IT1392752B1 - Sistema di stampa serigrafica di nuova generazione - Google Patents
Sistema di stampa serigrafica di nuova generazioneInfo
- Publication number
- IT1392752B1 IT1392752B1 ITUD2008A000262A ITUD20080262A IT1392752B1 IT 1392752 B1 IT1392752 B1 IT 1392752B1 IT UD2008A000262 A ITUD2008A000262 A IT UD2008A000262A IT UD20080262 A ITUD20080262 A IT UD20080262A IT 1392752 B1 IT1392752 B1 IT 1392752B1
- Authority
- IT
- Italy
- Prior art keywords
- printing system
- new generation
- serigraphic printing
- serigraphic
- generation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fax Reproducing Arrangements (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2008A000262A IT1392752B1 (it) | 2008-12-18 | 2008-12-18 | Sistema di stampa serigrafica di nuova generazione |
US12/418,912 US8215473B2 (en) | 2008-05-21 | 2009-04-06 | Next generation screen printing system |
PCT/EP2009/056024 WO2009141319A1 (en) | 2008-05-21 | 2009-05-18 | Next generation screen printing system |
EP09749809A EP2297777A1 (en) | 2008-05-21 | 2009-05-18 | Next generation screen printing system |
JP2011509948A JP2011523910A (ja) | 2008-05-21 | 2009-05-18 | 次世代型スクリーン印刷システム |
KR1020107028737A KR20110020272A (ko) | 2008-05-21 | 2009-05-18 | 차세대 스크린 프린팅 시스템 |
CN2009801195714A CN102037555B (zh) | 2008-05-21 | 2009-05-18 | 下一代丝网印刷系统 |
TW098116884A TWI397146B (zh) | 2008-05-21 | 2009-05-21 | 下一代網印系統 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2008A000262A IT1392752B1 (it) | 2008-12-18 | 2008-12-18 | Sistema di stampa serigrafica di nuova generazione |
Publications (2)
Publication Number | Publication Date |
---|---|
ITUD20080262A1 ITUD20080262A1 (it) | 2010-06-19 |
IT1392752B1 true IT1392752B1 (it) | 2012-03-16 |
Family
ID=40750977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUD2008A000262A IT1392752B1 (it) | 2008-05-21 | 2008-12-18 | Sistema di stampa serigrafica di nuova generazione |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT1392752B1 (it) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61113766A (ja) * | 1984-11-09 | 1986-05-31 | Nissin Electric Co Ltd | エンドステ−シヨン |
EP0582017B1 (en) * | 1992-08-04 | 1995-10-18 | International Business Machines Corporation | Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers |
US5518599A (en) * | 1994-12-14 | 1996-05-21 | Reflekt Technology, Inc. | Cross flow metalizing of compact discs |
DE19945648C2 (de) * | 1999-09-23 | 2001-08-02 | Steag Hamatech Ag | Vorrichtung zum Be- und Entladen von Substraten |
US7021450B2 (en) * | 2002-04-17 | 2006-04-04 | Kraft Foods Holdings, Inc. | Device and method to correct uneven spacing of successive articles |
JP4096359B2 (ja) * | 2003-03-10 | 2008-06-04 | セイコーエプソン株式会社 | 製造対象物の製造装置 |
TWI271367B (en) * | 2005-11-24 | 2007-01-21 | Chunghwa Picture Tubes Ltd | Cassette and mechanical arm and process apparatus |
JP4593461B2 (ja) * | 2005-12-27 | 2010-12-08 | 東京エレクトロン株式会社 | 基板搬送システム |
ITUD20070198A1 (it) * | 2007-10-24 | 2009-04-25 | Baccini S P A | Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento |
-
2008
- 2008-12-18 IT ITUD2008A000262A patent/IT1392752B1/it active
Also Published As
Publication number | Publication date |
---|---|
ITUD20080262A1 (it) | 2010-06-19 |
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