JP2009016531A5 - - Google Patents
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- Publication number
- JP2009016531A5 JP2009016531A5 JP2007176099A JP2007176099A JP2009016531A5 JP 2009016531 A5 JP2009016531 A5 JP 2009016531A5 JP 2007176099 A JP2007176099 A JP 2007176099A JP 2007176099 A JP2007176099 A JP 2007176099A JP 2009016531 A5 JP2009016531 A5 JP 2009016531A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- iii nitride
- nitride semiconductor
- group iii
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 54
- 150000004767 nitrides Chemical class 0.000 claims description 50
- 238000004519 manufacturing process Methods 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 30
- 238000004544 sputter deposition Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910021478 group 5 element Inorganic materials 0.000 claims description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000009832 plasma treatment Methods 0.000 claims description 4
- 238000001552 radio frequency sputter deposition Methods 0.000 claims description 4
- 238000005546 reactive sputtering Methods 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims description 2
- -1 nitride compound Chemical class 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007176099A JP4714712B2 (ja) | 2007-07-04 | 2007-07-04 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
| TW097124942A TWI491064B (zh) | 2007-07-04 | 2008-07-02 | Iii族氮化物半導體發光元件及該製造方法、以及燈 |
| KR1020097026968A KR101042417B1 (ko) | 2007-07-04 | 2008-07-03 | Ⅲ족 질화물 반도체 발광 소자 및 그의 제조 방법, 및 램프 |
| CN2008800221346A CN101689592B (zh) | 2007-07-04 | 2008-07-03 | Ⅲ族氮化物半导体发光元件及其制造方法和灯 |
| PCT/JP2008/062072 WO2009005126A1 (ja) | 2007-07-04 | 2008-07-03 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
| US12/666,594 US8674398B2 (en) | 2007-07-04 | 2008-07-03 | Group III nitride semiconductor light emitting device and production method thereof, and lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007176099A JP4714712B2 (ja) | 2007-07-04 | 2007-07-04 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010162861A Division JP2010232700A (ja) | 2010-07-20 | 2010-07-20 | Iii族窒化物半導体発光素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009016531A JP2009016531A (ja) | 2009-01-22 |
| JP2009016531A5 true JP2009016531A5 (enExample) | 2010-06-03 |
| JP4714712B2 JP4714712B2 (ja) | 2011-06-29 |
Family
ID=40226167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007176099A Active JP4714712B2 (ja) | 2007-07-04 | 2007-07-04 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8674398B2 (enExample) |
| JP (1) | JP4714712B2 (enExample) |
| KR (1) | KR101042417B1 (enExample) |
| CN (1) | CN101689592B (enExample) |
| TW (1) | TWI491064B (enExample) |
| WO (1) | WO2009005126A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5564331B2 (ja) | 2009-05-29 | 2014-07-30 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN102034912B (zh) * | 2009-12-29 | 2015-03-25 | 比亚迪股份有限公司 | 发光二极管外延片、其制作方法及芯片的制作方法 |
| KR101484658B1 (ko) * | 2010-04-30 | 2015-01-21 | 캐논 아네르바 가부시키가이샤 | 에피텍셜 박막형성방법, 진공처리장치, 반도체 발광소자 제조방법, 반도체 발광소자, 및 조명장치 |
| JP2012243780A (ja) * | 2011-05-13 | 2012-12-10 | Toshiba Corp | 半導体発光素子及びウェーハ |
| WO2014008162A1 (en) | 2012-07-02 | 2014-01-09 | Applied Materials, Inc. | Aluminum-nitride buffer and active layers by physical vapor deposition |
| JP5734935B2 (ja) * | 2012-09-20 | 2015-06-17 | 株式会社東芝 | 半導体装置及びその製造方法 |
| US9368939B2 (en) | 2013-10-18 | 2016-06-14 | Soraa Laser Diode, Inc. | Manufacturable laser diode formed on C-plane gallium and nitrogen material |
| US9362715B2 (en) | 2014-02-10 | 2016-06-07 | Soraa Laser Diode, Inc | Method for manufacturing gallium and nitrogen bearing laser devices with improved usage of substrate material |
| US9520695B2 (en) * | 2013-10-18 | 2016-12-13 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser device having confinement region |
| US9379525B2 (en) | 2014-02-10 | 2016-06-28 | Soraa Laser Diode, Inc. | Manufacturable laser diode |
| US9520697B2 (en) | 2014-02-10 | 2016-12-13 | Soraa Laser Diode, Inc. | Manufacturable multi-emitter laser diode |
| US9871350B2 (en) | 2014-02-10 | 2018-01-16 | Soraa Laser Diode, Inc. | Manufacturable RGB laser diode source |
| JP2014241417A (ja) * | 2014-07-15 | 2014-12-25 | シャープ株式会社 | アルミニウム含有窒化物中間層の製造方法、窒化物層の製造方法および窒化物半導体素子の製造方法 |
| TWI553901B (zh) * | 2015-09-07 | 2016-10-11 | 環球晶圓股份有限公司 | 紫外光發光二極體及其製造方法 |
| WO2017094028A1 (en) * | 2015-12-02 | 2017-06-08 | Indian Institute Of Technology Bombay | Method and apparatus for forming silicon doped gallium nitride (gan) films by a co-sputtering technique |
| JP7055595B2 (ja) * | 2017-03-29 | 2022-04-18 | 古河機械金属株式会社 | Iii族窒化物半導体基板、及び、iii族窒化物半導体基板の製造方法 |
| JP7112190B2 (ja) * | 2017-09-29 | 2022-08-03 | 日機装株式会社 | 発光装置 |
| FI129628B (en) * | 2019-09-25 | 2022-05-31 | Beneq Oy | Method and apparatus for processing surface of a substrate |
| US12191626B1 (en) | 2020-07-31 | 2025-01-07 | Kyocera Sld Laser, Inc. | Vertically emitting laser devices and chip-scale-package laser devices and laser-based, white light emitting devices |
| CN114910828B (zh) * | 2022-05-16 | 2024-08-16 | 中国工程物理研究院激光聚变研究中心 | 一种判断量子级联激光器快速退火效果的方法 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD142966A1 (de) * | 1979-05-07 | 1980-07-23 | Reinhard Voigt | Verfahren zur in situ-vorbehandlung und zur beschichtungvon substraten mit duennen schichten |
| JPS60173829A (ja) | 1984-02-14 | 1985-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体薄膜の成長方法 |
| JP3026087B2 (ja) | 1989-03-01 | 2000-03-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
| JPH088217B2 (ja) | 1991-01-31 | 1996-01-29 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体の結晶成長方法 |
| JPH06120163A (ja) | 1992-09-30 | 1994-04-28 | Victor Co Of Japan Ltd | 半導体装置の電極形成方法 |
| JP3773282B2 (ja) | 1995-03-27 | 2006-05-10 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の電極形成方法 |
| JPH0964477A (ja) * | 1995-08-25 | 1997-03-07 | Toshiba Corp | 半導体発光素子及びその製造方法 |
| JPH11102907A (ja) * | 1997-09-26 | 1999-04-13 | Sharp Corp | 半導体装置の製造方法および絶縁膜形成装置 |
| JP2000216249A (ja) * | 1998-11-16 | 2000-08-04 | Sony Corp | 電子装置の製造方法及びその装置 |
| JP3700492B2 (ja) | 1999-09-21 | 2005-09-28 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
| JP3440873B2 (ja) | 1999-03-31 | 2003-08-25 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
| JP2001168386A (ja) | 1999-09-29 | 2001-06-22 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子 |
| US6406931B1 (en) * | 1999-10-12 | 2002-06-18 | Sandia Corporation | Structural tuning of residual conductivity in highly mismatched III-V layers |
| JP2001185493A (ja) * | 1999-12-24 | 2001-07-06 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子 |
| JP3994623B2 (ja) * | 2000-04-21 | 2007-10-24 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
| JP4963763B2 (ja) | 2000-12-21 | 2012-06-27 | 日本碍子株式会社 | 半導体素子 |
| JP2003119564A (ja) | 2001-10-12 | 2003-04-23 | Tokyo Electron Ltd | 成膜方法及びプラズマcvd装置 |
| JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
| JP2003332234A (ja) * | 2002-05-15 | 2003-11-21 | Kyocera Corp | 窒化層を有するサファイア基板およびその製造方法 |
| JP4123828B2 (ja) | 2002-05-27 | 2008-07-23 | 豊田合成株式会社 | 半導体発光素子 |
| JP2005209925A (ja) | 2004-01-23 | 2005-08-04 | Nichia Chem Ind Ltd | 積層半導体基板 |
| JP2006114886A (ja) | 2004-09-14 | 2006-04-27 | Showa Denko Kk | n型III族窒化物半導体積層構造体 |
| JP5004432B2 (ja) * | 2005-04-11 | 2012-08-22 | 東京エレクトロン株式会社 | 金属シリサイド膜を形成する方法、前処理方法、成膜システム、制御プログラムおよびコンピュータ記憶媒体 |
| JP4939014B2 (ja) * | 2005-08-30 | 2012-05-23 | 国立大学法人徳島大学 | Iii族窒化物半導体発光素子およびiii族窒化物半導体発光素子の製造方法 |
| JP4912843B2 (ja) * | 2006-11-22 | 2012-04-11 | 昭和電工株式会社 | Iii族窒化物化合物半導体発光素子の製造方法 |
-
2007
- 2007-07-04 JP JP2007176099A patent/JP4714712B2/ja active Active
-
2008
- 2008-07-02 TW TW097124942A patent/TWI491064B/zh active
- 2008-07-03 US US12/666,594 patent/US8674398B2/en active Active
- 2008-07-03 CN CN2008800221346A patent/CN101689592B/zh active Active
- 2008-07-03 WO PCT/JP2008/062072 patent/WO2009005126A1/ja not_active Ceased
- 2008-07-03 KR KR1020097026968A patent/KR101042417B1/ko active Active
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