JPWO2020175396A1 - - Google Patents

Info

Publication number
JPWO2020175396A1
JPWO2020175396A1 JP2021502215A JP2021502215A JPWO2020175396A1 JP WO2020175396 A1 JPWO2020175396 A1 JP WO2020175396A1 JP 2021502215 A JP2021502215 A JP 2021502215A JP 2021502215 A JP2021502215 A JP 2021502215A JP WO2020175396 A1 JPWO2020175396 A1 JP WO2020175396A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021502215A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020175396A1 publication Critical patent/JPWO2020175396A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Led Device Packages (AREA)
JP2021502215A 2019-02-28 2020-02-21 Pending JPWO2020175396A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019036763 2019-02-28
PCT/JP2020/007184 WO2020175396A1 (ja) 2019-02-28 2020-02-21 接着層付き光学部材および発光装置

Publications (1)

Publication Number Publication Date
JPWO2020175396A1 true JPWO2020175396A1 (enExample) 2020-09-03

Family

ID=72240030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021502215A Pending JPWO2020175396A1 (enExample) 2019-02-28 2020-02-21

Country Status (5)

Country Link
US (1) US20210384391A1 (enExample)
JP (1) JPWO2020175396A1 (enExample)
CN (1) CN113474307A (enExample)
TW (1) TW202103342A (enExample)
WO (1) WO2020175396A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022131066A1 (enExample) * 2020-12-18 2022-06-23
CN116583400A (zh) * 2020-12-18 2023-08-11 Ａｇｃ株式会社 接合体、接合体的制造方法以及发光装置
CN115893866B (zh) * 2022-10-28 2025-02-21 四川旭虹光电科技有限公司 一种连续制备ag膜、ar膜和af膜的方法和系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064038A (ja) * 1999-08-30 2001-03-13 Hoya Corp ガラス材およびそれを用いたガラスファイバ
JP2002141556A (ja) * 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
JP2016052971A (ja) * 2014-09-04 2016-04-14 株式会社オハラ ガラスの製造方法およびガラス
US20160111612A1 (en) * 2014-10-17 2016-04-21 High Power Opto. Inc. Light emitting diode having mirror protection layer and method for manufacturing mirror protection layer
JP2018035046A (ja) * 2016-09-01 2018-03-08 セントラル硝子株式会社 光源用封止材及び光源用封止材用のガラス材料
CN108172676A (zh) * 2018-01-25 2018-06-15 研创光电科技（赣州）有限公司 一种led陶瓷复合封装基板及其生产工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060231737A1 (en) * 2005-04-15 2006-10-19 Asahi Glass Company, Limited Light emitting diode element
EP2067182B1 (en) * 2006-09-22 2016-10-05 Koninklijke Philips N.V. Light emitting device with tension relaxation
KR20090089431A (ko) * 2006-11-17 2009-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 광원용 광학 접합 조성물
TW201403885A (zh) * 2012-07-06 2014-01-16 隆達電子股份有限公司 發光二極體裝置
JP6544238B2 (ja) * 2013-12-03 2019-07-17 Ａｇｃ株式会社 光学ガラス、プレス成形用プリフォームおよび光学素子
KR101766284B1 (ko) * 2016-06-23 2017-08-08 주식회사 엘엠에스 자외선 차단 기능이 우수한 점착 조성물, 점착 시트 및 이를 포함하는 디스플레이 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064038A (ja) * 1999-08-30 2001-03-13 Hoya Corp ガラス材およびそれを用いたガラスファイバ
JP2002141556A (ja) * 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
JP2016052971A (ja) * 2014-09-04 2016-04-14 株式会社オハラ ガラスの製造方法およびガラス
US20160111612A1 (en) * 2014-10-17 2016-04-21 High Power Opto. Inc. Light emitting diode having mirror protection layer and method for manufacturing mirror protection layer
JP2018035046A (ja) * 2016-09-01 2018-03-08 セントラル硝子株式会社 光源用封止材及び光源用封止材用のガラス材料
CN108172676A (zh) * 2018-01-25 2018-06-15 研创光电科技（赣州）有限公司 一种led陶瓷复合封装基板及其生产工艺

Also Published As

Publication number Publication date
TW202103342A (zh) 2021-01-16
CN113474307A (zh) 2021-10-01
WO2020175396A1 (ja) 2020-09-03
US20210384391A1 (en) 2021-12-09

Similar Documents

Publication Publication Date Title
BR112019017762A2 (enExample)
BR112021018450A2 (enExample)
BR112021017637A2 (enExample)
BR112021017892A2 (enExample)
BR112021017782A2 (enExample)
BR112021017939A2 (enExample)
BR112021017738A2 (enExample)
BR112019016141A2 (enExample)
BR112021008711A2 (enExample)
BR112021018452A2 (enExample)
BR112021017703A2 (enExample)
BR112021017728A2 (enExample)
AU2020104490A5 (enExample)
BR112019016138A2 (enExample)
BR112019016142A2 (enExample)
BR112021018168A2 (enExample)
BR112021017732A2 (enExample)
BR112021012348A2 (enExample)
BR112021018250A2 (enExample)
BR112021018093A2 (enExample)
BR112021018102A2 (enExample)
BR112021018584A2 (enExample)
JPWO2020175396A1 (enExample)
BR112021013128A2 (enExample)
BR112021018484A2 (enExample)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220804

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230606

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230803

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231017