JP6457784B2 - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
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- JP6457784B2 JP6457784B2 JP2014226919A JP2014226919A JP6457784B2 JP 6457784 B2 JP6457784 B2 JP 6457784B2 JP 2014226919 A JP2014226919 A JP 2014226919A JP 2014226919 A JP2014226919 A JP 2014226919A JP 6457784 B2 JP6457784 B2 JP 6457784B2
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- 239000004065 semiconductor Substances 0.000 title claims description 111
- 239000010410 layer Substances 0.000 claims description 451
- 239000000203 mixture Substances 0.000 claims description 49
- 230000004888 barrier function Effects 0.000 claims description 26
- 239000002346 layers by function Substances 0.000 claims description 24
- 229910002704 AlGaN Inorganic materials 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 23
- 230000004048 modification Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 14
- 238000009877 rendering Methods 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000003595 spectral effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- ORFSSYGWXNGVFB-UHFFFAOYSA-N sodium 4-amino-6-[[4-[4-[(8-amino-1-hydroxy-5,7-disulfonaphthalen-2-yl)diazenyl]-3-methoxyphenyl]-2-methoxyphenyl]diazenyl]-5-hydroxynaphthalene-1,3-disulfonic acid Chemical group COC1=C(C=CC(=C1)C2=CC(=C(C=C2)N=NC3=C(C4=C(C=C3)C(=CC(=C4N)S(=O)(=O)O)S(=O)(=O)O)O)OC)N=NC5=C(C6=C(C=C5)C(=CC(=C6N)S(=O)(=O)O)S(=O)(=O)O)O.[Na+] ORFSSYGWXNGVFB-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Description
12 n型半導体層(第1の半導体層)
13、13A、13B、33 発光機能層(発光層)
13B1 第1の発光層
13B2 第2の発光層
33A 第3の発光層
14 電子ブロック層
15 p型半導体層(第2の半導体層)
BL、BLA、BLB ベース層
BL1 第1の副ベース層
BL2 第2の副ベース層
BS、BS1、BS2 ベースセグメント
GR 溝
Claims (7)
- 第1の導電型を有する第1の半導体層と、前記第1の半導体層上に形成された発光層を含む発光機能層と、前記発光機能層上に形成され、前記第1の半導体層とは反対の導電型を有する第2の半導体層とを有する半導体発光素子であって、
前記発光層は、前記第1の半導体層から応力歪を受ける組成を有してランダムな網目状に形成された複数のベースセグメントを有するベース層と、前記ベース層を埋め込んで形成された少なくとも1つの量子井戸層及び少なくとも1つの障壁層からなる量子井戸構造層と、を有し、
前記ベース層は、互いに異なるAl組成を有するAlGaNからなる複数の副ベース層を有し、
前記第1の半導体層はGaNの組成を有し、
前記少なくとも1つの量子井戸層の各々はInGaNの組成を有し、
前記ベース層は、前記複数の副ベース層のうち、第1の副ベース層と、前記第1の副ベース層よりも前記第2の半導体層側に形成され、前記第1の副ベース層よりも大きなAl組成を有する第2の副ベース層と、を有することを特徴とする半導体発光素子。 - 前記ベース層は、前記第1及び第2の副ベース層がこの順で複数回繰り返し積層された構造を有することを特徴とする請求項1に記載の半導体発光素子。
- 前記ベース層は、キャリアのトンネル効果を生じさせる層厚を有することを特徴とする請求項1又は2に記載の半導体発光素子。
- 前記第2の副ベース層は、AlNの組成を有することを特徴とする請求項1乃至3のいずれか1つに記載の半導体発光素子。
- 前記発光機能層は、複数の前記発光層が積層された構造を有していることを特徴とする請求項1乃至4のいずれか1つに記載の半導体発光素子。
- 前記複数の前記発光層の各々における前記ベース層の各々は、互いに組成が異なることを特徴とする請求項5に記載の半導体発光素子。
- 前記発光機能層は、前記複数の前記発光層のうち、最も前記第1の半導体層側に位置する前記発光層と前記第1の半導体層との間に、少なくとも1つの量子井戸層と複数の障壁層とからなる量子井戸構造を有する発光層を有することを特徴とする請求項5又は6に記載の半導体発光素子。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014226919A JP6457784B2 (ja) | 2014-11-07 | 2014-11-07 | 半導体発光素子 |
KR1020177012270A KR102397663B1 (ko) | 2014-11-07 | 2015-10-22 | 반도체 발광 소자 |
US15/525,057 US10056524B2 (en) | 2014-11-07 | 2015-10-22 | Semiconductor light-emitting element |
EP15858018.3A EP3217441B1 (en) | 2014-11-07 | 2015-10-22 | Semiconductor light-emitting device |
PCT/JP2015/079807 WO2016072277A1 (ja) | 2014-11-07 | 2015-10-22 | 半導体発光素子 |
CN201580060595.2A CN107004743B (zh) | 2014-11-07 | 2015-10-22 | 半导体发光元件 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2014226919A JP6457784B2 (ja) | 2014-11-07 | 2014-11-07 | 半導体発光素子 |
Publications (2)
Publication Number | Publication Date |
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JP2016092286A JP2016092286A (ja) | 2016-05-23 |
JP6457784B2 true JP6457784B2 (ja) | 2019-01-23 |
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JP2014226919A Active JP6457784B2 (ja) | 2014-11-07 | 2014-11-07 | 半導体発光素子 |
Country Status (6)
Country | Link |
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US (1) | US10056524B2 (ja) |
EP (1) | EP3217441B1 (ja) |
JP (1) | JP6457784B2 (ja) |
KR (1) | KR102397663B1 (ja) |
CN (1) | CN107004743B (ja) |
WO (1) | WO2016072277A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6433247B2 (ja) | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
JP6433248B2 (ja) | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
JP6457784B2 (ja) | 2014-11-07 | 2019-01-23 | スタンレー電気株式会社 | 半導体発光素子 |
JP6433246B2 (ja) | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
JP6651167B2 (ja) | 2015-03-23 | 2020-02-19 | スタンレー電気株式会社 | 半導体発光素子及びその製造方法 |
KR102569461B1 (ko) * | 2015-11-30 | 2023-09-04 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 이를 포함하는 조명장치 |
JP2017220586A (ja) * | 2016-06-08 | 2017-12-14 | 国立大学法人 東京大学 | 半導体発光素子 |
WO2022109797A1 (zh) * | 2020-11-24 | 2022-06-02 | 苏州晶湛半导体有限公司 | 多波长led结构及其制作方法 |
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JP6457784B2 (ja) | 2014-11-07 | 2019-01-23 | スタンレー電気株式会社 | 半導体発光素子 |
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2014
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- 2015-10-22 WO PCT/JP2015/079807 patent/WO2016072277A1/ja active Application Filing
- 2015-10-22 EP EP15858018.3A patent/EP3217441B1/en active Active
- 2015-10-22 US US15/525,057 patent/US10056524B2/en active Active
- 2015-10-22 KR KR1020177012270A patent/KR102397663B1/ko active IP Right Grant
- 2015-10-22 CN CN201580060595.2A patent/CN107004743B/zh active Active
Also Published As
Publication number | Publication date |
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WO2016072277A1 (ja) | 2016-05-12 |
CN107004743A (zh) | 2017-08-01 |
EP3217441A4 (en) | 2018-06-13 |
US20170317232A1 (en) | 2017-11-02 |
US10056524B2 (en) | 2018-08-21 |
CN107004743B (zh) | 2019-07-02 |
EP3217441B1 (en) | 2019-07-17 |
KR102397663B1 (ko) | 2022-05-13 |
JP2016092286A (ja) | 2016-05-23 |
EP3217441A1 (en) | 2017-09-13 |
KR20170080600A (ko) | 2017-07-10 |
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