TW202103342A - 附接著層之光學構件及發光裝置 - Google Patents

附接著層之光學構件及發光裝置 Download PDF

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Publication number
TW202103342A
TW202103342A TW109105921A TW109105921A TW202103342A TW 202103342 A TW202103342 A TW 202103342A TW 109105921 A TW109105921 A TW 109105921A TW 109105921 A TW109105921 A TW 109105921A TW 202103342 A TW202103342 A TW 202103342A
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TW
Taiwan
Prior art keywords
optical member
light
glass
adhesive layer
less
Prior art date
Application number
TW109105921A
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English (en)
Chinese (zh)
Inventor
染谷武紀
Original Assignee
日商Ａｇｃ股份有限公司
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Publication date
Application filed by 日商Ａｇｃ股份有限公司 filed Critical 日商Ａｇｃ股份有限公司
Publication of TW202103342A publication Critical patent/TW202103342A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Led Device Packages (AREA)
TW109105921A 2019-02-28 2020-02-24 附接著層之光學構件及發光裝置 TW202103342A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-036763 2019-02-28
JP2019036763 2019-02-28

Publications (1)

Publication Number Publication Date
TW202103342A true TW202103342A (zh) 2021-01-16

Family

ID=72240030

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109105921A TW202103342A (zh) 2019-02-28 2020-02-24 附接著層之光學構件及發光裝置

Country Status (5)

Country Link
US (1) US20210384391A1 (enExample)
JP (1) JPWO2020175396A1 (enExample)
CN (1) CN113474307A (enExample)
TW (1) TW202103342A (enExample)
WO (1) WO2020175396A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022131066A1 (ja) * 2020-12-18 2022-06-23 Ａｇｃ株式会社 接合体、接合体の製造方法、及び発光装置
CN116583400A (zh) * 2020-12-18 2023-08-11 Ａｇｃ株式会社 接合体、接合体的制造方法以及发光装置
CN115893866B (zh) * 2022-10-28 2025-02-21 四川旭虹光电科技有限公司 一种连续制备ag膜、ar膜和af膜的方法和系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064038A (ja) * 1999-08-30 2001-03-13 Hoya Corp ガラス材およびそれを用いたガラスファイバ
JP2002141556A (ja) * 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US20060231737A1 (en) * 2005-04-15 2006-10-19 Asahi Glass Company, Limited Light emitting diode element
WO2008035283A2 (en) * 2006-09-22 2008-03-27 Koninklijke Philips Electronics N.V. Light emitting device with tension relaxation
KR20090089431A (ko) * 2006-11-17 2009-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 광원용 광학 접합 조성물
TW201403885A (zh) * 2012-07-06 2014-01-16 隆達電子股份有限公司 發光二極體裝置
JP6544238B2 (ja) * 2013-12-03 2019-07-17 Ａｇｃ株式会社 光学ガラス、プレス成形用プリフォームおよび光学素子
JP2016052971A (ja) * 2014-09-04 2016-04-14 株式会社オハラ ガラスの製造方法およびガラス
US9401465B2 (en) * 2014-10-17 2016-07-26 High Power Opto. Inc. Light emitting diode having mirror protection layer and method for manufacturing mirror protection layer
KR101766284B1 (ko) * 2016-06-23 2017-08-08 주식회사 엘엠에스 자외선 차단 기능이 우수한 점착 조성물, 점착 시트 및 이를 포함하는 디스플레이 장치
JP2018035046A (ja) * 2016-09-01 2018-03-08 セントラル硝子株式会社 光源用封止材及び光源用封止材用のガラス材料
CN108172676A (zh) * 2018-01-25 2018-06-15 研创光电科技（赣州）有限公司 一种led陶瓷复合封装基板及其生产工艺

Also Published As

Publication number Publication date
US20210384391A1 (en) 2021-12-09
CN113474307A (zh) 2021-10-01
WO2020175396A1 (ja) 2020-09-03
JPWO2020175396A1 (enExample) 2020-09-03

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