JP2010510671A - Ｌｅｄ光源用の光学接着組成物 - Google Patents

Ｌｅｄ光源用の光学接着組成物 Download PDF

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Publication number
JP2010510671A
JP2010510671A JP2009537362A JP2009537362A JP2010510671A JP 2010510671 A JP2010510671 A JP 2010510671A JP 2009537362 A JP2009537362 A JP 2009537362A JP 2009537362 A JP2009537362 A JP 2009537362A JP 2010510671 A JP2010510671 A JP 2010510671A
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Prior art keywords
oxide
light source
led light
metal oxide
led
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JP2009537362A
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Japanese (ja)
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JP2010510671A5 (enExample
Inventor
エイミー・エス・バーンズ
ディ・スコット・トンプソン
ブラント・ユー・コルブ
トッド・エイ・バレン
ジャクリーン・ツェー・ロルフ
ロバート・エル・ブロット
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2010510671A publication Critical patent/JP2010510671A/ja
Publication of JP2010510671A5 publication Critical patent/JP2010510671A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2009537362A 2006-11-17 2007-11-15 Ｌｅｄ光源用の光学接着組成物 Withdrawn JP2010510671A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86628006P 2006-11-17 2006-11-17
PCT/US2007/084806 WO2008064070A1 (en) 2006-11-17 2007-11-15 Optical bonding composition for led light source

Publications (2)

Publication Number Publication Date
JP2010510671A true JP2010510671A (ja) 2010-04-02
JP2010510671A5 JP2010510671A5 (enExample) 2010-12-09

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JP2009537362A Withdrawn JP2010510671A (ja) 2006-11-17 2007-11-15 Ｌｅｄ光源用の光学接着組成物

Country Status (7)

Country Link
US (1) US8026115B2 (enExample)
EP (1) EP2092576A1 (enExample)
JP (1) JP2010510671A (enExample)
KR (1) KR20090089431A (enExample)
CN (1) CN101548397B (enExample)
TW (1) TW200835765A (enExample)
WO (1) WO2008064070A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534728A (ja) * 2010-06-22 2013-09-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体素子および半導体素子の製造方法
JP2016207924A (ja) * 2015-04-27 2016-12-08 日亜化学工業株式会社 発光装置及びその製造方法
JP2017520115A (ja) * 2014-06-02 2017-07-20 スウェアフレックス ゲーエムベーハー 照明装置および照明方法
JP2020080429A (ja) * 2020-02-27 2020-05-28 日亜化学工業株式会社 発光装置及びその製造方法
KR20210076236A (ko) * 2019-12-13 2021-06-24 한국전자기술연구원 Led 실장형 디스플레이 및 그의 제조 방법

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RU2440389C2 (ru) * 2006-01-18 2012-01-20 Спарксис Б.В. Новые мономерные и полимерные материалы
DE102008016487A1 (de) * 2008-03-31 2009-10-01 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
JP5087672B2 (ja) 2010-12-13 2012-12-05 株式会社東芝 半導体発光素子
KR20120071960A (ko) 2010-12-23 2012-07-03 삼성모바일디스플레이주식회사 광학 접촉 결합을 이용한 금속 및 글라스 접합 방법, 이를 이용한 표시 장치의 제조 방법, 및 상기 제조 방법에 의해 만들어진 표시 장치
KR101293791B1 (ko) 2011-05-16 2013-08-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
KR101644051B1 (ko) * 2011-05-20 2016-08-01 삼성전자 주식회사 광전자 소자 및 적층 구조
US10043942B2 (en) * 2013-10-17 2018-08-07 Luminus Devices, Inc. Vertical multi-junction light emitting diode
CN104531052A (zh) * 2015-01-06 2015-04-22 段志春 一种纳米锆铌硅酮密封胶及其制作方法
KR102359811B1 (ko) * 2016-05-12 2022-02-09 루미리즈 홀딩 비.브이. 시준하는 온-다이 광학계
US10466404B2 (en) 2016-05-12 2019-11-05 Lumileds Llc Collimating on-die optic
US10290779B2 (en) * 2016-12-15 2019-05-14 Panasonic Intellectual Property Management Co., Ltd. Light emitting element
CN108864952A (zh) * 2018-04-26 2018-11-23 华中光电技术研究所（中国船舶重工集团有限公司第七七研究所） 光学玻璃零件粘合胶及粘接技术
JPWO2020175396A1 (enExample) * 2019-02-28 2020-09-03
WO2020211091A1 (en) * 2019-04-19 2020-10-22 Materion Precision Optics (Shanghai) Limited High temperature resistant reflective layer for wavelength conversion devices
CN114368947B (zh) * 2022-01-11 2023-07-25 澳门大学 一种可用于门板的纳米泡沫玻璃微珠混凝土及其制备方法

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JP2001139894A (ja) 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、および半導体装置
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US6679621B2 (en) * 2002-06-24 2004-01-20 Lumileds Lighting U.S., Llc Side emitting LED and lens
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US7118438B2 (en) * 2003-01-27 2006-10-10 3M Innovative Properties Company Methods of making phosphor based light sources having an interference reflector
CA2517009A1 (en) * 2003-02-26 2004-09-10 Cree, Inc. White light source using emitting diode and phosphor and method of fabrication
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KR100550491B1 (ko) * 2003-05-06 2006-02-09 스미토모덴키고교가부시키가이샤 질화물 반도체 기판 및 질화물 반도체 기판의 가공 방법
JP4645071B2 (ja) * 2003-06-20 2011-03-09 日亜化学工業株式会社 パッケージ成型体およびそれを用いた半導体装置
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US7330319B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company High brightness LED package with multiple optical elements
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US7329982B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013534728A (ja) * 2010-06-22 2013-09-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体素子および半導体素子の製造方法
US9368699B2 (en) 2010-06-22 2016-06-14 Osram Opto Semiconductors Gmbh Semiconductor component containing a highly refractive polymer material
US9634207B2 (en) 2010-06-22 2017-04-25 Osram Opto Semiconductors Gmbh Semiconductor component and method of producing a semiconductor component
JP2017520115A (ja) * 2014-06-02 2017-07-20 スウェアフレックス ゲーエムベーハー 照明装置および照明方法
JP2016207924A (ja) * 2015-04-27 2016-12-08 日亜化学工業株式会社 発光装置及びその製造方法
KR20210076236A (ko) * 2019-12-13 2021-06-24 한국전자기술연구원 Led 실장형 디스플레이 및 그의 제조 방법
KR102269020B1 (ko) * 2019-12-13 2021-06-25 한국전자기술연구원 Led 실장형 디스플레이 및 그의 제조 방법
JP2020080429A (ja) * 2020-02-27 2020-05-28 日亜化学工業株式会社 発光装置及びその製造方法
JP7011195B2 (ja) 2020-02-27 2022-01-26 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
CN101548397A (zh) 2009-09-30
US20100059776A1 (en) 2010-03-11
CN101548397B (zh) 2011-12-21
EP2092576A1 (en) 2009-08-26
TW200835765A (en) 2008-09-01
WO2008064070A1 (en) 2008-05-29
KR20090089431A (ko) 2009-08-21
US8026115B2 (en) 2011-09-27

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