JP2010212669A5 - - Google Patents

Download PDF

Info

Publication number
JP2010212669A5
JP2010212669A5 JP2010027358A JP2010027358A JP2010212669A5 JP 2010212669 A5 JP2010212669 A5 JP 2010212669A5 JP 2010027358 A JP2010027358 A JP 2010027358A JP 2010027358 A JP2010027358 A JP 2010027358A JP 2010212669 A5 JP2010212669 A5 JP 2010212669A5
Authority
JP
Japan
Prior art keywords
coil
coil transducer
layer
transducer
core layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010027358A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010212669A (ja
JP5647795B2 (ja
Filing date
Publication date
Priority claimed from US12/370,208 external-priority patent/US9105391B2/en
Application filed filed Critical
Publication of JP2010212669A publication Critical patent/JP2010212669A/ja
Publication of JP2010212669A5 publication Critical patent/JP2010212669A5/ja
Application granted granted Critical
Publication of JP5647795B2 publication Critical patent/JP5647795B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010027358A 2009-02-12 2010-02-10 高電圧耐圧コイルトランスジューサ（コイル変換器） Expired - Fee Related JP5647795B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/370,208 US9105391B2 (en) 2006-08-28 2009-02-12 High voltage hold-off coil transducer
US12/370,208 2009-02-12

Publications (3)

Publication Number Publication Date
JP2010212669A JP2010212669A (ja) 2010-09-24
JP2010212669A5 true JP2010212669A5 (enExample) 2013-03-21
JP5647795B2 JP5647795B2 (ja) 2015-01-07

Family

ID=42338911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010027358A Expired - Fee Related JP5647795B2 (ja) 2009-02-12 2010-02-10 高電圧耐圧コイルトランスジューサ（コイル変換器）

Country Status (3)

Country Link
US (1) US9105391B2 (enExample)
JP (1) JP5647795B2 (enExample)
DE (1) DE102010001888B4 (enExample)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8093983B2 (en) * 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
US7791900B2 (en) * 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
US8427844B2 (en) 2006-08-28 2013-04-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Widebody coil isolators
US8385043B2 (en) * 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
US8061017B2 (en) * 2006-08-28 2011-11-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Methods of making coil transducers
US20080278275A1 (en) 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
US9019057B2 (en) 2006-08-28 2015-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US8258911B2 (en) * 2008-03-31 2012-09-04 Avago Technologies ECBU IP (Singapor) Pte. Ltd. Compact power transformer components, devices, systems and methods
US8380146B2 (en) * 2009-12-31 2013-02-19 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-band, multi-mode RF transmit amplifier system with separate signal paths for linear and saturated operation
US8237535B2 (en) 2010-04-16 2012-08-07 World Properties, Inc. Integral planar transformer and busbar
JP5839535B2 (ja) * 2010-10-20 2016-01-06 旭化成エレクトロニクス株式会社 平面コイル及びアクチュエータ
US9303971B1 (en) * 2010-12-15 2016-04-05 The Boeing Company High aspect ratio positioning system
US8614616B2 (en) 2011-01-18 2013-12-24 Infineon Technologies Ag Semiconductor device and method of manufacture thereof
US8572838B2 (en) 2011-03-02 2013-11-05 Honeywell International Inc. Methods for fabricating high temperature electromagnetic coil assemblies
JP5711572B2 (ja) * 2011-03-02 2015-05-07 日東電工株式会社 アイソレータ用回路基板、アイソレータおよびそれらの製造方法
US8466767B2 (en) 2011-07-20 2013-06-18 Honeywell International Inc. Electromagnetic coil assemblies having tapered crimp joints and methods for the production thereof
KR101541570B1 (ko) * 2011-09-30 2015-08-04 삼성전기주식회사 코일 부품 및 그 제조방법
US9141157B2 (en) * 2011-10-13 2015-09-22 Texas Instruments Incorporated Molded power supply system having a thermally insulated component
US8860541B2 (en) 2011-10-18 2014-10-14 Honeywell International Inc. Electromagnetic coil assemblies having braided lead wires and methods for the manufacture thereof
JP5800691B2 (ja) * 2011-11-25 2015-10-28 ルネサスエレクトロニクス株式会社 トランス
US8754735B2 (en) 2012-04-30 2014-06-17 Honeywell International Inc. High temperature electromagnetic coil assemblies including braided lead wires and methods for the fabrication thereof
US9076581B2 (en) 2012-04-30 2015-07-07 Honeywell International Inc. Method for manufacturing high temperature electromagnetic coil assemblies including brazed braided lead wires
EP2682958A1 (en) * 2012-07-04 2014-01-08 Alstom Technology Ltd Transformer
DE102012016569A1 (de) * 2012-08-22 2014-02-27 Phoenix Contact Gmbh & Co. Kg Planarer Übertrager
US9508485B1 (en) * 2012-10-04 2016-11-29 Vlt, Inc. Isolator with integral transformer
US9035435B2 (en) 2012-11-14 2015-05-19 Power Integrations, Inc. Magnetically coupled galvanically isolated communication using lead frame
US8818296B2 (en) 2012-11-14 2014-08-26 Power Integrations, Inc. Noise cancellation for a magnetically coupled communication link utilizing a lead frame
US9027228B2 (en) 2012-11-29 2015-05-12 Honeywell International Inc. Method for manufacturing electromagnetic coil assemblies
US20140151095A1 (en) * 2012-12-05 2014-06-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
JP6170568B2 (ja) * 2012-12-19 2017-07-26 テレフオンアクチーボラゲット エルエム エリクソン（パブル） 平面トランス
DE102013101768A1 (de) * 2013-02-22 2014-08-28 Intel Mobile Communications GmbH Transformator und elektrische Schaltung
US9929038B2 (en) 2013-03-07 2018-03-27 Analog Devices Global Insulating structure, a method of forming an insulating structure, and a chip scale isolator including such an insulating structure
US9722464B2 (en) 2013-03-13 2017-08-01 Honeywell International Inc. Gas turbine engine actuation systems including high temperature actuators and methods for the manufacture thereof
CN105190992B (zh) * 2013-04-15 2018-02-09 松下知识产权经营株式会社 高频传输装置
JP6591637B2 (ja) * 2013-11-13 2019-10-16 ローム株式会社 半導体装置および半導体モジュール
JP6395304B2 (ja) * 2013-11-13 2018-09-26 ローム株式会社 半導体装置および半導体モジュール
KR101892689B1 (ko) 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US9799441B2 (en) 2015-03-19 2017-10-24 Ricoh Company, Ltd. Transformer and plasma generator
JP2016001751A (ja) * 2015-08-25 2016-01-07 ルネサスエレクトロニクス株式会社 トランス
US10720788B2 (en) * 2015-10-09 2020-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wireless charging devices having wireless charging coils and methods of manufacture thereof
US10204732B2 (en) 2015-10-23 2019-02-12 Analog Devices Global Dielectric stack, an isolator device and method of forming an isolator device
US9941565B2 (en) 2015-10-23 2018-04-10 Analog Devices Global Isolator and method of forming an isolator
US10497506B2 (en) * 2015-12-18 2019-12-03 Texas Instruments Incorporated Methods and apparatus for isolation barrier with integrated magnetics for high power modules
US11227825B2 (en) 2015-12-21 2022-01-18 Intel Corporation High performance integrated RF passives using dual lithography process
CN109314467B (zh) * 2016-06-24 2020-11-03 三菱电机株式会社 绝缘型转换器
US9978696B2 (en) 2016-09-14 2018-05-22 Analog Devices, Inc. Single lead-frame stacked die galvanic isolator
US11049639B2 (en) * 2017-02-13 2021-06-29 Analog Devices, Inc. Coupled coils with lower far field radiation and higher noise immunity
CN108933029A (zh) * 2017-05-24 2018-12-04 通用电气公司 具有电流隔离的信号和功率传输集成系统
CN109524364B (zh) 2017-09-19 2023-09-26 恩智浦美国有限公司 具有堆叠管芯的封装式集成电路和其方法
US20190109061A1 (en) 2017-10-11 2019-04-11 Texas Instruments Incorporated Edge Bend for Isolation Packages
US10700551B2 (en) * 2018-05-21 2020-06-30 Raytheon Company Inductive wireless power transfer device with improved coupling factor and high voltage isolation
JP7462525B2 (ja) 2018-06-01 2024-04-05 株式会社タムラ製作所 電子部品
CN112352298B (zh) * 2018-06-29 2024-05-28 新电元工业株式会社 电子装置
US10734312B2 (en) 2018-07-18 2020-08-04 Nxp Usa, Inc. Packaged integrated circuit having stacked die and method for therefor
US11044022B2 (en) 2018-08-29 2021-06-22 Analog Devices Global Unlimited Company Back-to-back isolation circuit
US12176285B2 (en) 2018-12-31 2024-12-24 Texas Instruments Incorporated Transformer guard trace
US11538766B2 (en) 2019-02-26 2022-12-27 Texas Instruments Incorporated Isolated transformer with integrated shield topology for reduced EMI
US11450469B2 (en) 2019-08-28 2022-09-20 Analog Devices Global Unlimited Company Insulation jacket for top coil of an isolated transformer
US11164826B2 (en) 2019-08-30 2021-11-02 Nxp Usa, Inc. Packaged integrated circuit having stacked die and method for making
US10847297B1 (en) 2019-10-16 2020-11-24 Hong Kong Applied Science and Technology Research Institute Company, Limited Low-core-loss transformer with magnetic pillar in center of four corner pillars
US11387316B2 (en) 2019-12-02 2022-07-12 Analog Devices International Unlimited Company Monolithic back-to-back isolation elements with floating top plate
US11538741B2 (en) * 2020-02-17 2022-12-27 Texas Instruments Incorporated Multi-chip module leadless package
JP7284121B2 (ja) * 2020-03-23 2023-05-30 株式会社東芝 アイソレータ
US11706057B2 (en) 2021-06-18 2023-07-18 Nunami Inc. Devices, systems, and methods for serial communication over a galvanically isolated channel
JP2023141929A (ja) * 2022-03-24 2023-10-05 株式会社東芝 アイソレータ

Family Cites Families (161)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8018A (en) * 1851-04-01 Improvement in seed-planters
US4027152A (en) * 1975-11-28 1977-05-31 Hewlett-Packard Company Apparatus and method for transmitting binary-coded information
DE2752783C2 (de) 1977-11-25 1979-08-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gerät zum Erfassen und Verarbeiten von elektrischen Signalen
JPS5739598Y2 (enExample) 1979-01-19 1982-08-31
US4494100A (en) * 1982-07-12 1985-01-15 Motorola, Inc. Planar inductors
FR2546704B1 (fr) * 1983-05-27 1986-04-18 Rhone Poulenc Sa Substrats metallisables pour circuits imprimes et leur procede de preparation
JPH0234328Y2 (enExample) 1984-09-25 1990-09-14
AT389744B (de) 1987-09-09 1990-01-25 Steyr Daimler Puch Ag Schalldaemmende verschalung fuer brennkraftmaschinen
EP0361967B1 (en) * 1988-09-30 1995-12-20 Kabushiki Kaisha Toshiba Planar inductor
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
US4931075A (en) * 1989-08-07 1990-06-05 Ppg Industries, Inc. High current multiterminal bushing controller
US5015972A (en) 1989-08-17 1991-05-14 Motorola, Inc. Broadband RF transformer
KR960006848B1 (ko) * 1990-05-31 1996-05-23 가부시끼가이샤 도시바 평면형 자기소자
JPH0466826U (enExample) 1990-10-16 1992-06-12
JP3141562B2 (ja) * 1992-05-27 2001-03-05 富士電機株式会社 薄膜トランス装置
JP2897091B2 (ja) * 1992-07-09 1999-05-31 株式会社村田製作所 ライントランス
US5312674A (en) * 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
JP3171705B2 (ja) 1992-11-11 2001-06-04 株式会社イノアックコーポレーション 可倒式ヘッドレストの製造方法
US5444600A (en) 1992-12-03 1995-08-22 Linear Technology Corporation Lead frame capacitor and capacitively-coupled isolator circuit using the same
JPH0653052U (ja) 1992-12-28 1994-07-19 リョービ株式会社 研磨盤
DE9304784U1 (de) * 1993-03-29 1993-08-05 Cooper Tools GmbH, 74354 Besigheim Löt-/Entlötvorrichtung, insbesondere für integrierte Schaltungen
JP3245692B2 (ja) * 1993-07-21 2002-01-15 長野日本無線株式会社 プリント基板
DE4334592C1 (de) 1993-10-11 1994-07-21 Siemens Ag Hochfrequenz-Generator
JPH07202097A (ja) 1994-01-11 1995-08-04 Hitachi Ltd 半導体装置及びリードフレーム
US5489850A (en) * 1994-05-09 1996-02-06 Xerox Corporation Balanced beam electrostatic voltmeter modulator employing a shielded electrode and carbon fiber conductors
EP0774187A1 (en) * 1994-08-03 1997-05-21 Madge Networks Limited Electromagnetic interference isolator
US5701037A (en) 1994-11-15 1997-12-23 Siemens Aktiengesellschaft Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit
US5754088A (en) * 1994-11-17 1998-05-19 International Business Machines Corporation Planar transformer and method of manufacture
US5716713A (en) * 1994-12-16 1998-02-10 Ceramic Packaging, Inc. Stacked planar transformer
FR2729964B1 (fr) 1995-01-31 2003-02-28 Omya Sa Charges minerales traitees. suspensions de ces charges dans des polyols et leurs utilisations dans les mousses polyurethannes
US5642276A (en) 1995-02-08 1997-06-24 Lucent Technologies Inc. High frequency surface mount transformer-diode power module
JPH08236365A (ja) * 1995-02-27 1996-09-13 Nippon Signal Co Ltd:The 平板状トランス
JP2730506B2 (ja) 1995-02-27 1998-03-25 日本電気株式会社 圧電トランスを用いたｄｃ／ｄｃコンバータ
US5597979A (en) 1995-05-12 1997-01-28 Schlegel Corporation EMI shielding having flexible condustive sheet and I/O Gasket
JPH08340079A (ja) 1995-06-13 1996-12-24 Nippon Telegr & Teleph Corp <Ntt> マルチチップモジュール
KR100452022B1 (ko) 1995-10-31 2004-12-14 더 휘태커 코포레이션 다중층금속중합체구조를이용한알에프변압기
GB9605367D0 (en) 1996-03-14 1996-05-15 Nat Grid Comp Plc Switchgear device
US5659462A (en) * 1996-04-12 1997-08-19 Lucent Technologies Inc. Encapsulated, integrated power magnetic device and method of manufacture therefor
US5693871A (en) * 1996-07-12 1997-12-02 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Low differential pressure generator
JP3130809B2 (ja) 1996-11-19 2001-01-31 日本電気株式会社 半導体装置
US5952849A (en) * 1997-02-21 1999-09-14 Analog Devices, Inc. Logic isolator with high transient immunity
US6091966A (en) 1997-09-29 2000-07-18 Ericsson, Inc. Dual-band, dual-mode power amplifier
US20030042571A1 (en) 1997-10-23 2003-03-06 Baoxing Chen Chip-scale coils and isolators based thereon
US6873065B2 (en) * 1997-10-23 2005-03-29 Analog Devices, Inc. Non-optical signal isolator
TW388889B (en) * 1997-12-17 2000-05-01 Koninkl Philips Electronics Nv Planar transformer
US6300617B1 (en) 1998-03-04 2001-10-09 Nonvolatile Electronics, Incorporated Magnetic digital signal coupler having selected/reversal directions of magnetization
US6215377B1 (en) * 1998-05-26 2001-04-10 Microsubstrates Corporation Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
US6167475A (en) * 1998-07-06 2000-12-26 International Business Machines Corporation Data transfer method/engine for pipelining shared memory bus accesses
JP2000114047A (ja) 1998-10-07 2000-04-21 Alps Electric Co Ltd 薄膜トランス及び薄膜トランスの製造方法
DE19911133C2 (de) 1999-03-12 2001-06-28 Eckhard Mademann Trennschaltkreis
US6198374B1 (en) 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
US6320532B1 (en) * 1999-05-27 2001-11-20 Rosemount Inc. Low power radar level transmitter having reduced ground loop errors
US6255714B1 (en) * 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
JP3654816B2 (ja) 1999-08-26 2005-06-02 Ｆｄｋ株式会社 マルチチャンネル・ユニフォーム出力型トランス
CN1175617C (zh) * 1999-09-14 2004-11-10 皇家菲利浦电子有限公司 网络耦连器
US6476704B2 (en) * 1999-11-18 2002-11-05 The Raytheon Company MMIC airbridge balun transformer
US6856228B2 (en) * 1999-11-23 2005-02-15 Intel Corporation Integrated inductor
US6891461B2 (en) * 1999-11-23 2005-05-10 Intel Corporation Integrated transformer
US6870456B2 (en) * 1999-11-23 2005-03-22 Intel Corporation Integrated transformer
US6835576B2 (en) * 2000-05-02 2004-12-28 Fuji Electric Co., Ltd. Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device
US6262600B1 (en) * 2000-02-14 2001-07-17 Analog Devices, Inc. Isolator for transmitting logic signals across an isolation barrier
JP4126519B2 (ja) 2000-03-10 2008-07-30 富士フイルム株式会社 カメラシステム
JP3452028B2 (ja) * 2000-05-09 2003-09-29 株式会社村田製作所 チップインダクタ及びその製造方法
CN1230840C (zh) * 2000-11-21 2005-12-07 皇家菲利浦电子有限公司 系统、印刷电路板、充电器装置、用户装置及设备
KR20020057469A (ko) * 2001-01-05 2002-07-11 윤종용 코어 없는 초박형 프린트회로기판 변압기 및 그프린트회로기판 변압기를 이용한 무접점 배터리 충전기
JP2002260936A (ja) 2001-03-06 2002-09-13 Hitachi Ltd 内燃機関の点火回路モジュール及び点火コイル装置
US6489850B2 (en) * 2001-03-16 2002-12-03 International Business Machines Corporation Crosstalk suppression in differential AC coupled multichannel IC amplifiers
US6882239B2 (en) 2001-05-08 2005-04-19 Formfactor, Inc. Electromagnetically coupled interconnect system
US7016490B2 (en) 2001-05-21 2006-03-21 Conexant Systems, Inc. Circuit board capacitor structure for forming a high voltage isolation barrier
US6501364B1 (en) * 2001-06-15 2002-12-31 City University Of Hong Kong Planar printed-circuit-board transformers with effective electromagnetic interference (EMI) shielding
US6888438B2 (en) * 2001-06-15 2005-05-03 City University Of Hong Kong Planar printed circuit-board transformers with effective electromagnetic interference (EMI) shielding
JP2003017338A (ja) 2001-06-29 2003-01-17 Hitachi Chem Co Ltd 電気・電子部品
US7623859B2 (en) 2001-09-14 2009-11-24 Atc Technologies, Llc Additional aggregate radiated power control for multi-band/multi-mode satellite radiotelephone communications systems and methods
US6819941B2 (en) 2001-10-11 2004-11-16 Rf Micro Devices, Inc. Single output stage power amplification for multimode applications
US6859130B2 (en) * 2001-10-24 2005-02-22 Matsushita Electric Industrial Co., Ltd. Low-profile transformer and method of manufacturing the transformer
DE10154906A1 (de) 2001-10-30 2003-05-28 Osram Opto Semiconductors Gmbh Optokoppler
GB2382231B (en) 2001-11-01 2003-12-24 Motorola Inc Isolator devices for current suppression
US6538313B1 (en) * 2001-11-13 2003-03-25 National Semiconductor Corporation IC package with integral substrate capacitor
JP2003151829A (ja) 2001-11-14 2003-05-23 Fdk Corp チップインダクタ
US6801114B2 (en) * 2002-01-23 2004-10-05 Broadcom Corp. Integrated radio having on-chip transformer balun
US6661079B1 (en) * 2002-02-20 2003-12-09 National Semiconductor Corporation Semiconductor-based spiral capacitor
EP1355316B1 (en) * 2002-04-18 2007-02-21 Innovative Silicon SA Data storage device and refreshing method for use with such device
CN1180277C (zh) 2002-06-20 2004-12-15 钟伟章 暗线探测仪
DE10232642B4 (de) * 2002-07-18 2006-11-23 Infineon Technologies Ag Integrierte Transformatoranordnung
CN1237081C (zh) 2002-11-07 2006-01-18 中国石油天然气股份有限公司 超高分子量聚丙烯酰胺合成工艺技术中的水解方法
US7064662B2 (en) 2002-12-11 2006-06-20 Oils Wells, Inc. Master signal transmitter with allied servant receiver to receive a directed signal from the transmitter
KR20050093808A (ko) * 2002-12-27 2005-09-23 티디케이가부시기가이샤 수지조성물, 수지경화물, 시트형상 수지경화물, 적층체,프리프레그, 전자부품 및 다층기판
US6867678B2 (en) * 2003-01-28 2005-03-15 Entrust Power Co., Ltd. Transformer structure
US7376116B2 (en) 2003-02-03 2008-05-20 Skyworks Solutions, Inc. Software defined multiple transmit architecture
US6944009B2 (en) * 2003-02-11 2005-09-13 Oplink Communications, Inc. Ultra broadband capacitor assembly
WO2004095624A1 (ja) * 2003-04-24 2004-11-04 Matsushita Electric Industrial Co., Ltd. 高周波回路
EP2302850A1 (en) 2003-04-30 2011-03-30 Analog Devices, Inc. Signal isolators using micro-transformers
JP2003318029A (ja) * 2003-05-30 2003-11-07 Tdk Corp 積層電子部品
US6992387B2 (en) 2003-06-23 2006-01-31 Intel Corporation Capacitor-related systems for addressing package/motherboard resonance
US7064442B1 (en) * 2003-07-02 2006-06-20 Analog Devices, Inc. Integrated circuit package device
US6970040B1 (en) 2003-11-13 2005-11-29 Rf Micro Devices, Inc. Multi-mode/multi-band power amplifier
US7084728B2 (en) * 2003-12-15 2006-08-01 Nokia Corporation Electrically decoupled integrated transformer having at least one grounded electric shield
US7177370B2 (en) 2003-12-17 2007-02-13 Triquint Semiconductor, Inc. Method and architecture for dual-mode linear and saturated power amplifier operation
JP4162583B2 (ja) * 2003-12-19 2008-10-08 三井金属鉱業株式会社 プリント配線板および半導体装置
US7302247B2 (en) 2004-06-03 2007-11-27 Silicon Laboratories Inc. Spread spectrum isolator
US7447492B2 (en) 2004-06-03 2008-11-04 Silicon Laboratories Inc. On chip transformer isolator
US8049573B2 (en) 2004-06-03 2011-11-01 Silicon Laboratories Inc. Bidirectional multiplexed RF isolator
US7460604B2 (en) * 2004-06-03 2008-12-02 Silicon Laboratories Inc. RF isolator for isolating voltage sensing and gate drivers
US7421028B2 (en) 2004-06-03 2008-09-02 Silicon Laboratories Inc. Transformer isolator for digital power supply
US7737871B2 (en) 2004-06-03 2010-06-15 Silicon Laboratories Inc. MCU with integrated voltage isolator to provide a galvanic isolation between input and output
US7376212B2 (en) 2004-06-03 2008-05-20 Silicon Laboratories Inc. RF isolator with differential input/output
US7821428B2 (en) 2004-06-03 2010-10-26 Silicon Laboratories Inc. MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link
US7577223B2 (en) 2004-06-03 2009-08-18 Silicon Laboratories Inc. Multiplexed RF isolator circuit
US7738568B2 (en) * 2004-06-03 2010-06-15 Silicon Laboratories Inc. Multiplexed RF isolator
NO320550B1 (no) 2004-06-07 2005-12-19 Applied Plasma Physics Asa Anordning ved planar hoyspenningstransformator
DE102004034248A1 (de) 2004-07-14 2006-02-02 Endress + Hauser Flowtec Ag, Reinach Elektronische Schaltung mit galvanisch getrennten Baugruppen
DE102004036139B4 (de) * 2004-07-26 2008-09-04 Infineon Technologies Ag Bauelementanordnung mit einem planaren Transformator
DE102004038306A1 (de) * 2004-08-04 2006-03-30 Siemens Ag Verfahren zur Parametrierung eines elektrischen Feldgerätes und parametrierbares elektrisches Feldgerät
CN101027734B (zh) 2004-09-24 2011-09-14 皇家飞利浦电子股份有限公司 变压器
US20060095639A1 (en) * 2004-11-02 2006-05-04 Guenin Bruce M Structures and methods for proximity communication using bridge chips
EP1861857A4 (en) * 2004-12-07 2009-09-02 Multi Fineline Electronix Inc MINIATURE CIRCUITS AND INDUCTIVE COMPONENTS AND MANUFACTURING METHOD THEREFOR
US7436282B2 (en) * 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
JP2006229190A (ja) * 2005-01-24 2006-08-31 Sanyo Electric Co Ltd 半導体装置
US7280024B2 (en) * 2005-02-02 2007-10-09 Intel Corporation Integrated transformer structure and method of fabrication
JP4769033B2 (ja) * 2005-03-23 2011-09-07 スミダコーポレーション株式会社 インダクタ
JP2006286805A (ja) * 2005-03-31 2006-10-19 Fujitsu Ltd 可変インダクタ
US7683707B2 (en) 2005-09-01 2010-03-23 Danmarks Tekniske Universitet Self-oscillating modulator
JP2007086285A (ja) 2005-09-21 2007-04-05 Fujifilm Corp レジスト組成物及びそれを用いたパターン形成方法
US7483274B2 (en) 2005-09-29 2009-01-27 Welch Allyn, Inc. Galvanic isolation of a signal using capacitive coupling embedded within a circuit board
US20070085632A1 (en) * 2005-10-18 2007-04-19 Larson John D Iii Acoustic galvanic isolator
US7525398B2 (en) * 2005-10-18 2009-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustically communicating data signals across an electrical isolation barrier
US7425787B2 (en) * 2005-10-18 2008-09-16 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating single insulated decoupled stacked bulk acoustic resonator with acoustically-resonant electrical insulator
KR100653653B1 (ko) * 2005-12-12 2006-12-06 한국전자통신연구원 수십㎓ 대역에서 ｒｆ의 진행방향을 변경할 수 있도록개선된 코플래너 웨이브가이드 및 이를 적용한 광통신용모듈
EP1972900B1 (en) * 2006-01-06 2014-08-06 NTN Corporation Rotation angle detector and bearing with rotation angle detector
WO2007086285A1 (ja) 2006-01-30 2007-08-02 Nec Corporation 信号伝送方式及び半導体集積回路装置
TWI407870B (zh) * 2006-04-25 2013-09-01 日本特殊陶業股份有限公司 配線基板之製造方法
JP4924107B2 (ja) 2006-04-27 2012-04-25 ソニー株式会社 無線通信システム、並びに無線通信装置及び無線通信方法
US7449987B2 (en) * 2006-07-06 2008-11-11 Harris Corporation Transformer and associated method of making
US7719305B2 (en) 2006-07-06 2010-05-18 Analog Devices, Inc. Signal isolator using micro-transformers
US20080051158A1 (en) * 2006-08-22 2008-02-28 Texas Instruments Incorporated Galvanic isolation integrated in a signal channel
US8385043B2 (en) * 2006-08-28 2013-02-26 Avago Technologies ECBU IP (Singapoare) Pte. Ltd. Galvanic isolator
US8427844B2 (en) 2006-08-28 2013-04-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Widebody coil isolators
US9019057B2 (en) 2006-08-28 2015-04-28 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolators and coil transducers
US20080278275A1 (en) * 2007-05-10 2008-11-13 Fouquet Julie E Miniature Transformers Adapted for use in Galvanic Isolators and the Like
US7852186B2 (en) 2006-08-28 2010-12-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics
US8093983B2 (en) 2006-08-28 2012-01-10 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Narrowbody coil isolator
US7948067B2 (en) 2009-06-30 2011-05-24 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Coil transducer isolator packages
US8061017B2 (en) 2006-08-28 2011-11-22 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Methods of making coil transducers
US7791900B2 (en) 2006-08-28 2010-09-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Galvanic isolator
KR100886351B1 (ko) * 2007-01-24 2009-03-03 삼성전자주식회사 변압기 및 밸룬
US7871865B2 (en) * 2007-01-24 2011-01-18 Analog Devices, Inc. Stress free package and laminate-based isolator package
US8139653B2 (en) * 2007-02-15 2012-03-20 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-channel galvanic isolator utilizing a single transmission channel
JP4836015B2 (ja) * 2007-02-27 2011-12-14 株式会社村田製作所 積層型トランス部品
JP2008236365A (ja) 2007-03-20 2008-10-02 Tsutomu Yoneyama 非接触ミリ波通信機
JP4900019B2 (ja) * 2007-04-19 2012-03-21 富士電機株式会社 絶縁トランスおよび電力変換装置
ITTO20070325A1 (it) * 2007-05-11 2008-11-12 St Microelectronics Srl Isolatore galvanico integrato utilizzante trasmissione wireless
US7468547B2 (en) 2007-05-11 2008-12-23 Intersil Americas Inc. RF-coupled digital isolator
JP2008289257A (ja) 2007-05-16 2008-11-27 Fuji Electric Device Technology Co Ltd 絶縁トランスを用いた信号伝送回路および電力変換装置
US7570144B2 (en) * 2007-05-18 2009-08-04 Chartered Semiconductor Manufacturing, Ltd. Integrated transformer and method of fabrication thereof
US7919781B2 (en) * 2007-06-12 2011-04-05 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Galvanic isolator having improved high voltage common mode transient immunity
JP2009035028A (ja) 2007-07-31 2009-02-19 Nissan Motor Co Ltd ハイブリッド車両のトルク変動低減装置
JP5187310B2 (ja) 2007-09-12 2013-04-24 日本電気株式会社 データ伝送装置およびデータ伝送方法
JP4957495B2 (ja) 2007-10-03 2012-06-20 株式会社豊田自動織機 信号伝達回路
US20090180403A1 (en) 2008-01-11 2009-07-16 Bogdan Tudosoiu Multi-band and multi-mode radio frequency front-end module architecture
US8258911B2 (en) 2008-03-31 2012-09-04 Avago Technologies ECBU IP (Singapor) Pte. Ltd. Compact power transformer components, devices, systems and methods
US7902665B2 (en) * 2008-09-02 2011-03-08 Linear Technology Corporation Semiconductor device having a suspended isolating interconnect

Similar Documents

Publication Publication Date Title
JP2010212669A5 (enExample)
JP2008078596A5 (enExample)
CN204968221U (zh) 柔性电路板
JP2008182184A5 (enExample)
JP2020503606A5 (enExample)
CN110335739A (zh) 线圈电子组件和制造该线圈电子组件的方法
JP5658399B1 (ja) プリント配線板
JP2017022407A5 (enExample)
JP2010193059A5 (enExample)
JP2010153505A5 (enExample)
JP2013042135A5 (enExample)
EP2391192A1 (en) Multilayer circuit substrate
CN109074947A (zh) 电子部件
US11574879B2 (en) Device package with reduced radio frequency losses
CN102970817A (zh) 电子电路板
JP7173752B2 (ja) フレキシブル配線回路基板、その製造方法、および、撮像装置
KR20150092625A (ko) 임베디드 인쇄회로기판
JP2019040902A (ja) 回路基板
JP2006253289A5 (enExample)
CN107768067B (zh) 共模滤波器及其制造方法
CN102024565A (zh) 电容结构
WO1992015117A1 (fr) Tableau de connexions
CN207053873U (zh) 一种低成本柔性电路板
KR20150079189A (ko) 전자소자 내장 기판
US20180218957A1 (en) Power semiconductor module