JP2011017069A - 成形回路部品の製造方法 - Google Patents
成形回路部品の製造方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
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Abstract
【解決手段】基体1を成形する第1工程と、第1のレーザー光2を照射してこの基体の表面、またはこの表面のうち回路となる部分1aのみのいずれかを粗化する第2工程と、
この基体の表面に触媒3を付与する第3工程と、この基体を乾燥させる第4工程と、非回路となる部分1bに第2のレーザー光4を照射して、この非回路となる部分の触媒の機能を低下または消失させる第5工程と、この回路部分となる部分に無電解めっきを施す第6工程とを備える。
【選択図】 図1
Description
1a、101a〜301a 回路となる部分
1b、101b〜301b 非回路となる部分
101c、301c 境界
1e オーバーラップ
2、102〜302 第1のレーザー光
3、103〜303 触媒
4、104〜304 第2のレーザー光
5、105〜305 無電解めっき
106、306 電解めっき
Claims (5)
- 絶縁材からなる基体を成形する第1工程と、
第1のレーザー光を照射して上記基体の表面、またはこの表面のうち回路となる部分のみのいずれかを粗化する第2工程と、
上記基体を触媒液に浸漬して、この基体の表面に無電解めっきのための触媒を付与する第3工程と、
上記基体の表面を乾燥させて、上記触媒をこの基体の表面に定着させる第4工程と、
上記基体の表面であって非回路となる部分に第2のレーザー光を照射して、この非回路となる部分に定着した上記触媒の機能を低下または消失させる第5工程と、
上記基体の表面であって上記回路となる部分に無電解めっきを施す第6工程とを備える
ことを特徴とする成形回路部品の製造方法。 - 絶縁材からなる基体を成形する第1工程と、
第1のレーザー光を照射して上記基体の表面、またはこの表面のうち回路となる部分のみのいずれかを粗化する第2工程と、
上記基体を触媒液に浸漬して、この基体の表面に無電解めっきのための触媒を付与する第3工程と、
上記基体の表面を乾燥させて、上記触媒をこの基体の表面に定着させる第4工程と、
上記基体の表面であって上記回路となる部分と非回路となる部分との境界に第2のレーザー光を照射して、この境界に定着した上記触媒の機能を低下または消失させる第5工程と、
上記基体の表面であって上記回路となる部分と非回路となる部分とに無電解めっきを施す第6工程と、
上記基体の表面であって上記回路となる部分の無電解めっきの表面に電解めっきを施す第7工程と、
上記基体の表面であって上記非回路となる部分の無電解めっきをエッチングによって除去する第8工程とを備える
ことを特徴とする成形回路部品の製造方法。 - 絶縁材からなる基体を成形する第1工程と、
第1のレーザー光を照射して上記基体の表面、またはこの表面のうち回路となる部分のみのいずれかを粗化する第2工程と、
上記基体を触媒液に浸漬して、この基体の表面に無電解めっきのための触媒を付与する第3工程と、
上記基体の表面に無電解めっきを施す第4工程と、
上記基体の表面であって非回路となる部分に第2のレーザー光を照射して、この非回路となる部分の上記無電解めっきを除去する第5工程とを備える
ことを特徴とする成形回路部品の製造方法。 - 絶縁材からなる基体を成形する第1工程と、
第1のレーザー光を照射して上記基体の表面、またはこの表面のうち回路となる部分のみのいずれかを粗化する第2工程と、
上記基体を触媒液に浸漬して、この基体の表面に無電解めっきのための触媒を付与する第3工程と、
上記基体の表面に無電解めっきを施す第4工程と、
上記基体の表面であって上記回路となる部分と非回路となる部分との境界に第2のレーザー光を照射して、この境界に施された上記無電解めっきを除去する第5工程と、
上記基体の表面であって上記回路となる部分の無電解めっきの表面に電解めっきを施す第6工程と、
上記基体の表面であって上記非回路となる部分の無電解めっきをエッチングによって除去する第7工程とを備える
ことを特徴とする成形回路部品の製造方法。 - 請求項1乃至4のいずれかの1において、上記第2の工程では、上記第1のレーザー光を照射して上記基体の表面のうち回路となる部分のみを粗化し、
上記第5の工程では、上記回路となる部分の周縁から、この回路となる部分の内側に向かって所定の幅分だけオーバーラップするように上記第2のレーザーを照射する
ことを特徴とする成形回路部品の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009164028A JP4996653B2 (ja) | 2009-07-10 | 2009-07-10 | 成形回路部品の製造方法 |
US13/382,085 US20120107522A1 (en) | 2009-07-10 | 2010-07-06 | Method for producing formed circuit component |
CN2010800309246A CN102471889B (zh) | 2009-07-10 | 2010-07-06 | 成型电路部件的制造方法 |
PCT/JP2010/061434 WO2011004802A1 (ja) | 2009-07-10 | 2010-07-06 | 成形回路部品の製造方法 |
EP10797113.7A EP2453040B1 (en) | 2009-07-10 | 2010-07-06 | Method for producing formed circuit component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009164028A JP4996653B2 (ja) | 2009-07-10 | 2009-07-10 | 成形回路部品の製造方法 |
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Publication Number | Publication Date |
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JP2011017069A true JP2011017069A (ja) | 2011-01-27 |
JP4996653B2 JP4996653B2 (ja) | 2012-08-08 |
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JP2009164028A Expired - Fee Related JP4996653B2 (ja) | 2009-07-10 | 2009-07-10 | 成形回路部品の製造方法 |
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Country | Link |
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US (1) | US20120107522A1 (ja) |
EP (1) | EP2453040B1 (ja) |
JP (1) | JP4996653B2 (ja) |
CN (1) | CN102471889B (ja) |
WO (1) | WO2011004802A1 (ja) |
Cited By (14)
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JP2014506737A (ja) * | 2011-02-25 | 2014-03-17 | タイワン グリーン ポイント エンタープライジーズ カンパニー リミテッド | 非導電性基板の表面上に連続導電性回路を作製するための無害技法 |
JP2013151158A (ja) * | 2012-01-24 | 2013-08-08 | Taiwan Green Point Enterprises Co Ltd | 封止型電子装置の製造方法及び封止型電子装置 |
KR101453492B1 (ko) * | 2012-11-26 | 2014-10-23 | 양묘근 | 회로패턴 구현방법 |
KR101513292B1 (ko) * | 2013-03-21 | 2015-04-16 | (주)파트론 | 도체 패턴 형성방법 |
KR101513293B1 (ko) * | 2013-05-15 | 2015-04-16 | (주)파트론 | 도체 패턴 형성 방법 |
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US9275868B2 (en) | 2013-07-19 | 2016-03-01 | Globalfoundries Inc. | Uniform roughness on backside of a wafer |
CN105637594A (zh) * | 2013-11-29 | 2016-06-01 | Lg化学株式会社 | 用于形成导电图案的组合物、使用该组合物形成导电图案的方法以及具有导电图案的树脂结构 |
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US9659682B2 (en) | 2013-11-29 | 2017-05-23 | Lg Chem, Ltd. | Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon |
WO2016152938A1 (ja) * | 2015-03-24 | 2016-09-29 | オーエム産業株式会社 | めっき品の製造方法 |
JPWO2016152938A1 (ja) * | 2015-03-24 | 2017-10-12 | オーエム産業株式会社 | めっき品の製造方法 |
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KR102461819B1 (ko) * | 2016-04-27 | 2022-11-01 | 맥셀 주식회사 | 삼차원 성형 회로 부품 |
JP2018103559A (ja) * | 2016-12-28 | 2018-07-05 | エスアイアイ・プリンテック株式会社 | 溝構造のめっき方法 |
JP2018115355A (ja) * | 2017-01-17 | 2018-07-26 | マクセルホールディングス株式会社 | メッキ部品の製造方法及びメッキ部品 |
WO2018135479A1 (ja) * | 2017-01-17 | 2018-07-26 | マクセルホールディングス株式会社 | メッキ部品の製造方法及びメッキ部品 |
JP2020017583A (ja) * | 2018-07-24 | 2020-01-30 | スタンレー電気株式会社 | 配線付基板、および、その製造方法 |
JP7474360B2 (ja) | 2019-03-15 | 2024-04-24 | マクセル株式会社 | メッキ部品の製造方法及び基材の成形に用いられる金型 |
Also Published As
Publication number | Publication date |
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EP2453040A1 (en) | 2012-05-16 |
CN102471889A (zh) | 2012-05-23 |
EP2453040A4 (en) | 2013-02-27 |
JP4996653B2 (ja) | 2012-08-08 |
EP2453040B1 (en) | 2014-04-30 |
US20120107522A1 (en) | 2012-05-03 |
CN102471889B (zh) | 2013-11-06 |
WO2011004802A1 (ja) | 2011-01-13 |
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