JP2009081406A5 - - Google Patents
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- Publication number
- JP2009081406A5 JP2009081406A5 JP2007251478A JP2007251478A JP2009081406A5 JP 2009081406 A5 JP2009081406 A5 JP 2009081406A5 JP 2007251478 A JP2007251478 A JP 2007251478A JP 2007251478 A JP2007251478 A JP 2007251478A JP 2009081406 A5 JP2009081406 A5 JP 2009081406A5
- Authority
- JP
- Japan
- Prior art keywords
- buffer layer
- group iii
- iii nitride
- nitride semiconductor
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 22
- 150000004767 nitrides Chemical class 0.000 claims 18
- 238000004519 manufacturing process Methods 0.000 claims 9
- 238000000034 method Methods 0.000 claims 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 7
- 239000001301 oxygen Substances 0.000 claims 7
- 229910052760 oxygen Inorganic materials 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 6
- 238000005546 reactive sputtering Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000007789 gas Substances 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- 229910052594 sapphire Inorganic materials 0.000 claims 3
- 239000010980 sapphire Substances 0.000 claims 3
- 238000009826 distribution Methods 0.000 claims 2
- -1 nitride compound Chemical class 0.000 claims 2
- 239000002994 raw material Substances 0.000 claims 2
- 238000004544 sputter deposition Methods 0.000 claims 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 238000001552 radio frequency sputter deposition Methods 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007251478A JP2009081406A (ja) | 2007-09-27 | 2007-09-27 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
| PCT/JP2008/066261 WO2009041256A1 (ja) | 2007-09-27 | 2008-09-09 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
| US12/680,445 US20100219445A1 (en) | 2007-09-27 | 2008-09-09 | Group iii nitride semiconductor light-emitting device, method for manufacturing the same, and lamp |
| CN200880117594A CN101874306A (zh) | 2007-09-27 | 2008-09-09 | Ⅲ族氮化物半导体发光元件及其制造方法以及灯 |
| KR1020107006929A KR20100049123A (ko) | 2007-09-27 | 2008-09-09 | Ⅲ족 질화물 반도체 발광 소자 및 그 제조 방법, 및 램프 |
| EP08833533.6A EP2200099A4 (en) | 2007-09-27 | 2008-09-09 | GROUP III NITRID SEMICONDUCTOR LIGHTING ELEMENT, METHOD OF MANUFACTURING THEREOF AND LAMP |
| TW097136316A TW200933933A (en) | 2007-09-27 | 2008-09-22 | Group III nitride semiconductor light emitting device, method of manufacturing thereof, and lamps using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007251478A JP2009081406A (ja) | 2007-09-27 | 2007-09-27 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011002985A Division JP2011082570A (ja) | 2011-01-11 | 2011-01-11 | Iii族窒化物半導体発光素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009081406A JP2009081406A (ja) | 2009-04-16 |
| JP2009081406A5 true JP2009081406A5 (enExample) | 2010-05-20 |
Family
ID=40511145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007251478A Pending JP2009081406A (ja) | 2007-09-27 | 2007-09-27 | Iii族窒化物半導体発光素子及びその製造方法、並びにランプ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100219445A1 (enExample) |
| EP (1) | EP2200099A4 (enExample) |
| JP (1) | JP2009081406A (enExample) |
| KR (1) | KR20100049123A (enExample) |
| CN (1) | CN101874306A (enExample) |
| TW (1) | TW200933933A (enExample) |
| WO (1) | WO2009041256A1 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5272390B2 (ja) * | 2007-11-29 | 2013-08-28 | 豊田合成株式会社 | Iii族窒化物半導体の製造方法、iii族窒化物半導体発光素子の製造方法、及びiii族窒化物半導体発光素子、並びにランプ |
| US8742459B2 (en) | 2009-05-14 | 2014-06-03 | Transphorm Inc. | High voltage III-nitride semiconductor devices |
| WO2011037251A1 (ja) * | 2009-09-28 | 2011-03-31 | 株式会社トクヤマ | 積層体の製造方法 |
| KR101178505B1 (ko) * | 2009-11-03 | 2012-09-07 | 주식회사루미지엔테크 | 반도체 기판과 이의 제조 방법 |
| WO2011058968A1 (ja) * | 2009-11-10 | 2011-05-19 | 株式会社トクヤマ | 積層体の製造方法 |
| JP5399552B2 (ja) | 2010-03-01 | 2014-01-29 | シャープ株式会社 | 窒化物半導体素子の製造方法、窒化物半導体発光素子および発光装置 |
| DE102010035489A1 (de) * | 2010-08-26 | 2012-03-01 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelement |
| KR20120032329A (ko) | 2010-09-28 | 2012-04-05 | 삼성전자주식회사 | 반도체 소자 |
| US8742460B2 (en) | 2010-12-15 | 2014-06-03 | Transphorm Inc. | Transistors with isolation regions |
| US8409895B2 (en) * | 2010-12-16 | 2013-04-02 | Applied Materials, Inc. | Gallium nitride-based LED fabrication with PVD-formed aluminum nitride buffer layer |
| US8643062B2 (en) | 2011-02-02 | 2014-02-04 | Transphorm Inc. | III-N device structures and methods |
| US8772842B2 (en) | 2011-03-04 | 2014-07-08 | Transphorm, Inc. | Semiconductor diodes with low reverse bias currents |
| JP5879225B2 (ja) * | 2011-08-22 | 2016-03-08 | 住友化学株式会社 | 窒化物半導体テンプレート及び発光ダイオード |
| US8901604B2 (en) | 2011-09-06 | 2014-12-02 | Transphorm Inc. | Semiconductor devices with guard rings |
| US9257547B2 (en) | 2011-09-13 | 2016-02-09 | Transphorm Inc. | III-N device structures having a non-insulating substrate |
| US8598937B2 (en) | 2011-10-07 | 2013-12-03 | Transphorm Inc. | High power semiconductor electronic components with increased reliability |
| KR20130067610A (ko) * | 2011-12-14 | 2013-06-25 | 한국전자통신연구원 | 도파로형 광 혼합기 |
| JP2013145867A (ja) * | 2011-12-15 | 2013-07-25 | Hitachi Cable Ltd | 窒化物半導体テンプレート及び発光ダイオード |
| US9165766B2 (en) | 2012-02-03 | 2015-10-20 | Transphorm Inc. | Buffer layer structures suited for III-nitride devices with foreign substrates |
| WO2013155108A1 (en) | 2012-04-09 | 2013-10-17 | Transphorm Inc. | N-polar iii-nitride transistors |
| DE102012103686B4 (de) | 2012-04-26 | 2021-07-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Epitaxiesubstrat, Verfahren zur Herstellung eines Epitaxiesubstrats und optoelektronischer Halbleiterchip mit einem Epitaxiesubstrat |
| KR20130128931A (ko) * | 2012-05-18 | 2013-11-27 | 삼성전자주식회사 | N형 알루미늄 갈륨 나이트라이드 박막 및 자외선 발광소자 |
| US9184275B2 (en) | 2012-06-27 | 2015-11-10 | Transphorm Inc. | Semiconductor devices with integrated hole collectors |
| TWI499080B (zh) | 2012-11-19 | 2015-09-01 | Genesis Photonics Inc | 氮化物半導體結構及半導體發光元件 |
| TWI535055B (zh) | 2012-11-19 | 2016-05-21 | 新世紀光電股份有限公司 | 氮化物半導體結構及半導體發光元件 |
| TWI524551B (zh) | 2012-11-19 | 2016-03-01 | 新世紀光電股份有限公司 | 氮化物半導體結構及半導體發光元件 |
| US9171730B2 (en) | 2013-02-15 | 2015-10-27 | Transphorm Inc. | Electrodes for semiconductor devices and methods of forming the same |
| US9087718B2 (en) | 2013-03-13 | 2015-07-21 | Transphorm Inc. | Enhancement-mode III-nitride devices |
| JP6063035B2 (ja) * | 2013-03-14 | 2017-01-18 | キヤノンアネルバ株式会社 | 成膜方法、半導体発光素子の製造方法、半導体発光素子、照明装置 |
| US9929310B2 (en) | 2013-03-14 | 2018-03-27 | Applied Materials, Inc. | Oxygen controlled PVD aluminum nitride buffer for gallium nitride-based optoelectronic and electronic devices |
| US9245993B2 (en) | 2013-03-15 | 2016-01-26 | Transphorm Inc. | Carbon doping semiconductor devices |
| KR102075543B1 (ko) * | 2013-05-06 | 2020-02-11 | 엘지이노텍 주식회사 | 반도체 기판, 발광 소자 및 전자 소자 |
| US9443938B2 (en) | 2013-07-19 | 2016-09-13 | Transphorm Inc. | III-nitride transistor including a p-type depleting layer |
| TWI536606B (zh) * | 2013-12-25 | 2016-06-01 | 新世紀光電股份有限公司 | 發光二極體結構 |
| DE102014101966A1 (de) | 2014-02-17 | 2015-08-20 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines elektronischen Halbleiterchips und elektronischer Halbleiterchip |
| JP6176141B2 (ja) * | 2014-02-19 | 2017-08-09 | 豊田合成株式会社 | Iii 族窒化物半導体発光素子の製造方法 |
| JP2015176936A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社東芝 | 半導体装置 |
| US9318593B2 (en) | 2014-07-21 | 2016-04-19 | Transphorm Inc. | Forming enhancement mode III-nitride devices |
| US9608103B2 (en) | 2014-10-02 | 2017-03-28 | Toshiba Corporation | High electron mobility transistor with periodically carbon doped gallium nitride |
| JP6375890B2 (ja) | 2014-11-18 | 2018-08-22 | 日亜化学工業株式会社 | 窒化物半導体素子及びその製造方法 |
| US9536966B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Gate structures for III-N devices |
| US9536967B2 (en) | 2014-12-16 | 2017-01-03 | Transphorm Inc. | Recessed ohmic contacts in a III-N device |
| TWI568016B (zh) * | 2014-12-23 | 2017-01-21 | 錼創科技股份有限公司 | 半導體發光元件 |
| CN104701432A (zh) * | 2015-03-20 | 2015-06-10 | 映瑞光电科技(上海)有限公司 | GaN 基LED 外延结构及其制备方法 |
| KR102010401B1 (ko) * | 2015-10-27 | 2019-08-14 | 주식회사 엘지화학 | 유기발광소자 |
| CN105633223B (zh) * | 2015-12-31 | 2018-10-09 | 华灿光电(苏州)有限公司 | AlGaN模板、AlGaN模板的制备方法及AlGaN模板上的半导体器件 |
| CN105633233B (zh) * | 2015-12-31 | 2018-01-12 | 华灿光电(苏州)有限公司 | AlN模板、AlN模板的制备方法及AlN模板上的半导体器件 |
| CN108604597B (zh) | 2016-01-15 | 2021-09-17 | 创世舫电子有限公司 | 具有al(1-x)sixo栅极绝缘体的增强模式iii-氮化物器件 |
| CN105755536B (zh) * | 2016-02-06 | 2019-04-26 | 上海新傲科技股份有限公司 | 一种采用AlON缓冲层的氮化物的外延生长技术 |
| CN105590839B (zh) * | 2016-03-22 | 2018-09-14 | 安徽三安光电有限公司 | 氮化物底层、发光二极管及底层制备方法 |
| WO2017210323A1 (en) | 2016-05-31 | 2017-12-07 | Transphorm Inc. | Iii-nitride devices including a graded depleting layer |
| TWI703726B (zh) * | 2016-09-19 | 2020-09-01 | 新世紀光電股份有限公司 | 含氮半導體元件 |
| CN109841708B (zh) * | 2017-11-28 | 2022-05-31 | 中国科学院半导体研究所 | 半导体器件及其制备方法 |
| JP7555470B1 (ja) | 2023-12-07 | 2024-09-24 | 日機装株式会社 | 窒化物半導体発光素子 |
| CN118472152B (zh) * | 2024-07-12 | 2024-09-17 | 诺视科技(浙江)有限公司 | 集成反射穹顶的微显示器件及其制备方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6039819A (ja) * | 1983-08-12 | 1985-03-01 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体薄膜の作製方法 |
| JPS60173829A (ja) * | 1984-02-14 | 1985-09-07 | Nippon Telegr & Teleph Corp <Ntt> | 化合物半導体薄膜の成長方法 |
| JPS6365917A (ja) | 1986-09-06 | 1988-03-24 | Kurita Mach Mfg Co Ltd | 濾過ユニット |
| JPH088217B2 (ja) | 1991-01-31 | 1996-01-29 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体の結晶成長方法 |
| JP3456404B2 (ja) * | 1997-10-10 | 2003-10-14 | 豊田合成株式会社 | 半導体素子 |
| JPH11200031A (ja) * | 1997-12-25 | 1999-07-27 | Applied Materials Inc | スパッタリング装置及びその高速真空排気方法 |
| JP3700492B2 (ja) * | 1999-09-21 | 2005-09-28 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
| JP3440873B2 (ja) | 1999-03-31 | 2003-08-25 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
| US6713789B1 (en) * | 1999-03-31 | 2004-03-30 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor device and method of producing the same |
| JP4613373B2 (ja) * | 1999-07-19 | 2011-01-19 | ソニー株式会社 | Iii族ナイトライド化合物半導体薄膜の形成方法および半導体素子の製造方法 |
| JP3994623B2 (ja) * | 2000-04-21 | 2007-10-24 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
| US6787814B2 (en) * | 2000-06-22 | 2004-09-07 | Showa Denko Kabushiki Kaisha | Group-III nitride semiconductor light-emitting device and production method thereof |
| WO2002044443A1 (en) * | 2000-11-30 | 2002-06-06 | North Carolina State University | Methods and apparatus for producing m'n based materials |
| JP2004179457A (ja) * | 2002-11-28 | 2004-06-24 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子の製造方法 |
| JP4468744B2 (ja) | 2004-06-15 | 2010-05-26 | 日本電信電話株式会社 | 窒化物半導体薄膜の作製方法 |
| JP2007251478A (ja) | 2006-03-15 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 確率的演算素子及びこれを用いた確率的演算装置 |
-
2007
- 2007-09-27 JP JP2007251478A patent/JP2009081406A/ja active Pending
-
2008
- 2008-09-09 US US12/680,445 patent/US20100219445A1/en not_active Abandoned
- 2008-09-09 EP EP08833533.6A patent/EP2200099A4/en not_active Withdrawn
- 2008-09-09 KR KR1020107006929A patent/KR20100049123A/ko not_active Ceased
- 2008-09-09 CN CN200880117594A patent/CN101874306A/zh active Pending
- 2008-09-09 WO PCT/JP2008/066261 patent/WO2009041256A1/ja not_active Ceased
- 2008-09-22 TW TW097136316A patent/TW200933933A/zh unknown
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