JP2009032906A - 半導体装置パッケージ - Google Patents
半導体装置パッケージ Download PDFInfo
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- JP2009032906A JP2009032906A JP2007195494A JP2007195494A JP2009032906A JP 2009032906 A JP2009032906 A JP 2009032906A JP 2007195494 A JP2007195494 A JP 2007195494A JP 2007195494 A JP2007195494 A JP 2007195494A JP 2009032906 A JP2009032906 A JP 2009032906A
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- lead frame
- resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
【解決手段】リードフレーム2と樹脂パッケージ本体4との接合面の一部を網目構造としているので、この接続面の接触面積が増大し、リードフレーム2と樹脂パッケージ本体4との接合性を向上できる。しかも、網目構造のメッシュを樹脂に含まれるフィラー10の平均粒子径より小さくすることで、リードフレーム2の表面近傍に到達するフィラー10を減らし、リードフレーム2の近傍における樹脂の弾性率を変化させることで半導体装置パッケージ4の使用環境より受ける応力で変形するリードフレーム2に樹脂が追従することができるので、密着性が向上する。
【選択図】図1
Description
2 リードフレーム
3 ワイヤーボンディング
4 樹脂パッケージ本体
5 外部リード
9 ダイパッド
10 フィラー
11 リードフレーム網目構造部
12 リードフレーム上のワイヤーボンディングする部分
101 半導体装置
102 リードフレーム
103 ワイヤーボンディング
104 樹脂パッケージ本体
105 外部リード
106 外部リードと樹脂パッケージ本体との界面
107 中央ダイパッド部
108 リードフレームと樹脂パッケージ本体との間で発生する剥離部分
Claims (5)
- 半導体チップと、電気的に接続されたリードフレームと、前記半導体チップを含む前記リードフレームの一部を封止する樹脂パッケージを有する半導体装置パッケージにおいて、前記リードフレームが網目構造を有していることを特徴とする半導体装置パッケージ。
- 前記リードフレームの表面側が網目構造であることを特徴とする請求項1に記載の半導体装置パッケージ
- 前記リードフレームに形成された網目構造が封止樹脂に含まれるフィラーの標準粒子径より小さいことを特徴とする請求項1に記載の半導体装置パッケージ。
- 前記リードフレームの網目構造が網目を2層以上重ねた形状を特徴とする請求項1に記載の半導体装置パッケージ。
- 前記リードフレームのワイヤーボンディング接続部が網目構造をしていないことを特徴とする請求項1に記載の半導体装置パッケージ
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007195494A JP2009032906A (ja) | 2007-07-27 | 2007-07-27 | 半導体装置パッケージ |
US12/178,341 US7750443B2 (en) | 2007-07-27 | 2008-07-23 | Semiconductor device package |
TW097128179A TWI433289B (zh) | 2007-07-27 | 2008-07-24 | 半導體裝置封裝 |
KR1020080073149A KR101548739B1 (ko) | 2007-07-27 | 2008-07-25 | 반도체 디바이스 패키지 |
CN200810144777XA CN101355074B (zh) | 2007-07-27 | 2008-07-25 | 半导体器件封装 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007195494A JP2009032906A (ja) | 2007-07-27 | 2007-07-27 | 半導体装置パッケージ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013154937A Division JP5757979B2 (ja) | 2013-07-25 | 2013-07-25 | 半導体装置パッケージ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009032906A true JP2009032906A (ja) | 2009-02-12 |
Family
ID=40294529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007195494A Pending JP2009032906A (ja) | 2007-07-27 | 2007-07-27 | 半導体装置パッケージ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7750443B2 (ja) |
JP (1) | JP2009032906A (ja) |
KR (1) | KR101548739B1 (ja) |
CN (1) | CN101355074B (ja) |
TW (1) | TWI433289B (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5358089B2 (ja) * | 2007-12-21 | 2013-12-04 | スパンション エルエルシー | 半導体装置 |
JP5247626B2 (ja) * | 2008-08-22 | 2013-07-24 | 住友化学株式会社 | リードフレーム、樹脂パッケージ、半導体装置及び樹脂パッケージの製造方法 |
AU2011242697B2 (en) | 2010-04-21 | 2015-01-22 | Government Of The United States | Fluoroscopy-independent, endovascular aortic occlusion system |
CN102403297B (zh) * | 2011-12-07 | 2013-11-20 | 上海凯虹科技电子有限公司 | 一种抗冲击的引线框架以及封装体 |
CN102744176B (zh) * | 2012-07-07 | 2017-04-26 | 上海鼎虹电子有限公司 | 电子元件封装中的清洁剂涂覆支架 |
US9474882B2 (en) | 2013-02-26 | 2016-10-25 | Prytime Medical Devices, Inc. | Fluoroscopy-independent balloon guided occlusion catheter and methods |
EP3424552B1 (en) | 2013-09-09 | 2020-04-15 | Prytime Medical Devices, Inc. | Low-profile occlusion catheter |
EP3077036A4 (en) | 2014-06-10 | 2017-04-19 | Pryor Medical Devices, Inc. | Conduit guiding tip |
CA2980018C (en) | 2015-03-19 | 2018-02-20 | Prytime Medical Devices, Inc. | System and method for low-profile occlusion balloon catheter |
US9691637B2 (en) * | 2015-10-07 | 2017-06-27 | Nxp Usa, Inc. | Method for packaging an integrated circuit device with stress buffer |
CA2990479C (en) | 2016-06-02 | 2019-03-26 | Prytime Medical Devices, Inc. | System and method for low-profile occlusion balloon catheter |
EP3568190B1 (en) | 2017-01-12 | 2023-11-22 | The Regents of the University of California | Endovascular perfusion augmentation for critical care |
CN106531714A (zh) * | 2017-01-24 | 2017-03-22 | 日月光封装测试(上海)有限公司 | 用于半导体封装的引线框架条及其制造方法 |
US10204842B2 (en) * | 2017-02-15 | 2019-02-12 | Texas Instruments Incorporated | Semiconductor package with a wire bond mesh |
JP2020518329A (ja) | 2017-04-21 | 2020-06-25 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 大動脈の部分遮断用の大動脈血流量計およびポンプ |
CA3107489A1 (en) | 2018-08-06 | 2020-02-13 | Prytime Medical Devices, Inc. | System and method for low profile occlusion balloon catheter |
EP4121159A2 (en) | 2020-03-16 | 2023-01-25 | Certus Critical Care, Inc. | Blood flow control devices, systems, and methods and error detection thereof |
WO2022188071A1 (en) * | 2021-03-10 | 2022-09-15 | Innoscience (suzhou) Semiconductor Co., Ltd. | Iii-nitride-based semiconductor packaged structure and method for manufacturing thereof |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183950A (ja) * | 1985-02-08 | 1986-08-16 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ムの製造方法 |
JPS62183548A (ja) * | 1986-02-07 | 1987-08-11 | Nec Corp | 半導体装置 |
JPS62249463A (ja) * | 1986-04-23 | 1987-10-30 | Hitachi Ltd | 半導体装置 |
JPH02285662A (ja) * | 1989-04-27 | 1990-11-22 | Hitachi Ltd | 樹脂封止半導体及びその製造方法 |
JPH0319261A (ja) * | 1989-06-15 | 1991-01-28 | Matsushita Electron Corp | 半導体用リードフレーム |
JPH04146658A (ja) * | 1990-10-09 | 1992-05-20 | Toshiba Corp | リードフレーム |
JPH10189858A (ja) * | 1998-01-26 | 1998-07-21 | Kawai Musical Instr Mfg Co Ltd | 半導体デバイス用リードフレーム |
JPH10199905A (ja) * | 1997-01-14 | 1998-07-31 | Nippon Motorola Ltd | チップ支持板の粗面化方法 |
JPH10284677A (ja) * | 1997-04-04 | 1998-10-23 | Samsung Electron Co Ltd | リードフレーム及びその製造方法 |
JPH10294413A (ja) * | 1997-04-21 | 1998-11-04 | Katsuya Hiroshige | 半導体チップ及び電子デバイスを外部回路と接続するための導電シート及び該導電シートによる接合(接続)方法 |
JPH1174440A (ja) * | 1997-06-27 | 1999-03-16 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
JPH11163210A (ja) * | 1997-12-01 | 1999-06-18 | Mitsubishi Shindoh Co Ltd | 表面処理金属材料およびその製造方法 |
JPH11345928A (ja) * | 1998-06-03 | 1999-12-14 | Hitachi Cable Ltd | 半導体装置とその製造方法 |
JP2000031371A (ja) * | 1998-07-09 | 2000-01-28 | Seiko Epson Corp | リードフレームおよびそれを用いて構成された半導体装置 |
JP2002009222A (ja) * | 2000-06-19 | 2002-01-11 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
JP2006222406A (ja) * | 2004-08-06 | 2006-08-24 | Denso Corp | 半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2622104B2 (ja) | 1994-07-02 | 1997-06-18 | アナム インダストリアル カンパニー インコーポレーティド | 電子装置パッケージの製造方法 |
US6720207B2 (en) * | 2001-02-14 | 2004-04-13 | Matsushita Electric Industrial Co., Ltd. | Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |
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2007
- 2007-07-27 JP JP2007195494A patent/JP2009032906A/ja active Pending
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2008
- 2008-07-23 US US12/178,341 patent/US7750443B2/en not_active Expired - Fee Related
- 2008-07-24 TW TW097128179A patent/TWI433289B/zh not_active IP Right Cessation
- 2008-07-25 CN CN200810144777XA patent/CN101355074B/zh not_active Expired - Fee Related
- 2008-07-25 KR KR1020080073149A patent/KR101548739B1/ko active IP Right Grant
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61183950A (ja) * | 1985-02-08 | 1986-08-16 | Hitachi Cable Ltd | 半導体用リ−ドフレ−ムの製造方法 |
JPS62183548A (ja) * | 1986-02-07 | 1987-08-11 | Nec Corp | 半導体装置 |
JPS62249463A (ja) * | 1986-04-23 | 1987-10-30 | Hitachi Ltd | 半導体装置 |
JPH02285662A (ja) * | 1989-04-27 | 1990-11-22 | Hitachi Ltd | 樹脂封止半導体及びその製造方法 |
JPH0319261A (ja) * | 1989-06-15 | 1991-01-28 | Matsushita Electron Corp | 半導体用リードフレーム |
JPH04146658A (ja) * | 1990-10-09 | 1992-05-20 | Toshiba Corp | リードフレーム |
JPH10199905A (ja) * | 1997-01-14 | 1998-07-31 | Nippon Motorola Ltd | チップ支持板の粗面化方法 |
JPH10284677A (ja) * | 1997-04-04 | 1998-10-23 | Samsung Electron Co Ltd | リードフレーム及びその製造方法 |
JPH10294413A (ja) * | 1997-04-21 | 1998-11-04 | Katsuya Hiroshige | 半導体チップ及び電子デバイスを外部回路と接続するための導電シート及び該導電シートによる接合(接続)方法 |
JPH1174440A (ja) * | 1997-06-27 | 1999-03-16 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
JPH11163210A (ja) * | 1997-12-01 | 1999-06-18 | Mitsubishi Shindoh Co Ltd | 表面処理金属材料およびその製造方法 |
JPH10189858A (ja) * | 1998-01-26 | 1998-07-21 | Kawai Musical Instr Mfg Co Ltd | 半導体デバイス用リードフレーム |
JPH11345928A (ja) * | 1998-06-03 | 1999-12-14 | Hitachi Cable Ltd | 半導体装置とその製造方法 |
JP2000031371A (ja) * | 1998-07-09 | 2000-01-28 | Seiko Epson Corp | リードフレームおよびそれを用いて構成された半導体装置 |
JP2002009222A (ja) * | 2000-06-19 | 2002-01-11 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
JP2006222406A (ja) * | 2004-08-06 | 2006-08-24 | Denso Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20090012177A (ko) | 2009-02-02 |
TWI433289B (zh) | 2014-04-01 |
CN101355074A (zh) | 2009-01-28 |
US20090026595A1 (en) | 2009-01-29 |
TW200913203A (en) | 2009-03-16 |
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