CN101548397B - 用于led光源的光学粘合组合物 - Google Patents
用于led光源的光学粘合组合物 Download PDFInfo
- Publication number
- CN101548397B CN101548397B CN200780042714.7A CN200780042714A CN101548397B CN 101548397 B CN101548397 B CN 101548397B CN 200780042714 A CN200780042714 A CN 200780042714A CN 101548397 B CN101548397 B CN 101548397B
- Authority
- CN
- China
- Prior art keywords
- light source
- optical
- surface modification
- led light
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86628006P | 2006-11-17 | 2006-11-17 | |
| US60/866,280 | 2006-11-17 | ||
| PCT/US2007/084806 WO2008064070A1 (en) | 2006-11-17 | 2007-11-15 | Optical bonding composition for led light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101548397A CN101548397A (zh) | 2009-09-30 |
| CN101548397B true CN101548397B (zh) | 2011-12-21 |
Family
ID=39430051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780042714.7A Expired - Fee Related CN101548397B (zh) | 2006-11-17 | 2007-11-15 | 用于led光源的光学粘合组合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8026115B2 (enExample) |
| EP (1) | EP2092576A1 (enExample) |
| JP (1) | JP2010510671A (enExample) |
| KR (1) | KR20090089431A (enExample) |
| CN (1) | CN101548397B (enExample) |
| TW (1) | TW200835765A (enExample) |
| WO (1) | WO2008064070A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2440389C2 (ru) * | 2006-01-18 | 2012-01-20 | Спарксис Б.В. | Новые мономерные и полимерные материалы |
| DE102008016487A1 (de) * | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| DE102010024545B4 (de) | 2010-06-22 | 2022-01-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
| JP5087672B2 (ja) | 2010-12-13 | 2012-12-05 | 株式会社東芝 | 半導体発光素子 |
| KR20120071960A (ko) | 2010-12-23 | 2012-07-03 | 삼성모바일디스플레이주식회사 | 광학 접촉 결합을 이용한 금속 및 글라스 접합 방법, 이를 이용한 표시 장치의 제조 방법, 및 상기 제조 방법에 의해 만들어진 표시 장치 |
| KR101293791B1 (ko) | 2011-05-16 | 2013-08-06 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
| KR101644051B1 (ko) * | 2011-05-20 | 2016-08-01 | 삼성전자 주식회사 | 광전자 소자 및 적층 구조 |
| US10043942B2 (en) * | 2013-10-17 | 2018-08-07 | Luminus Devices, Inc. | Vertical multi-junction light emitting diode |
| EP2953176A1 (de) * | 2014-06-02 | 2015-12-09 | Swarovski Energy GmbH | Beleuchtungsvorrichtung |
| CN104531052A (zh) * | 2015-01-06 | 2015-04-22 | 段志春 | 一种纳米锆铌硅酮密封胶及其制作方法 |
| JP6668608B2 (ja) * | 2015-04-27 | 2020-03-18 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| KR102359811B1 (ko) * | 2016-05-12 | 2022-02-09 | 루미리즈 홀딩 비.브이. | 시준하는 온-다이 광학계 |
| US10466404B2 (en) | 2016-05-12 | 2019-11-05 | Lumileds Llc | Collimating on-die optic |
| US10290779B2 (en) * | 2016-12-15 | 2019-05-14 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting element |
| CN108864952A (zh) * | 2018-04-26 | 2018-11-23 | 华中光电技术研究所(中国船舶重工集团有限公司第七七研究所) | 光学玻璃零件粘合胶及粘接技术 |
| JPWO2020175396A1 (enExample) * | 2019-02-28 | 2020-09-03 | ||
| WO2020211091A1 (en) * | 2019-04-19 | 2020-10-22 | Materion Precision Optics (Shanghai) Limited | High temperature resistant reflective layer for wavelength conversion devices |
| KR102269020B1 (ko) * | 2019-12-13 | 2021-06-25 | 한국전자기술연구원 | Led 실장형 디스플레이 및 그의 제조 방법 |
| JP7011195B2 (ja) * | 2020-02-27 | 2022-01-26 | 日亜化学工業株式会社 | 発光装置 |
| CN114368947B (zh) * | 2022-01-11 | 2023-07-25 | 澳门大学 | 一种可用于门板的纳米泡沫玻璃微珠混凝土及其制备方法 |
Citations (3)
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|---|---|---|---|---|
| JP2001139894A (ja) * | 1999-11-15 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | シリコーン系接着性シート、および半導体装置 |
| CN1707326A (zh) * | 2004-06-03 | 2005-12-14 | 日东电工株式会社 | 剥离力调整方法、粘合剂层及带粘合剂的光学构件 |
| CN1777999A (zh) * | 2003-02-26 | 2006-05-24 | 美商克立股份有限公司 | 复合式白色光源及其制造方法 |
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| DE69715504T2 (de) * | 1996-04-26 | 2003-06-05 | Dow Corning Toray Silicone Co. Ltd., Ichihara | Elektrisch leitfähige Silikonkautschukzusammensetzung und ihre Anwendung zur Herstellung von Halbleiteranordnungen |
| JP3950493B2 (ja) * | 1996-04-26 | 2007-08-01 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
| WO1997043117A1 (en) * | 1996-05-16 | 1997-11-20 | Lockheed Martin Energy Systems, Inc. | Low temperature material bonding technique |
| US5777433A (en) * | 1996-07-11 | 1998-07-07 | Hewlett-Packard Company | High refractive index package material and a light emitting device encapsulated with such material |
| US6548176B1 (en) * | 1997-04-03 | 2003-04-15 | The Board Of Trustees Of The Leland Stanford Junior University | Hydroxide-catalyzed bonding |
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| US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
| US6291839B1 (en) * | 1998-09-11 | 2001-09-18 | Lulileds Lighting, U.S. Llc | Light emitting device having a finely-patterned reflective contact |
| US6307218B1 (en) * | 1998-11-20 | 2001-10-23 | Lumileds Lighting, U.S., Llc | Electrode structures for light emitting devices |
| US6455100B1 (en) * | 1999-04-13 | 2002-09-24 | Elisha Technologies Co Llc | Coating compositions for electronic components and other metal surfaces, and methods for making and using the compositions |
| US6376590B2 (en) * | 1999-10-28 | 2002-04-23 | 3M Innovative Properties Company | Zirconia sol, process of making and composite material |
| US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| TWI250190B (en) * | 2001-10-03 | 2006-03-01 | Dow Corning Toray Silicone | Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device |
| US6836602B2 (en) * | 2001-10-26 | 2004-12-28 | Corning Incorporated | Direct bonding of optical components |
| US6734465B1 (en) * | 2001-11-19 | 2004-05-11 | Nanocrystals Technology Lp | Nanocrystalline based phosphors and photonic structures for solid state lighting |
| US6791120B2 (en) * | 2002-03-26 | 2004-09-14 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor device and method of fabricating the same |
| KR20020035819A (ko) | 2002-04-25 | 2002-05-15 | 주식회사 포스기술 | 방수, 방진 구조를 가진 방열판 겸용 반사면을 구비한발광소자 매트릭스 모듈 및 그 형성방법 |
| US6679621B2 (en) * | 2002-06-24 | 2004-01-20 | Lumileds Lighting U.S., Llc | Side emitting LED and lens |
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| TW200406829A (en) * | 2002-09-17 | 2004-05-01 | Adv Lcd Tech Dev Ct Co Ltd | Interconnect, interconnect forming method, thin film transistor, and display device |
| US7118438B2 (en) * | 2003-01-27 | 2006-10-10 | 3M Innovative Properties Company | Methods of making phosphor based light sources having an interference reflector |
| TW200427111A (en) * | 2003-03-12 | 2004-12-01 | Shinetsu Chemical Co | Material for coating/protecting light-emitting semiconductor and the light-emitting semiconductor device |
| US7078735B2 (en) * | 2003-03-27 | 2006-07-18 | Sanyo Electric Co., Ltd. | Light-emitting device and illuminator |
| KR100550491B1 (ko) * | 2003-05-06 | 2006-02-09 | 스미토모덴키고교가부시키가이샤 | 질화물 반도체 기판 및 질화물 반도체 기판의 가공 방법 |
| JP4645071B2 (ja) * | 2003-06-20 | 2011-03-09 | 日亜化学工業株式会社 | パッケージ成型体およびそれを用いた半導体装置 |
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| US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
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| JP4332407B2 (ja) * | 2003-10-31 | 2009-09-16 | シャープ株式会社 | 半導体発光素子及びその製造方法 |
| KR100592327B1 (ko) | 2003-12-19 | 2006-06-21 | 주식회사 코스텍시스 | 전자기기용 발광다이오드 모듈 |
| JP4231418B2 (ja) * | 2004-01-07 | 2009-02-25 | 株式会社小糸製作所 | 発光モジュール及び車両用灯具 |
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-
2007
- 2007-11-15 KR KR1020097012446A patent/KR20090089431A/ko not_active Ceased
- 2007-11-15 JP JP2009537362A patent/JP2010510671A/ja not_active Withdrawn
- 2007-11-15 US US12/514,630 patent/US8026115B2/en not_active Expired - Fee Related
- 2007-11-15 WO PCT/US2007/084806 patent/WO2008064070A1/en not_active Ceased
- 2007-11-15 CN CN200780042714.7A patent/CN101548397B/zh not_active Expired - Fee Related
- 2007-11-15 EP EP07864450A patent/EP2092576A1/en not_active Withdrawn
- 2007-11-16 TW TW096143625A patent/TW200835765A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001139894A (ja) * | 1999-11-15 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | シリコーン系接着性シート、および半導体装置 |
| CN1777999A (zh) * | 2003-02-26 | 2006-05-24 | 美商克立股份有限公司 | 复合式白色光源及其制造方法 |
| CN1707326A (zh) * | 2004-06-03 | 2005-12-14 | 日东电工株式会社 | 剥离力调整方法、粘合剂层及带粘合剂的光学构件 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101548397A (zh) | 2009-09-30 |
| JP2010510671A (ja) | 2010-04-02 |
| US20100059776A1 (en) | 2010-03-11 |
| EP2092576A1 (en) | 2009-08-26 |
| TW200835765A (en) | 2008-09-01 |
| WO2008064070A1 (en) | 2008-05-29 |
| KR20090089431A (ko) | 2009-08-21 |
| US8026115B2 (en) | 2011-09-27 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20171115 |