JP2011044733A - 白色発光素子 - Google Patents
白色発光素子 Download PDFInfo
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- JP2011044733A JP2011044733A JP2010253685A JP2010253685A JP2011044733A JP 2011044733 A JP2011044733 A JP 2011044733A JP 2010253685 A JP2010253685 A JP 2010253685A JP 2010253685 A JP2010253685 A JP 2010253685A JP 2011044733 A JP2011044733 A JP 2011044733A
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- light emitting
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- 239000000758 substrate Substances 0.000 claims abstract description 103
- 229910052751 metal Inorganic materials 0.000 claims abstract description 75
- 239000002184 metal Substances 0.000 claims abstract description 75
- 239000004065 semiconductor Substances 0.000 claims abstract description 73
- 150000004767 nitrides Chemical class 0.000 claims abstract description 47
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 18
- 239000010948 rhodium Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052703 rhodium Inorganic materials 0.000 claims description 6
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052707 ruthenium Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 34
- 230000008569 process Effects 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 230000000903 blocking effect Effects 0.000 description 12
- 238000000605 extraction Methods 0.000 description 9
- 239000012535 impurity Substances 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 229910015363 Au—Sn Inorganic materials 0.000 description 3
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Abstract
【解決手段】白色発光素子130は、上面にp側リード端子132aとn側リード端子132bが形成されたサブマウント基板131と、下からp型窒化物半導体層126、第1活性層124,125、n型窒化物半導体層123及び絶縁性基板121が順次に積層されて成り、前記p型及びn型窒化物半導体層はそれぞれ前記p側及びn側リード端子に各々連結された第1発光部120と、前記絶縁性基板の上面の一領域上に形成された金属層138と、前記金属層の一領域上に接合され、下からp型AlGaInP系半導体層146、第2活性層145及びn型AlGaInP系半導体層142が順次に積層されて成る第2発光部140と、前記金属層の他領域と前記n型AlGaInP系半導体層上にそれぞれ形成されたp側電極148及びn側電極149とを含む。
【選択図】 図5
Description
22 n型窒化物半導体層
24、25 青色及び緑活性層
26 p型窒化物半導体層
27 電流遮断層
28 高反射性金属層
31 シリコンサブマウント基板
32 p側共通電極
40 第2発光部
41 GaAs基板
42 n型AlGaInP系半導体層
45 赤色活性層
46 p型AlGaInP系半導体層
49 n側共通電極
60 第1発光部
61a 凹凸パターン
61 伝導性基板
62 n型窒化物半導体層
64、65 窒化物系活性層
66 p型窒化物半導体層
68 第1金属層
69 n側電極
71 伝導性サブマウント基板
72 p側電極
77 絶縁層
78 第2金属層
80 第2発光部
82 n型AlGaInP系半導体層
88 p側電極
89 第2のn側電極
90 白色発光素子
120 第1発光部
121 絶縁性基板
121a 凹凸パターン
123 n型窒化物半導体層
124、125 窒化物系活性層
126 p型窒化物半導体層
128 第1金属層
130 白色発光素子
131 サブマウント基板
132a p側リード電極
132b n側リード電極
138 第2金属層
140 第2発光部
142、143 n型AlGaInP系半導体層
145 AlGaInP系活性層
146 p型AlGaInP系半導体層
148 p側電極
149 n側電極
Claims (8)
- 上面にp側リード端子とn側リード端子が形成されたサブマウント基板と、
下からp型窒化物半導体層、第1活性層、n型窒化物半導体層及び絶縁性基板が順次に積層されて成り、前記p型及びn型窒化物半導体層はそれぞれ前記p側及びn側リード端子に各々連結された第1発光部と、
前記絶縁性基板の上面の一領域上に形成された金属層と、
前記金属層の一領域上に接合され、下からp型AlGaInP系半導体層、第2活性層及びn型AlGaInP系半導体層が順次に積層されて成る第2発光部と、
前記金属層の他領域と前記n型AlGaInP系半導体層上にそれぞれ形成されたp側及びn側電極と、
を含む白色発光素子。 - 前記サブマウント基板はシリコン基板または金属基板であることを特徴とする請求項1に記載の白色発光素子。
- 前記金属層はアルミニウム(Al)、銀(Ag)、ロジウム(Rh)、ルテニウム(Ru)、白金(Pt)、パラジウム(Pd)及びその合金から成るグループより選択された高反射性金属を含むことを特徴とする請求項1または2に記載の白色発光素子。
- 前記第1発光部の絶縁性基板はサファイア基板であることを特徴とする請求項1〜3のいずれか一項に記載の白色発光素子。
- 前記第2発光部が形成された上面領域は前記絶縁性基板の残り上面面積より小さいことを特徴とする請求項1〜3のいずれか一項に記載の白色発光素子。
- 前記絶縁性基板の前記第2発光部が形成されてない上面領域には凹凸パターンが形成されていることを特徴とする請求項1〜5のいずれか一項に記載の白色発光素子。
- 前記第1活性層は約450〜475nmの波長光を生成し、前記第2活性層は約550〜600nmの波長光を生成することを特徴とする請求項1〜6のいずれか一項に記載の白色発光素子。
- 前記第1活性層はそれぞれ約450〜475nmの波長光と約510〜535nmの波長光を生成する2つの活性層を含み、前記第2活性層は約600〜635nmの波長光を生成することを特徴とする請求項1〜6のいずれか一項に記載の白色発光素子。
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WO2016079929A1 (ja) * | 2014-11-21 | 2016-05-26 | 信越半導体株式会社 | 発光素子及び発光素子の製造方法 |
JP2018506187A (ja) * | 2015-02-18 | 2018-03-01 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 複数の積み重ねられた発光デバイスを有するデバイス |
KR101869553B1 (ko) * | 2011-08-08 | 2018-07-20 | 엘지이노텍 주식회사 | 발광소자, 발광소자 패키지, 및 라이트 유닛 |
WO2018163713A1 (ja) * | 2017-03-07 | 2018-09-13 | 信越半導体株式会社 | 発光素子及びその製造方法 |
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US7211833B2 (en) | 2001-07-23 | 2007-05-01 | Cree, Inc. | Light emitting diodes including barrier layers/sublayers |
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JP4699287B2 (ja) | 2011-06-08 |
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US7514720B2 (en) | 2009-04-07 |
KR20060124510A (ko) | 2006-12-05 |
KR100691177B1 (ko) | 2007-03-09 |
CN1874017A (zh) | 2006-12-06 |
JP5512493B2 (ja) | 2014-06-04 |
US20060267026A1 (en) | 2006-11-30 |
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US20090173955A1 (en) | 2009-07-09 |
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