JP2010517298A5 - - Google Patents

Download PDF

Info

Publication number
JP2010517298A5
JP2010517298A5 JP2009547307A JP2009547307A JP2010517298A5 JP 2010517298 A5 JP2010517298 A5 JP 2010517298A5 JP 2009547307 A JP2009547307 A JP 2009547307A JP 2009547307 A JP2009547307 A JP 2009547307A JP 2010517298 A5 JP2010517298 A5 JP 2010517298A5
Authority
JP
Japan
Prior art keywords
strained
strained layer
layer
thickness
single crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009547307A
Other languages
English (en)
Japanese (ja)
Other versions
JP5730484B2 (ja
JP2010517298A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/001003 external-priority patent/WO2008094464A2/en
Publication of JP2010517298A publication Critical patent/JP2010517298A/ja
Publication of JP2010517298A5 publication Critical patent/JP2010517298A5/ja
Application granted granted Critical
Publication of JP5730484B2 publication Critical patent/JP5730484B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009547307A 2007-01-26 2008-01-25 厚みのある擬似格子整合型の窒化物エピタキシャル層 Active JP5730484B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US89757207P 2007-01-26 2007-01-26
US60/897,572 2007-01-26
PCT/US2008/001003 WO2008094464A2 (en) 2007-01-26 2008-01-25 Thick pseudomorphic nitride epitaxial layers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015079162A Division JP2015167231A (ja) 2007-01-26 2015-04-08 厚みのある擬似格子整合型の窒化物エピタキシャル層

Publications (3)

Publication Number Publication Date
JP2010517298A JP2010517298A (ja) 2010-05-20
JP2010517298A5 true JP2010517298A5 (OSRAM) 2014-12-04
JP5730484B2 JP5730484B2 (ja) 2015-06-10

Family

ID=39473776

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009547307A Active JP5730484B2 (ja) 2007-01-26 2008-01-25 厚みのある擬似格子整合型の窒化物エピタキシャル層
JP2015079162A Pending JP2015167231A (ja) 2007-01-26 2015-04-08 厚みのある擬似格子整合型の窒化物エピタキシャル層

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015079162A Pending JP2015167231A (ja) 2007-01-26 2015-04-08 厚みのある擬似格子整合型の窒化物エピタキシャル層

Country Status (4)

Country Link
US (1) US9437430B2 (OSRAM)
JP (2) JP5730484B2 (OSRAM)
CN (1) CN101652832B (OSRAM)
WO (1) WO2008094464A2 (OSRAM)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8545629B2 (en) 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US20060005763A1 (en) 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
EP1885918B1 (en) * 2005-05-11 2017-01-25 North Carolina State University Methods of preparing controlled polarity group iii-nitride films
US7641735B2 (en) 2005-12-02 2010-01-05 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
US9034103B2 (en) 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
CN101454487B (zh) 2006-03-30 2013-01-23 晶体公司 氮化铝块状晶体的可控掺杂方法
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
CN107059116B (zh) 2007-01-17 2019-12-31 晶体公司 引晶的氮化铝晶体生长中的缺陷减少
US9437430B2 (en) 2007-01-26 2016-09-06 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US8080833B2 (en) 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US20080277686A1 (en) * 2007-05-08 2008-11-13 Huga Optotech Inc. Light emitting device and method for making the same
US8088220B2 (en) 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
US20090250626A1 (en) * 2008-04-04 2009-10-08 Hexatech, Inc. Liquid sanitization device
US7915178B2 (en) 2008-07-30 2011-03-29 North Carolina State University Passivation of aluminum nitride substrates
JP2011071356A (ja) * 2009-09-26 2011-04-07 Sanken Electric Co Ltd 半導体装置
WO2011109754A1 (en) * 2010-03-04 2011-09-09 The Regents Of The University Of California Semi-polar iii-nitride optoelectronic devices on m-plane substrates with miscuts less than +/-15 degrees in the c-direction
US10472229B2 (en) 2010-03-05 2019-11-12 Cornell University—Cornell Center for Technology Monocrystalline epitaxially aligned nanostructures and related methods
TWI442455B (zh) * 2010-03-29 2014-06-21 Soitec Silicon On Insulator Iii-v族半導體結構及其形成方法
CN103038400B (zh) 2010-06-30 2016-06-22 晶体公司 使用热梯度控制的大块氮化铝单晶的生长
JP5319628B2 (ja) * 2010-08-26 2013-10-16 シャープ株式会社 窒化物半導体素子および半導体光学装置
CN102140680A (zh) * 2011-05-10 2011-08-03 青岛铝镓光电半导体有限公司 氮化镓单晶的制备方法
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
US8379684B1 (en) * 2011-08-16 2013-02-19 Corning Incorporated Hole blocking layers in non-polar and semi-polar green light emitting devices
US9064980B2 (en) * 2011-08-25 2015-06-23 Palo Alto Research Center Incorporated Devices having removed aluminum nitride sections
US9252329B2 (en) * 2011-10-04 2016-02-02 Palo Alto Research Center Incorporated Ultraviolet light emitting devices having compressively strained light emitting layer for enhanced light extraction
JP2013128103A (ja) * 2011-11-17 2013-06-27 Sanken Electric Co Ltd 窒化物半導体装置及び窒化物半導体装置の製造方法
WO2014031119A1 (en) 2012-08-23 2014-02-27 National University Corporation Tokyo University Of Agriculture And Technology Highly transparent aluminum nitride single crystalline layers and devices made therefrom
JP6328557B2 (ja) 2012-09-11 2018-05-23 株式会社トクヤマ 窒化アルミニウム基板およびiii族窒化物積層体
JP2016511938A (ja) 2013-01-29 2016-04-21 ヘクサテック,インコーポレイテッド 単結晶窒化アルミニウム基板を組み込む光電子デバイス
CN103117209B (zh) * 2013-02-01 2015-05-13 中山大学 一种渐变AlGaN层的制备方法及采用该方法得到的器件
US20160005919A1 (en) * 2013-02-05 2016-01-07 Tokuyama Corporation Nitride semiconductor light emitting device
US9385198B2 (en) * 2013-03-12 2016-07-05 Taiwan Semiconductor Manufacturing Company, Ltd. Heterostructures for semiconductor devices and methods of forming the same
WO2014159954A1 (en) * 2013-03-14 2014-10-02 Hexatech, Inc. Power semiconductor devices incorporating single crystalline aluminum nitride substrate
CN105144345B (zh) * 2013-03-15 2018-05-08 晶体公司 与赝配电子和光电器件的平面接触
JP6318474B2 (ja) * 2013-06-07 2018-05-09 住友電気工業株式会社 半導体装置の製造方法
US9412911B2 (en) 2013-07-09 2016-08-09 The Silanna Group Pty Ltd Optical tuning of light emitting semiconductor junctions
WO2015108089A1 (ja) * 2014-01-16 2015-07-23 株式会社トクヤマ 紫外発光ダイオードおよび紫外線光源
KR102318317B1 (ko) 2014-05-27 2021-10-28 실라나 유브이 테크놀로지스 피티이 리미티드 반도체 구조물과 초격자를 사용하는 진보된 전자 디바이스 구조
JP6986349B2 (ja) 2014-05-27 2021-12-22 シランナ・ユー・ブイ・テクノロジーズ・プライベート・リミテッドSilanna Uv Technologies Pte Ltd n型超格子及びp型超格子を備える電子デバイス
WO2015181648A1 (en) 2014-05-27 2015-12-03 The Silanna Group Pty Limited An optoelectronic device
US11322643B2 (en) 2014-05-27 2022-05-03 Silanna UV Technologies Pte Ltd Optoelectronic device
US9444224B2 (en) * 2014-12-08 2016-09-13 Palo Alto Research Center Incorporated Nitride laser diode with engineered non-uniform alloy composition in the n-cladding layer
US10224458B2 (en) * 2015-03-06 2019-03-05 Stanley Electric Co., Ltd. Group III nitride laminate, luminescence element comprising said laminate, and method of producing group III nitride laminate
EP3350844B1 (en) 2015-09-17 2021-10-27 Crystal Is, Inc. Ultraviolet light-emitting devices incorporating two-dimensional hole gases
US10418517B2 (en) 2016-02-23 2019-09-17 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
WO2017145026A1 (en) 2016-02-23 2017-08-31 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
JP7117243B2 (ja) 2016-09-14 2022-08-12 スタンレー電気株式会社 Iii族窒化物積層体、及び該積層体を有する半導体デバイス
JP6648685B2 (ja) * 2016-12-26 2020-02-14 豊田合成株式会社 Iii族窒化物半導体発光素子の製造方法
JP7094082B2 (ja) * 2017-06-14 2022-07-01 日本ルメンタム株式会社 光半導体素子、光サブアセンブリ、及び光モジュール
US10407798B2 (en) * 2017-06-16 2019-09-10 Crystal Is, Inc. Two-stage seeded growth of large aluminum nitride single crystals
US10954608B2 (en) 2017-11-10 2021-03-23 Crystal Is, Inc. UV-transparent aluminum nitride single crystal having a diameter of 35 mm to 150 mm and a predefined UV transparency metric at a wavelength of 265 nm
JP7576386B2 (ja) 2017-12-15 2024-10-31 スタンレー電気株式会社 光半導体素子
US11168411B2 (en) 2018-06-19 2021-11-09 Crystal Is, Inc. Impurity control during formation of aluminum nitride crystals and thermal treatment of aluminum nitride crystals
US10622514B1 (en) 2018-10-15 2020-04-14 Silanna UV Technologies Pte Ltd Resonant optical cavity light emitting device
DE112020003863T5 (de) 2019-08-15 2022-05-19 Crystal Is, Inc. Durchmessererweiterung von aluminiumnitridkristallen
KR20250165432A (ko) 2023-03-29 2025-11-25 헥사테크, 인크. 단결정 질화 알루미늄 기판 및 이로부터 제조된 광전자 장치

Family Cites Families (198)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6615059A (OSRAM) * 1966-10-25 1968-04-26
US3600701A (en) 1968-03-14 1971-08-17 Gen Electric Signal generator for producing a set of signals at baseband frequency and with adjustable phase slope
US3531245A (en) 1968-04-01 1970-09-29 Du Pont Magnesium-aluminum nitrides
US3607014A (en) 1968-12-09 1971-09-21 Dow Chemical Co Method for preparing aluminum nitride and metal fluoride single crystals
US3603414A (en) 1970-01-30 1971-09-07 Frank E Stebley Insert for drilling unit
US3768983A (en) 1971-11-03 1973-10-30 North American Rockwell Single crystal beryllium oxide growth from calcium oxide-beryllium oxide melts
US3903357A (en) 1971-12-06 1975-09-02 Westinghouse Electric Corp Adaptive gate video gray level measurement and tracker
FR2225207B1 (OSRAM) * 1973-04-16 1978-04-21 Ibm
US3933573A (en) * 1973-11-27 1976-01-20 The United States Of America As Represented By The Secretary Of The Air Force Aluminum nitride single crystal growth from a molten mixture with calcium nitride
US4008851A (en) * 1976-01-16 1977-02-22 Curt G. Joa, Inc. Adhesive tape bag closure
DE2750607A1 (de) 1977-11-11 1979-05-17 Max Planck Gesellschaft Luftbestaendiges kristallines lithiumnitrid, verfahren zu seiner herstellung und seine verwendung
FR2538953B1 (fr) * 1982-12-30 1986-02-28 Thomson Csf Structure epitaxiale a effet piezoelectrique exalte et dispositif electronique a ondes acoustiques de surface comportant une telle structure
US4547471A (en) 1983-11-18 1985-10-15 General Electric Company High thermal conductivity aluminum nitride ceramic body
JPS61236686A (ja) 1985-04-13 1986-10-21 Tohoku Metal Ind Ltd 単結晶育成法
JP2745408B2 (ja) 1988-07-07 1998-04-28 東芝セラミックス株式会社 半導体単結晶引上げ装置
US5258218A (en) * 1988-09-13 1993-11-02 Kabushiki Kaisha Toshiba Aluminum nitride substrate and method for producing same
US5070393A (en) 1988-12-23 1991-12-03 Kabushiki Kaisha Toshiba Aluminum nitride substrate for formation of thin-film conductor layer and semiconductor device using the substrate
US5087949A (en) * 1989-06-27 1992-02-11 Hewlett-Packard Company Light-emitting diode with diagonal faces
JPH03285075A (ja) 1990-03-30 1991-12-16 Nisshin Steel Co Ltd タングステンルツボの製造方法
JPH04355920A (ja) 1991-01-31 1992-12-09 Shin Etsu Handotai Co Ltd 半導体素子形成用基板およびその製造方法
US5292487A (en) * 1991-04-16 1994-03-08 Sumitomo Electric Industries, Ltd. Czochralski method using a member for intercepting radiation from raw material molten solution and apparatus therefor
EP0544329A3 (en) 1991-11-28 1993-09-01 Kabushiki Kaisha Toshiba Semiconductor package
US5578839A (en) 1992-11-20 1996-11-26 Nichia Chemical Industries, Ltd. Light-emitting gallium nitride-based compound semiconductor device
JP2989975B2 (ja) 1992-11-30 1999-12-13 京セラ株式会社 窒化アルミニウム質基板の製造方法
JP2875726B2 (ja) * 1993-10-28 1999-03-31 新日本無線株式会社 化合物半導体の熱処理方法
US6083812A (en) 1993-02-02 2000-07-04 Texas Instruments Incorporated Heteroepitaxy by large surface steps
US5520785A (en) * 1994-01-04 1996-05-28 Motorola, Inc. Method for enhancing aluminum nitride
DE69526748T2 (de) 1994-02-25 2002-09-05 Sumitomo Electric Industries, Ltd. Substrat für aluminium-nitrid dünne Film und Verfahren zu seiner Herstellung
US5525320A (en) * 1994-07-11 1996-06-11 University Of Cincinnati Process for aluminum nitride powder production
JPH0859386A (ja) * 1994-08-22 1996-03-05 Mitsubishi Materials Corp 半導体単結晶育成装置
US5670798A (en) 1995-03-29 1997-09-23 North Carolina State University Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same
EP0992470B1 (en) * 1995-08-03 2006-03-08 Ngk Insulators, Ltd. Aluminium nitride sintered bodies and their use as substrate in an apparatus for producing semiconductors
JP3604205B2 (ja) * 1995-09-18 2004-12-22 日亜化学工業株式会社 窒化物半導体の成長方法
US5981980A (en) 1996-04-22 1999-11-09 Sony Corporation Semiconductor laminating structure
JP3876473B2 (ja) 1996-06-04 2007-01-31 住友電気工業株式会社 窒化物単結晶及びその製造方法
JP3644191B2 (ja) * 1996-06-25 2005-04-27 住友電気工業株式会社 半導体素子
US5954874A (en) * 1996-10-17 1999-09-21 Hunter; Charles Eric Growth of bulk single crystals of aluminum nitride from a melt
US5858086A (en) 1996-10-17 1999-01-12 Hunter; Charles Eric Growth of bulk single crystals of aluminum nitride
US5868837A (en) * 1997-01-17 1999-02-09 Cornell Research Foundation, Inc. Low temperature method of preparing GaN single crystals
JP3239787B2 (ja) * 1997-01-30 2001-12-17 安藤電気株式会社 Icソケット
US6229160B1 (en) * 1997-06-03 2001-05-08 Lumileds Lighting, U.S., Llc Light extraction from a semiconductor light-emitting device via chip shaping
US6270569B1 (en) 1997-06-11 2001-08-07 Hitachi Cable Ltd. Method of fabricating nitride crystal, mixture, liquid phase growth method, nitride crystal, nitride crystal powders, and vapor phase growth method
JP3776565B2 (ja) 1997-06-12 2006-05-17 株式会社コトブキ 伸縮式階段状観覧席
US6006620A (en) 1997-12-01 1999-12-28 Chrysler Corporation Automated manual transmission controller
EP0979883A4 (en) 1997-12-25 2003-10-15 Japan Energy Corp METHOD AND DEVICE FOR PRODUCING SINGLE CRYSTALS OF COMPOSITE SEMICONDUCTORS AND SINGLE CRYSTALS OF COMPOSITE SEMICONDUCTORS
US6091085A (en) * 1998-02-19 2000-07-18 Agilent Technologies, Inc. GaN LEDs with improved output coupling efficiency
JP4214585B2 (ja) * 1998-04-24 2009-01-28 富士ゼロックス株式会社 半導体デバイス、半導体デバイスの製造方法及び製造装置
US6045612A (en) * 1998-07-07 2000-04-04 Cree, Inc. Growth of bulk single crystals of aluminum nitride
KR100277968B1 (ko) * 1998-09-23 2001-03-02 구자홍 질화갈륨 기판 제조방법
US6086672A (en) * 1998-10-09 2000-07-11 Cree, Inc. Growth of bulk single crystals of aluminum nitride: silicon carbide alloys
US6063185A (en) * 1998-10-09 2000-05-16 Cree, Inc. Production of bulk single crystals of aluminum nitride, silicon carbide and aluminum nitride: silicon carbide alloy
US6048813A (en) * 1998-10-09 2000-04-11 Cree, Inc. Simulated diamond gemstones formed of aluminum nitride and aluminum nitride: silicon carbide alloys
US6404125B1 (en) * 1998-10-21 2002-06-11 Sarnoff Corporation Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US6218293B1 (en) * 1998-11-13 2001-04-17 Micron Technology, Inc. Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride
JP3015887B1 (ja) 1998-11-19 2000-03-06 科学技術庁金属材料技術研究所長 バルク単結晶育成方法
US6307218B1 (en) * 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
US6187089B1 (en) * 1999-02-05 2001-02-13 Memc Electronic Materials, Inc. Tungsten doped crucible and method for preparing same
US6592663B1 (en) * 1999-06-09 2003-07-15 Ricoh Company Ltd. Production of a GaN bulk crystal substrate and a semiconductor device formed on a GaN bulk crystal substrate
US6829273B2 (en) 1999-07-16 2004-12-07 Agilent Technologies, Inc. Nitride semiconductor layer structure and a nitride semiconductor laser incorporating a portion of same
RU2158789C1 (ru) 1999-08-04 2000-11-10 Водаков Юрий Александрович Способ эпитаксиального выращивания монокристаллического нитрида алюминия и ростовая камера для осуществления способа
JP4145437B2 (ja) 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
US6398867B1 (en) * 1999-10-06 2002-06-04 General Electric Company Crystalline gallium nitride and method for forming crystalline gallium nitride
US6350393B2 (en) 1999-11-04 2002-02-26 Cabot Microelectronics Corporation Use of CsOH in a dielectric CMP slurry
JP2001192647A (ja) 2000-01-14 2001-07-17 Seimi Chem Co Ltd 酸化セリウム含有研磨用組成物及び研磨方法
US6879615B2 (en) 2000-01-19 2005-04-12 Joseph Reid Henrichs FCSEL that frequency doubles its output emissions using sum-frequency generation
US6698647B1 (en) * 2000-03-10 2004-03-02 Honeywell International Inc. Aluminum-comprising target/backing plate structures
US6447604B1 (en) * 2000-03-13 2002-09-10 Advanced Technology Materials, Inc. Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
US6627974B2 (en) * 2000-06-19 2003-09-30 Nichia Corporation Nitride semiconductor substrate and method for manufacturing the same, and nitride semiconductor device using nitride semiconductor substrate
US6777717B1 (en) 2000-09-21 2004-08-17 Gelcore, Llc LED reflector for improved light extraction
AU2002246489A1 (en) * 2000-10-06 2002-07-30 Science And Technology Corporation @ Unm Quantum dot lasers
US7053413B2 (en) 2000-10-23 2006-05-30 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
JP2002222771A (ja) 2000-11-21 2002-08-09 Ngk Insulators Ltd Iii族窒化物膜の製造方法、iii族窒化物膜の製造用下地膜、及びその下地膜の製造方法
US6548333B2 (en) 2000-12-01 2003-04-15 Cree, Inc. Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
JP2005167275A (ja) * 2000-12-07 2005-06-23 Ngk Insulators Ltd 半導体素子
JP2002274996A (ja) * 2001-01-15 2002-09-25 Ngk Insulators Ltd エピタキシャル下地基板及びエピタキシャル基板
US6791119B2 (en) 2001-02-01 2004-09-14 Cree, Inc. Light emitting diodes including modifications for light extraction
US7233028B2 (en) * 2001-02-23 2007-06-19 Nitronex Corporation Gallium nitride material devices and methods of forming the same
US6488767B1 (en) * 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
US6936357B2 (en) 2001-07-06 2005-08-30 Technologies And Devices International, Inc. Bulk GaN and ALGaN single crystals
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US7067849B2 (en) * 2001-07-17 2006-06-27 Lg Electronics Inc. Diode having high brightness and method thereof
EP3078899B1 (en) * 2001-08-09 2020-02-12 Everlight Electronics Co., Ltd Led illuminator and card type led illuminating light source
JP3785970B2 (ja) * 2001-09-03 2006-06-14 日本電気株式会社 Iii族窒化物半導体素子の製造方法
US6906339B2 (en) * 2001-09-05 2005-06-14 Rensselaer Polytechnic Institute Passivated nanoparticles, method of fabrication thereof, and devices incorporating nanoparticles
JP2003086904A (ja) * 2001-09-10 2003-03-20 Mitsubishi Cable Ind Ltd GaN系半導体レーザ
US7175281B1 (en) * 2003-05-13 2007-02-13 Lightmaster Systems, Inc. Method and apparatus to increase the contrast ratio of the image produced by a LCoS based light engine
US7105865B2 (en) * 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
TW573086B (en) 2001-09-21 2004-01-21 Crystal Is Inc Powder metallurgy tungsten crucible for aluminum nitride crystal growth
US7211146B2 (en) * 2001-09-21 2007-05-01 Crystal Is, Inc. Powder metallurgy crucible for aluminum nitride crystal growth
US7037838B2 (en) * 2001-11-20 2006-05-02 Rensselaer Polytechnic Institute Method for polishing a substrate surface
US6515308B1 (en) * 2001-12-21 2003-02-04 Xerox Corporation Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection
US6770135B2 (en) 2001-12-24 2004-08-03 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US20060005763A1 (en) * 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US8545629B2 (en) * 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
JP3782357B2 (ja) * 2002-01-18 2006-06-07 株式会社東芝 半導体発光素子の製造方法
US7063741B2 (en) * 2002-03-27 2006-06-20 General Electric Company High pressure high temperature growth of crystalline group III metal nitrides
US6841001B2 (en) * 2002-07-19 2005-01-11 Cree, Inc. Strain compensated semiconductor structures and methods of fabricating strain compensated semiconductor structures
WO2004013916A1 (ja) 2002-08-01 2004-02-12 Nichia Corporation 半導体発光素子及びその製造方法並びにそれを用いた発光装置
DE10248964B4 (de) 2002-10-14 2011-12-01 Crystal-N Gmbh Verfahren zur Sublimationszüchtung von Aluminiumnitrid-Einkristallen
DE10255849B4 (de) * 2002-11-29 2006-06-14 Advanced Micro Devices, Inc., Sunnyvale Verbesserte Drain/Source-Erweiterungsstruktur eines Feldeffekttransistors mit dotierten Seitenwandabstandselementen mit hoher Permittivität und Verfahren zu deren Herstellung
PL224992B1 (pl) * 2002-12-11 2017-02-28 Ammono Spółka Z Ograniczoną Odpowiedzialnością Podłoże typu template dla urządzeń opto-elektrycznych lub elektrycznych oraz sposób jego wytwarzania
US7186302B2 (en) 2002-12-16 2007-03-06 The Regents Of The University Of California Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
JP4373086B2 (ja) * 2002-12-27 2009-11-25 株式会社半導体エネルギー研究所 発光装置
JP2004253788A (ja) * 2003-01-30 2004-09-09 Toyoda Gosei Co Ltd 端面発光型の半導体レーザ
US7116691B2 (en) * 2003-01-30 2006-10-03 Toyoda Gosei Co., Ltd. Edge-emitting type semiconductor laser
JP4377600B2 (ja) * 2003-03-24 2009-12-02 株式会社東芝 3族窒化物半導体の積層構造、その製造方法、及び3族窒化物半導体装置
FR2852974A1 (fr) 2003-03-31 2004-10-01 Soitec Silicon On Insulator Procede de fabrication de cristaux monocristallins
US6831302B2 (en) 2003-04-15 2004-12-14 Luminus Devices, Inc. Light emitting devices with improved extraction efficiency
US7274043B2 (en) 2003-04-15 2007-09-25 Luminus Devices, Inc. Light emitting diode systems
US7098589B2 (en) 2003-04-15 2006-08-29 Luminus Devices, Inc. Light emitting devices with high light collimation
US7211831B2 (en) * 2003-04-15 2007-05-01 Luminus Devices, Inc. Light emitting device with patterned surfaces
US7521854B2 (en) * 2003-04-15 2009-04-21 Luminus Devices, Inc. Patterned light emitting devices and extraction efficiencies related to the same
US7306748B2 (en) 2003-04-25 2007-12-11 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining ceramics
US7192849B2 (en) 2003-05-07 2007-03-20 Sensor Electronic Technology, Inc. Methods of growing nitride-based film using varying pulses
JP4112449B2 (ja) * 2003-07-28 2008-07-02 株式会社東芝 放電電極及び放電灯
DE10335538A1 (de) 2003-07-31 2005-02-24 Sicrystal Ag Verfahren und Vorrichtung zur AIN-Einkristall-Herstellung mit gasdurchlässiger Tiegelwand
CN100389481C (zh) * 2003-08-12 2008-05-21 日本电信电话株式会社 氮化物半导体生长用衬底
EP1658642B1 (en) * 2003-08-28 2014-02-26 Panasonic Corporation Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
US7288152B2 (en) 2003-08-29 2007-10-30 Matsushita Electric Industrial Co., Ltd. Method of manufacturing GaN crystals and GaN crystal substrate, GaN crystals and GaN crystal substrate obtained by the method, and semiconductor device including the same
US6995402B2 (en) * 2003-10-03 2006-02-07 Lumileds Lighting, U.S., Llc Integrated reflector cup for a light emitting device mount
JP4396816B2 (ja) * 2003-10-17 2010-01-13 日立電線株式会社 Iii族窒化物半導体基板およびその製造方法
CN100397574C (zh) * 2003-10-30 2008-06-25 台湾积体电路制造股份有限公司 具有应变的多层结构及具有应变层的场效应晶体管的制法
US7276779B2 (en) 2003-11-04 2007-10-02 Hitachi Cable, Ltd. III-V group nitride system semiconductor substrate
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
US7087112B1 (en) 2003-12-02 2006-08-08 Crystal Is, Inc. Nitride ceramics to mount aluminum nitride seed for sublimation growth
KR101156146B1 (ko) * 2003-12-09 2012-06-18 재팬 사이언스 앤드 테크놀로지 에이젼시 질소면의 표면상의 구조물 제조를 통한 고효율 3족 질화물계 발광다이오드
US7518158B2 (en) * 2003-12-09 2009-04-14 Cree, Inc. Semiconductor light emitting devices and submounts
JP2005210084A (ja) * 2003-12-22 2005-08-04 Ngk Insulators Ltd エピタキシャル基板、半導体積層構造、転位低減方法およびエピタキシャル形成用基板
JP2005197573A (ja) * 2004-01-09 2005-07-21 Sharp Corp Iii族窒化物半導体発光素子
US7056383B2 (en) * 2004-02-13 2006-06-06 The Fox Group, Inc. Tantalum based crucible
US7569863B2 (en) 2004-02-19 2009-08-04 Panasonic Corporation Semiconductor light emitting device
US7420218B2 (en) 2004-03-18 2008-09-02 Matsushita Electric Industrial Co., Ltd. Nitride based LED with a p-type injection region
WO2005111278A1 (ja) 2004-05-19 2005-11-24 Sumitomo Electric Industries, Ltd. Iii族窒化物半導体結晶およびその製造方法ならびにiii族窒化物半導体デバイス
US20050269577A1 (en) 2004-06-08 2005-12-08 Matsushita Electric Industrial Co., Ltd. Surface treatment method and surface treatment device
US7294199B2 (en) 2004-06-10 2007-11-13 Sumitomo Electric Industries, Ltd. Nitride single crystal and producing method thereof
US7339205B2 (en) 2004-06-28 2008-03-04 Nitronex Corporation Gallium nitride materials and methods associated with the same
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7476910B2 (en) * 2004-09-10 2009-01-13 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing the same
WO2006068297A1 (en) * 2004-12-22 2006-06-29 Matsushita Electric Industrial Co., Ltd. Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
US7186580B2 (en) * 2005-01-11 2007-03-06 Semileds Corporation Light emitting diodes (LEDs) with improved light extraction by roughening
US7335920B2 (en) * 2005-01-24 2008-02-26 Cree, Inc. LED with current confinement structure and surface roughening
US7125734B2 (en) 2005-03-09 2006-10-24 Gelcore, Llc Increased light extraction from a nitride LED
JP4563230B2 (ja) 2005-03-28 2010-10-13 昭和電工株式会社 AlGaN基板の製造方法
JP2006310721A (ja) 2005-03-28 2006-11-09 Yokohama National Univ 自発光デバイス
WO2006110512A1 (en) 2005-04-07 2006-10-19 North Carolina State University Seeded growth process for preparing aluminum nitride single crystals
US8101498B2 (en) 2005-04-21 2012-01-24 Pinnington Thomas Henry Bonded intermediate substrate and method of making same
US7544963B2 (en) 2005-04-29 2009-06-09 Cree, Inc. Binary group III-nitride based high electron mobility transistors
JP5236148B2 (ja) * 2005-05-12 2013-07-17 日本碍子株式会社 エピタキシャル基板、半導体素子、エピタキシャル基板の製造方法、半導体素子の製造方法、およびiii族窒化物結晶における転位偏在化方法
KR20060127743A (ko) * 2005-06-06 2006-12-13 스미토모덴키고교가부시키가이샤 질화물 반도체 기판과 그 제조 방법
US20060288929A1 (en) 2005-06-10 2006-12-28 Crystal Is, Inc. Polar surface preparation of nitride substrates
KR100616686B1 (ko) 2005-06-10 2006-08-28 삼성전기주식회사 질화물계 반도체 장치의 제조 방법
EP2750194A1 (en) * 2005-06-22 2014-07-02 Seoul Viosys Co., Ltd. Light emitting device comprising a plurality of light emitting diode cells
TWI422044B (zh) * 2005-06-30 2014-01-01 克立公司 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置
US20070018182A1 (en) * 2005-07-20 2007-01-25 Goldeneye, Inc. Light emitting diodes with improved light extraction and reflectivity
JP4778745B2 (ja) 2005-07-27 2011-09-21 パナソニック株式会社 半導体発光装置及びその製造方法
JP2007073761A (ja) * 2005-09-07 2007-03-22 Sumitomo Electric Ind Ltd 窒化物半導体基板及び窒化物半導体基板の加工方法
JP2009515344A (ja) * 2005-11-04 2009-04-09 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 高い光抽出効率の発光ダイオード(led)
EP1960570A2 (en) 2005-11-28 2008-08-27 Crystal Is, Inc. Large aluminum nitride crystals with reduced defects and methods of making them
US7641735B2 (en) * 2005-12-02 2010-01-05 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
WO2007073001A1 (en) 2005-12-22 2007-06-28 Showa Denko K.K. Light-emitting diode and method for fabricant thereof
JP4963839B2 (ja) * 2006-02-06 2012-06-27 昭和電工株式会社 発光装置
EP1994552B1 (en) * 2006-03-10 2020-12-30 UNM Rainforest Innovations Two-phase growth of group iii-v nanowires
CN101454487B (zh) 2006-03-30 2013-01-23 晶体公司 氮化铝块状晶体的可控掺杂方法
US9034103B2 (en) * 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
US7524376B2 (en) * 2006-05-04 2009-04-28 Fairfield Crystal Technology, Llc Method and apparatus for aluminum nitride monocrystal boule growth
US20080012034A1 (en) * 2006-07-17 2008-01-17 3M Innovative Properties Company Led package with converging extractor
US7755103B2 (en) 2006-08-03 2010-07-13 Sumitomo Electric Industries, Ltd. Nitride gallium semiconductor substrate and nitride semiconductor epitaxial substrate
US7714340B2 (en) * 2006-09-06 2010-05-11 Palo Alto Research Center Incorporated Nitride light-emitting device
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
EP2080223B8 (en) 2006-10-31 2018-08-22 Lumileds Holding B.V. Lighting device package
US20090121250A1 (en) * 2006-11-15 2009-05-14 Denbaars Steven P High light extraction efficiency light emitting diode (led) using glass packaging
US9318327B2 (en) * 2006-11-28 2016-04-19 Cree, Inc. Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same
US8110838B2 (en) * 2006-12-08 2012-02-07 Luminus Devices, Inc. Spatial localization of light-generating portions in LEDs
US7687823B2 (en) * 2006-12-26 2010-03-30 Nichia Corporation Light-emitting apparatus and method of producing the same
JPWO2008081758A1 (ja) 2006-12-28 2010-04-30 株式会社トクヤマ 窒化アルミニウムメタライズド基板の製造方法
CN107059116B (zh) 2007-01-17 2019-12-31 晶体公司 引晶的氮化铝晶体生长中的缺陷减少
US8080833B2 (en) 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US9437430B2 (en) 2007-01-26 2016-09-06 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US9061450B2 (en) 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
JP5121268B2 (ja) 2007-03-27 2013-01-16 日本碍子株式会社 窒化アルミニウム焼結体及び半導体製造装置用部材
US8163582B2 (en) 2007-04-23 2012-04-24 Goldeneye, Inc. Method for fabricating a light emitting diode chip including etching by a laser beam
US8088220B2 (en) * 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
US20090039373A1 (en) * 2007-07-24 2009-02-12 Toyoda Gosei Co., Ltd. Group III nitride-based compound semiconductor light emitting device
US8866185B2 (en) * 2007-09-06 2014-10-21 SemiLEDs Optoelectronics Co., Ltd. White light LED with multiple encapsulation layers
TW200931690A (en) * 2007-11-30 2009-07-16 Univ California Light output enhanced gallium nitride based thin light emitting diode
US20090140279A1 (en) * 2007-12-03 2009-06-04 Goldeneye, Inc. Substrate-free light emitting diode chip
US7713769B2 (en) * 2007-12-21 2010-05-11 Tekcore Co., Ltd. Method for fabricating light emitting diode structure having irregular serrations
US8049237B2 (en) 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
US20090173958A1 (en) 2008-01-04 2009-07-09 Cree, Inc. Light emitting devices with high efficiency phospor structures
US7859000B2 (en) 2008-04-10 2010-12-28 Cree, Inc. LEDs using single crystalline phosphor and methods of fabricating same
KR101092079B1 (ko) 2008-04-24 2011-12-12 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR20100003321A (ko) 2008-06-24 2010-01-08 삼성전자주식회사 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및발광 장치의 제조 방법
US20090321758A1 (en) 2008-06-25 2009-12-31 Wen-Huang Liu Led with improved external light extraction efficiency
JP5305758B2 (ja) 2008-06-30 2013-10-02 株式会社東芝 半導体発光装置
US8384115B2 (en) * 2008-08-01 2013-02-26 Cree, Inc. Bond pad design for enhancing light extraction from LED chips
US20100314551A1 (en) 2009-06-11 2010-12-16 Bettles Timothy J In-line Fluid Treatment by UV Radiation

Similar Documents

Publication Publication Date Title
JP2010517298A5 (OSRAM)
CN1909190B (zh) 含晶格参数改变元素的氮化镓器件衬底
US9577144B2 (en) Ultraviolet light-emitting device
US20170047407A1 (en) Semiconductor Material Having a Compositionally-Graded Transition Layer
US20020020341A1 (en) Method of controlling stress in gallium nitride films deposited on substrates
US9397232B2 (en) Nitride semiconductor epitaxial substrate and nitride semiconductor device
US8969891B2 (en) Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
US8692287B2 (en) Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
US20090321781A1 (en) Quantum dot device and method of making the same
JP2013191851A (ja) (Al,In,Ga,B)Nの伝導性制御方法
JP2010501117A5 (OSRAM)
JP2015167231A5 (OSRAM)
JP2010517298A (ja) 厚みのある擬似格子整合型の窒化物エピタキシャル層
US9202873B2 (en) Semiconductor wafer for semiconductor device having a multilayer
US20110003420A1 (en) Fabrication method of gallium nitride-based compound semiconductor
CN102610719A (zh) 变质基板体系、其制备方法以及iii-氮化物半导体器件
WO2009021201A1 (en) Planar nonpolar m-plane group iii-nitride films grown on miscut substrates
EP2525417A2 (en) Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
KR101274211B1 (ko) 반도체 기판, 이를 이용한 발광소자 및 그 제조방법
JP2014022685A (ja) 半導体積層構造およびこれを用いた半導体素子
US20060175681A1 (en) Method to grow III-nitride materials using no buffer layer
JP2014003056A (ja) 半導体積層構造およびこれを用いた半導体素子
KR101532267B1 (ko) 질화물계 발광소자의 제조방법
CN106299057A (zh) 一种可提高亮度带3d层的led外延结构
JP4333092B2 (ja) 窒化物半導体の製造方法