JP2009123874A5 - - Google Patents

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Publication number
JP2009123874A5
JP2009123874A5 JP2007295519A JP2007295519A JP2009123874A5 JP 2009123874 A5 JP2009123874 A5 JP 2009123874A5 JP 2007295519 A JP2007295519 A JP 2007295519A JP 2007295519 A JP2007295519 A JP 2007295519A JP 2009123874 A5 JP2009123874 A5 JP 2009123874A5
Authority
JP
Japan
Prior art keywords
electronic component
insulating layer
wiring board
component mounting
mounting pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007295519A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009123874A (ja
JP5144222B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007295519A external-priority patent/JP5144222B2/ja
Priority to JP2007295519A priority Critical patent/JP5144222B2/ja
Priority to KR20080112374A priority patent/KR101508782B1/ko
Priority to US12/270,143 priority patent/US8119930B2/en
Priority to TW097144031A priority patent/TWI426845B/zh
Priority to CNA2008101809126A priority patent/CN101436578A/zh
Publication of JP2009123874A publication Critical patent/JP2009123874A/ja
Publication of JP2009123874A5 publication Critical patent/JP2009123874A5/ja
Priority to US13/340,979 priority patent/US20120096711A1/en
Publication of JP5144222B2 publication Critical patent/JP5144222B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007295519A 2007-11-14 2007-11-14 配線基板及びその製造方法 Active JP5144222B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007295519A JP5144222B2 (ja) 2007-11-14 2007-11-14 配線基板及びその製造方法
KR20080112374A KR101508782B1 (ko) 2007-11-14 2008-11-12 배선기판 및 그 제조방법
US12/270,143 US8119930B2 (en) 2007-11-14 2008-11-13 Wiring board and method for manufacturing the same
CNA2008101809126A CN101436578A (zh) 2007-11-14 2008-11-14 配线基板和制造配线基板的方法
TW097144031A TWI426845B (zh) 2007-11-14 2008-11-14 佈線板及其製造方法
US13/340,979 US20120096711A1 (en) 2007-11-14 2011-12-30 Wiring board and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007295519A JP5144222B2 (ja) 2007-11-14 2007-11-14 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009123874A JP2009123874A (ja) 2009-06-04
JP2009123874A5 true JP2009123874A5 (enExample) 2010-11-04
JP5144222B2 JP5144222B2 (ja) 2013-02-13

Family

ID=40640741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007295519A Active JP5144222B2 (ja) 2007-11-14 2007-11-14 配線基板及びその製造方法

Country Status (5)

Country Link
US (2) US8119930B2 (enExample)
JP (1) JP5144222B2 (enExample)
KR (1) KR101508782B1 (enExample)
CN (1) CN101436578A (enExample)
TW (1) TWI426845B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100704919B1 (ko) * 2005-10-14 2007-04-09 삼성전기주식회사 코어층이 없는 기판 및 그 제조 방법
JP5157587B2 (ja) * 2008-03-31 2013-03-06 凸版印刷株式会社 多層配線基板の製造方法
KR100956688B1 (ko) * 2008-05-13 2010-05-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
TWI458400B (zh) 2008-10-31 2014-10-21 太陽誘電股份有限公司 Printed circuit board and manufacturing method thereof
JP5193809B2 (ja) * 2008-11-05 2013-05-08 新光電気工業株式会社 配線基板及びその製造方法
CN102239753B (zh) * 2008-12-05 2013-11-06 揖斐电株式会社 多层印刷线路板和多层印刷线路板的制造方法
KR101042060B1 (ko) * 2009-05-27 2011-06-16 주식회사 코리아써키트 회로기판의 제조방법
KR101037450B1 (ko) * 2009-09-23 2011-05-26 삼성전기주식회사 패키지 기판
US20110114372A1 (en) * 2009-10-30 2011-05-19 Ibiden Co., Ltd. Printed wiring board
JP5001395B2 (ja) * 2010-03-31 2012-08-15 イビデン株式会社 配線板及び配線板の製造方法
US20120032337A1 (en) * 2010-08-06 2012-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Flip Chip Substrate Package Assembly and Process for Making Same
JP5772134B2 (ja) * 2011-03-26 2015-09-02 富士通株式会社 回路基板、その製造方法および半導体装置
JP2013048205A (ja) * 2011-07-25 2013-03-07 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP5653893B2 (ja) * 2011-12-07 2015-01-14 信越化学工業株式会社 積層基板
US20130241058A1 (en) * 2012-03-16 2013-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wire Bonding Structures for Integrated Circuits
US20130337648A1 (en) * 2012-06-14 2013-12-19 Bridge Semiconductor Corporation Method of making cavity substrate with built-in stiffener and cavity
US8987602B2 (en) * 2012-06-14 2015-03-24 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic support structure with cofabricated metal core
JP2014045025A (ja) * 2012-08-24 2014-03-13 Sony Corp 配線基板及び配線基板の製造方法
CN103857181A (zh) * 2012-12-06 2014-06-11 华为终端有限公司 Pcb板以及具有该pcb板的电子设备
JP2014229761A (ja) * 2013-05-23 2014-12-08 株式会社東芝 電子機器
US9355967B2 (en) * 2013-06-24 2016-05-31 Qualcomm Incorporated Stress compensation patterning
JP2015032649A (ja) * 2013-08-01 2015-02-16 イビデン株式会社 配線板の製造方法および配線板
KR20150125424A (ko) * 2014-04-30 2015-11-09 삼성전기주식회사 강연성 인쇄회로기판 및 강연성 인쇄회로기판의 제조 방법
JP6358431B2 (ja) 2014-08-25 2018-07-18 新光電気工業株式会社 電子部品装置及びその製造方法
JP6373219B2 (ja) * 2015-03-31 2018-08-15 太陽誘電株式会社 部品内蔵基板および半導体モジュール
US10177130B2 (en) * 2015-04-01 2019-01-08 Bridge Semiconductor Corporation Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener
US20170064821A1 (en) * 2015-08-31 2017-03-02 Kristof Darmawikarta Electronic package and method forming an electrical package
KR20190019324A (ko) * 2017-08-17 2019-02-27 엘지이노텍 주식회사 통신 모듈
JP2019179831A (ja) 2018-03-30 2019-10-17 新光電気工業株式会社 配線基板、配線基板の製造方法
JP2020031090A (ja) * 2018-08-21 2020-02-27 イビデン株式会社 プリント配線板
TWI682517B (zh) * 2019-03-12 2020-01-11 力成科技股份有限公司 超薄型晶片封裝結構及其製造方法
KR102698698B1 (ko) * 2019-08-05 2024-08-27 삼성전자주식회사 반도체 패키지 장치
KR20230019650A (ko) * 2021-08-02 2023-02-09 엘지이노텍 주식회사 회로기판
KR20230065808A (ko) * 2021-11-05 2023-05-12 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
JP2023137137A (ja) * 2022-03-17 2023-09-29 新光電気工業株式会社 配線基板及びその製造方法
KR20250030755A (ko) * 2023-08-25 2025-03-05 엘지이노텍 주식회사 회로 기판 및 이를 포함하는 반도체 패키지
KR20250129421A (ko) * 2024-02-22 2025-08-29 엘지이노텍 주식회사 회로기판 및 반도체 패키지

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999021224A1 (en) * 1997-10-17 1999-04-29 Ibiden Co., Ltd. Package substrate
JP3635219B2 (ja) 1999-03-11 2005-04-06 新光電気工業株式会社 半導体装置用多層基板及びその製造方法
JP2001015638A (ja) * 1999-06-30 2001-01-19 Mitsumi Electric Co Ltd Ｉｃパッケージの基板
JP4553466B2 (ja) * 2000-09-05 2010-09-29 パナソニック株式会社 プリント回路基板
US6291268B1 (en) * 2001-01-08 2001-09-18 Thin Film Module, Inc. Low cost method of testing a cavity-up BGA substrate
JP3492348B2 (ja) * 2001-12-26 2004-02-03 新光電気工業株式会社 半導体装置用パッケージの製造方法
TWI315657B (en) 2005-06-07 2009-10-01 Phoenix Prec Technology Corp Reverse build-up structure of circuit board
JP4452222B2 (ja) * 2005-09-07 2010-04-21 新光電気工業株式会社 多層配線基板及びその製造方法
JP5117692B2 (ja) * 2006-07-14 2013-01-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法

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