JP2010510228A5 - - Google Patents

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JP2010510228A5
JP2010510228A5 JP2009537237A JP2009537237A JP2010510228A5 JP 2010510228 A5 JP2010510228 A5 JP 2010510228A5 JP 2009537237 A JP2009537237 A JP 2009537237A JP 2009537237 A JP2009537237 A JP 2009537237A JP 2010510228 A5 JP2010510228 A5 JP 2010510228A5
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group
bis
alkyl
dicarboxamide
mmol
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JP2009537237A
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JP2010510228A (ja
JP5380296B2 (ja
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Priority claimed from PCT/US2007/024189 external-priority patent/WO2008063609A2/en
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JP2009537237A 2006-11-17 2007-11-19 ジイミド系半導体材料ならびにジイミド系半導体材料を調製および使用する方法 Expired - Fee Related JP5380296B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US85976106P 2006-11-17 2006-11-17
US60/859,761 2006-11-17
PCT/US2007/024189 WO2008063609A2 (en) 2006-11-17 2007-11-19 Diimide-based semiconductor materials and methods of preparing and using the same

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JP2010510228A JP2010510228A (ja) 2010-04-02
JP2010510228A5 true JP2010510228A5 (enExample) 2011-12-15
JP5380296B2 JP5380296B2 (ja) 2014-01-08

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JP2009537237A Expired - Fee Related JP5380296B2 (ja) 2006-11-17 2007-11-19 ジイミド系半導体材料ならびにジイミド系半導体材料を調製および使用する方法

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US (1) US7902363B2 (enExample)
EP (1) EP2086974B1 (enExample)
JP (1) JP5380296B2 (enExample)
WO (1) WO2008063609A2 (enExample)

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