JP2010521806A - 垂直外部共振器形面発光レーザ、及び、その発光部品を製造する方法 - Google Patents
垂直外部共振器形面発光レーザ、及び、その発光部品を製造する方法 Download PDFInfo
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18305—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] with emission through the substrate, i.e. bottom emission
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04256—Electrodes, e.g. characterised by the structure characterised by the configuration
- H01S5/04257—Electrodes, e.g. characterised by the structure characterised by the configuration having positive and negative electrodes on the same side of the substrate
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
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- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
- H01S3/108—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using non-linear optical devices, e.g. exhibiting Brillouin or Raman scattering
- H01S3/109—Frequency multiplication, e.g. harmonic generation
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
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- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0217—Removal of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
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Abstract
Description
ケース1:金属層を介しての接触:ドープ層の厚さ100〜1000nm,p-type 10E18〜10E20cm-3,n-type 10E17〜10E18cm-3
ケース2:ドープ層を介しての接触:ドープ層の厚さ100〜1000nm,p-type 10E19〜10E20cm-3,n-type 10E17〜10E18cm-3
ケース3:ドープ層を介しての接触,金属層無:ドープ層の厚さ500〜5000nm,p-type 10E19〜10E20cm-3,n-type 10E17〜10E18 cm-3
2 積層部
3 下部のDBR
4 活性化領域
5 上部のDBR
6 支持基板
7 メタライズ層
8 ガラス基板
9 発光部品
10 ヒートシンク
11 外部ミラー
12 周波数倍増結晶
13 pドープ電流注入層
14 p接触
15 n接触
16 統合レンズ
Claims (19)
- 外部共振器の第1の端部ミラーを形成する外部ミラーと、
前記外部共振器の第2の端部ミラーを形成する、レーザ発生波長に対する分布ブラッグ反射器(DBR;distributed Bragg reflector)と、
前記分布ブラッグ反射器の内側に設けられる、発光のための活性化領域と、
前記活性化領域及び前記分布ブラッグ反射器が少なくとも自身の一部を形成する積層部に取り付けられる、前記外部共振器の内部の光学的に透明な基板と、
前記分布ブラッグ反射器の外側で前記積層部に取り付けられるヒートシンクとを少なくとも有し、
電流注入層が、前記活性化領域と前記光学的に透明な基板との間に挟まれ、レーザ動作を可能にするように設計され又は設けられる、垂直外部共振器形面発光レーザ(VECSEL; vertical extended cavity surface emission laser)。 - 追加の金属層が、前記電流注入層と前記透明な基板との間に挟まれる、請求項1に記載の垂直外部共振器形面発光レーザ。
- 追加の分布ブラッグ反射器が、前記活性化領域と前記電流注入層との間に挟まれ、前記第2の端部ミラーを形成する前記分布ブラッグ反射器の反射率よりもレーザ発生波長に対して低い反射率をもち、
前記追加の分布ブラッグ反射器は、4〜13対の層で形成される、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。 - 前記透明な基板は、前記第2の端部ミラーを形成する前記分布ブラッグ反射器の反射率よりもレーザ発生波長に対して低い反射率を伴うダイクロイックのコーティングを有する、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。
- 前記光学的に透明な基板は、ガラス基板である、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。
- 他の光学部品が、前記外部ミラーと前記透明な基板との間の前記外部共振器の内部に設けられる、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。
- 前記第2の端部ミラーを形成する前記分布ブラッグ反射器は、20よりも多い対の層で形成される、請求項3に記載の垂直外部共振器形面発光レーザ。
- 前記金属層は、前記活性化領域における電流分布、及び/又は、レーザの光学的挙動に影響を与えるように構造化される、請求項2に記載の垂直外部共振器形面発光レーザ。
- 前記金属層は、外部共振器内に形成するレーザ放射の定常波のノードに設けられる、請求項2に記載の垂直外部共振器形面発光レーザ。
- 前記ヒートシンクは、前記積層部に電気的に接触するための導体構造を有する、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。
- 前記透明な基板は、光学機能を実行するように設計される、特に、偏光子、レンズ又は周波数倍増結晶を形成するように設計される、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。
- 前記透明な基板は、少なくとも幾つかが異なる光学機能を有する複数の異なる材料層のサンドイッチで形成される、請求項1又は請求項2に記載の垂直外部共振器形面発光レーザ。
- 垂直外部共振器形面発光レーザ(VECSEL; vertical extended cavity surface emission laser)の発光部品を製造する方法であって、
発光のための活性化領域、上部の分布ブラッグ反射器を形成する上部層シーケンス、及び、半導体基板と前記活性化領域との間に挟まれたn又はpドープ電流注入層を形成する少なくとも複数の層を有する積層部を、前記半導体基板上にエピタキシャルに成長させるステップと、
機械的サポート又はサブマウントを前記積層部の上側に取り付けるステップと、
前記半導体基板を除去するステップと、
光学的に透明な基板を前記積層部の下側に接合させるステップとを少なくとも有する、方法。 - メタライズ層は、前記半導体基板を除去するステップと光学的に透明な基板を前記積層部の下側に接合させるステップとの間において、前記積層部の下側に堆積される、請求項13に記載の方法。
- エピタキシャルに成長された前記積層部は、前記活性化領域と前記n又はpドープ電流注入層との間に下部の分布ブラッグ反射器を形成する下部層シーケンスを有する、請求項13又は請求項14に記載の方法。
- 前記機械的サポートは、前記積層部の上側に接合され、前記光学的に透明な基板を前記積層部の下側に接合させるステップの後に除去される、請求項13又は請求項14に記載の方法。
- 前記サブマウントは、前記積層部の上側に接合又ははんだ付けされる、請求項13又は請求項14に記載の方法。
- 前記メタライズ層は、光伝送のためのホールを提供するために、及び/又は、偏光子若しくはモデル制御のような追加の光学機能性を提供するために、構造化される、請求項14に記載の方法。
- 前記半導体基板は、ウエハー基板であり、
前記積層部は、前記ウエハー基板に複数の垂直発光ダイオードを並べて形成するためにエピタキシャルに成長され、前記光学的に透明な基板の結合の後に、生ずる基板及び前記積層部が、各部品が1又は幾つかの発光ダイオードを有する単一の部品に切断される、請求項13又は請求項14に記載の方法。
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EP07104291 | 2007-03-16 | ||
EP07104291.5 | 2007-03-16 | ||
PCT/IB2008/050859 WO2008114160A1 (en) | 2007-03-16 | 2008-03-10 | Vertical extended cavity surface emission laser and method for manufacturing a light emitting component of the same |
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JP2010521806A true JP2010521806A (ja) | 2010-06-24 |
JP2010521806A5 JP2010521806A5 (ja) | 2011-04-28 |
JP4927178B2 JP4927178B2 (ja) | 2012-05-09 |
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US (1) | US8023547B2 (ja) |
EP (1) | EP2127046B1 (ja) |
JP (1) | JP4927178B2 (ja) |
CN (1) | CN101636887B (ja) |
AT (1) | ATE487256T1 (ja) |
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US8023547B2 (en) | 2011-09-20 |
DE602008003316D1 (de) | 2010-12-16 |
CN101636887A (zh) | 2010-01-27 |
JP4927178B2 (ja) | 2012-05-09 |
EP2127046A1 (en) | 2009-12-02 |
CN101636887B (zh) | 2012-10-10 |
US20100195690A1 (en) | 2010-08-05 |
ATE487256T1 (de) | 2010-11-15 |
WO2008114160A1 (en) | 2008-09-25 |
EP2127046B1 (en) | 2010-11-03 |
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