JP2009054619A - 電子部品実装システムおよび電子部品実装方法 - Google Patents
電子部品実装システムおよび電子部品実装方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0495—Mounting of components, e.g. of leadless components having a plurality of work-stations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
Abstract
【解決手段】複数の電子部品実装装置を連結して構成され、電子部品を基板に実装して実装基板を製造する電子部品実装システムにおいて、一の電子部品実装装置M3の第1の搬送コンベア25(搬入コンベア)とこの一の電子部品実装用装置の上流側に位置する他の電子部品実装装置M2の第2の搬送コンベア29(搬出コンベア)とによって形成される待機エリア[SA]に、実装コンベア27に搬入される基板4Aを一時待機させる構成とする。これにより、コンパクトな設備で基板搬送に起因する無駄時間を排除して生産効率を向上させることができる。
【選択図】図9
Description
ための所定の作業動作を実行する作業動作機構と、前記基板をベルトコンベアによって前記作業動作機構による作業位置に搬送する作業コンベアと、前記作業コンベアの上流側に隣接して配設され上流側から搬送された前記基板を前記作業コンベアに搬入する搬入コンベアと、前記作業コンベアの下流側に隣接して配設され前記基板を前記作業コンベアから搬出する搬出コンベアとを備え、複数の前記電子部品実装用装置を連結した状態において、一の電子部品実装用装置の前記搬入コンベアとこの一の電子部品実装用装置の上流側に位置する他の電子部品実装用装置の前記搬出コンベアとによって形成される基板待機エリアに、前記一の電子部品実装用装置の前記作業コンベアに搬入される基板を一時待機させる。
ア29の3つのベルトコンベア機構より構成される。図4(b)に示すように、第1の搬送コンベア25、実装コンベア27、第2の搬送コンベア29はいずれも搬送面を電子部品実装システム1における基板搬送レベルPLに合わせて配置されている。これらのコンベア機構は搬送方向を正逆切り換えて使用可能となっており、図4において左側(矢印a方向)から搬送された基板4は、第1の搬送コンベア25を介して実装コンベア27へ受け渡され、右側(矢印b方向)から搬送された基板4は、第2の搬送コンベア29を介して実装コンベア27へ受け渡される。
3は、部品搭載動作時に基板4を下方から支持する機能を有するものである。本実施の形態においては、実装コンベア27に複数(ここでは2枚)の基板を個別に位置決めして部品搭載動作の対象とすることができるように、個別に動作可能な複数(ここでは2つ)の第1下受部3A、第2下受部3Bが、図6に示す第1分割実装エリア[MA1]、第2分割実装エリア[MA2]の配置に対応して、すなわち部品搭載機構による搭載作業位置に対応して設けられている。
の搬入前の基板4Aを複数の電子部品実装装置を跨いで待機させる構成を採用することにより、無駄な装置スペースを排除して、設備のコンパクト化を促進することが可能となっている。
2 基板搬送機構
3 基板下受部
3A 第1下受部
3B 第2下受部
4,4A,4B 基板
5 部品供給部
8 Y軸移動テーブル
13 搭載ヘッド
25 第1の搬送コンベア(搬入コンベア)
27 実装コンベア
28 コンベア駆動モータ
29 第2の搬送コンベア(搬出コンベア)
32 下受けブロック
33 下受けピン
M1 基板供給装置
M2〜M5 電子部品実装装置
[MA] 実装エリア
[MA1] 第1分割実装エリア
[MA2] 第2分割実装エリア
[SA] 待機エリア
[SA1] 第1待機エリア
[SA2] 第2待機エリア
Claims (2)
- 複数の電子部品実装用装置を直列に連結して構成され電子部品を基板に実装して実装基板を製造する電子部品実装システムであって、
前記電子部品実装用装置は、前記基板を対象として実装基板を製造するための所定の作業動作を実行する作業動作機構と、前記基板をベルトコンベアによって前記作業動作機構による作業位置に搬送する作業コンベアと、前記作業コンベアの上流側に隣接して配設され上流側から搬送された前記基板を前記作業コンベアに搬入する搬入コンベアと、前記作業コンベアの下流側に隣接して配設され前記基板を前記作業コンベアから搬出する搬出コンベアとを備え、
複数の前記電子部品実装用装置を連結した状態において、一の電子部品実装用装置の前記搬入コンベアとこの一の電子部品実装用装置の上流側に位置する他の電子部品実装用装置の前記搬出コンベアとによって、前記一の電子部品実装用装置の前記作業コンベアに搬入される基板を一時待機させるための基板待機エリアが形成されることを特徴とする電子部品実装システム。 - 複数の電子部品実装用装置を直列に連結して構成された電子部品実装システムによって電子部品を基板に実装して実装基板を製造する電子部品実装方法であって、
前記電子部品実装用装置は、前記基板を対象として実装基板を製造するための所定の作業動作を実行する作業動作機構と、前記基板をベルトコンベアによって前記作業動作機構による作業位置に搬送する作業コンベアと、前記作業コンベアの上流側に隣接して配設され上流側から搬送された前記基板を前記作業コンベアに搬入する搬入コンベアと、前記作業コンベアの下流側に隣接して配設され前記基板を前記作業コンベアから搬出する搬出コンベアとを備え、
複数の前記電子部品実装用装置を連結した状態において、一の電子部品実装用装置の前記搬入コンベアとこの一の電子部品実装用装置の上流側に位置する他の電子部品実装用装置の前記搬出コンベアとによって形成される基板待機エリアに、前記一の電子部品実装用装置の前記作業コンベアに搬入される基板を一時待機させることを特徴とする電子部品実装方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007217039A JP4957453B2 (ja) | 2007-08-23 | 2007-08-23 | 電子部品実装システムおよび電子部品実装方法 |
US12/194,310 US8789265B2 (en) | 2007-08-23 | 2008-08-19 | Electronic component mounting method providing a substrate standby area |
KR1020080082090A KR20090020510A (ko) | 2007-08-23 | 2008-08-21 | 전자 부품 실장 시스템 및 전자 부품 실장 방법 |
CN2008101445793A CN101374405B (zh) | 2007-08-23 | 2008-08-22 | 电子元件安装系统和电子元件安装方法 |
DE102008039566A DE102008039566A1 (de) | 2007-08-23 | 2008-08-25 | Montagevorrichtung für elektronische Bauelemente und Montageverfahren für elektronische Bauelemente |
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JP2007217039A JP4957453B2 (ja) | 2007-08-23 | 2007-08-23 | 電子部品実装システムおよび電子部品実装方法 |
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JP2009054619A true JP2009054619A (ja) | 2009-03-12 |
JP4957453B2 JP4957453B2 (ja) | 2012-06-20 |
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US (1) | US8789265B2 (ja) |
JP (1) | JP4957453B2 (ja) |
KR (1) | KR20090020510A (ja) |
CN (1) | CN101374405B (ja) |
DE (1) | DE102008039566A1 (ja) |
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JP2011171515A (ja) * | 2010-02-18 | 2011-09-01 | Panasonic Corp | 部品実装基板搬送方法、部品実装基板搬送システム及び実装基板生産装置 |
JP2014157973A (ja) * | 2013-02-18 | 2014-08-28 | Juki Corp | 電子部品実装システム及び電子部品実装システムの基板搬送方法 |
WO2018109891A1 (ja) | 2016-12-15 | 2018-06-21 | 株式会社Fuji | 基板搬送装置 |
JP2019192767A (ja) * | 2018-04-25 | 2019-10-31 | Juki株式会社 | 搬送装置、実装装置、再クランプ方法 |
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JP5786261B2 (ja) * | 2011-04-26 | 2015-09-30 | Jukiオートメーションシステムズ株式会社 | 実装システム、電子部品の実装方法、基板の製造方法及びプログラム |
JP5477330B2 (ja) * | 2011-04-28 | 2014-04-23 | パナソニック株式会社 | 電子部品実装装置 |
JP5861041B2 (ja) | 2013-03-07 | 2016-02-16 | パナソニックIpマネジメント株式会社 | 基板搬送機構および部品実装用装置 |
CN103358252B (zh) * | 2013-07-12 | 2016-09-14 | 宁波精达成形装备股份有限公司 | 一种自动插弯头机的工件定位同步装置 |
WO2015061435A1 (en) * | 2013-10-22 | 2015-04-30 | Middlesex General Industries, Inc. | High volume conveyor transport for clean environments |
KR102106884B1 (ko) * | 2016-03-22 | 2020-05-06 | 야마하 모터 로보틱스 홀딩스 가부시키가이샤 | 본딩 장치 및 본딩 방법 |
CN110214477B (zh) * | 2017-01-31 | 2021-05-18 | 西门子股份公司 | 用于在装配线上优化产量地生产电路板的控制装置和方法 |
US11363748B2 (en) | 2017-08-22 | 2022-06-14 | Universal Instruments Corporation | Printed circuit board transport |
CN108463101A (zh) * | 2018-05-22 | 2018-08-28 | 深圳中科工控智能科技有限公司 | 全自动高速按键插件机 |
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- 2008-08-21 KR KR1020080082090A patent/KR20090020510A/ko not_active Application Discontinuation
- 2008-08-22 CN CN2008101445793A patent/CN101374405B/zh active Active
- 2008-08-25 DE DE102008039566A patent/DE102008039566A1/de not_active Withdrawn
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JP2011171515A (ja) * | 2010-02-18 | 2011-09-01 | Panasonic Corp | 部品実装基板搬送方法、部品実装基板搬送システム及び実装基板生産装置 |
JP2014157973A (ja) * | 2013-02-18 | 2014-08-28 | Juki Corp | 電子部品実装システム及び電子部品実装システムの基板搬送方法 |
WO2018109891A1 (ja) | 2016-12-15 | 2018-06-21 | 株式会社Fuji | 基板搬送装置 |
US10856458B2 (en) | 2016-12-15 | 2020-12-01 | Fuji Corporation | Substrate transfer device |
JP2019192767A (ja) * | 2018-04-25 | 2019-10-31 | Juki株式会社 | 搬送装置、実装装置、再クランプ方法 |
JP7045252B2 (ja) | 2018-04-25 | 2022-03-31 | Juki株式会社 | 搬送装置、実装装置、再クランプ方法 |
Also Published As
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DE102008039566A1 (de) | 2009-02-26 |
US8789265B2 (en) | 2014-07-29 |
US20090049682A1 (en) | 2009-02-26 |
KR20090020510A (ko) | 2009-02-26 |
JP4957453B2 (ja) | 2012-06-20 |
CN101374405B (zh) | 2012-03-28 |
CN101374405A (zh) | 2009-02-25 |
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