TWI390692B - 封裝基板與其製法暨基材 - Google Patents

封裝基板與其製法暨基材 Download PDF

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Publication number
TWI390692B
TWI390692B TW098120959A TW98120959A TWI390692B TW I390692 B TWI390692 B TW I390692B TW 098120959 A TW098120959 A TW 098120959A TW 98120959 A TW98120959 A TW 98120959A TW I390692 B TWI390692 B TW I390692B
Authority
TW
Taiwan
Prior art keywords
layer
metal
dielectric layer
auxiliary dielectric
layers
Prior art date
Application number
TW098120959A
Other languages
English (en)
Chinese (zh)
Other versions
TW201101441A (en
Inventor
劉謹銘
Original Assignee
欣興電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 欣興電子股份有限公司 filed Critical 欣興電子股份有限公司
Priority to TW098120959A priority Critical patent/TWI390692B/zh
Priority to JP2009263132A priority patent/JP2011009686A/ja
Priority to US12/731,480 priority patent/US8354598B2/en
Publication of TW201101441A publication Critical patent/TW201101441A/zh
Priority to US13/738,526 priority patent/US20130118680A1/en
Application granted granted Critical
Publication of TWI390692B publication Critical patent/TWI390692B/zh
Priority to JP2013225193A priority patent/JP2014017531A/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H10W70/655—
    • H10W72/884—
    • H10W72/90—
    • H10W72/923—
    • H10W72/9415—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW098120959A 2009-06-23 2009-06-23 封裝基板與其製法暨基材 TWI390692B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW098120959A TWI390692B (zh) 2009-06-23 2009-06-23 封裝基板與其製法暨基材
JP2009263132A JP2011009686A (ja) 2009-06-23 2009-11-18 パッケージ基板及びその製造方法、並びにその基材
US12/731,480 US8354598B2 (en) 2009-06-23 2010-03-25 Packaging substrate and fabrication method thereof
US13/738,526 US20130118680A1 (en) 2009-06-23 2013-01-10 Method for fabricating a packaging substrate
JP2013225193A JP2014017531A (ja) 2009-06-23 2013-10-30 パッケージ基板及びその製造方法、並びにその基材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098120959A TWI390692B (zh) 2009-06-23 2009-06-23 封裝基板與其製法暨基材

Publications (2)

Publication Number Publication Date
TW201101441A TW201101441A (en) 2011-01-01
TWI390692B true TWI390692B (zh) 2013-03-21

Family

ID=43353307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098120959A TWI390692B (zh) 2009-06-23 2009-06-23 封裝基板與其製法暨基材

Country Status (3)

Country Link
US (2) US8354598B2 (enExample)
JP (2) JP2011009686A (enExample)
TW (1) TWI390692B (enExample)

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TWI576025B (zh) * 2014-10-29 2017-03-21 矽品精密工業股份有限公司 基板結構及其製法

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TWI453872B (zh) * 2011-06-23 2014-09-21 矽品精密工業股份有限公司 半導體封裝件及其製法
CN102956575A (zh) * 2011-08-24 2013-03-06 国碁电子(中山)有限公司 封装结构及制造方法
US9230899B2 (en) 2011-09-30 2016-01-05 Unimicron Technology Corporation Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
CN103035756A (zh) * 2011-10-08 2013-04-10 威奈联合科技股份有限公司 光电元件及其制造方法
CN103066048B (zh) * 2011-10-21 2015-11-25 欣兴电子股份有限公司 具有支撑体的封装基板、封装结构及其制法
CN103066049B (zh) * 2011-10-24 2015-09-02 联致科技股份有限公司 封装基板及其制法
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JP5536748B2 (ja) * 2011-12-16 2014-07-02 聯致科技股▲フン▼有限公司 パッケージ基板の製造方法
TWI444123B (zh) * 2012-02-16 2014-07-01 威盛電子股份有限公司 線路板製作方法及線路板
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JP6478309B2 (ja) 2012-12-31 2019-03-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． 多層基板及び多層基板の製造方法
US8659173B1 (en) * 2013-01-04 2014-02-25 International Business Machines Corporation Isolated wire structures with reduced stress, methods of manufacturing and design structures
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CN104576596B (zh) * 2013-10-25 2019-01-01 日月光半导体制造股份有限公司 半导体基板及其制造方法
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TWI529883B (zh) * 2014-05-09 2016-04-11 矽品精密工業股份有限公司 封裝堆疊結構及其製法暨無核心層式封裝基板及其製法
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Publication number Priority date Publication date Assignee Title
TWI576025B (zh) * 2014-10-29 2017-03-21 矽品精密工業股份有限公司 基板結構及其製法

Also Published As

Publication number Publication date
US8354598B2 (en) 2013-01-15
TW201101441A (en) 2011-01-01
JP2014017531A (ja) 2014-01-30
JP2011009686A (ja) 2011-01-13
US20100319966A1 (en) 2010-12-23
US20130118680A1 (en) 2013-05-16

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