JP2011522403A - 少なくとも1つの電子構成部品をプリント回路基板に組み込むための方法、およびプリント回路基板 - Google Patents
少なくとも1つの電子構成部品をプリント回路基板に組み込むための方法、およびプリント回路基板 Download PDFInfo
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Abstract
Description
電子構成部品を支持するためのプリント回路基板の層を備えるステップと、
接着剤を層の表面に塗布するステップと、
接着剤により層上に電子構成部品を固定するステップと、
接着剤から離れた側面もしくは表面で、少なくとも1つの電気的導体層を、構成部品上または構成部品に付着、または配置するステップと、
電子構成部品の接点および/またはプリント回路基板上に形成される導体トラックに従い電気的導体層をパターン形成するステップとである。
Claims (17)
- 少なくとも1つの電子構成部品をプリント回路基板に組み込むための方法であって、
電子構成部品(1、2、3、16)を支持するためのプリント回路基板の層(4)を備えるステップと、
接着剤(5)を層(4)の表面に塗布するステップと、
接着剤(5)によって層(4)上に電子構成部品(1、2、3、16)を固定するステップと、
接着剤(5)から離れた側面または表面で、少なくとも1つの電気的導体層(8、23、24)を構成部品(1、2、3、16)上または構成部品(1、2、3、16)に付着する、または配置するステップと、
電子構成部品の接点および/またはプリント回路基板で形成される導体トラックに従って電気的導体層(8、23、24)をパターン形成するステップとを含む、方法。 - 電子構成部品(1、2、3、16)が層に固定された後に、絶縁材料(9、10)、詳細にはプリプレグフィルムおよび/または樹脂によって囲まれることを特徴とする、請求項1に記載の方法。
- 電子構成部品(1、2、3、16)を支持するための層(4)が、接着剤(5)の塗布の前にキャリア層(6)またはコアに付着されることを特徴とする、請求項1または2に記載の方法。
- キャリア層(6)が電子構成部品(1、2、3、16)の固定後に除去されることを特徴とする、請求項3に記載の方法。
- 接着剤(5)が、固定される電子構成部品(1、2、3、16)の配置と一致したパターンで層(4)の表面に塗布されることを特徴とする、請求項1から4のいずれか一項に記載の方法。
- 電気的導体層(8、23、24)のパターン形成が、レーザーパターン形成、フォトパターン形成などで行われることを特徴とする、請求項1から5のいずれか一項に記載の方法。
- 電気的導体層(8、23、24)のパターン形成後に、少なくとも1つの絶縁層(11、22)が、電子構成部品(1、2、3、16)から離れたパターン形成された電気的導体層(8、23、24)の表面に付着されることを特徴とする、請求項1から6のいずれか一項に記載の方法。
- 例えば、RCC箔などの、少なくとも1つ伝導および/または非伝導層(9、11、19、21)が追加して付着、または配置されことを特徴とする、請求項1から7のいずれか一項に記載の方法。
- 電気的導体層から離れた電子構成部品(1、2、3、16)側、詳細には電子構成部品の固定領域で、少なくとも1つの開口部(15、18、26)が熱の除去および/または構成部品への接触のために形成されることを特徴とする、請求項1から8のいずれか一項に記載の方法。
- 電子構成部品(1、2、3、16)を支持するための層(4)が金属、および詳細には、電気的導体層により形成されることを特徴とする、請求項1から9のいずれか一項に記載の方法。
- 熱的に伝導または伝熱性のある接着剤(5)が使用されることを特徴とする、請求項1から10のいずれか一項に記載の方法。
- 反対側の主表面で、そのそれぞれに、電気的導体層(4、8)と接触される複数の接点(7、17)が備えられた電子構成部品(16)が使用されることを特徴とする、請求項1から11のいずれか一項に記載の方法。
- 電子構成部品(1、2、3、16)は、電気的導体層(8、23、24)のパターン形成直後にその機能性がテストされることを特徴とする、請求項1から12のいずれか一項に記載の方法。
- 電子構成部品(1、2、3、16)を支持するための層(4)を備え、少なくとも1つの電子構成部品(1、2、3、16)が接着剤(5)により固定される、少なくとも組み込まれた1つの電子構成部品を含むプリント回路基板であって、電子構成部品(1、2、3、16)の固定後に、少なくとも1つの電気的導体層(8、23、24)が構成部品(1、2、3、16)上または構成部品(1、2、3、16)に配置され、電子構成部品(1、2、3、16)の接点(7)および/または導体トラックまたはプリント回路基板に従ってパターン形成されることが可能なプリント回路基板。
- 電子構成部品(1、2、3、16)が絶縁材料(9、10)、詳細にはプリプレグフィルムおよび/または絶縁樹脂で囲まれることを特徴とする、請求項14に記載のプリント回路基板。
- 構成部品(1、2、3、16)を埋め込み、絶縁および/または導体材料でできている複数の層(9、11、19、21)が提供されることを特徴とする、請求項14または15に記載のプリント回路基板。
- 熱を除去するための少なくとも1つの開口部(15、18、26)が、特に電子構成部品(1、2、3、16)の周囲および/または支持の絶縁材料、詳細には電子構成部品の固定の領域に備えられるようにすることを特徴とする、請求項14、15、または16に記載のプリント回路基板。
Applications Claiming Priority (3)
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ATGM313/2008 | 2008-05-30 | ||
AT20031308U AT10247U8 (de) | 2008-05-30 | 2008-05-30 | Verfahren zur integration wenigstens eines elektronischen bauteils in eine leiterplatte sowie leiterplatte |
PCT/AT2009/000224 WO2009143550A1 (de) | 2008-05-30 | 2009-05-29 | Verfahren zur integration wenigstens eines elektronischen bauteils in eine leiterplatte sowie leiterplatte |
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JP2014000092A Pending JP2014090201A (ja) | 2008-05-30 | 2014-01-06 | 少なくとも1つの電子構成部品をプリント回路基板に組み込むための方法、およびプリント回路基板 |
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EP (1) | EP2286644B1 (ja) |
JP (2) | JP2011522403A (ja) |
KR (1) | KR101652534B1 (ja) |
CN (1) | CN102090155B (ja) |
AT (1) | AT10247U8 (ja) |
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KR20110018883A (ko) | 2011-02-24 |
US20140307403A1 (en) | 2014-10-16 |
US8789271B2 (en) | 2014-07-29 |
CN102090155A (zh) | 2011-06-08 |
JP2014090201A (ja) | 2014-05-15 |
AT10247U2 (de) | 2008-11-15 |
ES2392924T3 (es) | 2012-12-17 |
AT10247U3 (de) | 2013-04-15 |
AT10247U8 (de) | 2008-12-15 |
KR101652534B1 (ko) | 2016-08-30 |
CN102090155B (zh) | 2013-06-12 |
EP2286644B1 (de) | 2012-09-26 |
WO2009143550A1 (de) | 2009-12-03 |
US20110069448A1 (en) | 2011-03-24 |
EP2286644A1 (de) | 2011-02-23 |
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