KR20090089431A - Ｌｅｄ 광원용 광학 접합 조성물 - Google Patents

Ｌｅｄ 광원용 광학 접합 조성물

Info

Publication number
KR20090089431A
KR20090089431A KR1020097012446A KR20097012446A KR20090089431A KR 20090089431 A KR20090089431 A KR 20090089431A KR 1020097012446 A KR1020097012446 A KR 1020097012446A KR 20097012446 A KR20097012446 A KR 20097012446A KR 20090089431 A KR20090089431 A KR 20090089431A
Authority
KR
South Korea
Prior art keywords
oxide
light source
led light
metal oxide
optical element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097012446A
Other languages
English (en)
Korean (ko)
Inventor
에이미 에스. 바르네스
디. 스콧 톰슨
브랜트 유. 콜브
토드 에이. 발렌
자퀠린 씨. 롤프
로버트 엘. 브롯
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20090089431A publication Critical patent/KR20090089431A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biophysics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
KR1020097012446A 2006-11-17 2007-11-15 Ｌｅｄ 광원용 광학 접합 조성물 Ceased KR20090089431A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86628006P 2006-11-17 2006-11-17
US60/866,280 2006-11-17

Publications (1)

Publication Number Publication Date
KR20090089431A true KR20090089431A (ko) 2009-08-21

Family

ID=39430051

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097012446A Ceased KR20090089431A (ko) 2006-11-17 2007-11-15 Ｌｅｄ 광원용 광학 접합 조성물

Country Status (7)

Country Link
US (1) US8026115B2 (enExample)
EP (1) EP2092576A1 (enExample)
JP (1) JP2010510671A (enExample)
KR (1) KR20090089431A (enExample)
CN (1) CN101548397B (enExample)
TW (1) TW200835765A (enExample)
WO (1) WO2008064070A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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KR20120129604A (ko) * 2011-05-20 2012-11-28 삼성전자주식회사 광전자 소자 및 적층 구조
US8665509B2 (en) 2010-12-23 2014-03-04 Samsung Display Co., Ltd. Method of bonding metal and glass using optical contact bonding, method of manufacturing display apparatus using the method of bonding, and display apparatus manufactured by the method of bonding

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DE102010024545B4 (de) 2010-06-22 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
JP5087672B2 (ja) 2010-12-13 2012-12-05 株式会社東芝 半導体発光素子
KR101293791B1 (ko) 2011-05-16 2013-08-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
US10043942B2 (en) * 2013-10-17 2018-08-07 Luminus Devices, Inc. Vertical multi-junction light emitting diode
EP2953176A1 (de) * 2014-06-02 2015-12-09 Swarovski Energy GmbH Beleuchtungsvorrichtung
CN104531052A (zh) * 2015-01-06 2015-04-22 段志春 一种纳米锆铌硅酮密封胶及其制作方法
JP6668608B2 (ja) * 2015-04-27 2020-03-18 日亜化学工業株式会社 発光装置の製造方法
KR102359811B1 (ko) * 2016-05-12 2022-02-09 루미리즈 홀딩 비.브이. 시준하는 온-다이 광학계
US10466404B2 (en) 2016-05-12 2019-11-05 Lumileds Llc Collimating on-die optic
US10290779B2 (en) * 2016-12-15 2019-05-14 Panasonic Intellectual Property Management Co., Ltd. Light emitting element
CN108864952A (zh) * 2018-04-26 2018-11-23 华中光电技术研究所（中国船舶重工集团有限公司第七七研究所） 光学玻璃零件粘合胶及粘接技术
JPWO2020175396A1 (enExample) * 2019-02-28 2020-09-03
WO2020211091A1 (en) * 2019-04-19 2020-10-22 Materion Precision Optics (Shanghai) Limited High temperature resistant reflective layer for wavelength conversion devices
KR102269020B1 (ko) * 2019-12-13 2021-06-25 한국전자기술연구원 Led 실장형 디스플레이 및 그의 제조 방법
JP7011195B2 (ja) * 2020-02-27 2022-01-26 日亜化学工業株式会社 発光装置
CN114368947B (zh) * 2022-01-11 2023-07-25 澳门大学 一种可用于门板的纳米泡沫玻璃微珠混凝土及其制备方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8665509B2 (en) 2010-12-23 2014-03-04 Samsung Display Co., Ltd. Method of bonding metal and glass using optical contact bonding, method of manufacturing display apparatus using the method of bonding, and display apparatus manufactured by the method of bonding
KR20120129604A (ko) * 2011-05-20 2012-11-28 삼성전자주식회사 광전자 소자 및 적층 구조

Also Published As

Publication number Publication date
CN101548397A (zh) 2009-09-30
JP2010510671A (ja) 2010-04-02
US20100059776A1 (en) 2010-03-11
CN101548397B (zh) 2011-12-21
EP2092576A1 (en) 2009-08-26
TW200835765A (en) 2008-09-01
WO2008064070A1 (en) 2008-05-29
US8026115B2 (en) 2011-09-27

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