JP2011009686A - パッケージ基板及びその製造方法、並びにその基材 - Google Patents

パッケージ基板及びその製造方法、並びにその基材 Download PDF

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Publication number
JP2011009686A
JP2011009686A JP2009263132A JP2009263132A JP2011009686A JP 2011009686 A JP2011009686 A JP 2011009686A JP 2009263132 A JP2009263132 A JP 2009263132A JP 2009263132 A JP2009263132 A JP 2009263132A JP 2011009686 A JP2011009686 A JP 2011009686A
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Japan
Prior art keywords
layer
metal
layers
auxiliary dielectric
dielectric layer
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Pending
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JP2009263132A
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English (en)
Japanese (ja)
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JP2011009686A5 (enExample
Inventor
Chin-Ming Liu
▲謹▼銘 劉
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Unimicron Technology Corp
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Unimicron Technology Corp
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Publication of JP2011009686A publication Critical patent/JP2011009686A/ja
Publication of JP2011009686A5 publication Critical patent/JP2011009686A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H10W70/655—
    • H10W72/884—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2009263132A 2009-06-23 2009-11-18 パッケージ基板及びその製造方法、並びにその基材 Pending JP2011009686A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098120959A TWI390692B (zh) 2009-06-23 2009-06-23 封裝基板與其製法暨基材

Related Child Applications (1)

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JP2013225193A Division JP2014017531A (ja) 2009-06-23 2013-10-30 パッケージ基板及びその製造方法、並びにその基材

Publications (2)

Publication Number Publication Date
JP2011009686A true JP2011009686A (ja) 2011-01-13
JP2011009686A5 JP2011009686A5 (enExample) 2013-01-10

Family

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JP2009263132A Pending JP2011009686A (ja) 2009-06-23 2009-11-18 パッケージ基板及びその製造方法、並びにその基材
JP2013225193A Pending JP2014017531A (ja) 2009-06-23 2013-10-30 パッケージ基板及びその製造方法、並びにその基材

Family Applications After (1)

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JP2013225193A Pending JP2014017531A (ja) 2009-06-23 2013-10-30 パッケージ基板及びその製造方法、並びにその基材

Country Status (3)

Country Link
US (2) US8354598B2 (enExample)
JP (2) JP2011009686A (enExample)
TW (1) TWI390692B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035756A (zh) * 2011-10-08 2013-04-10 威奈联合科技股份有限公司 光电元件及其制造方法
JP2013128000A (ja) * 2011-12-16 2013-06-27 Advance Materials Corp パッケージ基板及びその製造方法
WO2014054803A1 (ja) * 2012-10-04 2014-04-10 Jx日鉱日石金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP2014082489A (ja) * 2012-09-28 2014-05-08 Hitachi Chemical Co Ltd 多層配線基板の製造方法
JP2014123772A (ja) * 2014-03-17 2014-07-03 Advance Materials Corp パッケージ基板
US11640934B2 (en) * 2018-03-30 2023-05-02 Intel Corporation Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate

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JP5003812B2 (ja) * 2009-12-10 2012-08-15 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
US20110253439A1 (en) * 2010-04-20 2011-10-20 Subtron Technology Co. Ltd. Circuit substrate and manufacturing method thereof
JP5590985B2 (ja) * 2010-06-21 2014-09-17 新光電気工業株式会社 半導体装置及びその製造方法
US20120055706A1 (en) * 2010-09-03 2012-03-08 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
TW201241969A (en) 2011-04-08 2012-10-16 Unimicron Technology Corp Method for fabricating heat dissipation substrate
TWI453872B (zh) * 2011-06-23 2014-09-21 矽品精密工業股份有限公司 半導體封裝件及其製法
CN102956575A (zh) * 2011-08-24 2013-03-06 国碁电子(中山)有限公司 封装结构及制造方法
US9230899B2 (en) 2011-09-30 2016-01-05 Unimicron Technology Corporation Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
CN103066048B (zh) * 2011-10-21 2015-11-25 欣兴电子股份有限公司 具有支撑体的封装基板、封装结构及其制法
CN103066049B (zh) * 2011-10-24 2015-09-02 联致科技股份有限公司 封装基板及其制法
TWI560835B (en) * 2011-11-07 2016-12-01 Siliconware Precision Industries Co Ltd Package substrate and fabrication method thereof
CN103137568B (zh) * 2011-12-02 2017-05-03 欣兴电子股份有限公司 具有支撑体的封装基板及其制法
TWI444123B (zh) * 2012-02-16 2014-07-01 威盛電子股份有限公司 線路板製作方法及線路板
TWI484600B (zh) * 2012-08-15 2015-05-11 Unimicron Technology Corp 無核心封裝基板及其製法
CN103681586B (zh) * 2012-08-30 2016-07-06 欣兴电子股份有限公司 无核心封装基板及其制法
KR101980993B1 (ko) * 2012-10-04 2019-05-21 제이엑스금속주식회사 다층 프린트 배선 기판의 제조 방법 및 베이스 기재
JP2014075515A (ja) * 2012-10-05 2014-04-24 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
JP2014086651A (ja) * 2012-10-26 2014-05-12 Ibiden Co Ltd プリント配線板及びプリント配線板の製造方法
JP2014127623A (ja) 2012-12-27 2014-07-07 Shinko Electric Ind Co Ltd 配線基板及び配線基板の製造方法
JP2014130856A (ja) * 2012-12-28 2014-07-10 Kyocer Slc Technologies Corp 配線基板の製造方法
JP6478309B2 (ja) 2012-12-31 2019-03-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． 多層基板及び多層基板の製造方法
US8659173B1 (en) * 2013-01-04 2014-02-25 International Business Machines Corporation Isolated wire structures with reduced stress, methods of manufacturing and design structures
US9275925B2 (en) 2013-03-12 2016-03-01 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for an improved interconnect structure
US10464836B2 (en) 2013-10-10 2019-11-05 Medtronic, Inc. Hermetic conductive feedthroughs for a semiconductor wafer
CN104576596B (zh) * 2013-10-25 2019-01-01 日月光半导体制造股份有限公司 半导体基板及其制造方法
US9609751B2 (en) * 2014-04-11 2017-03-28 Qualcomm Incorporated Package substrate comprising surface interconnect and cavity comprising electroless fill
TWI529883B (zh) * 2014-05-09 2016-04-11 矽品精密工業股份有限公司 封裝堆疊結構及其製法暨無核心層式封裝基板及其製法
CN204014250U (zh) * 2014-05-16 2014-12-10 奥特斯(中国)有限公司 用于生产电子元件的连接系统的半成品
US9603247B2 (en) * 2014-08-11 2017-03-21 Intel Corporation Electronic package with narrow-factor via including finish layer
TWI576025B (zh) * 2014-10-29 2017-03-21 矽品精密工業股份有限公司 基板結構及其製法
JP6615701B2 (ja) * 2016-06-24 2019-12-04 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US10515888B2 (en) 2017-09-18 2019-12-24 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for manufacturing the same
TWI693874B (zh) * 2018-06-08 2020-05-11 欣興電子股份有限公司 線路載板結構及其製作方法
US11637060B2 (en) 2019-07-18 2023-04-25 Unimicron Technology Corp. Wiring board and method of manufacturing the same
TWI751506B (zh) * 2020-03-06 2022-01-01 欣興電子股份有限公司 線路板及其製造方法
DE102020131125A1 (de) * 2020-04-29 2021-11-04 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleiterpaket und Verfahren zum Herstellen desselben

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JP2002026171A (ja) * 2000-07-06 2002-01-25 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
JP2004186265A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
JP2004214272A (ja) * 2002-12-27 2004-07-29 Ngk Spark Plug Co Ltd 片面積層配線基板の製造方法
JP2006080214A (ja) * 2004-09-08 2006-03-23 Cmk Corp プリント配線板とその製造方法
WO2009037939A1 (ja) * 2007-09-20 2009-03-26 Ibiden Co., Ltd. プリント配線板及びその製造方法
JP2009088429A (ja) * 2007-10-03 2009-04-23 Nec Toppan Circuit Solutions Inc 印刷配線板及びその製造方法ならびに半導体装置

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JP2002026171A (ja) * 2000-07-06 2002-01-25 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
JP2004186265A (ja) * 2002-11-29 2004-07-02 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
JP2004214272A (ja) * 2002-12-27 2004-07-29 Ngk Spark Plug Co Ltd 片面積層配線基板の製造方法
JP2006080214A (ja) * 2004-09-08 2006-03-23 Cmk Corp プリント配線板とその製造方法
WO2009037939A1 (ja) * 2007-09-20 2009-03-26 Ibiden Co., Ltd. プリント配線板及びその製造方法
JP2009088429A (ja) * 2007-10-03 2009-04-23 Nec Toppan Circuit Solutions Inc 印刷配線板及びその製造方法ならびに半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035756A (zh) * 2011-10-08 2013-04-10 威奈联合科技股份有限公司 光电元件及其制造方法
JP2013128000A (ja) * 2011-12-16 2013-06-27 Advance Materials Corp パッケージ基板及びその製造方法
JP2014082489A (ja) * 2012-09-28 2014-05-08 Hitachi Chemical Co Ltd 多層配線基板の製造方法
WO2014054803A1 (ja) * 2012-10-04 2014-04-10 Jx日鉱日石金属株式会社 多層プリント配線基板の製造方法及びベース基材
JP2014123772A (ja) * 2014-03-17 2014-07-03 Advance Materials Corp パッケージ基板
US11640934B2 (en) * 2018-03-30 2023-05-02 Intel Corporation Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate

Also Published As

Publication number Publication date
US8354598B2 (en) 2013-01-15
TW201101441A (en) 2011-01-01
JP2014017531A (ja) 2014-01-30
TWI390692B (zh) 2013-03-21
US20100319966A1 (en) 2010-12-23
US20130118680A1 (en) 2013-05-16

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