 3 And the pulse current of A enables the evaporation material to be evaporated in the pixel evaporation area corresponding to the backboard to be evaporated.
2. The method for evaporation coating a film layer on a display panel according to claim 1, wherein the step of coating an evaporation material on a transfer substrate having a pixel region heating resistor comprises:
and coating an evaporation material on a transfer printing substrate with a pixel area heating resistor by adopting an ink-jet printing mode.
3. The method for evaporation of film layers of a display panel according to claim 2, wherein the step of coating an evaporation material on a transfer substrate having a pixel region heating resistor comprises: and coating the whole surface of the transfer printing substrate with an evaporation material by adopting an ink-jet printing mode.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105489788A (en) * | 2015-12-29 | 2016-04-13 | 昆山工研院新型平板显示技术中心有限公司 | OLED (organic light-emitting diode) pixel pattern evaporation method and system |
| CN107994117A (en) * | 2017-12-08 | 2018-05-04 | 京东方科技集团股份有限公司 | Prepare method, OLED display device and the OLED display devices of OLED display device |
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| KR101405502B1 (en) * | 2011-08-26 | 2014-06-27 | 주식회사 엔씰텍 | Deposition device for forming organic layer using a Joule-heating and Device for fabricating an electroluminescent display device using the deposition device |
| WO2016186386A1 (en) * | 2015-05-15 | 2016-11-24 | 주식회사 다원시스 | Apparatus and method for depositing organic film, and organic film apparatus |
| KR101769547B1 (en) * | 2015-11-19 | 2017-08-21 | 주식회사 다원시스 | Device and system for deposiong using induction heating |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105489788A (en) * | 2015-12-29 | 2016-04-13 | 昆山工研院新型平板显示技术中心有限公司 | OLED (organic light-emitting diode) pixel pattern evaporation method and system |
| CN107994117A (en) * | 2017-12-08 | 2018-05-04 | 京东方科技集团股份有限公司 | Prepare method, OLED display device and the OLED display devices of OLED display device |
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