JP2009016531A5 - - Google Patents

Download PDF

Info

Publication number
JP2009016531A5
JP2009016531A5 JP2007176099A JP2007176099A JP2009016531A5 JP 2009016531 A5 JP2009016531 A5 JP 2009016531A5 JP 2007176099 A JP2007176099 A JP 2007176099A JP 2007176099 A JP2007176099 A JP 2007176099A JP 2009016531 A5 JP2009016531 A5 JP 2009016531A5
Authority
JP
Japan
Prior art keywords
semiconductor light
iii nitride
nitride semiconductor
group iii
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007176099A
Other languages
English (en)
Japanese (ja)
Other versions
JP4714712B2 (ja
JP2009016531A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007176099A external-priority patent/JP4714712B2/ja
Priority to JP2007176099A priority Critical patent/JP4714712B2/ja
Priority to TW097124942A priority patent/TWI491064B/zh
Priority to PCT/JP2008/062072 priority patent/WO2009005126A1/ja
Priority to CN2008800221346A priority patent/CN101689592B/zh
Priority to KR1020097026968A priority patent/KR101042417B1/ko
Priority to US12/666,594 priority patent/US8674398B2/en
Publication of JP2009016531A publication Critical patent/JP2009016531A/ja
Publication of JP2009016531A5 publication Critical patent/JP2009016531A5/ja
Publication of JP4714712B2 publication Critical patent/JP4714712B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007176099A 2007-07-04 2007-07-04 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ Active JP4714712B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007176099A JP4714712B2 (ja) 2007-07-04 2007-07-04 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ
TW097124942A TWI491064B (zh) 2007-07-04 2008-07-02 Iii族氮化物半導體發光元件及該製造方法、以及燈
KR1020097026968A KR101042417B1 (ko) 2007-07-04 2008-07-03 Ⅲ족 질화물 반도체 발광 소자 및 그의 제조 방법, 및 램프
CN2008800221346A CN101689592B (zh) 2007-07-04 2008-07-03 Ⅲ族氮化物半导体发光元件及其制造方法和灯
PCT/JP2008/062072 WO2009005126A1 (ja) 2007-07-04 2008-07-03 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ
US12/666,594 US8674398B2 (en) 2007-07-04 2008-07-03 Group III nitride semiconductor light emitting device and production method thereof, and lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007176099A JP4714712B2 (ja) 2007-07-04 2007-07-04 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010162861A Division JP2010232700A (ja) 2010-07-20 2010-07-20 Iii族窒化物半導体発光素子の製造方法

Publications (3)

Publication Number Publication Date
JP2009016531A JP2009016531A (ja) 2009-01-22
JP2009016531A5 true JP2009016531A5 (enExample) 2010-06-03
JP4714712B2 JP4714712B2 (ja) 2011-06-29

Family

ID=40226167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007176099A Active JP4714712B2 (ja) 2007-07-04 2007-07-04 Iii族窒化物半導体発光素子及びその製造方法、並びにランプ

Country Status (6)

Country Link
US (1) US8674398B2 (enExample)
JP (1) JP4714712B2 (enExample)
KR (1) KR101042417B1 (enExample)
CN (1) CN101689592B (enExample)
TW (1) TWI491064B (enExample)
WO (1) WO2009005126A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5564331B2 (ja) 2009-05-29 2014-07-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN102034912B (zh) * 2009-12-29 2015-03-25 比亚迪股份有限公司 发光二极管外延片、其制作方法及芯片的制作方法
KR101484658B1 (ko) * 2010-04-30 2015-01-21 캐논 아네르바 가부시키가이샤 에피텍셜 박막형성방법, 진공처리장치, 반도체 발광소자 제조방법, 반도체 발광소자, 및 조명장치
JP2012243780A (ja) * 2011-05-13 2012-12-10 Toshiba Corp 半導体発光素子及びウェーハ
WO2014008162A1 (en) 2012-07-02 2014-01-09 Applied Materials, Inc. Aluminum-nitride buffer and active layers by physical vapor deposition
JP5734935B2 (ja) * 2012-09-20 2015-06-17 株式会社東芝 半導体装置及びその製造方法
US9368939B2 (en) 2013-10-18 2016-06-14 Soraa Laser Diode, Inc. Manufacturable laser diode formed on C-plane gallium and nitrogen material
US9362715B2 (en) 2014-02-10 2016-06-07 Soraa Laser Diode, Inc Method for manufacturing gallium and nitrogen bearing laser devices with improved usage of substrate material
US9520695B2 (en) * 2013-10-18 2016-12-13 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser device having confinement region
US9379525B2 (en) 2014-02-10 2016-06-28 Soraa Laser Diode, Inc. Manufacturable laser diode
US9520697B2 (en) 2014-02-10 2016-12-13 Soraa Laser Diode, Inc. Manufacturable multi-emitter laser diode
US9871350B2 (en) 2014-02-10 2018-01-16 Soraa Laser Diode, Inc. Manufacturable RGB laser diode source
JP2014241417A (ja) * 2014-07-15 2014-12-25 シャープ株式会社 アルミニウム含有窒化物中間層の製造方法、窒化物層の製造方法および窒化物半導体素子の製造方法
TWI553901B (zh) * 2015-09-07 2016-10-11 環球晶圓股份有限公司 紫外光發光二極體及其製造方法
WO2017094028A1 (en) * 2015-12-02 2017-06-08 Indian Institute Of Technology Bombay Method and apparatus for forming silicon doped gallium nitride (gan) films by a co-sputtering technique
JP7055595B2 (ja) * 2017-03-29 2022-04-18 古河機械金属株式会社 Iii族窒化物半導体基板、及び、iii族窒化物半導体基板の製造方法
JP7112190B2 (ja) * 2017-09-29 2022-08-03 日機装株式会社 発光装置
FI129628B (en) * 2019-09-25 2022-05-31 Beneq Oy Method and apparatus for processing surface of a substrate
US12191626B1 (en) 2020-07-31 2025-01-07 Kyocera Sld Laser, Inc. Vertically emitting laser devices and chip-scale-package laser devices and laser-based, white light emitting devices
CN114910828B (zh) * 2022-05-16 2024-08-16 中国工程物理研究院激光聚变研究中心 一种判断量子级联激光器快速退火效果的方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD142966A1 (de) * 1979-05-07 1980-07-23 Reinhard Voigt Verfahren zur in situ-vorbehandlung und zur beschichtungvon substraten mit duennen schichten
JPS60173829A (ja) 1984-02-14 1985-09-07 Nippon Telegr & Teleph Corp <Ntt> 化合物半導体薄膜の成長方法
JP3026087B2 (ja) 1989-03-01 2000-03-27 豊田合成株式会社 窒化ガリウム系化合物半導体の気相成長方法
JPH088217B2 (ja) 1991-01-31 1996-01-29 日亜化学工業株式会社 窒化ガリウム系化合物半導体の結晶成長方法
JPH06120163A (ja) 1992-09-30 1994-04-28 Victor Co Of Japan Ltd 半導体装置の電極形成方法
JP3773282B2 (ja) 1995-03-27 2006-05-10 豊田合成株式会社 窒化ガリウム系化合物半導体の電極形成方法
JPH0964477A (ja) * 1995-08-25 1997-03-07 Toshiba Corp 半導体発光素子及びその製造方法
JPH11102907A (ja) * 1997-09-26 1999-04-13 Sharp Corp 半導体装置の製造方法および絶縁膜形成装置
JP2000216249A (ja) * 1998-11-16 2000-08-04 Sony Corp 電子装置の製造方法及びその装置
JP3700492B2 (ja) 1999-09-21 2005-09-28 豊田合成株式会社 Iii族窒化物系化合物半導体素子
JP3440873B2 (ja) 1999-03-31 2003-08-25 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
JP2001168386A (ja) 1999-09-29 2001-06-22 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子
US6406931B1 (en) * 1999-10-12 2002-06-18 Sandia Corporation Structural tuning of residual conductivity in highly mismatched III-V layers
JP2001185493A (ja) * 1999-12-24 2001-07-06 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子
JP3994623B2 (ja) * 2000-04-21 2007-10-24 豊田合成株式会社 Iii族窒化物系化合物半導体素子の製造方法
JP4963763B2 (ja) 2000-12-21 2012-06-27 日本碍子株式会社 半導体素子
JP2003119564A (ja) 2001-10-12 2003-04-23 Tokyo Electron Ltd 成膜方法及びプラズマcvd装置
JP2003183823A (ja) * 2001-12-17 2003-07-03 Sharp Corp スパッタ装置
JP2003332234A (ja) * 2002-05-15 2003-11-21 Kyocera Corp 窒化層を有するサファイア基板およびその製造方法
JP4123828B2 (ja) 2002-05-27 2008-07-23 豊田合成株式会社 半導体発光素子
JP2005209925A (ja) 2004-01-23 2005-08-04 Nichia Chem Ind Ltd 積層半導体基板
JP2006114886A (ja) 2004-09-14 2006-04-27 Showa Denko Kk n型III族窒化物半導体積層構造体
JP5004432B2 (ja) * 2005-04-11 2012-08-22 東京エレクトロン株式会社 金属シリサイド膜を形成する方法、前処理方法、成膜システム、制御プログラムおよびコンピュータ記憶媒体
JP4939014B2 (ja) * 2005-08-30 2012-05-23 国立大学法人徳島大学 Iii族窒化物半導体発光素子およびiii族窒化物半導体発光素子の製造方法
JP4912843B2 (ja) * 2006-11-22 2012-04-11 昭和電工株式会社 Iii族窒化物化合物半導体発光素子の製造方法

Similar Documents

Publication Publication Date Title
JP2009016531A5 (enExample)
TWI705479B (zh) 電子元件的製造方法及積層體
TWI345320B (en) Method of growing nitride semiconductor material
TW200733196A (en) Vaporizer, semiconductor manufacturing apparatus and manufacturing method thereof
JP2009081406A5 (enExample)
CN103915537A (zh) 硅衬底上化合物半导体外延层生长方法及其器件结构
CN104393128B (zh) 一种使用SiC衬底的氮化物LED外延结构及其制备方法
ATE546570T1 (de) Verfahren zur epitaktischen abscheidung von einkristallinen iii-v halbleitermaterial
EA201071184A1 (ru) Способ осаждения тонкого слоя
WO2009028314A1 (ja) 半導体装置の製造方法
WO2011126612A3 (en) Nitrogen doped amorphous carbon hardmask
TW200720474A (en) Method of preparing a film layer-by-layer using plasma enhanced atomic layer deposition
JP2014156116A (ja) ハウジング及びその製造方法
CN103996606B (zh) 生长在蓝宝石衬底上的高均匀性AlN薄膜及其制备方法和应用
TW200746262A (en) Method of manufacturing nitride semiconductor substrate and composite material substrate
CN105914270A (zh) 硅基氮化镓led外延结构的制造方法
JP5791399B2 (ja) AlN層の製造方法
CN204167345U (zh) 一种使用 SiC 衬底的氮化物 LED 外延结构
CN107492478B (zh) 半导体设备的成膜方法以及半导体设备的氮化铝成膜方法
TW200631079A (en) Growth process of a crystalline gallium nitride based compound and semiconductor device including gallium nitride based compound
Zhong et al. Low-temperature growth of high c-orientated crystalline GaN films on amorphous Ni/glass substrates with ECR-PEMOCVD
TW201105819A (en) Method of depositing amorphous hydrocarbon nitride (a-cn:hx) film, organic el device, and process for producing the same
WO2009013873A1 (ja) 積層膜の製造方法、半導体装置の製造方法、半導体装置および表示装置
TW200701347A (en) Method of film formation and computer-readable storage medium
CN106784195B (zh) 一种提高发光二极管品质的外延生长方法