CN101548397B - 用于led光源的光学粘合组合物 - Google Patents

用于led光源的光学粘合组合物 Download PDF

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Publication number
CN101548397B
CN101548397B CN200780042714.7A CN200780042714A CN101548397B CN 101548397 B CN101548397 B CN 101548397B CN 200780042714 A CN200780042714 A CN 200780042714A CN 101548397 B CN101548397 B CN 101548397B
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China
Prior art keywords
light source
optical
surface modification
led light
led
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Expired - Fee Related
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CN200780042714.7A
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English (en)
Chinese (zh)
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CN101548397A (zh
Inventor
埃米·S·巴尔内斯
D·斯科特·汤姆森
布兰特·U·科尔布
托德·A·巴伦
杰奎琳·C·罗尔夫
罗伯特·L·布罗特
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00Nanooptics, e.g. quantum optics or photonic crystals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN200780042714.7A 2006-11-17 2007-11-15 用于led光源的光学粘合组合物 Expired - Fee Related CN101548397B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86628006P 2006-11-17 2006-11-17
US60/866,280 2006-11-17
PCT/US2007/084806 WO2008064070A1 (en) 2006-11-17 2007-11-15 Optical bonding composition for led light source

Publications (2)

Publication Number Publication Date
CN101548397A CN101548397A (zh) 2009-09-30
CN101548397B true CN101548397B (zh) 2011-12-21

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CN200780042714.7A Expired - Fee Related CN101548397B (zh) 2006-11-17 2007-11-15 用于led光源的光学粘合组合物

Country Status (7)

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US (1) US8026115B2 (enExample)
EP (1) EP2092576A1 (enExample)
JP (1) JP2010510671A (enExample)
KR (1) KR20090089431A (enExample)
CN (1) CN101548397B (enExample)
TW (1) TW200835765A (enExample)
WO (1) WO2008064070A1 (enExample)

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KR101293791B1 (ko) 2011-05-16 2013-08-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
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JP6668608B2 (ja) * 2015-04-27 2020-03-18 日亜化学工業株式会社 発光装置の製造方法
KR102359811B1 (ko) * 2016-05-12 2022-02-09 루미리즈 홀딩 비.브이. 시준하는 온-다이 광학계
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US10290779B2 (en) * 2016-12-15 2019-05-14 Panasonic Intellectual Property Management Co., Ltd. Light emitting element
CN108864952A (zh) * 2018-04-26 2018-11-23 华中光电技术研究所(中国船舶重工集团有限公司第七七研究所) 光学玻璃零件粘合胶及粘接技术
JPWO2020175396A1 (enExample) * 2019-02-28 2020-09-03
WO2020211091A1 (en) * 2019-04-19 2020-10-22 Materion Precision Optics (Shanghai) Limited High temperature resistant reflective layer for wavelength conversion devices
KR102269020B1 (ko) * 2019-12-13 2021-06-25 한국전자기술연구원 Led 실장형 디스플레이 및 그의 제조 방법
JP7011195B2 (ja) * 2020-02-27 2022-01-26 日亜化学工業株式会社 発光装置
CN114368947B (zh) * 2022-01-11 2023-07-25 澳门大学 一种可用于门板的纳米泡沫玻璃微珠混凝土及其制备方法

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Also Published As

Publication number Publication date
CN101548397A (zh) 2009-09-30
JP2010510671A (ja) 2010-04-02
US20100059776A1 (en) 2010-03-11
EP2092576A1 (en) 2009-08-26
TW200835765A (en) 2008-09-01
WO2008064070A1 (en) 2008-05-29
KR20090089431A (ko) 2009-08-21
US8026115B2 (en) 2011-09-27

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Granted publication date: 20111221

Termination date: 20171115