JP2009224580A5 - - Google Patents

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Publication number
JP2009224580A5
JP2009224580A5 JP2008067806A JP2008067806A JP2009224580A5 JP 2009224580 A5 JP2009224580 A5 JP 2009224580A5 JP 2008067806 A JP2008067806 A JP 2008067806A JP 2008067806 A JP2008067806 A JP 2008067806A JP 2009224580 A5 JP2009224580 A5 JP 2009224580A5
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JP
Japan
Prior art keywords
predetermined
type
lot
cleaning
processing
Prior art date
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Application number
JP2008067806A
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English (en)
Japanese (ja)
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JP2009224580A (ja
JP5220447B2 (ja
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Application filed filed Critical
Priority claimed from JP2008067806A external-priority patent/JP5220447B2/ja
Priority to JP2008067806A priority Critical patent/JP5220447B2/ja
Priority to KR1020090018091A priority patent/KR101227235B1/ko
Priority to US12/398,587 priority patent/US8382910B2/en
Priority to TW098108460A priority patent/TWI464792B/zh
Priority to CN2009101284480A priority patent/CN101540274B/zh
Publication of JP2009224580A publication Critical patent/JP2009224580A/ja
Publication of JP2009224580A5 publication Critical patent/JP2009224580A5/ja
Publication of JP5220447B2 publication Critical patent/JP5220447B2/ja
Application granted granted Critical
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Anticipated expiration legal-status Critical

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JP2008067806A 2008-03-17 2008-03-17 基板処理システムの洗浄方法、記憶媒体及び基板処理システム Active JP5220447B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008067806A JP5220447B2 (ja) 2008-03-17 2008-03-17 基板処理システムの洗浄方法、記憶媒体及び基板処理システム
KR1020090018091A KR101227235B1 (ko) 2008-03-17 2009-03-03 기판 처리 시스템의 세정 방법, 기억 매체 및 기판 처리 시스템
US12/398,587 US8382910B2 (en) 2008-03-17 2009-03-05 Cleaning method for substrate processing system, storage medium, and substrate processing system
TW098108460A TWI464792B (zh) 2008-03-17 2009-03-16 Substrate processing system cleaning method, memory media and substrate processing system
CN2009101284480A CN101540274B (zh) 2008-03-17 2009-03-17 基板处理系统的洗净方法和基板处理系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008067806A JP5220447B2 (ja) 2008-03-17 2008-03-17 基板処理システムの洗浄方法、記憶媒体及び基板処理システム

Publications (3)

Publication Number Publication Date
JP2009224580A JP2009224580A (ja) 2009-10-01
JP2009224580A5 true JP2009224580A5 (enExample) 2011-04-28
JP5220447B2 JP5220447B2 (ja) 2013-06-26

Family

ID=41061644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008067806A Active JP5220447B2 (ja) 2008-03-17 2008-03-17 基板処理システムの洗浄方法、記憶媒体及び基板処理システム

Country Status (5)

Country Link
US (1) US8382910B2 (enExample)
JP (1) JP5220447B2 (enExample)
KR (1) KR101227235B1 (enExample)
CN (1) CN101540274B (enExample)
TW (1) TWI464792B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101097912B1 (ko) * 2006-01-27 2011-12-23 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치
JP5947030B2 (ja) 2010-12-28 2016-07-06 キヤノンアネルバ株式会社 基板処理方法、基板処理装置
CN103215572B (zh) * 2012-01-19 2016-12-14 北京北方微电子基地设备工艺研究中心有限责任公司 半导体设备工艺控制方法和半导体设备工艺控制装置
JP5954108B2 (ja) * 2012-10-23 2016-07-20 東京エレクトロン株式会社 基板処理装置
JP2016103496A (ja) * 2014-11-27 2016-06-02 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6956147B2 (ja) * 2019-07-23 2021-10-27 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム
CN111118458B (zh) * 2019-12-04 2022-03-22 北京北方华创微电子装备有限公司 腔室清洁方法及装置
JP7013618B2 (ja) 2020-02-03 2022-01-31 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
US20240209500A1 (en) * 2021-05-06 2024-06-27 Applied Materials, Inc. Processing system and methods for forming void-free and seam-free tungsten features

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3350264B2 (ja) * 1994-12-22 2002-11-25 松下電器産業株式会社 プラズマクリーニング方法
JPH09298152A (ja) * 1996-05-07 1997-11-18 Nikon Corp 加工方法
JPH10135094A (ja) * 1996-10-28 1998-05-22 Canon Sales Co Inc 半導体製造装置
JPH10199817A (ja) * 1997-01-10 1998-07-31 Kokusai Electric Co Ltd 成膜装置
JPH10270396A (ja) 1997-03-26 1998-10-09 Super Silicon Kenkyusho:Kk ウエハ表面洗浄方法およびウエハの総合研磨洗浄装置
US6168672B1 (en) * 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
JP2002299315A (ja) * 2001-03-29 2002-10-11 Toshiba Corp 半導体装置の製造方法
JP4017463B2 (ja) * 2002-07-11 2007-12-05 株式会社荏原製作所 洗浄方法
JP2006319041A (ja) * 2005-05-11 2006-11-24 Tokyo Electron Ltd プラズマクリーニング方法、成膜方法
JP4822048B2 (ja) * 2005-12-08 2011-11-24 富士通セミコンダクター株式会社 半導体製造装置のプリメンテナンス方法
JP4963842B2 (ja) * 2006-02-13 2012-06-27 東京エレクトロン株式会社 基板処理室の洗浄方法、記憶媒体及び基板処理装置
US20070215180A1 (en) * 2006-03-15 2007-09-20 Tokyo Electron Limited Cleaning method of substrate processing equipment, substrate processing equipment, and recording medium for recording program thereof
JP4671355B2 (ja) * 2006-03-15 2011-04-13 東京エレクトロン株式会社 基板処理装置のクリーニング方法,基板処理装置,プログラムを記録した記録媒体

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