JP2013534728A - 半導体素子および半導体素子の製造方法 - Google Patents
半導体素子および半導体素子の製造方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000003287 optical effect Effects 0.000 claims abstract description 106
- 239000002861 polymer material Substances 0.000 claims abstract description 23
- 229920002100 high-refractive-index polymer Polymers 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 43
- 239000012778 molding material Substances 0.000 claims description 37
- 238000001723 curing Methods 0.000 claims description 27
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 8
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- 150000002118 epoxides Chemical class 0.000 claims description 6
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- 230000001939 inductive effect Effects 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 abstract description 2
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- 238000004020 luminiscence type Methods 0.000 description 6
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- 238000004132 cross linking Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- -1 phosphorus compound Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- 238000001879 gelation Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- 230000009467 reduction Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
Description
Claims (15)
- 光電半導体チップ(2)と当該半導体チップの光線通過面(20)上に配置された光学素子(3)とを備える半導体構成素子(1)であって、
前記光学素子は高屈折率のポリマー材料をベースにする半導体構成素子。 - 請求項1に記載の半導体構成素子であって、
前記光学素子は、シリコーン、エポキシドまたはハイブリッド材料を含む半導体構成素子。 - 請求項1または2に記載の半導体構成素子であって、
前記高屈折率のポリマー材料には、屈折率を高めるためにナノ粒子が埋め込まれている半導体構成素子。 - 請求項1から3までのいずれか1項に記載の半導体構成素子であって、
前記光学素子は、前記半導体チップとは反対の側では当該半導体構成素子を上から見る方向で凸状に湾曲している半導体構成素子。 - 請求項1から4までのいずれか1項に記載の半導体構成素子であって、
前記光学素子は、横方向には最大でも前記半導体チップの側面(201)までしか延在しない半導体構成素子。 - 請求項1から5までのいずれか1項に記載の半導体構成素子であって、
前記光学素子に発光変換物質(32)が埋め込まれている半導体構成素子。 - 請求項1から5までのいずれか1項に記載の半導体構成素子であって、
前記光学素子には発光変換物質(32)が埋め込まれており、前記光学素子の前記半導体チップとは反対の側には別の光学素子(35)が配置されており、該別の光学素子は高屈折率のポリマー材料をベースにし、凸状に湾曲している半導体構成素子。 - 請求項7に記載の半導体構成素子であって、
前記半導体チップと前記光学素子との間には高屈折率の接続層(31)が配置されている半導体構成素子。 - a)光電半導体チップ(2)を準備するステップと、
b)光学素子(3)用の成形材料(30)を取り付けるステップと、ただし前記成形材料は高屈折率のポリマー材料をベースにし、
c)前記成形材料を、高くても50℃の温度で予硬化するステップと、
d)前記成形材料を硬化するステップと、
を有する半導体構成素子(1)の製造方法。 - 請求項9に記載の方法であって、
前記予硬化を電磁光線によって誘発する方法。 - 請求項10に記載の方法であって、
前記成形材料は前記ステップc)で、0.2J/cm2から2.0J/cm2のエネルギー量を備える光線に晒される方法。 - 請求項9から11までのいずれか1項に記載の方法であって、
前記成形材料は前記ステップc)で、当該成形材料の少なくとも2つの成分の混合によって活性化される方法。 - 請求項9から12までのいずれか1項に記載の方法であって、
前記ステップd)は、前記ステップc)での温度よりも高い温度で実施される方法。 - 請求項9から13までのいずれか1項に記載の方法であって、
前記ステップd)では熱的硬化が実施される方法。 - 請求項9から14までのいずれか1項に記載の方法であって、
請求項1から8までのいずれか1項に記載の半導体構成素子が製造される方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102010024545.3 | 2010-06-22 | ||
DE102010024545.3A DE102010024545B4 (de) | 2010-06-22 | 2010-06-22 | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
PCT/EP2011/058580 WO2011160913A1 (de) | 2010-06-22 | 2011-05-25 | Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements |
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JP2013534728A true JP2013534728A (ja) | 2013-09-05 |
JP2013534728A5 JP2013534728A5 (ja) | 2016-07-28 |
JP6315988B2 JP6315988B2 (ja) | 2018-04-25 |
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DE102014108368A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Halbleiterbauelement und Verfahren zu dessen Herstellung |
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US9634207B2 (en) | 2017-04-25 |
TW201208148A (en) | 2012-02-16 |
EP2586069B1 (de) | 2017-03-01 |
WO2011160913A1 (de) | 2011-12-29 |
JP6315988B2 (ja) | 2018-04-25 |
KR20130023347A (ko) | 2013-03-07 |
CN102947959A (zh) | 2013-02-27 |
DE102010024545A1 (de) | 2011-12-22 |
US9368699B2 (en) | 2016-06-14 |
US20160247986A1 (en) | 2016-08-25 |
TW201541673A (zh) | 2015-11-01 |
EP2586069A1 (de) | 2013-05-01 |
TWI497776B (zh) | 2015-08-21 |
CN105529392A (zh) | 2016-04-27 |
CN102947959B (zh) | 2016-01-27 |
TWI545809B (zh) | 2016-08-11 |
CN105529392B (zh) | 2019-10-18 |
DE102010024545B4 (de) | 2022-01-13 |
KR20170131724A (ko) | 2017-11-29 |
US20130240929A1 (en) | 2013-09-19 |
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