JP2010062530A5 - - Google Patents

Download PDF

Info

Publication number
JP2010062530A5
JP2010062530A5 JP2009145453A JP2009145453A JP2010062530A5 JP 2010062530 A5 JP2010062530 A5 JP 2010062530A5 JP 2009145453 A JP2009145453 A JP 2009145453A JP 2009145453 A JP2009145453 A JP 2009145453A JP 2010062530 A5 JP2010062530 A5 JP 2010062530A5
Authority
JP
Japan
Prior art keywords
wiring
power supply
region
printed
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009145453A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010062530A (ja
JP5284194B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2009145453A external-priority patent/JP5284194B2/ja
Priority to JP2009145453A priority Critical patent/JP5284194B2/ja
Priority to US12/534,834 priority patent/US8168895B2/en
Priority to KR1020090071566A priority patent/KR101076671B1/ko
Priority to EP09167291A priority patent/EP2152050B1/en
Priority to AT09167291T priority patent/ATE531241T1/de
Priority to CN200910160333XA priority patent/CN101646300B/zh
Publication of JP2010062530A publication Critical patent/JP2010062530A/ja
Publication of JP2010062530A5 publication Critical patent/JP2010062530A5/ja
Publication of JP5284194B2 publication Critical patent/JP5284194B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009145453A 2008-08-07 2009-06-18 プリント配線板およびプリント回路板 Expired - Fee Related JP5284194B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009145453A JP5284194B2 (ja) 2008-08-07 2009-06-18 プリント配線板およびプリント回路板
US12/534,834 US8168895B2 (en) 2008-08-07 2009-08-03 Printed wiring board
KR1020090071566A KR101076671B1 (ko) 2008-08-07 2009-08-04 프린트 배선판
AT09167291T ATE531241T1 (de) 2008-08-07 2009-08-05 Bestückte leiterplatte
EP09167291A EP2152050B1 (en) 2008-08-07 2009-08-05 Printed wiring board
CN200910160333XA CN101646300B (zh) 2008-08-07 2009-08-07 印刷布线板和印刷电路板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008203734 2008-08-07
JP2008203734 2008-08-07
JP2009145453A JP5284194B2 (ja) 2008-08-07 2009-06-18 プリント配線板およびプリント回路板

Publications (3)

Publication Number Publication Date
JP2010062530A JP2010062530A (ja) 2010-03-18
JP2010062530A5 true JP2010062530A5 (zh) 2012-08-02
JP5284194B2 JP5284194B2 (ja) 2013-09-11

Family

ID=41172327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009145453A Expired - Fee Related JP5284194B2 (ja) 2008-08-07 2009-06-18 プリント配線板およびプリント回路板

Country Status (6)

Country Link
US (1) US8168895B2 (zh)
EP (1) EP2152050B1 (zh)
JP (1) JP5284194B2 (zh)
KR (1) KR101076671B1 (zh)
CN (1) CN101646300B (zh)
AT (1) ATE531241T1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5354949B2 (ja) 2007-06-19 2013-11-27 キヤノン株式会社 プリント回路板
CN102802339B (zh) * 2011-05-23 2017-05-24 永捷电子（始兴）有限公司 印刷电路板
CN103091649A (zh) * 2011-10-28 2013-05-08 爱盛科技股份有限公司 磁感测装置
CN103091648A (zh) * 2011-10-28 2013-05-08 爱盛科技股份有限公司 磁感测装置
JP5904856B2 (ja) 2012-04-23 2016-04-20 キヤノン株式会社 プリント配線板、半導体パッケージ及びプリント回路板
KR101472638B1 (ko) * 2012-12-31 2014-12-15 삼성전기주식회사 수동소자 내장기판
US8723052B1 (en) * 2013-02-27 2014-05-13 Boulder Wind Power, Inc. Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies
US8785784B1 (en) 2013-03-13 2014-07-22 Boulder Wind Power, Inc. Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly
JP6385075B2 (ja) * 2013-04-15 2018-09-05 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器
EP3022483B1 (en) * 2013-07-18 2017-07-12 Quarkstar LLC Luminaire module with multiple light guide elements
US9793775B2 (en) 2013-12-31 2017-10-17 Boulder Wind Power, Inc. Methods and apparatus for reducing machine winding circulating current losses
JP6758888B2 (ja) * 2016-04-06 2020-09-23 株式会社アムコー・テクノロジー・ジャパン 半導体装置
CN107479227A (zh) * 2017-07-06 2017-12-15 惠科股份有限公司 一种电路板及其制作方法
JP6984441B2 (ja) * 2018-01-25 2021-12-22 富士通株式会社 基板及び電子装置
JP6984442B2 (ja) * 2018-01-25 2021-12-22 富士通株式会社 基板、電子装置、及び基板の設計支援方法
JP2019201070A (ja) * 2018-05-15 2019-11-21 株式会社デンソーテン 多層基板及び多層基板を用いて素子に電流を供給する方法
FR3083320B1 (fr) * 2018-06-27 2022-11-11 Safran Electronics & Defense Circuit imprime integrant un pont diviseur de courant
IT202000029210A1 (it) * 2020-12-01 2022-06-01 St Microelectronics Srl Dispositivo a semiconduttore e corrispondente procedimento

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997953A (ja) * 1995-09-29 1997-04-08 Toshiba Ave Corp 大電流用プリント基板
JP3957803B2 (ja) 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
US5969421A (en) 1997-11-18 1999-10-19 Lucent Technologies Inc. Integrated circuit conductors that avoid current crowding
JPH11224974A (ja) * 1998-02-06 1999-08-17 Hitachi Ltd 配線基板
JP2000200948A (ja) * 1999-01-07 2000-07-18 Toshiba Corp 並列回路の配線構造
US6977435B2 (en) 2003-09-09 2005-12-20 Intel Corporation Thick metal layer integrated process flow to improve power delivery and mechanical buffering
JP2006066665A (ja) * 2004-08-27 2006-03-09 Mitsumi Electric Co Ltd 配線基板
US7501698B2 (en) 2004-10-26 2009-03-10 Kabushiki Kaisha Toshiba Method and system for an improved power distribution network for use with a semiconductor device
CN101347052B (zh) 2006-08-07 2012-02-15 日本亚比欧尼克斯股份有限公司 印刷配线板的连接方法及连接装置
JP2008078314A (ja) * 2006-09-20 2008-04-03 Toshiba Corp 高速信号回路装置
US8056039B2 (en) * 2008-05-29 2011-11-08 International Business Machines Corporation Interconnect structure for integrated circuits having improved electromigration characteristics

Similar Documents

Publication Publication Date Title
JP2010062530A5 (zh)
JP5284194B2 (ja) プリント配線板およびプリント回路板
JP2011151185A5 (ja) 半導体装置
JP2017539090A5 (zh)
JP2011071315A5 (zh)
JP2013225610A5 (zh)
JP2011023439A5 (ja) キャパシタ及び配線基板
JP2009289849A5 (zh)
US9549459B2 (en) Multilayer printed circuit board
JP2008066693A5 (zh)
DE602009001232D1 (de) Leiterplatte und Herstellungsverfahren dafür
JP6272173B2 (ja) 配線基板
JP2007235009A5 (zh)
JP2008153542A5 (zh)
TWI457063B (zh) 多層配線基板
JP2014150102A5 (zh)
JP2007329452A5 (zh)
JP2011129729A5 (zh)
JP2008066468A (ja) 回路材および該回路材を収容した車載用の電気接続箱
JPWO2021111604A5 (zh)
TW202031106A (zh) 多層印刷基板
WO2008111408A1 (ja) 多層配線基板及びその製造方法
TWI704858B (zh) 電子模組
JP2009010260A5 (zh)
KR101046388B1 (ko) 반도체 패키지