JP6433248B2 - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
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- JP6433248B2 JP6433248B2 JP2014226940A JP2014226940A JP6433248B2 JP 6433248 B2 JP6433248 B2 JP 6433248B2 JP 2014226940 A JP2014226940 A JP 2014226940A JP 2014226940 A JP2014226940 A JP 2014226940A JP 6433248 B2 JP6433248 B2 JP 6433248B2
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- 239000004065 semiconductor Substances 0.000 title claims description 116
- 239000010410 layer Substances 0.000 claims description 431
- 239000000203 mixture Substances 0.000 claims description 80
- 230000004888 barrier function Effects 0.000 claims description 70
- 239000002346 layers by function Substances 0.000 claims description 21
- 230000007423 decrease Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 23
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 238000009877 rendering Methods 0.000 description 8
- 229910002704 AlGaN Inorganic materials 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- ORFSSYGWXNGVFB-UHFFFAOYSA-N sodium 4-amino-6-[[4-[4-[(8-amino-1-hydroxy-5,7-disulfonaphthalen-2-yl)diazenyl]-3-methoxyphenyl]-2-methoxyphenyl]diazenyl]-5-hydroxynaphthalene-1,3-disulfonic acid Chemical group COC1=C(C=CC(=C1)C2=CC(=C(C=C2)N=NC3=C(C4=C(C=C3)C(=CC(=C4N)S(=O)(=O)O)S(=O)(=O)O)O)OC)N=NC5=C(C6=C(C=C5)C(=CC(=C6N)S(=O)(=O)O)S(=O)(=O)O)O.[Na+] ORFSSYGWXNGVFB-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0025—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
- H01L33/145—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Description
12 n型半導体層(第1の半導体層)
13、33、53 発光機能層(発光層)
53A 発光層
14 電子ブロック層
15 p型半導体層(第2の半導体層)
BL ベース層
WA、WA1、WA2 量子井戸層
BA、BA1、BA2 障壁層
GR1、GR2 第1及び第2の溝
Claims (6)
- 第1の導電型を有する第1の半導体層と、前記第1の半導体層上に形成され、発光層を含む発光機能層と、前記発光機能層上に形成され、前記第1の半導体層とは反対の導電型を有する第2の半導体層と、を有する半導体発光素子であって、
前記発光層は、前記第1の半導体層から応力歪を受ける組成を有してランダムな網目状に区画された複数のベースセグメントを有するベース層と、前記ベース層上に形成された少なくとも1つの量子井戸層及び少なくとも1つの障壁層からなる量子井戸構造層と、を有し、
前記ベース層は、AlxGa1-xN(0≦x≦1)の組成を有し、前記少なくとも1つの障壁層は、AlyGa1-yN(0≦y<1)の組成を有し、前記組成x及び組成yは、x>yの関係を満たすことを特徴とする半導体発光素子。 - 前記第1の半導体層はGaNの組成を有し、前記少なくとも1つの量子井戸層はInGaNの組成を有することを特徴とする請求項1に記載の半導体発光素子。
- 前記量子井戸構造層は多重量子井戸構造を有し、
前記多重量子井戸構造の障壁層の各々は、前記第2の半導体層に近づくに従ってAl組成が小さくなるように形成されていることを特徴とする請求項1又は2に記載の半導体発光素子。 - 前記ベース層は、キャリアのトンネル効果を生じさせる層厚を有することを特徴とする請求項1乃至3のいずれか1つに記載の半導体発光素子。
- 前記ベース層はAlNの組成を有し、前記少なくとも1つの障壁層のうち、最も前記第2の半導体層側に位置する障壁層は、GaNの組成を有することを特徴とする請求項1乃至4のいずれか1つに記載の半導体発光素子。
- 前記発光機能層は、前記第1の半導体層と前記発光層との間に、少なくとも1つの量子井戸層及び複数の障壁層とからなる発光層を有することを特徴とする請求項1乃至5のいずれか1つに記載の半導体発光素子。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014226940A JP6433248B2 (ja) | 2014-11-07 | 2014-11-07 | 半導体発光素子 |
PCT/JP2015/079808 WO2016072278A1 (ja) | 2014-11-07 | 2015-10-22 | 半導体発光素子 |
CN201580060112.9A CN107078188B (zh) | 2014-11-07 | 2015-10-22 | 半导体发光元件 |
EP15857406.1A EP3217440B1 (en) | 2014-11-07 | 2015-10-22 | Semiconductor light-emitting element |
US15/525,054 US10062805B2 (en) | 2014-11-07 | 2015-10-22 | Semiconductor light-emitting element |
KR1020177012269A KR102397662B1 (ko) | 2014-11-07 | 2015-10-22 | 반도체 발광 소자 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014226940A JP6433248B2 (ja) | 2014-11-07 | 2014-11-07 | 半導体発光素子 |
Publications (2)
Publication Number | Publication Date |
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JP2016092287A JP2016092287A (ja) | 2016-05-23 |
JP6433248B2 true JP6433248B2 (ja) | 2018-12-05 |
Family
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JP2014226940A Active JP6433248B2 (ja) | 2014-11-07 | 2014-11-07 | 半導体発光素子 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10062805B2 (ja) |
EP (1) | EP3217440B1 (ja) |
JP (1) | JP6433248B2 (ja) |
KR (1) | KR102397662B1 (ja) |
CN (1) | CN107078188B (ja) |
WO (1) | WO2016072278A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6433246B2 (ja) | 2014-11-07 | 2018-12-05 | スタンレー電気株式会社 | 半導体発光素子 |
KR102569461B1 (ko) * | 2015-11-30 | 2023-09-04 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 이를 포함하는 조명장치 |
US10541514B2 (en) * | 2016-02-25 | 2020-01-21 | Ngk Insulators, Ltd. | Surface-emitting device, vertical external-cavity surface-emitting laser, and method for manufacturing surface-emitting device |
JP2017220586A (ja) * | 2016-06-08 | 2017-12-14 | 国立大学法人 東京大学 | 半導体発光素子 |
CN115732604A (zh) * | 2021-08-27 | 2023-03-03 | 无锡晶湛半导体有限公司 | Led结构及其制备方法 |
CN113964246B (zh) * | 2021-09-28 | 2024-05-31 | 厦门士兰明镓化合物半导体有限公司 | 发光二极管的外延结构及其制造方法 |
CN114038954A (zh) * | 2021-09-28 | 2022-02-11 | 厦门士兰明镓化合物半导体有限公司 | 发光二极管的外延结构及其制造方法 |
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2014
- 2014-11-07 JP JP2014226940A patent/JP6433248B2/ja active Active
-
2015
- 2015-10-22 KR KR1020177012269A patent/KR102397662B1/ko active IP Right Grant
- 2015-10-22 US US15/525,054 patent/US10062805B2/en active Active
- 2015-10-22 EP EP15857406.1A patent/EP3217440B1/en active Active
- 2015-10-22 CN CN201580060112.9A patent/CN107078188B/zh active Active
- 2015-10-22 WO PCT/JP2015/079808 patent/WO2016072278A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP3217440A1 (en) | 2017-09-13 |
KR102397662B1 (ko) | 2022-05-13 |
EP3217440B1 (en) | 2020-03-11 |
WO2016072278A1 (ja) | 2016-05-12 |
US10062805B2 (en) | 2018-08-28 |
CN107078188A (zh) | 2017-08-18 |
EP3217440A4 (en) | 2018-06-13 |
US20180033911A1 (en) | 2018-02-01 |
JP2016092287A (ja) | 2016-05-23 |
KR20170080599A (ko) | 2017-07-10 |
CN107078188B (zh) | 2019-07-16 |
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