JP2011103498A5 - - Google Patents

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Publication number
JP2011103498A5
JP2011103498A5 JP2011031168A JP2011031168A JP2011103498A5 JP 2011103498 A5 JP2011103498 A5 JP 2011103498A5 JP 2011031168 A JP2011031168 A JP 2011031168A JP 2011031168 A JP2011031168 A JP 2011031168A JP 2011103498 A5 JP2011103498 A5 JP 2011103498A5
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JP
Japan
Prior art keywords
water
polishing
cmp
cerium oxide
azobis
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JP2011031168A
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Japanese (ja)
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JP2011103498A (ja
JP5509114B2 (ja
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Priority claimed from JP2011031168A external-priority patent/JP5509114B2/ja
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Publication of JP2011103498A5 publication Critical patent/JP2011103498A5/ja
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Publication of JP5509114B2 publication Critical patent/JP5509114B2/ja
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JP2011031168A 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法 Expired - Lifetime JP5509114B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011031168A JP5509114B2 (ja) 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004216039 2004-07-23
JP2004216039 2004-07-23
JP2011031168A JP5509114B2 (ja) 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法

Related Parent Applications (1)

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JP2006529234A Division JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Cmp研磨剤及び基板の研磨方法

Related Child Applications (1)

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JP2013042019A Division JP5655879B2 (ja) 2004-07-23 2013-03-04 Cmp研磨剤及び基板の研磨方法

Publications (3)

Publication Number Publication Date
JP2011103498A JP2011103498A (ja) 2011-05-26
JP2011103498A5 true JP2011103498A5 (https=) 2012-06-21
JP5509114B2 JP5509114B2 (ja) 2014-06-04

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ID=35785268

Family Applications (3)

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JP2006529234A Pending JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Cmp研磨剤及び基板の研磨方法
JP2011031168A Expired - Lifetime JP5509114B2 (ja) 2004-07-23 2011-02-16 Cmp研磨剤及び基板の研磨方法
JP2013042019A Expired - Lifetime JP5655879B2 (ja) 2004-07-23 2013-03-04 Cmp研磨剤及び基板の研磨方法

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JP2006529234A Pending JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Cmp研磨剤及び基板の研磨方法

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JP2013042019A Expired - Lifetime JP5655879B2 (ja) 2004-07-23 2013-03-04 Cmp研磨剤及び基板の研磨方法

Country Status (7)

Country Link
US (1) US9293344B2 (https=)
EP (1) EP1796152B1 (https=)
JP (3) JPWO2006009160A1 (https=)
KR (1) KR100856171B1 (https=)
CN (3) CN101311205A (https=)
TW (1) TWI287040B (https=)
WO (1) WO2006009160A1 (https=)

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MD3809C2 (ro) * 2008-06-26 2009-08-31 Акционерное Общество "Azurit" Procedeu de prelucrare de finisare a plăcilor pentru acoperire din calcar hemogen
TW201038690A (en) * 2008-09-26 2010-11-01 Rhodia Operations Abrasive compositions for chemical mechanical polishing and methods for using same
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US8703004B2 (en) * 2011-11-14 2014-04-22 Kabushiki Kaisha Toshiba Method for chemical planarization and chemical planarization apparatus
JPWO2013137220A1 (ja) * 2012-03-14 2015-08-03 日立化成株式会社 研磨方法
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
JP2016175948A (ja) * 2013-08-09 2016-10-06 コニカミノルタ株式会社 Cmp用研磨液
JP5920840B2 (ja) * 2013-09-30 2016-05-18 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
KR102239131B1 (ko) * 2013-09-30 2021-04-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 그 제조 방법
CN104356950B (zh) * 2014-10-21 2017-01-18 李金平 一种蓝宝石晶片抛光液
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
CN104987839A (zh) * 2015-06-30 2015-10-21 安徽德诺化工有限公司 Led用蓝宝石衬底研磨液
US11649377B2 (en) * 2017-08-14 2023-05-16 Resonac Corporation Polishing liquid, polishing liquid set and polishing method
KR102846745B1 (ko) 2017-09-29 2025-08-13 가부시끼가이샤 레조낙 연마액, 연마액 세트 및 연마 방법
JP6837958B2 (ja) * 2017-12-28 2021-03-03 花王株式会社 酸化珪素膜用研磨液組成物
US11718767B2 (en) 2018-08-09 2023-08-08 Versum Materials Us, Llc Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
WO2020170331A1 (ja) 2019-02-19 2020-08-27 日立化成株式会社 研磨液及び研磨方法
CN111014695A (zh) * 2019-11-21 2020-04-17 苏州新锐合金工具股份有限公司 硬质合金混合料的制备方法

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