JP2011521874A - 直接シリコン鋳造又は直接反応金属鋳造 - Google Patents
直接シリコン鋳造又は直接反応金属鋳造 Download PDFInfo
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- JP2011521874A JP2011521874A JP2011510685A JP2011510685A JP2011521874A JP 2011521874 A JP2011521874 A JP 2011521874A JP 2011510685 A JP2011510685 A JP 2011510685A JP 2011510685 A JP2011510685 A JP 2011510685A JP 2011521874 A JP2011521874 A JP 2011521874A
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- Prior art keywords
- silicon
- casting
- reactor chamber
- containing gas
- liquid
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 166
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 153
- 239000010703 silicon Substances 0.000 title claims abstract description 153
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 34
- 238000005266 casting Methods 0.000 title claims abstract description 30
- 238000005058 metal casting Methods 0.000 title 1
- 239000007788 liquid Substances 0.000 claims abstract description 55
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 28
- 230000008018 melting Effects 0.000 claims abstract description 28
- 239000007787 solid Substances 0.000 claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 59
- 210000003625 skull Anatomy 0.000 claims description 32
- 238000007711 solidification Methods 0.000 claims description 16
- 230000008023 solidification Effects 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 6
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 5
- 239000005052 trichlorosilane Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000009749 continuous casting Methods 0.000 claims description 3
- VJIYRPVGAZXYBD-UHFFFAOYSA-N dibromosilane Chemical compound Br[SiH2]Br VJIYRPVGAZXYBD-UHFFFAOYSA-N 0.000 claims description 3
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims description 3
- AIHCVGFMFDEUMO-UHFFFAOYSA-N diiodosilane Chemical compound I[SiH2]I AIHCVGFMFDEUMO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- AIFMYMZGQVTROK-UHFFFAOYSA-N silicon tetrabromide Chemical compound Br[Si](Br)(Br)Br AIFMYMZGQVTROK-UHFFFAOYSA-N 0.000 claims description 3
- IBOKZQNMFSHYNQ-UHFFFAOYSA-N tribromosilane Chemical compound Br[SiH](Br)Br IBOKZQNMFSHYNQ-UHFFFAOYSA-N 0.000 claims description 3
- DNAPJAGHXMPFLD-UHFFFAOYSA-N triiodosilane Chemical compound I[SiH](I)I DNAPJAGHXMPFLD-UHFFFAOYSA-N 0.000 claims description 3
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 claims description 2
- CFTHARXEQHJSEH-UHFFFAOYSA-N silicon tetraiodide Chemical compound I[Si](I)(I)I CFTHARXEQHJSEH-UHFFFAOYSA-N 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 19
- 239000000047 product Substances 0.000 description 27
- 239000007789 gas Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 230000008569 process Effects 0.000 description 13
- 239000002245 particle Substances 0.000 description 12
- 239000011863 silicon-based powder Substances 0.000 description 12
- 239000012263 liquid product Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 11
- 238000011109 contamination Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- 239000013078 crystal Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000006698 induction Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 235000015220 hamburgers Nutrition 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000012686 silicon precursor Substances 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 238000001089 thermophoresis Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/04—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method adding crystallising materials or reactants forming it in situ to the melt
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12884708P | 2008-05-23 | 2008-05-23 | |
| US61/128,847 | 2008-05-23 | ||
| US12/378,243 US20090289390A1 (en) | 2008-05-23 | 2009-02-11 | Direct silicon or reactive metal casting |
| US12/378,243 | 2009-02-11 | ||
| PCT/US2009/044704 WO2009143264A2 (en) | 2008-05-23 | 2009-05-20 | Direct silicon or reactive metal casting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011521874A true JP2011521874A (ja) | 2011-07-28 |
| JP2011521874A5 JP2011521874A5 (enExample) | 2012-06-07 |
Family
ID=41340860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011510685A Pending JP2011521874A (ja) | 2008-05-23 | 2009-05-20 | 直接シリコン鋳造又は直接反応金属鋳造 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090289390A1 (enExample) |
| EP (1) | EP2291552A4 (enExample) |
| JP (1) | JP2011521874A (enExample) |
| KR (1) | KR20110030482A (enExample) |
| CN (1) | CN102084038B (enExample) |
| CA (1) | CA2725104A1 (enExample) |
| TW (1) | TW201009139A (enExample) |
| WO (1) | WO2009143264A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013523595A (ja) * | 2010-04-13 | 2013-06-17 | シュミット シリコン テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 結晶半導体材料の製造方法 |
| KR20220031660A (ko) * | 2019-07-04 | 2022-03-11 | 슈미트 실리콘 테크놀로지 게엠베하 | 액체 실리콘을 제조하기 위한 장치 및 방법 |
| KR20220038730A (ko) * | 2019-08-08 | 2022-03-29 | 슈미트 실리콘 테크놀로지 게엠베하 | 실리콘 함유 재료의 제조 방법 및 장치 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100189926A1 (en) * | 2006-04-14 | 2010-07-29 | Deluca Charles | Plasma deposition apparatus and method for making high purity silicon |
| US20100047148A1 (en) * | 2008-05-23 | 2010-02-25 | Rec Silicon, Inc. | Skull reactor |
| CN102498062A (zh) * | 2009-04-29 | 2012-06-13 | 卡利太阳能有限公司 | 升级冶金级硅材料提纯的过程控制 |
| WO2011079485A1 (zh) * | 2009-12-31 | 2011-07-07 | 江苏中能硅业科技发展有限公司 | 硅单质的生产方法及生产设备 |
| DE102010011853A1 (de) * | 2010-03-09 | 2011-09-15 | Schmid Silicon Technology Gmbh | Verfahren zur Herstellung von hochreinem Silizium |
| EP2558232B1 (de) * | 2010-04-13 | 2017-07-12 | Schmid Silicon Technology GmbH | Herstellung von monokristallinen halbleiterwerkstoffen |
| DE102010021004A1 (de) * | 2010-05-14 | 2011-11-17 | Schmid Silicon Technology Gmbh | Herstellung von monokristallinen Halbleiterwerkstoffen |
| DE102010045040A1 (de) * | 2010-09-10 | 2012-03-15 | Centrotherm Sitec Gmbh | Verfahren und Vorrichtung zum Herstellen von Silizium |
| US20120082610A1 (en) * | 2010-10-02 | 2012-04-05 | Channon Matthew J | Fluorspar/Iodide process for reduction,purificatioin, and crystallization of silicon |
| KR101339481B1 (ko) * | 2011-08-05 | 2013-12-10 | 주식회사 글로실 | 단결정 실리콘 웨이퍼 원료 제조를 위한 다결정 실리콘 로드 제조방법 |
| CN104583122B (zh) * | 2012-08-29 | 2017-09-05 | 赫姆洛克半导体运营有限责任公司 | 锥形流化床反应器及其使用方法 |
| CN103626184B (zh) * | 2013-07-31 | 2016-02-24 | 浙江精功新材料技术有限公司 | 一种高纯液体多晶硅的制备方法 |
| CN106365169A (zh) * | 2016-08-24 | 2017-02-01 | 上海交通大学 | 一种由硅烷直接铸造多晶硅锭的设备及方法 |
| CN106319618A (zh) * | 2016-09-22 | 2017-01-11 | 上海交通大学 | 一种由硅烷制造直拉单晶硅棒的设备及方法 |
| CN112893789B (zh) * | 2021-01-15 | 2022-08-30 | 台州学院 | 一种用于生产半导体材料箔的装置及方法 |
| CN113415805B (zh) * | 2021-06-16 | 2022-03-29 | 何良雨 | 一种激光维持等离子体制备多晶硅的方法及系统 |
| EP4479582A1 (en) * | 2022-02-15 | 2024-12-25 | Lau Superconductors Inc. | Manufacture and repair of high temperature reinforced superconductors |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59501109A (ja) * | 1982-06-22 | 1984-06-28 | エシルコ−ポレ−シヨン | ソ−ラ−グレ−ドの珪素を製造するための装置と方法 |
| JP2001019594A (ja) * | 1999-07-01 | 2001-01-23 | Sumitomo Sitix Of Amagasaki Inc | シリコン連続鋳造方法 |
| JP2001526171A (ja) * | 1997-12-19 | 2001-12-18 | サントル ナスィオナル デ ラ ルシェルシェ スィアンティフィーク | シリコンの精製方法および精製装置 |
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| US4102765A (en) * | 1977-01-06 | 1978-07-25 | Westinghouse Electric Corp. | Arc heater production of silicon involving alkali or alkaline-earth metals |
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| US4212343A (en) * | 1979-03-16 | 1980-07-15 | Allied Chemical Corporation | Continuous casting method and apparatus for structurally defined metallic strips |
| DE3016807A1 (de) * | 1980-05-02 | 1981-11-05 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur herstellung von silizium |
| US4274473A (en) * | 1980-01-14 | 1981-06-23 | Allied Chemical Corporation | Contour control for planar flow casting of metal ribbon |
| US4343772A (en) * | 1980-02-29 | 1982-08-10 | Nasa | Thermal reactor |
| CA1147698A (en) * | 1980-10-15 | 1983-06-07 | Maher I. Boulos | Purification of metallurgical grade silicon |
| DE3419137A1 (de) * | 1984-05-23 | 1985-11-28 | Bayer Ag, 5090 Leverkusen | Verfahren und vorrichtung zur herstellung von halbleiterfolien |
| DE3629231A1 (de) * | 1986-08-28 | 1988-03-03 | Heliotronic Gmbh | Verfahren zum aufschmelzen von in einen schmelztiegel chargiertem siliciumpulver und schmelztiegel zur durchfuehrung des verfahrens |
| US4936375A (en) * | 1988-10-13 | 1990-06-26 | Axel Johnson Metals, Inc. | Continuous casting of ingots |
| DE4228402C2 (de) * | 1992-08-26 | 2000-08-03 | Ald Vacuum Techn Ag | Zur Atmosphäre hin abgeschlossene Induktionsschmelzvorrichtung |
| DE4320766C2 (de) * | 1993-06-23 | 2002-06-27 | Ald Vacuum Techn Ag | Vorrichtung zum Einschmelzen einer festen Schicht aus elektrisch leitfähigem Material |
| DE19607805C1 (de) * | 1996-03-01 | 1997-07-17 | Ald Vacuum Techn Gmbh | Verfahren und Vorrichtung zum Schmelzen und Gießen von Metallen in Formen |
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| US6468886B2 (en) * | 1999-06-15 | 2002-10-22 | Midwest Research Institute | Purification and deposition of silicon by an iodide disproportionation reaction |
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| US6960537B2 (en) * | 2001-10-02 | 2005-11-01 | Asm America, Inc. | Incorporation of nitrogen into high k dielectric film |
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- 2009-05-20 JP JP2011510685A patent/JP2011521874A/ja active Pending
- 2009-05-20 WO PCT/US2009/044704 patent/WO2009143264A2/en not_active Ceased
- 2009-05-20 CN CN2009801187328A patent/CN102084038B/zh not_active Expired - Fee Related
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013523595A (ja) * | 2010-04-13 | 2013-06-17 | シュミット シリコン テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 結晶半導体材料の製造方法 |
| KR20220031660A (ko) * | 2019-07-04 | 2022-03-11 | 슈미트 실리콘 테크놀로지 게엠베하 | 액체 실리콘을 제조하기 위한 장치 및 방법 |
| JP2022538811A (ja) * | 2019-07-04 | 2022-09-06 | シュミット シリコン テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 液体シリコンを製造するための装置及び方法 |
| JP7297108B2 (ja) | 2019-07-04 | 2023-06-23 | シュミット シリコン テクノロジー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 液体シリコンを製造するための装置及び方法 |
| KR102689682B1 (ko) | 2019-07-04 | 2024-07-29 | 슈미트 실리콘 테크놀로지 게엠베하 | 액체 실리콘을 제조하기 위한 장치 및 방법 |
| KR20220038730A (ko) * | 2019-08-08 | 2022-03-29 | 슈미트 실리콘 테크놀로지 게엠베하 | 실리콘 함유 재료의 제조 방법 및 장치 |
| KR102814341B1 (ko) | 2019-08-08 | 2025-06-05 | 슈미트 실리콘 테크놀로지 게엠베하 | 실리콘 함유 재료의 제조 방법 및 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009143264A3 (en) | 2010-03-11 |
| EP2291552A2 (en) | 2011-03-09 |
| TW201009139A (en) | 2010-03-01 |
| CA2725104A1 (en) | 2009-11-26 |
| US20090289390A1 (en) | 2009-11-26 |
| WO2009143264A2 (en) | 2009-11-26 |
| CN102084038B (zh) | 2013-12-11 |
| EP2291552A4 (en) | 2012-01-04 |
| KR20110030482A (ko) | 2011-03-23 |
| CN102084038A (zh) | 2011-06-01 |
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